U.S. patent application number 12/650076 was filed with the patent office on 2010-07-22 for non-volatile memory device and method for fabricating non-volatile memory device.
This patent application is currently assigned to Samsung Electronics Co., Ltd.. Invention is credited to Sang Won Bae, Daehyuk Kang, Young-Hoo Kim, Youngok Kim, Kuntack Lee, Boun Yoon.
Application Number | 20100181610 12/650076 |
Document ID | / |
Family ID | 42336228 |
Filed Date | 2010-07-22 |
United States Patent
Application |
20100181610 |
Kind Code |
A1 |
Kim; Young-Hoo ; et
al. |
July 22, 2010 |
NON-VOLATILE MEMORY DEVICE AND METHOD FOR FABRICATING NON-VOLATILE
MEMORY DEVICE
Abstract
Provided are nonvolatile memory devices with a three-dimensional
structure and methods of fabricating the same. The nonvolatile
memory device includes conductive patterns three-dimensionally
arranged on a semiconductor substrate, semiconductor patterns that
extend from the semiconductor substrate and intersect one-side
walls of the conductive patterns, charge storage layers interposed
between the semiconductor patterns and one-side walls of the
conductive patterns, and seed layer patterns interposed between the
charge storage layers and one-side walls of the conductive
patterns.
Inventors: |
Kim; Young-Hoo;
(Seongnam-si, KR) ; Kang; Daehyuk; (Hwaseong-si,
KR) ; Kim; Youngok; (Suwon-si, KR) ; Bae; Sang
Won; (Namdong-gu, KR) ; Yoon; Boun; (Seoul,
KR) ; Lee; Kuntack; (Suwon-si, KR) |
Correspondence
Address: |
MYERS BIGEL SIBLEY & SAJOVEC
PO BOX 37428
RALEIGH
NC
27627
US
|
Assignee: |
Samsung Electronics Co.,
Ltd.
|
Family ID: |
42336228 |
Appl. No.: |
12/650076 |
Filed: |
December 30, 2009 |
Current U.S.
Class: |
257/314 ;
257/E29.309 |
Current CPC
Class: |
H01L 27/11556 20130101;
H01L 27/11551 20130101; H01L 27/11582 20130101; H01L 27/11578
20130101; H01L 29/792 20130101; H01L 29/7926 20130101 |
Class at
Publication: |
257/314 ;
257/E29.309 |
International
Class: |
H01L 29/792 20060101
H01L029/792 |
Foreign Application Data
Date |
Code |
Application Number |
Jan 19, 2009 |
KR |
10-2009-0004232 |
Claims
1. A nonvolatile memory device, comprising: conductive patterns
three-dimensionally arranged on a semiconductor substrate;
semiconductor patterns extending from the semiconductor substrate
and intersecting one-side walls of the conductive patterns; charge
storage layers interposed between the semiconductor patterns and
one-side walls of the conductive patterns; and seed layer patterns
interposed between the charge storage layers and one-side walls of
the conductive patterns.
2. The nonvolatile memory device as set forth in claim 1, further
comprising: insulating interlayer patterns interposed with the
conductive patterns; and wherein the one-side walls of the
conductive patterns and one-side walls of the insulating layer
patterns adjacent thereto are disposed on different perpendicular
lines.
3. The nonvolatile memory device as set forth in claim 2, further
comprising: extended portions corresponding to recessed portions of
the one-side walls of the conductive patterns disposed between the
insulating layer patterns vertically adjacent to each other;
wherein the seed layer patterns are disposed in the extended
portions.
4. The nonvolatile memory device as set forth in claim 2, wherein a
distance between the conductive patterns horizontally adjacent to
each other is larger than a distance between the insulating layer
patterns horizontally adjacent to each other.
5. The nonvolatile memory device as set forth in claim 1, wherein
respective ones of the seed layer patterns adjacent to respective
ones of the conductive patterns are isolated from respective ones
of the seed layer patterns adjacent to respective other ones of the
conductive patterns.
6.-11. (canceled)
Description
CROSS-REFERENCE TO RELATED APPLICATION
[0001] This U.S. non-provisional patent application claims priority
under 35 U.S.C. .sctn.119 of Korean Patent Application
10-2009-0004232, filed on Jan. 19, 2009, the entire contents of
which are hereby incorporated by reference.
BACKGROUND
[0002] An embodiment of the inventive concept relates to a
nonvolatile memory device, and, more particularly, to a nonvolatile
memory device with a three-dimensional structure capable of
improving electrical characteristics and a method of fabricating
the same.
[0003] In general, nonvolatile memory devices can electrically
erase and program data and can retain data even if power source is
interrupted. Recently, nonvolatile memory devices are increasingly
used in various fields.
[0004] These nonvolatile memory devices are provided with various
types of memory cell transistors. The nonvolatile memory devices
are classified into NAND type and NOR type according to cell array
structures. The NAND-type flash memory devices and the NOR-type
nonvolatile memory devices have both merits and demerits in high
integration and high-speed performance, respectively.
[0005] Specifically, NAND-type flash memory devices may be
advantageous for high integration due to a cell string structure in
which a plurality of memory cell transistors is connected in
series. In addition, because NAND-type flash memory devices use
operations that simultaneously change all information stored in the
plurality of memory cell transistors, information update speed of
the NAND-type flash memory devices is generally far faster than
that of the NOR-type nonvolatile memory device. Due to the high
integration and fast update speed, NAND-type flash memory devices
are mainly used for portable electronic products that require a
mass storage device, such as a digital camera and an MP3
player.
[0006] Research and development efforts have been active in
promoting and improving markedly the merits of NAND-type flash
memory devices. Recent developments have been made with respect to
NAND-type flash memory devices with a three-dimensional
structure.
SUMMARY OF THE INVENTION
[0007] An embodiment of the inventive concept is directed to an
NAND-type flash memory device with a three-dimensional structure in
which electrical characteristics are improved.
[0008] An embodiment of the inventive concept is also directed to a
method of fabricating an NAND-type flash memory device with a
three-dimensional structure in which electrical characteristics and
efficiency in a fabricating process are improved.
[0009] An exemplary embodiment of the inventive concept is to
provide a nonvolatile memory device including: conductive patterns
three-dimensionally arranged on a semiconductor substrate;
semiconductor patterns extending from the semiconductor substrate
and intersecting one-side walls of the conductive patterns; charge
storage layers interposed between the semiconductor patterns and
one-side walls of the conductive patterns; and seed layer patterns
interposed between the charge storage layers and one-side walls of
the conductive patterns.
[0010] Another exemplary embodiment of the inventive concept is to
provide a method of fabricating a nonvolatile memory device
including: alternatively stacking first and second insulating
layers having different etching rates, respectively, on a
semiconductor substrate; forming a first trench that exposes
one-side wall of the first and second insulating layers by
penetrating the first and second insulating layers; faulting
extended portions that extend in a direction parallel to the
semiconductor substrate from the first trench by removing a portion
of the second insulating layer exposed by the first trench; forming
seed layer patterns that come in contact with a sidewall of the
second insulating layer in the extended portions; forming a second
trench that exposes the other sidewall of the first and second
insulating layers by penetrating the first and second insulating
layers; forming openings that expose the seed layer patterns by
removing the second insulating layer exposed by the second trench;
and forming locally conductive patterns in the openings by using
the seed layer patterns.
BRIEF DESCRIPTION OF THE DRAWINGS
[0011] The accompanying drawings are included to provide a further
understanding of the invention, and are incorporated in and
constitute a part of this specification. The drawings illustrate
example embodiments of the inventive concept and, together with the
description, serve to explain principles of the inventive concept.
In the drawings:
[0012] FIG. 1 is a schematic circuit diagram of a nonvolatile
memory device according to an embodiment of the inventive
concept;
[0013] FIG. 2 is a diagram illustrating a nonvolatile memory device
according to an embodiment of the inventive concept.
[0014] FIGS. 3 to 10 are diagrams illustrating a method for
fabricating a nonvolatile memory device according to an embodiment
of the inventive concept, in order of process.
[0015] FIG. 11 is a schematic block diagram illustrating an example
of a memory system including a nonvolatile memory device according
to an embodiment of the inventive concept.
[0016] FIG. 12 is a schematic block diagram illustrating an example
of a memory card including a nonvolatile memory device according to
an embodiment of the inventive concept.
[0017] FIG. 13 is a schematic block diagram illustrating an example
of an information process system including a nonvolatile memory
device according to an embodiment of the inventive concept.
DETAILED DESCRIPTION
[0018] Exemplary embodiments of the inventive concept will be
described below in more detail with reference to the accompanying
drawings. The inventive concept may, however, be embodied in
different forms and should not be constructed as limited to the
embodiments set forth herein. Rather, these embodiments are
provided so that this disclosure will be thorough and complete, and
will fully convey the scope of the invention to those skilled in
the art. Like numerals refer to like elements throughout the
specification.
[0019] The terminology used herein is for the purpose of describing
various embodiments only and is not intended to be limiting of
example embodiments. As used herein, the singular forms "a," "an,"
and "the" are intended to include the plural forms as well, unless
the context clearly indicates otherwise. It will be further
understood that the terms "comprises" and/or "comprising," when
used in this specification, specify the presence of stated
features, integers, steps, operations, elements, and/or components,
but do not preclude the presence or addition of one or more other
features, integers, steps, operations, elements, components, and/or
groups thereof. In addition, it will be understood that when a
layer is referred to as being "on" another layer or a substrate, it
may be directly on another layer or substrate or intervening layers
may be present.
[0020] Example embodiments are described herein with reference to
cross-sectional illustrations and/or plane illustrations that are
schematic illustrations of idealized embodiments of example
embodiments. In drawings, the thickness of layers and regions is
exaggerated to effectively describe technical details. Accordingly,
variations from the shapes of the illustrations as a result, for
example, of manufacturing techniques and/or tolerances, are to be
expected. Thus, example embodiments should not be construed as
limited to the shapes of regions illustrated herein but are to
include deviations in shapes that result, for example, from
manufacturing. For example, an etching region illustrated as a
rectangle will, typically, have rounded or curved features. Thus,
the regions illustrated in the figures are schematic in nature and
their shapes are not intended to illustrate the actual shape of a
region of a device and are not intended to limit the scope of
example embodiments.
[0021] Exemplary embodiments of the inventive concept will now be
described in conjunction with the accompanying drawings. The
nonvolatile memory device according to embodiments of the inventive
concept has a three-dimensional structure.
[0022] FIG. 1 is a circuit diagram illustrating a nonvolatile
memory device according to an embodiment of the inventive
concept.
[0023] Referring FIG. 1, the nonvolatile memory device according to
an embodiment of the inventive concept includes a cell array having
a plurality of strings STRs. The cell array includes a plurality of
bit lines BL1 to BL3, word lines WL1 to WL4, upper and lower
selection lines USL1 to USL3 and LSL, and a common source line CSL.
In addition, the cell array includes a plurality of strings STRs
between the bit lines BL1 to BL3 and the common source line
CSL.
[0024] Each of the strings STRs includes upper and lower selection
transistors UST and LST and a plurality of memory cell transistors
MC connected between the upper and lower selection transistors UST
and LST in series. A drain of the upper selection transistor UST is
connected to the bit lines BL1 and BL3, and a source of the lower
selection transistor LST is connected to the common source line
CSL. The common source line CSL is a line to which the sources of
the lower selection transistors LSTs are connected in common.
[0025] Further, the upper selection transistors USTs are connected
to the upper selection lines USL1 and USL3, and each of the lower
selection transistors LSTs is connected to the lower selection line
LSL. In addition, each of memory cells MCs is connected to word
lines WL1 to WL4.
[0026] Because the above-described cell array is arranged in a
three-dimensional structure, the strings STRs have a structure in
which the memory cells MCs are connected to each other in series in
a z-axis direction perpendicular to an x-y plane in parallel to the
upper surface of a substrate. Accordingly, channels of the
selection transistors UST and LST and channels of the memory cell
transistors MCs may be formed perpendicular to x-y plane.
[0027] In the nonvolatile memory device with the three-dimensional
structure, m memory cells may be formed in each x-y plane, and the
x-y plane having the m memory cells may be stacked with n layers
(where, m and n are natural numbers, respectively).
[0028] FIG. 2 is diagram illustrating the nonvolatile memory device
according to an embodiment of the inventive concept.
[0029] Referring to FIG. 2, an impurity area (or well) 102 may be
formed in the semiconductor substrate 100 to provide a common
source line, and insulating layers and conductive layers may
alternately be arranged on the impurity area 102.
[0030] More specifically, the insulating layer includes line-typed
insulating layer patterns 110, and the conductive layer includes
line-typed gate electrodes (i.e. word line) 170. The Insulating
layer patterns 110 and the gate electrodes 170 are alternately
stacked, thereby forming a stacked structure. The insulating layer
patterns 110 or the gate electrodes 170 may be arranged so as to be
spaced apart from each other. That is, the gate electrodes 170 may
be three-dimensionally arranged on the semiconductor substrate 100.
The gate electrodes 170 three-dimensionally arranged on the
semiconductor substrate 100 may be a polycrystalline semiconductor
layer formed by an epitaxial growth process. Further, the gate
electrodes 170 may be a metal layer formed by a plating
process.
[0031] Extended portions are formed between the insulating layer
patterns 110 alternately stacked on the semiconductor substrate
100. The extended portions are formed by recessing first sidewalls
of the gate electrodes 170. In the insulating layer pattern 110 and
the gate electrodes 170 alternately stacked on the semiconductor
substrate 100, the first sidewalls perpendicular to the
semiconductor substrate 100 may be misaligned with each other.
Specifically, the first sidewalls of the insulating layer patterns
110 and the first sidewalls of the gate electrodes 170 are arranged
on different perpendicular lines in the stacked structure formed
with the insulating layer pattern 100 and the gate electrodes 170.
Furthermore, the stacked structures in which the first sidewalls
are misaligned are spaced apart from each other at a predetermined
distance, but may have a mirror-symmetry. That is, the stacked
structures adjacent to each other may be arranged so that the
misaligned first sidewalls face each other. For this reason, a
distance between the gate electrodes 170 horizontally adjacent to
each other may be greater than that between the insulating layer
patterns 110 horizontally adjacent to each other.
[0032] Channel semiconductor patterns 148 are located on the first
sidewalls of the stacked structure in which the insulating layer
patterns 110 and gate electrodes 170 are alternately stacked. The
channel semiconductor patterns 148 transverse the first sidewalls
of the insulating layer patterns 110. The channel semiconductor
patterns 148 may form a line perpendicular to the semiconductor
substrate 100. Specifically, the channel semiconductor patterns 148
extend in the direction perpendicular to the semiconductor
substrate 100, and the plurality of gate electrodes 170 is
transversely formed on the sidewall of each channel semiconductor
pattern 148. At this time, because the first sidewall of the
stacked structure is misaligned, the channel semiconductor patterns
148 may be spaced apart from the first sidewalls of the gate
electrodes 170. Further, because the first sidewalls of the stacked
structures face each other, the channel semiconductor patterns 148
may be arranged so as to face each other. An insulating layer 150
may be formed between the channel semiconductor patterns 148 facing
each other. In addition, the channel semiconductor patterns 148
extending in the direction perpendicular to the semiconductor
substrate 100 are electrically connected to the bit lines 190 that
transverse the gate electrodes 170. The bit lines 190 may come
directly in contact with the upper surface of the channel
semiconductor pattern 148 or may be electrically connected to the
upper surface of the channel semiconductor pattern 148 through bit
line contacts.
[0033] Furthermore, a charge storage layer 144 and a seed layer
pattern 142 are provided between the first sidewall of the gate
electrode 170 and the channel semiconductor pattern 148.
[0034] The seed layer pattern 142 may be locally formed between the
insulating layer patterns 110 adjacent to each other. Specifically,
the seed layer pattern 142 may be conformally formed along the
first sidewall of the gate electrode 170 and the upper and lower
surface of the insulating layer pattern 110. In addition, the seed
layer patterns 142 are separated from any seed layer patterns 142
formed on the first sidewall of any gate electrodes 170. These seed
layer patterns 142 may be a poly crystalline semiconductor layer.
Moreover, the seed layer patterns 142 may be a metal layer such as
Cu, Ru, Co, Pt, Pd, Au, and Ag. When the seed layer patterns 142
are the metal layer, metal barrier layers (not shown), such as Ti
and TiN, may be formed between the seed layer patterns 142 and the
gate electrodes 170.
[0035] Charge storage layers 144 may be formed between the seed
layer patterns 142 and the channel semiconductor patterns 148. The
charge storage layer 144 may be formed across the first sidewall of
the stacked structure or be locally formed on the first sidewall of
each of the gate electrodes 170 like the seed layer patterns 142.
When the charge storage layer 144 is formed across the first
sidewall of the stacked structure, it may be conformally formed
along the first sidewall of the misaligned stacked structure.
Because the charge storage layer conformally formed on the
misaligned first sidewall is bent between the insulating layer
patterns 110, it can reduce or prevent charges trapped in the
charge storage layer 144 from being spread into the direction
perpendicular to the semiconductor substrate 100. This charge
storage layer 144 includes a charge tunneling layer, a charge
trapping layer, and a charge blocking layer. The charge tunneling
layer comes in contact with the channel semiconductor pattern, and
the charge blocking layer is formed to come in contact with the
seed layer pattern 142.
[0036] In the nonvolatile memory device according to an embodiment
of the inventive concept, the first sidewalls of the gate electrode
170 and the insulating layer pattern 110 has a misaligned stacked
structure. Therefore, this structure may increase a distance
between the gate electrodes horizontally adjacent to each other.
Further, because the charge storage layer 144 is formed along the
misaligned first sidewalls of the gate electrode 170 and the
insulating layer pattern 110, the charge storage layer 144 may be
bent. Thus, it can reduce or prevent charges trapped in the charge
storage layer 144 from being spread into the direction
perpendicular to the semiconductor substrate 100.
[0037] Moreover, the second sidewalls of the insulating layer
pattern 100 and the gate electrode 170 may be aligned with each
other, and the second sidewalls of the insulating layer pattern 110
and the gate electrode 170, which are horizontally adjacent to each
other, may also be arranged to face each other. An insulating layer
180 may be formed between the second sidewalls of the insulating
layer pattern 110 and the gate electrode 170. Further, when the
gate electrodes 170 are formed of the metal layer, a capping layer
172 may be formed on the surface of the second sidewalls of the
insulating layer pattern 110 and the gate electrode 170 to prevent
the metal material from being spread.
[0038] Next, a method of fabricating the nonvolatile memory device
according to an embodiment of the inventive concept will be
described in detail with reference to FIG. 3 to FIG. 10.
[0039] FIGS. 3 to 10 are diagrams sequentially illustrating methods
of fabricating the nonvolatile memory device according to an
embodiment of the inventive concept.
[0040] Referring to FIG. 3, the first and second insulating layers
110 and 120 having a different wet etching rate are alternately
stacked on the semiconductor substrate 100. The semiconductor
substrate 100 may include an impurity area (or well) 102 and the
first and second insulating layers 110 and 120 may be alternately
stacked on the impurity area. At this time, the number of first and
second insulating layers 110 and 120 to be stacked may be changed
by the memory capacity, and the second insulating layer 120 may be
formed of materials having a high wet etching rate as compared to
the first insulating layer 110. For example, the first and second
insulating layers 110 and 120 may be formed of a silicon oxide and
a silicon nitride, respectively. Moreover, the first and second
insulating layers 110 and 120 may be formed of silicon oxides that
are different from each other in the wet etching rate.
[0041] Subsequently, first trenches 130 of a line shape are formed
on the stacked first and second insulating layers 110 and 120. The
first trenches 130 may be formed by a typical photolithography and
etching process. The semiconductor substrate 100, i.e. the impurity
area 102, may be exposed through the first trenches 130. The first
trenches 130 are formed of a line and may be formed in parallel
with each other so as to be spaced apart from each other at a
predetermined distance. Therefore, as the first trenches 130 are
formed, the first sidewalls of the stacked first and second
insulating layers 110 and 120 may be exposed by the first trenches
130.
[0042] Referring to FIG. 4, extended portions 132 may be formed
between the first insulating layers 110 by removing a portion of
the second insulating layers 120 exposed by the first trench 130.
The extended portions 132 extend in the direction in parallel with
the semiconductor substrate 100 from the first trench 130.
[0043] More specifically, a portion of the second insulating layers
120 may be etched by supplying a wet etchant into the first trench
130 exposing the first sidewalls of the first and second insulating
layers 110 and 120. At this time, because the second insulating
layers 120 are higher in wet etching rate than the first insulating
layers 110, when the wet etchant is supplied through the first
trench 130, the extended portions 132 may be formed between the
first insulating layers 110. For this reason, the first trench 130
may be formed that vertically penetrates the first and second
insulating layers 110 and 120 and includes the extended portions
132 between the first insulating layers 110. In other words, the
first sidewalls of the first insulating layer 110 and the second
insulating layer 120, which are exposed by the first trench 130,
may be misaligned. Therefore, the width of the first trench 130 in
the first insulating layers 110 is smaller than that of the first
trench 130 in the second insulating layers 120. As a result, the
inner wall of the first trench 130 may be bent.
[0044] Referring to FIG. 5, a seed layer 140 is conformally formed
along an inner wall of the first trench 130 in which the extended
portions 132 are formed. Specifically, the seed layer 140 may be
deposited on a first sidewall, an upper surface, and a lower
surface of the first insulating layer 110 exposed by the first
trench 130 and on a first sidewall of the second insulating layer
120 exposed by the first trench 130. The seed layer deposition
process may proceed to cover the first sidewall of the second
insulating layer 120 in the extended portion. For example, the seed
layer 140 may be a semiconductor layer, and this seed layer 140 may
be a thin layer including Si, Ge, or a mixture of these materials.
A polysilicon layer may typically be used. Furthermore, the seed
layer 140 may be formed of metal materials, such as Cu, Ru, Co, Pt,
Pd, Au, or Ag. Moreover, the seed layer 140 may be a metal nitride
layer such as TiN, TaN, or WN. The seed layer 140 may be formed to
have a thickness about 2 to 20 nm by using Chemical Vapor
Deposition (CVD) or an Atomic Layer Deposition (ALD).
[0045] Referring to FIG. 6, seed layer patterns 142 may be locally
formed in the extended portion 132 by removing the seed layer
formed on the first sidewalls of the first insulation layer 110.
The seed layer formed on the first sidewalls of the first
insulation layer 110 may be etched by an anisotropic etching, such
as an etch-back process. At this time, the seed layer 140 formed in
the extended portion 132, that is, the seed layer 140 formed on the
first sidewall of the second insulating layer 120 may remain due to
the characteristics of the anisotropic etching process.
Alternatively, after forming the seed layer 140, the seed layer 140
formed on the first sidewall of the first insulating layer 110 may
be removed by embedding sacrificial layers (not shown) in the first
trenches 130 and carrying out a photolithography and etching
process.
[0046] As the seed layer 140 is removed by the anisotropic etching,
seed layer patterns 142 may be formed. The seed layer patterns 142
come in contact with the first sidewall of the second insulating
layer 120 in the extended portion 132 and extend to the upper and
lower surface of the first insulating layer 110. The seed layer
patterns 142, which are vertically adjacent to each other, may be
electrically isolated from each other.
[0047] Referring to FIG. 7, a charge storage layer 144 and a
semiconductor layer 146 are sequentially formed along the surface
of the first trench 130 including the extended portions in which
the seed layer patterns 142 are formed.
[0048] The charge storage layer 144 may conformally be formed along
the first sidewall of the first insulating layer 110 and the
surface of the seed layer pattern 142. That is, the charge storage
layer 144 may cover the surface of the extended portions in which
the seed layer patterns 142 are formed and the first sidewall of
the first insulating layer 110. Because the first trench 130
includes the extended portions 132, the charge storage layer 144
may be bent. This charge storage layer 144 may be formed by
sequentially depositing a charge blocking layer, a charge trapping
layer, and a charge tunneling layer. That is, an oxide layer, a
nitride layer, and an oxide layer may be sequentially formed on the
surface of the first trench 130.
[0049] Moreover, the charge storage layer 144 may be locally formed
in the extended portion 132 together with the seed layer pattern
142. That is, after sequentially forming the seed layer and the
charge storage layer on the inner wall of the first trench 130
provided with the extended portion 132, the seed layer pattern and
the charge storage layer pattern may be locally formed in the
extended portion 132 by removing the seed layer and the charge
storage layer formed on the first sidewall of the first insulating
layer 110. Ultimately, the seed layer pattern and the charge
storage layer pattern, which are formed on the first sidewall of
the second insulating layer 120 and extend to the upper and lower
surface of the first insulating layer 110, may be formed in the
extended portion 132.
[0050] After forming the charge storage layer 146 on the inner wall
of the first trench 130, a channel semiconductor layer 146 is
formed on the charge storage layer 144. More specifically, the
channel semiconductor layer 146 is conformally deposited along the
inner wall of the first trench 130 in which the charge storage
layer 144 is formed. At this time, the channel semiconductor layer
146 may be deposited by the thickness that can embed the extended
portion 132 formed between the first insulating layers 110. Then,
the channel semiconductor layer 146, which is formed at the
impurity region 102 and the upper surface of the uppermost first
insulating layer 110, may be removed by anisotropic etching.
Accordingly, the channel semiconductor layers 146 facing each other
may be formed in the first trench 130.
[0051] These channel semiconductor layers 146 may be made of a
polycrystalline semiconductor and may be formed by using a chemical
vapor deposition process. Furthermore, the channel semiconductor
layer 146 made of a single crystalline semiconductor may be formed
in the first trenches 130 by carrying out an epitaxial growth
process that uses the semiconductor substrate 100 exposed by the
first trenches 130 as a seed layer.
[0052] After forming the channel semiconductor layers 146, an
insulating layer 150 may be formed between the channel
semiconductor layers 146 facing each other by embedding insulation
materials in the first trench 130 and planarizing it.
[0053] Referring to FIG. 8, second trenches 160 are formed between
the first trenches 130 provided with the channel semiconductor
layers 146, thereby exposing second sidewalls of the first and
second insulating layers 110 and 120. The second trenches 160 may
be formed by carrying out photolithography and dry etching
processes with respect to the stacked first and second insulating
layers 110 and 120. At this time, the second sidewalls of the first
and second insulating layers 110 and 120 exposed by the second
trenches 160 may be aligned by the anisotropic etching process. As
the first and second trenches 130 and 160 are formed, the first and
second insulating layers 110 and 120 on the semiconductor substrate
100 may form a line.
[0054] Referring to FIG. 9, the seed layer pattern 142 is exposed
in the second trench 160 by removing the second insulating layers
120 formed between the first insulating layers 110.
[0055] More specifically, a wet etchant is supplied into the second
trench 160 exposing the second sidewalls of the first and second
insulating layers 110 and 120. At this time, because the first
insulating layer 110 and the second insulating layer 120 are formed
of materials having relatively large differences in
wet-etching-rate, the second insulating layers 120 may selectively
removed. Accordingly, an opening 162 may be formed between the
stacked first insulating layers 110 to expose the seed layer
pattern 142. Further, because the channel semiconductor layer 146
and the charge storage layer 144 are not exposed in the second
trench 160 during removal of the second insulating layers 120 in
their entireties through the wet etching process, it can reduce or
prevent the channel semiconductor layer 146 and the charge storage
layer 144 from being damaged by the wet etching.
[0056] Referring to FIG. 10, gate electrodes 170 are formed on the
seed layer pattern 142 by filling conductive materials in the
opening 162. The gate electrodes 170 are locally formed between the
first insulating layers 110 and electrically isolated from other
gate electrodes 170. Therefore, the gate electrodes 170 may be
three-dimensionally disposed on the semiconductor substrate
100.
[0057] More specifically, when the seed layer pattern 142 exposed
in the second trench 160 is a polycrystalline semiconductor layer,
the gate electrodes 170 may be formed between the first insulating
layers 110 by carrying out the epitaxial growth process using the
seed layer pattern 142. The epitaxial growth process may be
controlled so that the second sidewalls of the first insulating
layer 110 may be filled with the conductive materials.
[0058] In addition, when the seed layer pattern 142 is formed of
metal materials, such as a copper, the gate electrodes 170 may be
formed by using electro plating or electroless plating. In forming
the gate electrodes 170 by the plating process, the seed layer
pattern 142 may increase the uniformity of plating layers and may
serve as an initial nucleation site.
[0059] In forming the gate electrodes 170 by using the epitaxial
growth process and the plating process, the gate electrodes 170 may
be locally formed between the first insulating layers 110 without a
patterning process for forming the gate electrodes 170. That is,
the gate electrodes 170 may be formed between the first insulating
layers 110 without etching a conductive layer as high as the first
insulating layers 110 stacked on the semiconductor substrate
100.
[0060] Referring again to FIG. 2, after forming the gate electrodes
170 made of the metal materials, the capping layer 172 may be
formed on the inner wall of the second trench 160. The capping
layer 172 may be formed of any material selected from, for example,
SiN, Ta, TaN, TaSiN, Ti, TiN, TiSiN, W, and WN or combinations
thereof.
[0061] The insulating layer 180 is embedded in the second trench
160 to cover the second sidewalls of the first insulating layer 110
and the surface of the gate electrodes 170.
[0062] Then, the channel semiconductor patterns 148 may be formed
by patterning the channel semiconductor layer 146 in the form of
line, which is formed on the first sidewall. Accordingly, it may
form the line-shaped channel semiconductor patterns 148 that
intersect one-side wall of the stacked gate electrodes 170 and are
spaced apart from each other. The channel semiconductor layer 146
may be patterned in the form of a line before the second trenches
160 are formed. Subsequently, the bit lines 190 may be formed on
the upper part of the gate electrodes 170 that are
three-dimensionally disposed. The bit lines 190 intersect the gate
electrodes 170 and are electrically connected to the channel
semiconductor patterns 148.
[0063] FIG. 11 is a schematic block diagram illustrating an example
of a memory system including a nonvolatile memory device according
to embodiments of the inventive concept.
[0064] Referring to FIG. 11, a memory system 1100 may be applicable
to a PDA, portable computer, web tablet, wireless phone, mobile
phone, digital music player, memory card, and/or all of devices
capable of transmitting and/or receiving information in wireless
environment.
[0065] The memory system 1100 includes a controller 1110, an
input/output (I/O) device 1120, such as a keypad, keyboard, and
display, a memory 1130, an interface 1140, and a bus 1150. The
memory 1130 and the interface 1140 communicate with each other
through the bus 1150.
[0066] The controller 1110 includes at least one microprocessor,
digital signal processer, microcontroller, or other processor
devices similar to these. The memory 1130 may be used for storing
instructions executed by the controller. The I/O device 1120 may
receive data or signals from the exterior of the system 1100 or may
output data or signals to the exterior of the system 1100. For
example, the I/O device 1120 may include a keypad, a keyboard, and
a display device.
[0067] The memory 1130 includes a nonvolatile memory device
according to embodiments of the inventive concept. The memory 1130
may further include other type of memory, such as volatile memory
capable of arbitrarily accessible whenever necessary, and various
types of memories.
[0068] The interface 1140 transmits data to a communication network
or receives data from a communication network.
[0069] FIG. 12 is a schematic block diagram illustrating an example
of memory card including a nonvolatile memory device according to
embodiments of the inventive concept.
[0070] Referring to FIG. 12, a memory card 1200 is provided with a
flash memory device according to embodiments of the inventive
concept to support a mass data storing capability. The memory card
1200 may include a memory controller 1220 for controlling all the
data exchanges between a host and the flash memory device 1210.
[0071] An SRAM 1221 is used as an operational memory of a CPU
(Central Processing Unit) 1222. A host interface 1223 may be
provided with a data exchange protocol between the memory card 1200
and the host. An ECC (Error Correction Code) 1224 may detect and
correct errors of data read from the flash memory device 1210. A
memory interface 1225 interfaces with the flash memory device 1210.
The CPU 1222 controls overall operations for the data exchange of
the memory controller 1220. Even though not illustrated in FIG. 11,
it will be apparent to those skilled in the art that the memory
card 1200 may further include a ROM (not shown) that stores code
data for interfacing with the host.
[0072] According to embodiments of the inventive concept, the flash
memory device and the memory card or the memory system may provide
a memory system having a high reliability through the flash memory
device 1210 in which an erasing characteristic of dummy cells is
improved. In particular, the flash memory device according to the
embodiments of the inventive concept may be provided in the memory
system, such as a semiconductor disk device (SSD: Solid State
Disk). In this case, it can provide a memory system having a high
reliability by preventing a reading error caused by the dummy
cells.
[0073] FIG. 13 is a schematic block diagram illustrating an example
of an information processing system including a nonvolatile memory
device according to embodiments of the inventive concept.
[0074] Referring to FIG. 13, a flash memory system 1310 is mounted
into an information processing system, such as a mobile products or
a desk top computer. An information processing system 1300 includes
a flash memory system 1310, a modem 1320, a central processing unit
1330, a RAM 1340, and a user interface 1350, which are electrically
connected to a system bus 1360, respectively. The flash memory
system 1310 may have substantially the same configuration as the
above-described memory system or flash memory system. Data, which
are processed by the CPU 1330 or input from the exterior, are
stored in the flash memory system 1310. Here, the flash memory
system may be configured by the semiconductor disk device (SSD). In
this case, the information processing system 1300 can stably store
the mass data in the flash memory system 1310. Moreover, as the
reliability increases, the flash memory system 1310 may reduce
resources required for error correction, thereby providing a
high-speed data exchange function to the information processing
system 1300. Although not illustrated in FIG. 13, it will be
apparent to those skilled in the art that an application chipset, a
Camera Image Processor (CIS), an input/output device and other
functionality may be further provided to the information process
system 1300 according to the embodiments of the inventive
concept.
[0075] The flash memory system or the memory system according to
the embodiments of the inventive concept may be mounted by various
types of packages. For example, the flash memory system or the
memory system may be packaged and mounted in such manners as
Package on Package (PoP), Ball Grid Arrays (BGAs), Chip Scale
Packages (CSPs), Plastic Leaded Chip Carrier (PLCC), Plastic Dual
In-Line Package (PDIP), Die in Waffle Pack, Die in Wafer Form, Chip
On Board (COB), Ceramic Dual In-Line Package (CERDIP), Plastic
Metric Quad Flat Pack (MQFP), Thin Quad Flatpack (TQFP), Small
Outline (SOIC), Shrink Small Outline Package (SSOP), Thin Small
Outline (TSOP), Thin Quad Flatpack (TQFP), System In Package (SIP),
Multi Chip Package (MCP), Wafer-level Fabricated Package (WFP),
Wafer-Level Processed Stack Package (WSP), and the like.
[0076] In the nonvolatile memory device and the method of
fabricating the nonvolatile memory device according to the
inventive concept, because one-side walls of the gate electrode and
insulating layer pattern are misaligned with each other, the
distance between the gate electrodes horizontally adjacent to each
other, that is, the distance between the charge trapping layers may
increase.
[0077] In addition, because the charge storage layer is formed
along sidewalls of the gate electrode and insulating layer pattern
that are misaligned with each other, the charge storage layer may
be bent. Therefore, it can suppress a spreading phenomenon in which
the charges trapped in the charge storage layer spreads out in a
direction perpendicular to the semiconductor substrate.
[0078] Furthermore, because the gate electrodes disposed
three-dimensionally on the semiconductor substrate are formed by
the epitaxial growth or electro-plating using the seed layer
patterns, the patterning process is not required with respect to
the gate electrodes, thereby improving process efficiency and
reliability of the nonvolatile memory device.
[0079] Although the inventive concept has been described in
connection with embodiments of the inventive concept illustrated in
the accompanying drawings, it is not limited thereto. It will be
apparent to those skilled in the art that various substitution,
modifications and changes may be thereto without departing from the
scope and spirit of the inventive concept.
* * * * *