U.S. patent application number 13/436263 was filed with the patent office on 2013-10-03 for honey cone heaters for integrated circuit manufacturing.
This patent application is currently assigned to Taiwan Semiconductor Manufacturing Company, Ltd.. The applicant listed for this patent is Tze-Liang Lee, Chii-Horng Li, Jr-Hung Li, Yi-Hung Lin. Invention is credited to Tze-Liang Lee, Chii-Horng Li, Jr-Hung Li, Yi-Hung Lin.
Application Number | 20130256292 13/436263 |
Document ID | / |
Family ID | 49233491 |
Filed Date | 2013-10-03 |
United States Patent
Application |
20130256292 |
Kind Code |
A1 |
Lin; Yi-Hung ; et
al. |
October 3, 2013 |
Honey Cone Heaters for Integrated Circuit Manufacturing
Abstract
A honey cone heater includes a lamp housing having an outer edge
that forms a partial circle. The lamp housing has an opening
extending from a top surface to a bottom surface of the lamp
housing. The opening further extends from the outer edge into a
center region of the lamp housing. A plurality of lamps is
distributed throughout the lamp housing, and is configured to emit
light out of the top surface of the lamp housing.
Inventors: |
Lin; Yi-Hung; (Taipei,
TW) ; Li; Jr-Hung; (Chupei City, TW) ; Li;
Chii-Horng; (Zhubei City, TW) ; Lee; Tze-Liang;
(Hsin-Chu, TW) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
Lin; Yi-Hung
Li; Jr-Hung
Li; Chii-Horng
Lee; Tze-Liang |
Taipei
Chupei City
Zhubei City
Hsin-Chu |
|
TW
TW
TW
TW |
|
|
Assignee: |
Taiwan Semiconductor Manufacturing
Company, Ltd.
Hsin-Chu
TW
|
Family ID: |
49233491 |
Appl. No.: |
13/436263 |
Filed: |
March 30, 2012 |
Current U.S.
Class: |
219/385 ;
219/481; 219/520 |
Current CPC
Class: |
H05B 3/0047 20130101;
H01L 21/67103 20130101 |
Class at
Publication: |
219/385 ;
219/520; 219/481 |
International
Class: |
H05B 3/06 20060101
H05B003/06; H05B 6/00 20060101 H05B006/00 |
Claims
1. An apparatus comprising: a honey cone heater comprising: a lamp
housing having an outer edge, wherein the outer edge forms a
partial circle, wherein the lamp housing comprises an opening
extending from a top surface to a bottom surface of the lamp
housing, and wherein the opening extends from the outer edge into a
center region of the lamp housing; and a plurality of lamps
distributed throughout the lamp housing, and is configured to emit
light out of the top surface of the lamp housing.
2. The apparatus of claim 1 further comprising: a shaft penetrating
through the center region of the lamp housing; and a susceptor over
and connected to the shaft, wherein the shaft and the susceptor are
configured to rotate.
3. The apparatus of claim 2 further comprising a spot lamp disposed
in the opening, wherein the spot lamp is configured to provide more
heat to one region than to remaining regions of a wafer placed on
the susceptor.
4. The apparatus of claim 1, wherein the lamp housing comprises: a
first edge and a second edge facing the opening; a first pipe
connected to spaces between the plurality of lamps through the
first edge; and a second pipe connected to the spaces through the
second edge, wherein the first and the second pipes are configured
to conduct a coolant to flow through the spaces.
5. The apparatus of claim 1, wherein the lamp housing comprises a
first edge and a second edge facing the opening, wherein the first
and the second edges form an angle between about 45 degrees and
about 135 degrees.
6. The apparatus of claim 1, wherein the top surface of the lamp
housing is non-coplanar.
7. The apparatus of claim 6, wherein first portions of the top
surface of the lamp housing are higher than second portions of the
top surface, and wherein the first portions of the top surface are
closer to the outer edge of the lamp housing than the second
portions.
8. The apparatus of claim 7, wherein the first portions are
co-planar, and wherein the second portions are curved.
9. An apparatus comprising: a honey cone heater comprising: a lamp
housing having an outer edge, wherein the outer edge forms a
partial circle, wherein the lamp housing comprises an opening
extending from a top surface to a bottom surface of the lamp
housing, and wherein the opening further extends from the outer
edge into a center region of lamp housing; a first edge and a
second edge facing the opening, wherein each of the first edge and
the second edge extends from the top surface to the bottom surface
of the lamp housing, and extends from the outer edge to the center
region of the circle; and a plurality of lamps distributed
throughout the lamp housing; a shaft penetrating through the center
region of the lamp housing; and a susceptor over and joined to the
shaft, wherein the shaft and the susceptor are configured to rotate
along an axis of the shaft.
10. The apparatus of claim 9, wherein the first and the second
edges are substantially straight, and form an angle between about
45 degrees and about 135 degrees.
11. The apparatus of claim 9, wherein the opening occupies between
about one eighth and about three eighths of an area of a full
circle defined by the outer edge.
12. The apparatus of claim 9, wherein the lamp housing is
configured to be able to slide in a direction perpendicular to a
lengthwise direction of the shaft, and wherein the shaft is
configured to pass through the opening when the lamp housing
slides.
13. The apparatus of claim 9 further comprising a spot lamp
disposed in the opening, wherein the spot lamp is configured to
provide more heat to a center region than to remaining regions of a
wafer placed on the susceptor.
14. The apparatus of claim 9, wherein the top surface of the lamp
housing is non-coplanar, and wherein outer portions of the lamp
housing are higher than inner portions of the lamp housing.
15. An apparatus comprising: a honey cone heater comprising: a lamp
housing comprising a top surface and a bottom surface, wherein the
top surface comprises a first portion farther away from a center
region of the lamp housing than a second portion of the top
surface, and wherein the first portion and the second portion are
non-coplanar; and a plurality of lamps distributed throughout the
lamp housing; a shaft penetrating through the center region of the
lamp housing; and a susceptor over the shaft and the lamp housing,
wherein the shaft and the susceptor are joined to each other.
16. The apparatus of claim 15, wherein the second portion of the
top surface of the lamp housing is higher than the first portion of
the top surface of the lamp housing.
17. The apparatus of claim 15, wherein each of the first portion
and the second portion of the top surface of the lamp housing is
coplanar, and wherein the first portion and the second portion form
a step.
18. The apparatus of claim 15, wherein the first portion gradually
rises in heights in a direction from the center region to an outer
edge of the lamp housing, and wherein the second portion is
coplanar.
19. The apparatus of claim 15, wherein the lamp housing comprises:
an outer edge forming a partial circle, wherein the lamp housing
comprises an opening extending from a top surface to a bottom
surface of the lamp housing, and wherein the opening further
extends from the outer edge to the center region of the lamp
housing; and a first edge and a second edge facing the opening,
wherein each of the first edge and the second edge extends from the
top surface to the bottom surface of the lamp housing, and extends
from the outer edge to the center region of the lamp housing.
20. The apparatus of claim 19, wherein the lamp housing is
configured to be able to slide in a direction perpendicular to a
lengthwise direction of the shaft, and wherein the shaft is
configured to pass through the opening when the lamp housing
slides.
Description
BACKGROUND
[0001] Honey cone heaters are used in the integrated circuit
manufacturing processes. In some of the integrated circuit
manufacturing processes, the honey cone heaters are used to heat
the backsides of the wafers. A wafer that is heated by a honey cone
heater is supported by a susceptor, which is further supported by a
shaft at the center or a hollow cylinder at the edge. The
susceptor, its support, and the wafer rotate during the integrated
circuit manufacturing process.
[0002] The honey cone heater is underlying, and aligned to the
susceptor. If the shaft needs to penetrate through the honey cone
heater, no lamp is distributed in the center region of the honey
cone heater. This causes the center cold problem, wherein the
center region of the wafer is colder than some other regions of the
wafer.
BRIEF DESCRIPTION OF THE DRAWINGS
[0003] For a more complete understanding of the embodiments, and
the advantages thereof, reference is now made to the following
descriptions taken in conjunction with the accompanying drawings,
in which:
[0004] FIG. 1 is a perspective view of an apparatus in accordance
with some exemplary embodiments, wherein the apparatus includes a
hone cone heater having an opening therein;
[0005] FIGS. 2 and 3 are top views of the apparatus in accordance
with various exemplary embodiments; and
[0006] FIGS. 4A through 7 are perspective views and a
cross-sectional view of various honey cone heaters in accordance
with some exemplary embodiments.
DETAILED DESCRIPTION OF ILLUSTRATIVE EMBODIMENTS
[0007] The making and using of the embodiments of the disclosure
are discussed in detail below. It should be appreciated, however,
that the embodiments provide many applicable inventive concepts
that can be embodied in a wide variety of specific contexts. The
specific embodiments discussed are illustrative, and do not limit
the scope of the disclosure.
[0008] Backside wafer heating apparatuses that include honey cone
heaters are provided in accordance with various exemplary
embodiments. The variations and the operation of the embodiments
are discussed. Throughout the various views and illustrative
embodiments, like reference numbers are used to designate like
elements.
[0009] FIG. 1 illustrates a perspective view of apparatus 20 for
the backside heating of wafers in accordance with some exemplary
embodiments. Apparatus 20 includes shaft 22, and susceptor 24 over
and connected to shaft 22. Shaft 22 is joined to the center portion
of the susceptor 24. Wafer 26 is placed over susceptor 24. Wafer 26
may be a semiconductor wafer such as a silicon wafer, on which
integrated circuit devices such as transistors may be formed. In
some embodiments, susceptor 24 has a size larger than the size of
wafer 26. Susceptor 24 may comprise silicon carbide in some
exemplary embodiments. Shaft 22 is configured to rotate along its
axis. As a result, susceptor 24 and wafer 26 rotate along with
shaft 22.
[0010] Honey cone heater 28 is placed underlying susceptor 24.
Honey cone heater 28 includes lamp housing 27, and lamps 30
disposed in lamp housing 27. Shaft 22 penetrates through a center
region of lamp housing 27. Lamps 30 may be distributed throughout
lamp housing 27. Lamps 30 faces toward susceptor 24 and wafer 26,
so that in the integrated manufacturing process, lamps 30 may emit
light upwardly to heat wafer 26. Honey cone heater 28 remains still
during the manufacturing process performed on wafer, while wafer 26
rotates.
[0011] Lamp housing 27 may have a round top view (also refer to
FIGS. 2 and 3), except portion 128 of the respective circle is
removed. Honey cone heater 28 thus may have a partial circular
top-view shape, and the outer edge 28B of lamp housing 27 forms a
partial circle. Throughout the description, the region that portion
128 would otherwise occupy is referred to as opening 29.
Accordingly, no lamp is disposed in opening 29. In some
embodiments, honey cone heater 28, due to the removal of portion
128, have edges 28A that extend from the center region of lamp
housing 27 to outer edge 28B. The center region of lamp housing 27
is also removed, so that shaft 22 may penetrate through. In some
embodiments, opening 29 extends from the outer edge 28B of lamp
housing 27 to the center region of lamp housing 27, and extends
from the top surface to the bottom surface of lamp housing 27.
[0012] FIG. 2 illustrates a top view of honey cone heater 28 in
accordance with some exemplary embodiments. Edges 28A (which face
opening 29) of lamp housing 27 may be substantially straight,
although they may also be curved. Angle a between edges 28A may
range between about 10 degrees and about 135 degrees, or between
about 45 degrees and about 135 degrees in some exemplary
embodiments. In alternative embodiments, as shown in FIG. 3, which
is also a top view of honey cone heater 28, edges 28A may be
substantially parallel to each other. Regardless of the top-view
shape of opening 29, opening 29 may occupy between about 1/8 and
about 3/8 of the otherwise full circle of lamp housing 27, wherein
the full circle is defined by outer edge 28B.
[0013] In some embodiments, apparatus 20 as in FIG. 1 is used for
an epitaxy process, wherein a semiconductor material such as
silicon, silicon germanium, or the like is epitaxially grown on
wafer 26. In other embodiments, other integrated circuit
manufacturing processes including deposition and surface treatment
steps, during which wafer 26 may be heated from the backside, may
also be performed using apparatus 20. Apparatus 20 may be placed in
a chamber (not shown), which may be vacuumed. During the integrated
circuit manufacturing process, since wafer 26 rotates along with
shaft 22 and susceptor 24, the removal of portion 128 of honey cone
heater 28 does not cause the non-uniformity in the heating of wafer
26.
[0014] Referring again to FIG. 1, one or a plurality of spot lamps
34 is placed adjacent to honey cone heater 28. In some embodiments,
spot lamps 34 are disposed in opening 29. Each of spot lamps 34 is
configured to focus on the center region of wafer 26, and hence the
center region of wafer 26 receives more heating from spot lamps 34
than the middle and edge portions of wafer 26. Since shaft 22 needs
to penetrate through honey cone heater 28, lamps 30 cannot be
distributed to the center region of lamp housing 27. This may cause
the center region of wafer 26 to have temperatures lower than some
other portions of wafer 26. In accordance with the embodiments,
however, the heat provided by spot lamps 34 compensates for, at
least partially, the reduction in the heat provided to the center
of wafer 26. The temperatures throughout wafer 26 are thus more
uniform.
[0015] Spot lamps 34 may be connected to and power by power source
36. Lamps 30 may be connected to and power by power source 37. In
some embodiments, power sources 36 and 37 are separate power
sources. The power provided to spot lamps 34 and the power provided
to lamps 30 may thus be adjusted separately, so that the heat
compensation to the center of wafer 26 may be adjusted
accurately.
[0016] Referring to FIG. 1, with opening 29 connected to the center
region of lamp housing 27, and with shaft 22 penetrating through
the center region of lamp housing 27, honey cone heater 28 may
slide out without the need to remove shaft 22 and susceptor 24
first. The sliding direction of honey cone heater 28 is illustrated
by arrow 44 in FIGS. 1 through 3. The maintenance (such as
replacing failed lamps 30) of honey cone heater 28 is hence
easier.
[0017] During the operation of lamps 30, lamps 30 may need to be
cooled to prevent the overheating of lamps 30 and honey cone heater
28. Referring to FIGS. 2 and 3, due to the existence of opening 29,
pipes 40 and 40 may be connected to edges 28A of lamp housing 27.
Pipes 40 and 42 are connected to the spaces between lamps 30 that
have cylinder shapes. Pipes 40 and 42 may be used as the inlet and
the outlet of coolant 38, which may be oil, water, cold air, or the
like. As shown in FIGS. 2 and 3, coolant 38 may flow into pipe 40
(or 42), and out of pipe 42 (or 40). Inside lamp housing 27,
coolant 38 flows through the spaces between lamps 30 in a clockwise
direction or a counter-clockwise direction, depending on which of
pipes 40 and 42 is used as the inlet or the outlet. An exemplary
flowing direction is illustrated as curved line 45, which passes
through the spaces between lamps 30. Coolant 38 brings out the heat
in honey cone heater 28, so that honey cone heater 28 is cooled.
The clockwise or the counter-clockwise flow of coolant 38 results
in the improvement in the efficiency of cooling.
[0018] FIGS. 4A through 7 illustrate honey cone heaters 28 in
accordance with alternative exemplary embodiments. Unless specified
otherwise, the materials and the design of the components in these
embodiments are essentially the same as the like components, which
are denoted by like reference numerals in the embodiments shown in
FIGS. 1 through 3. The details of the embodiments shown in FIGS. 4
through 7 may thus be found in the discussion of the like
embodiments shown in FIGS. 1 through 3.
[0019] Referring to FIG. 4A, honey cone heater 28 has a
non-coplanar top surface 27C, which is also the top surface of lamp
housing 27. Lamps 30 are disposed following the profile of top
surface 27C. Accordingly, the top surfaces of lamps 30 are also
non-coplanar. FIG. 4B illustrates a cross-sectional view of honey
cone heater 28 as shown in FIG. 4A. Since top surface 27C is
non-planar, the top ends 30A of lamps 30 are also non-coplanar,
wherein the light/heat is emitted from top ends 30A. From the
center to the edge, top surface 27C may be increasingly higher. The
increase in the height of top surface 27C from the center to the
edge may be gradual and substantially continuous. As shown in FIG.
4B, since the edge portions of honey cone heater 28 are higher than
the center portions, the edge portions may be closer to the
overlying wafer 26 than the honey cone heaters having planar top
surfaces. Accordingly, the heating to wafer 26 by lamps 30 may be
more uniform. In some exemplary embodiments, height difference
.DELTA.H1, which is the height difference between the edge portions
and the center portion of top surface 27C, is greater than about 20
mm, for example. FIG. 5 illustrates an embodiment essentially the
same as in FIGS. 4A and 4B, except that opening 29 is formed in
honey cone heater 28. The details of opening 29 are essentially the
same as discussed in the embodiments in FIGS. 1 through 3, and
hence are not discussed herein.
[0020] FIG. 6 illustrates honey cone heater 28 in accordance with
alternative exemplary embodiments. Top surface 27C of honey cone
heater 28 includes curved top surface portion 27C1 and planar top
surface portion 27C2. Top surface portion 27C2 may be parallel to
the overlying susceptor 24 and wafer 26 (not shown in FIG. 6,
please refer to FIG. 4B) in some embodiments. Top surface portion
27C2 may form a ring encircling the curved top surface portion 27C1
in some embodiments. Top surface portion 27C2 may be used to
compensate for the reduced heating to the edge of the overlying
wafer 26. In some embodiments, portion 128 of honey cone heater 28
may be removed to form an opening, which is similar to opening 29
in FIG. 1. In alternative embodiments, portion 128 is not removed,
and outer edge 28B of honey cone heater 28 may form a full circle
with no break therein.
[0021] FIG. 7 illustrates honey cone heater 28 in accordance with
yet alternative exemplary embodiments. Top surface 27C of honey
cone heater 28 may include a plurality of planar top portions, for
example, 27C1, 27C2, and/or the like. Top surface portions 27C1,
27C2, and the like form steps. In some exemplary embodiments, step
height .DELTA.H2 is greater than about 50 mm. In some embodiments,
portion 128 of honey cone heater 28 may be removed to form an
opening. In alternative embodiments, portion 128 is not removed,
and edge 28B of honey cone heater 28 may form a full circle with no
break therein.
[0022] It is realized that the embodiments shown in FIGS. 4A
through 7 may include other components that are shown in FIGS. 1
through 3, such as spot lamps 34, pipes 40 and 42, power sources 36
and 37, shaft 22, susceptor 24, wafer 26, and the like. The details
of these components may also be essentially the same as in the
embodiments in FIGS. 1 through 3.
[0023] In the embodiments, by forming honey cone heaters with
openings therein, the maintenance of the honey cone heaters are
easier. Furthermore, by forming the honey cone heaters having
non-coplanar top surfaces and/or adding spot lamps, the
non-uniformity in the wafer heating is reduced.
[0024] In accordance with embodiments, a honey cone heater includes
a lamp housing having an outer edge that forms a partial circle.
The lamp housing has an opening extending from a top surface to a
bottom surface of the lamp housing. The opening further extends
from the outer edge into a center region of the lamp housing. A
plurality of lamps is distributed throughout the lamp housing, and
is configured to emit light out of the top surface of the lamp
housing.
[0025] In accordance with other embodiments, an apparatus includes
a honey cone heater. The honey cone heater includes a lamp housing
having an outer edge, wherein the outer edge forms a partial
circle. The lamp housing has an opening extending from a top
surface to a bottom surface of the lamp housing, wherein the
opening further extends from the outer edge into a center region of
lamp housing. The lamp housing has a first edge and a second edge
facing the opening, wherein each of the first edge and the second
edge extends from the top surface to the bottom surface of the lamp
housing, and extends from the outer edge to the center region of
the circle. A plurality of lamps is distributed throughout the lamp
housing. A shaft penetrates through the center region of the lamp
housing. A susceptor is over and joined to the shaft, wherein the
shaft and the susceptor are configured to rotate along an axis of
the shaft.
[0026] In accordance with yet other embodiments, an apparatus
includes a honey cone heater. The honey cone heater has a lamp
housing that has a top surface and a bottom surface, wherein the
top surface has a first portion farther away from a center region
of the lamp housing than a second portion of the top surface, and
wherein the first portion and the second portion are non-coplanar.
A plurality of lamps is distributed throughout the lamp housing. A
shaft penetrates through the center region of the lamp housing. A
susceptor is over the shaft and the lamp housing, wherein the shaft
and the susceptor are joined to each other.
[0027] Although the embodiments and their advantages have been
described in detail, it should be understood that various changes,
substitutions and alterations can be made herein without departing
from the spirit and scope of the embodiments as defined by the
appended claims. Moreover, the scope of the present application is
not intended to be limited to the particular embodiments of the
process, machine, manufacture, and composition of matter, means,
methods and steps described in the specification. As one of
ordinary skill in the art will readily appreciate from the
disclosure, processes, machines, manufacture, compositions of
matter, means, methods, or steps, presently existing or later to be
developed, that perform substantially the same function or achieve
substantially the same result as the corresponding embodiments
described herein may be utilized according to the disclosure.
Accordingly, the appended claims are intended to include within
their scope such processes, machines, manufacture, compositions of
matter, means, methods, or steps. In addition, each claim
constitutes a separate embodiment, and the combination of various
claims and embodiments are within the scope of the disclosure.
* * * * *