U.S. patent application number 11/783115 was filed with the patent office on 2008-10-09 for lithographic apparatus and device manufacturing method.
This patent application is currently assigned to ASML Netherlands B.V.. Invention is credited to Paul Petrus Joannes Berkvens, Erik Roelof Loopstra, Henrikus Herman Marie Cox, Jeroen Johannes Sophia Maria Mertens, Wilhelmus Franciscus Johannes Simons.
Application Number | 20080246936 11/783115 |
Document ID | / |
Family ID | 39628437 |
Filed Date | 2008-10-09 |
United States Patent
Application |
20080246936 |
Kind Code |
A1 |
Loopstra; Erik Roelof ; et
al. |
October 9, 2008 |
Lithographic apparatus and device manufacturing method
Abstract
A position control system for a substrate support of a
lithographic apparatus includes a position measurement system
configured to determine a position of a sensor or sensor target on
the substrate support, a controller configured to provide a control
signal based on a desired position of a target portion of the
substrate and the determined position, and one or more actuators
configured to act on the substrate support. The position control
system includes a stiffness compensation model of the substrate
support, the stiffness compensation model including a relation
between a difference in a change in position of the target portion
and a change in position of the sensor or sensor target as a result
of a force exerted on the substrate support. The position control
system is configured to substantially correct at least during
projection of a patterned radiation beam on the target portion, the
position of the target portion using the stiffness compensation
model.
Inventors: |
Loopstra; Erik Roelof;
(Heeze, NL) ; Marie Cox; Henrikus Herman;
(Eindhoven, NL) ; Mertens; Jeroen Johannes Sophia
Maria; (Duizel, NL) ; Simons; Wilhelmus Franciscus
Johannes; (Beesel, NL) ; Berkvens; Paul Petrus
Joannes; (Veldhoven, NL) |
Correspondence
Address: |
PILLSBURY WINTHROP SHAW PITTMAN, LLP
P.O. BOX 10500
MCLEAN
VA
22102
US
|
Assignee: |
ASML Netherlands B.V.
Veldhoven
NL
|
Family ID: |
39628437 |
Appl. No.: |
11/783115 |
Filed: |
April 5, 2007 |
Current U.S.
Class: |
355/53 ; 355/67;
355/72; 355/75 |
Current CPC
Class: |
G03F 7/70725 20130101;
G05B 2219/45031 20130101; G05B 19/404 20130101; G03F 7/709
20130101; G05B 2219/49189 20130101 |
Class at
Publication: |
355/53 ; 355/67;
355/72; 355/75 |
International
Class: |
G03B 27/42 20060101
G03B027/42 |
Claims
1. A lithographic apparatus comprising: an illumination system
configured to condition a radiation beam; a patterning device
capable of imparting the radiation beam with a pattern in its
cross-section to form a patterned radiation beam; a substrate
support constructed to hold a substrate; a projection system
configured to project the patterned radiation beam onto a target
portion of the substrate; and a position control system configured
to control a position of the target portion of the substrate, the
position control system comprising a position measurement system
configured to determine a position of a sensor or sensor target on
the substrate support, a controller configured to provide a control
signal based on a desired position of the target portion and the
determined position; and one or more actuators configured to act on
the substrate support, wherein the position control system
comprises a stiffness compensation model of the substrate support,
the stiffness compensation model comprising a relation between a
force exerted on the substrate support and a resulting position
error of the target portion, the position control system configured
to substantially correct at least during projection of the
patterned radiation beam on the target portion, the position of the
target portion using the stiffness compensation model.
2. The lithographic apparatus of claim 1, wherein the stiffness
compensation model comprises one or more compensation gains for a
plurality of positions of the substrate support, each compensation
gain being dependent on a relation between a force signal and a
resulting position error of the target portion.
3. The lithographic apparatus of claim 2, wherein each of the
compensation gains is based on a transfer function of a force
signal to a resulting position error of the target portion.
4. The lithographic apparatus of claim 1, wherein the stiffness
compensation model comprises a relation between a force exerted on
the substrate support and a resulting difference between a position
error of the target portion and a position error of the sensor or
sensor target.
5. The lithographic apparatus of claim 4, wherein the stiffness
compensation model comprises one or more compensation gains for a
plurality of positions of the substrate support, each compensation
gain being dependent on a relation between a force signal and a
resulting difference in position error of the target portion and a
position error of the sensor or sensor target.
6. The lithographic apparatus of claim 5, wherein each of the
compensation gains is based on a transfer function of a force
signal to a resulting difference between a position error of the
target portion and a position error the sensor or sensor
target.
7. The lithographic apparatus of claim 2, wherein the stiffness
compensation model comprises compensation gains based on force
signals in six degrees of freedom to resulting position changes of
the target portion in six degrees of freedom for each of the
plurality of positions of the substrate support.
8. The lithographic apparatus of claim 2, wherein the plurality of
positions of the target portion extend in two degrees of
freedom.
9. The lithographic apparatus of claim 2, wherein the controller
comprises a feed-forward device, the stiffness compensation model
being part of the feed-forward device, the feed-forward device
being configured to provide a feed-forward signal by feeding a
force signal or equivalent thereof to the stiffness compensation
model.
10. The lithographic apparatus of claim 1, wherein the stiffness
compensation model is arranged in a feedback loop of the
controller.
11. The lithographic apparatus of claim 1, wherein the stiffness
compensation model is arranged in a combination of feed-forward and
feedback loop of the controller.
12. The lithographic apparatus of claim 1, wherein the stiffness
compensation model comprises a calculation device configured to
calculate compensation gains for positions of the substrate support
in between the plurality of positions of the substrate support.
13. The lithographic apparatus of claim 1, wherein one or more
forces are representative of a force exerted by one of the one or
more actuators of the substrate table.
14. The lithographic apparatus of claim 1, wherein one or more
forces are representative of a force exerted on the substrate table
or substrate by an immersion device.
15. The lithographic apparatus of claim 1, wherein the position
control system comprises a filter device configured to obtain the
required frequency content of the force signal before feeding it
into the stiffness compensation model.
16. The lithographic apparatus of claim 1, wherein the stiffness
compensation model is determined using finite element modeling.
17. A position control system configured to control a location on a
movable object, the system comprising: a position measurement
system configured to determine a position of a sensor or sensor
target on the movable object; a controller configured to provide a
control signal based on a desired position of the location on the
movable object and the determined position; one or more actuators
configured to act on the movable object, and a stiffness
compensation model of the movable object, the stiffness
compensation model comprising a relation between a force exerted on
the movable object and a resulting position error of the location
on the movable object, the position control system configured to
correct the position of the location using the stiffness
compensation model.
18. A lithographic apparatus comprising: an illumination system
configured to condition a radiation beam; a pattern support
constructed to support a patterning device, the patterning device
capable of imparting the radiation beam with a pattern in its
cross-section to form a patterned radiation beam; a substrate table
constructed to hold a substrate; a projection system configured to
project the patterned radiation beam onto a target portion of the
substrate; and a position control system configured to control a
pattern position of the patterning device, the position control
system comprising a position measurement system configured to
determine a position of a sensor or sensor target on the pattern
support, a controller configured to provide a control signal based
on a desired position of the pattern position and the determined
position, and one or more actuators configured to act on the
pattern support, wherein the position control system comprises a
stiffness compensation model of the pattern support, the stiffness
compensation model comprising a relation between a force exerted on
the pattern support and a resulting position error of the pattern
position, the position control system configured to substantially
correct at least during imparting the radiation beam with a
pattern, the position of the pattern position using the stiffness
compensation model.
19. The lithographic apparatus of claim 18, wherein the stiffness
compensation model comprises one or more compensation gains for a
plurality of positions of the pattern device support, each
compensation gain being dependent on a relation between a force
signal and a resulting position error of the pattern position.
20. The lithographic apparatus of claim 19, wherein each of the
compensation gains is based on a transfer function of a force
signal to a resulting position error of the pattern position.
21. A method for controlling a position of a target portion of a
substrate supported on a substrate support, the target portion to
be irradiated with a patterned beam of radiation, the method
comprising correcting position errors of the target portion the
correcting including determining force signals representative of
forces exerted on the substrate support and/or the substrate,
feeding the force signals to a stiffness compensation model of the
substrate support, the stiffness compensation model comprising a
relation between a force exerted on the substrate support and a
resulting position error of the target portion; and using an output
of the stiffness compensation model for correcting position errors
of the target portion.
22. A calibration method for determining a stiffness compensation
model of a substrate support in a lithographic apparatus, the
substrate support configured to hold a substrate that includes a
target portion, the stiffness compensation model comprising a
relation between a force exerted on the substrate support and a
resulting position error of the target portion, the method
comprising: exerting for each of a plurality of positions of the
substrate support a plurality of disturbance forces on the
substrate support, determining a frequency response function
between the disturbance forces and a resulting change in position
of the target portion; and generating for each of the plurality of
positions a compensation gain matrix, each compensation gain matrix
dependent on the position of the substrate support.
23. The method of claim 22, wherein the generating comprises
compensating for missing position signals by fitting a transfer
function for the missing position signals.
24. The method of claim 22, wherein the method further comprises
determining compensation gain matrices for positions of the
substrate support between the plurality of positions of the
substrate support by interpolation.
Description
BACKGROUND
[0001] 1. Field of the Invention
[0002] The present invention relates to a lithographic apparatus
and a method for manufacturing a device.
[0003] 2. Description of the Related Art
[0004] A lithographic apparatus is a machine that applies a desired
pattern onto a substrate, usually onto a target portion of the
substrate. A lithographic apparatus can be used, for example, in
the manufacture of integrated circuits (ICs). In such a case, a
patterning device, which is alternatively referred to as a mask or
a reticle, may be used to generate a circuit pattern to be formed
on an individual layer of the IC. This pattern can be transferred
onto a target portion (e.g. including part of, one, or several
dies) on a substrate (e.g. a silicon wafer). Transfer of the
pattern is typically via imaging onto a layer of
radiation-sensitive material (resist) provided on the substrate. In
general, a single substrate will contain a network of adjacent
target portions that are successively patterned. Conventional
lithographic apparatus include so-called steppers, in which each
target portion is irradiated by exposing an entire pattern onto the
target portion at once, and so-called scanners, in which each
target portion is irradiated by scanning the pattern through a
radiation beam in a given direction (the "scanning"-direction)
while synchronously scanning the substrate parallel or
anti-parallel to this direction. It is also possible to transfer
the pattern from the patterning device to the substrate by
imprinting the pattern onto the substrate.
[0005] The known lithographic apparatus includes a position control
system to control the position of the substrate support. This
position control system includes a position measurement system
which is configured to measure a number of sensor or sensor target
positions of the substrate support.
[0006] During use of the lithographic apparatus forces will be
exerted on the substrate support. For instance, during the exposure
phase, i.e. during projection of the patterned beam on a target
portion of the substrate level, level actuations may be performed
to position the upper surface of the substrate in a correct
orientation with respect to the lens column or projection system.
As the stiffness of the substrate support is limited, the level
actuations may cause temporary deformations of the substrate
support. Such deformations may lead to focus errors and/or offset
in overlay.
[0007] A known embodiment of the lithographic apparatus includes a
liquid confinement system which provides a liquid between the
substrate and a final element of the projection system to obtain
more suitable breaking indices between these elements in order to
improve the product quality. Such liquid confinement system or the
liquid itself may also during the exposure phase exert forces on
the substrate and therewith on the substrate support. These
external forces exerted by the liquid confinement system may also
result to temporary deformations in the substrate support and can
therefore result in focus errors and/or offset in overlay.
[0008] To reduce the risk on deformations of the substrate table
and as a consequence focus errors or overlay offset, it has been
proposed to increase the stiffness of the substrate support.
However, the increasing demand on accuracy and speed of the
positioning of the substrate support, the possibilities to increase
the stiffness of the substrate support without encountering further
problems, for instance with respect to weight may have come to
their limits.
SUMMARY
[0009] It is desirable to provide a position control system for a
lithographic apparatus in which the accuracy of the positioning of
the target portion with respect to the lens column or projection
system may be improved.
[0010] In an embodiment of the invention, there is provided a
lithographic apparatus including an illumination system configured
to condition a radiation beam; a patterning device capable of
imparting the radiation beam with a pattern in its cross-section to
form a patterned radiation beam; a substrate support constructed to
hold a substrate; and a projection system configured to project the
patterned radiation beam onto a target portion of the substrate,
wherein the lithographic apparatus includes a position control
system configured to control a position of the target portion,
wherein the position control system includes: a position
measurement system configured to determine a position of a sensor
or sensor target on the substrate support, a controller configured
to provide a control signal based on a desired position and the
determined position, and one or more actuators configured to act on
the substrate support, wherein the position control system includes
a stiffness compensation model of the substrate support, the
stiffness compensation model including a relation between a force
exerted on the substrate support and a resulting position error of
the target portion, wherein the position control system is
configured to substantially correct at least during the projection
of the patterned radiation beam on the target portion, the position
of the target portion using the stiffness compensation model.
[0011] In an embodiment of the invention, there is provided a
position control system configured to control a specific location
on a movable object, including: a position measurement system
configured to determine a position of a sensor or sensor target on
the movable object, a controller configured to provide a control
signal based on a desired position and the determined position, and
one or more actuators configured to act on the movable object,
wherein the position control system includes a stiffness
compensation model of the movable object, the stiffness
compensation model including a relation between a force exerted on
the movable object and a resulting position error of the specific
location on the movable object, and wherein the position control
system is configured to correct the position of the specific
location using the stiffness compensation model.
[0012] In an embodiment of the invention, there is provided a
lithographic apparatus including: an illumination system configured
to condition a radiation beam; a patterning device support
constructed to support a patterning device, the patterning device
capable of imparting the radiation beam with a pattern in its
cross-section to form a patterned radiation beam; a substrate table
constructed to hold a substrate; and a projection system configured
to project the patterned radiation beam onto a target portion of
the substrate, wherein the lithographic apparatus includes a
position control system configured to control a pattern position of
the pattern device, wherein the position control system includes: a
position measurement system configured to determine a position of a
sensor or sensor target on the pattern device support, a controller
configured to provide a control signal based on a desired position
and the determined position, and one or more actuators configured
to act on the pattern device support, wherein the position control
system includes a stiffness compensation model of the pattern
device support, the stiffness compensation model including a
relation between a force exerted on the pattern device support and
a resulting position error of the pattern position, wherein the
position control system is configured to substantially correct at
least during imparting the radiation beam with a pattern, the
position of the pattern position using the stiffness compensation
model.
[0013] In an embodiment of the invention, there is provided a
method for controlling the position of a target portion of a
substrate supported on a substrate support, the target portion to
be projected with a patterned beam of radiation, wherein position
control of the target portion includes correcting position errors
of the target portion the correcting including determining force
signals representative for forces exerted on the substrate table
and/or the substrate, feeding the force signals to a stiffness
compensation model of the substrate support, and using an output of
the stiffness compensation model for correcting position errors of
the target portion.
[0014] The stiffness compensation model of the substrate support
may include a relation between a force exerted on the substrate
support and a resulting position error of the target portion.
[0015] In an embodiment of the invention, there is provided a
calibration method for determining a stiffness compensation model
of a substrate support. The stiffness compensation model of the
substrate support may include a relation between a force exerted on
the substrate support and a resulting position error of a target
portion of the substrate. The method includes exerting in each of
the number of positions of the substrate support a number of
disturbance forces on the substrate support, determining a
frequency response function between the disturbance forces and a
resulting change in position of the target portion, generating for
each of the number of positions a compensation gain matrix, or
generating a compensation gain matrix, each compensation gain being
dependent on the position of the substrate support.
BRIEF DESCRIPTION OF THE DRAWINGS
[0016] Embodiments of the invention will now be described, by way
of example only, with reference to the accompanying schematic
drawings in which corresponding reference symbols indicate
corresponding parts, and in which:
[0017] FIG. 1 depicts a lithographic apparatus according to an
embodiment of the invention;
[0018] FIG. 2 depicts a stage of a lithographic apparatus according
to an embodiment of the invention;
[0019] FIG. 3 depicts schematically a control scheme of a
lithographic apparatus according for the embodiment of FIG. 2;
[0020] FIG. 4 depicts a frequency transfer function matrix
describing relation between servo and target portion error as a
result of acceleration forces on the substrate support determined
for a position of the substrate support in accordance with an
embodiment of the invention;
[0021] FIG. 5 depicts a stiffness compensation model according to
an embodiment of the invention; and
[0022] FIG. 6 depicts a control scheme for a lithographic apparatus
according to an embodiment of the invention including a liquid
confinement system.
DETAILED DESCRIPTION
[0023] FIG. 1 schematically depicts a lithographic apparatus
according to one embodiment of the invention. The apparatus
includes an illumination system (illuminator) IL configured to
condition a radiation beam B (e.g. UV radiation or any other
suitable radiation), a support structure or pattern support (e.g. a
mask table) MT constructed to support a patterning device (e.g. a
mask) MA and connected to a first positioning device PM configured
to accurately position the patterning device in accordance with
certain parameters. The apparatus also includes a substrate table
(e.g. a wafer table) WT or "substrate support" constructed to hold
a substrate (e.g. a resist-coated wafer) W and connected to a
second positioning device PW configured to accurately position the
substrate in accordance with certain parameters. The apparatus
further includes a projection system (e.g. a refractive projection
lens system) PS configured to project a pattern imparted to the
radiation beam B by patterning device MA onto a target portion C
(e.g. including one or more dies) of the substrate W.
[0024] The illumination system may include various types of optical
components, such as refractive, reflective, magnetic,
electromagnetic, electrostatic or other types of optical
components, or any combination thereof, for directing, shaping, or
controlling radiation.
[0025] The support structure supports, i.e. bears the weight of,
the patterning device. It holds the patterning device in a manner
that depends on the orientation of the patterning device, the
design of the lithographic apparatus, and other conditions, such as
for example whether or not the patterning device is held in a
vacuum environment. The support structure can use mechanical,
vacuum, electrostatic or other clamping techniques to hold the
patterning device. The support structure may be a frame or a table,
for example, which may be fixed or movable as required. The support
structure may ensure that the patterning device is at a desired
position, for example with respect to the projection system. Any
use of the terms "reticle" or "mask" herein may be considered
synonymous with the more general term "patterning device."
[0026] The term "patterning device" used herein should be broadly
interpreted as referring to any device that can be used to impart a
radiation beam with a pattern in its cross-section so as to create
a pattern in a target portion of the substrate. It should be noted
that the pattern imparted to the radiation beam may not exactly
correspond to the desired pattern in the target portion of the
substrate, for example if the pattern includes phase-shifting
features or so called assist features. Generally, the pattern
imparted to the radiation beam will correspond to a particular
functional layer in a device being created in the target portion,
such as an integrated circuit.
[0027] The patterning device may be transmissive or reflective.
Examples of patterning devices include masks, programmable mirror
arrays, and programmable LCD panels. Masks are well known in
lithography, and include mask types such as binary, alternating
phase-shift, and attenuated phase-shift, as well as various hybrid
mask types. An example of a programmable mirror array employs a
matrix arrangement of small mirrors, each of which can be
individually tilted so as to reflect an incoming radiation beam in
different directions. The tilted mirrors impart a pattern in a
radiation beam which is reflected by the mirror matrix.
[0028] The term "projection system" used herein should be broadly
interpreted as encompassing any type of projection system,
including refractive, reflective, catadioptric, magnetic,
electromagnetic and electrostatic optical systems, or any
combination thereof, as appropriate for the exposure radiation
being used, or for other factors such as the use of an immersion
liquid or the use of a vacuum. Any use of the term "projection
lens" herein may be considered as synonymous with the more general
term "projection system".
[0029] As here depicted, the apparatus is of a transmissive type
(e.g. employing a transmissive mask). Alternatively, the apparatus
may be of a reflective type (e.g. employing a programmable mirror
array of a type as referred to above, or employing a reflective
mask).
[0030] The lithographic apparatus may be of a type having two (dual
stage) or more substrate tables or "substrate supports" (and/or two
or more mask tables or "mask supports"). In such "multiple stage"
machines the additional tables or supports may be used in parallel,
or preparatory steps may be carried out on one or more tables or
supports while one or more other tables or supports are being used
for exposure.
[0031] The lithographic apparatus may also be of a type wherein at
least a portion of the substrate may be covered by a liquid having
a relatively high refractive index, e.g. water, so as to fill a
space between the projection system and the substrate. An immersion
liquid may also be applied to other spaces in the lithographic
apparatus, for example, between the mask and the projection system.
Immersion techniques can be used to increase the numerical aperture
of projection systems. The term "immersion" as used herein does not
mean that a structure, such as a substrate, must be submerged in
liquid, but rather only means that a liquid is located between the
projection system and the substrate during exposure.
[0032] Referring to FIG. 1, the illuminator IL receives a radiation
beam from a radiation source SO. The source and the lithographic
apparatus may be separate entities, for example when the source is
an excimer laser. In such cases, the source is not considered to
form part of the lithographic apparatus and the radiation beam is
passed from the source SO to the illuminator IL with the aid of a
beam delivery system BD including, for example, suitable directing
mirrors and/or a beam expander. In other cases the source may be an
integral part of the lithographic apparatus, for example when the
source is a mercury lamp. The source SO and the illuminator IL,
together with the beam delivery system BD if required, may be
referred to as a radiation system.
[0033] The illuminator IL may include an adjuster AD configured to
adjust the angular intensity distribution of the radiation beam.
Generally, at least the outer and/or inner radial extent (commonly
referred to as .sigma.-outer and .sigma.-inner, respectively) of
the intensity distribution in a pupil plane of the illuminator can
be adjusted. In addition, the illuminator IL may include various
other components, such as an integrator IN and a condenser CO. The
illuminator may be used to condition the radiation beam, to have a
desired uniformity and intensity distribution in its
cross-section.
[0034] The radiation beam B is incident on the patterning device
(e.g., mask MA), which is held on the support structure (e.g., mask
table MT), and is patterned by the patterning device. Having
traversed the patterning device (e.g. mask) MA, the radiation beam
B passes through the projection system PS, which focuses the beam
onto a target portion C of the substrate W. With the aid of the
second positioning device PW and position sensor IF (e.g. an
interferometric device, linear encoder or capacitive sensor), the
substrate table WT can be moved accurately, e.g. so as to position
different target portions C in the path of the radiation beam B.
Similarly, the first positioning device PM and another position
sensor (which is not explicitly depicted in FIG. 1) can be used to
accurately position the patterning device (e.g. mask) MA with
respect to the path of the radiation beam B, e.g. after mechanical
retrieval from a mask library, or during a scan. In general,
movement of the support structure or pattern support (e.g. mask
table) MT may be realized with the aid of a long-stroke module
(coarse positioning) and a short-stroke module (fine positioning),
which form part of the first positioning device PM. Similarly,
movement of the substrate table WT or "substrate support" may be
realized using a long-stroke module and a short-stroke module,
which form part of the second positioner PW. In the case of a
stepper (as opposed to a scanner) the support structure (e.g. mask
table) MT may be connected to a short-stroke actuator only, or may
be fixed. Patterning device (e.g. mask) MA and substrate W may be
aligned using mask alignment marks M1, M2 and substrate alignment
marks P1, P2. Although the substrate alignment marks as illustrated
occupy dedicated target portions, they may be located in spaces
between target portions (these are known as scribe-lane alignment
marks). Similarly, in situations in which more than one die is
provided on the mask MA, the mask alignment marks may be located
between the dies.
[0035] The depicted apparatus could be used in at least one of the
following modes:
[0036] 1. In step mode, the support structure (e.g. mask table) MT
or "pattern support" and the substrate table WT or "substrate
support" are kept essentially stationary, while an entire pattern
imparted to the radiation beam is projected onto a target portion C
at one time (i.e. a single static exposure). The substrate table WT
or "substrate support" is then shifted in the X and/or Y direction
so that a different target portion C can be exposed. In step mode,
the maximum size of the exposure field limits the size of the
target portion C imaged in a single static exposure.
[0037] 2. In scan mode, the support structure (e.g. mask table) MT
or "pattern support" and the substrate table WT or "substrate
support" are scanned synchronously while a pattern imparted to the
radiation beam is projected onto a target portion C (i.e. a single
dynamic exposure). The velocity and direction of the substrate
table WT or "substrate support" relative to the support structure
(e.g. mask table) MT or "pattern support" may be determined by the
(de-)magnification and image reversal characteristics of the
projection system PS. In scan mode, the maximum size of the
exposure field limits the width (in the non-scanning direction) of
the target portion in a single dynamic exposure, whereas the length
of the scanning motion determines the height (in the scanning
direction) of the target portion.
[0038] 3. In another mode, the support structure (e.g. mask table)
MT or "mask support" is kept essentially stationary holding a
programmable patterning device, and the substrate table WT or
"substrate support" is moved or scanned while a pattern imparted to
the radiation beam is projected onto a target portion C. In this
mode, generally a pulsed radiation source is employed and the
programmable patterning device is updated as required after each
movement of the substrate table WT or "substrate support" or in
between successive radiation pulses during a scan. This mode of
operation can be readily applied to maskless lithography that
utilizes programmable patterning device, such as a programmable
mirror array of a type as referred to above.
[0039] Combinations and/or variations on the above described modes
of use or entirely different modes of use may also be employed.
[0040] FIG. 2 shows a substrate support 1 supporting a substrate 2.
The substrate is subdivided in a number of target portions 3 as
shown in FIG. 1 on which subsequently a patterned beam is projected
with a projection system 4.
[0041] A position control system is provided to control the
position of the substrate support 2 in order to subsequently
position the different target portions 3 of the substrate 2 with
respect to the projection system 4. For this reason the substrate
support 1 is movable in a number of degrees of freedom, typically
three coplanar degrees of freedom (in a plane substantially
parallel to the substrate) or in six degrees of freedom.
[0042] The position control system includes a position measurement
system 5 to measure the position of the substrate support in a
suitable degrees of freedom, a controller 6 to provide control
signals at least on the basis of the position measured by the
position measurement system, and one or more actuators 7 to actuate
the substrate support 1 in a desired direction.
[0043] The position measurement system 5 is provided to measure the
position of the substrate support 1, and may for instance be an
interferometer system or an encoder-type measurement system. The
position measurement system 5 includes a number of sensors 8, for
instance encoder-type sensors, mounted on the substrate support 1
and a number of sensor targets 9 mounted on a substantially
stationary frame 10. In an alternative embodiment, the sensors may
be mounted on the metro-frame 10 while the sensor targets are
mounted on the substrate support 1. Any other type of measurement
suitable to measure the position of the substrate support with high
accuracy (nanometer accuracy) may be applied.
[0044] The controller includes a subtractor wherein the actual
position of the substrate support 2 is subtracted from a desired
position which is for instance given by a set-point generator. The
resulting signal which is often referred to as servo error is fed
into a controller unit which provides on the basis of the input of
the controller unit a control signal which is fed to the actuator
to actuate the substrate support 1 to a desired position.
[0045] The controller may further include a feed-forward device.
Such feed-forward device may provide a feed-forward signal on the
basis of a set-point signal or other reference signal. In such case
an addition device is arranged usually between the controller unit
and the actuator where the control signal and the feed-forward
signal are added to provide a second control signal which is fed to
the actuator 7.
[0046] The actuator 7 may be any actuator which is capable of
moving the substrate support 2 in a desired direction. The
actuators may be configured to actuate the substrate support in one
or more degrees of freedom. Two or more actuators may be provided
for actuation in different degrees of freedom or for actuation at
different locations on the substrate support 1. Such actuators and
actuator arrangements are known in the art.
[0047] The above position control system has been described with
respect to one degree of freedom. In practice, the position control
system will be configured to control the position of the substrate
support in a number of degrees of freedom, typically 3 co-planar
degrees of freedom or six degrees of freedom. For this reason, the
position control system 3 may include an arrangement of on or
multidimensional sensors configured to measure the position of the
substrate support in the desired number of degrees of freedom, as
well as an arrangement of one or multi-dimensional actuators to
make positioning of the substrate support in al desired degrees of
freedom possible.
[0048] Furthermore, the position control system 3 as described
above is directed at a control system to control the position of
the substrate support. Similar systems may be provided to control
the speed, acceleration or other relevant position related quantity
of the substrate support.
[0049] A position measurement system 5 as described above is
generally known. However, this position control system may not take
into account the internal flexibility of the substrate support.
When forces are exerted on the substrate support, the substrate
support may temporarily deform. As a result, a change of position
of one location of the substrate support does not automatically
result in a corresponding change of position of another location of
the substrate support. Such difference caused by the internal
flexibility of the substrate support may be in the same degree of
freedom, but also in different degrees of freedom, a so-called
cross-talk effect.
[0050] In general, there are three relevant locations on the
substrate support which are relevant for the position control of
the substrate support, when the flexibility of the substrate
support has to be taken into account. The first location is the
position of the sensor or sensor target mounted on the substrate
support. At this location the actual position of the substrate
support is determined. A second location of importance is the
location of the target portion of the substrate, since the goal of
position control of the substrate support is to control the
position of the target portion 3 with respect to the projection
system 4. A third location of importance is the location where a
force is exerted on the substrate support.
[0051] When an actuation force, or another force, is exerted on the
substrate support, due to the internal flexibility of the substrate
support the change in position of the first location and the second
location may be different. The controller will normally control the
position of the substrate support on the basis of the first
location as this is the position of the sensor or sensor target of
the position measurement system. Such correction may for instance
be performed using a feed-forward device.
[0052] However, although the control action may substantially
improve the positioning of this first location, it may have a
different effect on the second location. Since the flexibility of
the substrate support between the third location and the second
location may be different than the flexibility of the substrate
support between the first location and the second location.
Nevertheless it is desirable to actually control the position of
the second, i.e. the target portion, as this is the actual location
where a image is projected on the substrate.
[0053] In order to take the limited stiffness, i.e. the
flexibility, of the substrate support into account, the position
control system includes a stiffness compensation model which
includes a relation between a force exerted on the substrate
support and a resulting difference of change in position of the
target portion and the sensor or sensor target. The stiffness
compensation model may be arranged in a feed-forward part or in a
feedback part of the control loop or in a combination of
feedforward or feedback. Arrangement in the feed-forward loop may
be preferable in view of control stability.
[0054] In FIG. 3, a multivariable control scheme of a position
control system including a stiffness compensation model in a
feed-forward device is shown.
[0055] The control scheme of FIG. 3 is designed to compensate for
errors in the position of the target portion as a result of forces
which are exerted for level actuations during the projection phase
of a patterned beam on a target portion of a substrate, in
combination with the flexibility of the substrate stage. These
level actuations are made to take into account the irregularities
of the top surface of the substrate. During a so called measuring
phase, before the projection phase, a height map of the substrate
target portions, is made of these irregularities and during the
projection phase the substrate is moved to properly locate the
substrate with respect to the projection system. Such leveling is
described in more detail in U.S. Pat. No. 6,924,884, the contents
of which are herein incorporated by reference, and U.S. Pat. No.
7,019,815, the contents of which are herein incorporated by
reference.
[0056] In the control scheme of FIG. 3, a set-point generator SG
generates a position set-point sp-pos and an acceleration set-point
sp-acc for the substrate support. The actual position of the
substrate support as measured by the position measurement system is
subtracted from the position set-point in a subtractor and fed to a
controller unit CU which provides on the basis of this difference
between actual position and set-point position, i.e. the servo
error, a control force signal. The acceleration set-point sp-acc of
the set-point generator SG is fed into an acceleration feed-forward
unit FFacc which generates a feed-forward signal which is added to
the control signal and fed to a control signal to actuator force
transformation block CAFT that transforms the de-coupled controller
forces to force signals for the individual actuators to de-couple
the six degrees of freedom MIMO mechanics of the substrate support
in order to reduce cross talk-coupling matrices. The resulting
signal is fed to the actuator or actuators of the substrate support
for actuation of the substrate support ST to the desired
position.
[0057] Further, in the feed-forward device a stiffness compensation
model FFcomp is provided to compensate the difference between the
deformation of the substrate support at the location(s) of the
sensor(s) and the deformation at the location of the target portion
as a result of the forces being exerted on the substrate support
for the leveling of the substrate support ST. As the
(multi-dimensional) acceleration set-point is a representative
signal for the force actuated on the substrate support, this
acceleration set-point is used as a force signal which is fed into
the stiffness compensation matrix. Before being actually fed into
the compensation gain matrix, the acceleration set-point passes a
filter AF, e.g. a second order high pass filter which works as a
second order differentiator to convert the acceleration set-point
signal in a signal representative for the position change due to
flexibility of the substrate support at the target portion.
[0058] The compensation gain matrix includes a 6.times.6 matrix
Kcomp including a compensation gain for each relation between a
force in one of the six degrees of freedom and a resulting
compensation of the position of the target portion in one of the
six degrees of freedom. As the amount of compensation also depends
on the actual position of the substrate support, a matrix may be
provided for a number of positions of the substrate support. As the
movements of the substrate support during scanning are mainly
two-dimensional in the plane perpendicular to the axis of
projection (often called the z-direction), compensation gain
matrices may be provided for a number of positions of the substrate
support in this two dimensional plane (x-y-plane). A real-time
calculation device may be provided to calculate the compensation
gains for positions in between the number of positions for which
compensation gain matrices are determined.
[0059] In alternative embodiments a single compensation gain matrix
may be provided, wherein the compensation gains are a function of
the actual position of the substrate support.
[0060] The compensation gains are chosen such that the difference
between the change in position of the target portion and the change
of position of the sensor mounted on the substrate support as a
result of an actuation force being exerted on the substrate support
is compensates to position the target portion to be irradiated by
the projection system in the substantially correct position. Since
the compensation matrix is a multi-dimensional matrix this
correction may be performed in the same degree of freedom, for
instance actuation and correction in y-direction, but also in a
different direction, for instance a torque actuation in Rz
direction and a correction in z-direction. In general actuation in
each of the controlled degrees of freedom may lead to a position
correction in the same or each other degree of freedom.
[0061] By the above correction of the position by using the control
scheme of FIG. 3, the position control of the target portion of the
substrate supported on the substrate support is improved, resulting
in a better overlay and/or focus.
[0062] In an embodiment of the invention, a calibration method may
be used to obtain a stiffness compensation model as described
above. It will be appreciated for the man skilled in the art that
in order to obtain a proper position control of the target portion,
i.e. error compensation, the compensation gains of the stiffness
compensation model have to be determined. The calibration method of
the substrate support for obtaining a stiffness compensation model
will now be described in more detail.
[0063] FIG. 4 shows a 6.times.6 matrix of bode plots describing a
frequency transfer function for six input forces/accelerations (Fx,
Fy, Frz, Fz, Frx, Fry) to six position outputs (x, y, Rz, z, Rx,
Ry) of the servo error (solid line) in comparison with error of the
target portion of the substrate on the substrate support (dashed
line). These transfer functions can be obtained in an arrangement
in which both the position of the sensor(s) (servo) and the
position of the target portion (wafer) may be measured, whereby
subsequently the specific input forces are introduced to the
substrate table. In particular, in the off-diagonal transfer
functions, i.e. from an input in a degree of freedom to an output
in another degree of freedom, the flexibility of the substrate
support becomes clear. The transfer functions show that for some
input-output combinations the difference in sensitivity at the
location of the sensor (servo) and the target portion (wafer) may
be as large as 3 dB or even 10 dB. It is remarked that at high
frequencies, above 800-1500 Hz, the internal eigen frequencies
start to dominate the transfer functions.
[0064] Similar transfer functions may be obtained for different
positions of the substrate support. As the substrate support, at
least during the exposure phase, mainly moves in the x-y plane, the
transfer functions may be determined for a number of positions in
the x-y plane. It is remarked that a certain number of positions of
the substrate support relate to a specific target portion as in
these positions of the substrate support this specific target
portion is positioned under the projection system and is to be
illuminated.
[0065] In substantially the same arrangement the effect of other
forces exerted on the substrate or substrate support on the
positions of the sensor(s) and the target portion may be
obtained.
[0066] In a next step, the transfer function matrices including
position deformation as function of the forces/accelerations is
translated into a compensation matrix. This can be done by
multiplying the complex inverse transfer function of the substrate
support, or more general the mechanics of the movable object to be
controlled, with the desired ideal transfer function. The resulting
compensation model (shown in solid lines) is a frequency dependent
transfer function matrix for each measured x-y position of the
substrate support. It is desirable to obtain a more compact
compensation matrix. Such matrix can be obtained by fitting a real
function on the calculated compensation matrix (dashed lines). The
diagonal transfer functions (from one degree of freedom input to
same degree of freedom output) have a unity gain over the relevant
frequency range. The off-diagonal terms can be approximated by a
second order high pass filter with a +40 dB/decade slope.
[0067] Based on these approximations of the calculated compensation
matrix a real compensation matrix for each x-y position of the
substrate support is obtained.
[0068] An algorithm, for instance an interpolation algorithm may be
provided to calculate the compensation matrix for non-measured
positions of the substrate support, wherein the calculations for
instance are bases on values of adjacent measured positions of the
substrate support.
[0069] With respect to the above calibration method it is remarked
that any missing information regarding the position measurement of
the target portion during calibration for some degrees of freedom,
the missing frequency response functions may be fitted on the basis
of the information in the other degrees of freedom. However, it is
preferable to measure positions of both the target position and the
sensor/sensor target to obtain optimal compensation.
[0070] The position control system according to an embodiment of
the invention may also used for compensation of the positioning
error of a target portion of a substrate support due to the effect
of another force exerted on the substrate or substrate support in
combination with the flexibility of the substrate support. For
instance, in a lithographic apparatus in which a liquid confinement
system is used to provide a quantity of liquid between a target
portion of a substrate and a final lens element of the projection
system, the liquid confinement system may exert a force on the
substrate and/or substrate support. This force may be caused by
movement of the liquid confinement system itself, liquid flow
within the system, effects of the gas used to maintain the liquid
in the desired location, or by movement of the substrate support
with respect to the liquid confinement system.
[0071] It is known to estimate the forces exerted by a liquid
confinement system on a substrate support, by using the position of
the liquid confinement system/servo error and the control signal of
a position control system of the liquid confinement system. Such
estimation model is described in U.S. application Ser. No.
11/022,950, published as US2006/139613, the contents of which are
herein incorporated by reference.
[0072] In the control system described in U.S. Ser. No. 11/022,950
the estimated force is fed forward to the position control system
of the substrate support in order to provide a compensation force
for the force exerted on the substrate support. However, in this
control system the limited stiffness/flexibility of the substrate
support is not taken into account, which may cause focus and/or
overlay errors.
[0073] FIG. 6 shows a (simplified) control scheme according to an
embodiment of the present invention. This control scheme shows a
control scheme part CONliq for position control of the liquid
confinement system including a setpoint-generator SGliq, a
controller unit Cliq and the mechanics of the liquid confinement
system Pliq. The disturbance force exerted on the liquid
confinement system, which is also exerted in the opposed direction
on the substrate/substrate support is indicated with Fd. On the
basis of the servo error e and the control signal ctrl of the
controller unit Cliq, the disturbance estimator Dest estimates the
disturbance force Fdest.
[0074] The control scheme part of the substrate support CONsub,
includes a set-point generator SGsub, a controller unit Csub, and
the mechanics of the substrate support Psub. The disturbance force
Fd is added as -Fd in the control scheme as the force is opposed to
the force exerted on the liquid confinement system.
[0075] To compensate the position of the substrate support, as is
described in U.S. patent application Ser. No. 11/022,950 the
estimated disturbance force Fdest is subtracted from the control
signal of the substrate support controller Csub to compensate for
the disturbance force exerted on the substrate support. However,
this compensation force may not take into account the limited
stiffness of the substrate support.
[0076] Therefore, in accordance with an embodiment of the present
invention, the estimated force is also fed to the stiffness
compensation model SCMsub to calculate a compensation signal to be
fed into the control loop of the substrate support. By taking into
account the flexibility of the substrate support the target portion
may be positioned more accurately, and as a result the chance on
focus and/or overlay errors is substantially decreased.
[0077] Since the values of the stiffness compensation model depend
on the actual position of the substrate support, at least in the
x-y plane, the set point position is also fed in the stiffness
compensation model SCMsub. In an alternative embodiment, the actual
position of the substrate support may be fed into the stiffness
compensation model SCMsub.
[0078] Furthermore, instead of estimating the force on the basis of
a servo error and control signal of the liquid confinement system
position control system, the force to be fed into the stiffness
compensation model may be calculated or measured.
[0079] In the above description a stiffness compensation model has
been described for compensation of the position error of a target
portion of a substrate as a result of flexibility. A calibration
method has been described for obtaining this stiffness compensation
model. Any other suitable method for obtaining the stiffness
compensation model, for instance finite element modeling, may be
used and is regarded to fall within the scope of the present
invention.
[0080] In the above-described embodiments, the flexibility of the
substrate support has been taken into account for the positioning
of the target portion of a substrate supported on the substrate
support with respect to forces exerted on the substrate support at
least during exposure phase of the lithographic apparatus. Examples
of these forces are the actuation forces for leveling and the
forces exerted by the presence of a liquid confinement system. It
will be appreciated for the man skilled in the art that the
stiffness compensation model in accordance with an embodiment of
the invention may also be used for position compensation of the
target portion with respect to any other external force exerted on
the substrate support, when it is possible to calculate, measure or
estimate this external force so that is can be fed into the
stiffness compensation model. All such embodiments are deemed to
fall within the scope of the present invention.
[0081] The position control system according to an embodiment of
the invention may also be applied for the position control of a
specific location of a movable object in case the limited
stiffness/flexibility of the movable object should be taken into
account.
[0082] The position control system may be realized as software in a
computer program, or as a hardware control system, or a combination
thereof, or any other type of suitable control system.
[0083] Although specific reference may be made in this text to the
use of lithographic apparatus in the manufacture of ICs, it should
be understood that the lithographic apparatus described herein may
have other applications, such as the manufacture of integrated
optical systems, guidance and detection patterns for magnetic
domain memories, flat-panel displays, liquid-crystal displays
(LCDs), thin-film magnetic heads, etc. The skilled artisan will
appreciate that, in the context of such alternative applications,
any use of the terms "wafer" or "die" herein may be considered as
synonymous with the more general terms "substrate" or "target
portion", respectively. The substrate referred to herein may be
processed, before or after exposure, in for example a track (a tool
that typically applies a layer of resist to a substrate and
develops the exposed resist), a metrology tool and/or an inspection
tool. Where applicable, the disclosure herein may be applied to
such and other substrate processing tools. Further, the substrate
may be processed more than once, for example in order to create a
multi-layer IC, so that the term substrate used herein may also
refer to a substrate that already contains multiple processed
layers.
[0084] Although specific reference may have been made above to the
use of embodiments of the invention in the context of optical
lithography, it will be appreciated that the invention may be used
in other applications, for example imprint lithography, and where
the context allows, is not limited to optical lithography. In
imprint lithography a topography in a patterning device defines the
pattern created on a substrate. The topography of the patterning
device may be pressed into a layer of resist supplied to the
substrate whereupon the resist is cured by applying electromagnetic
radiation, heat, pressure or a combination thereof. The patterning
device is moved out of the resist leaving a pattern in it after the
resist is cured.
[0085] The terms "radiation" and "beam" used herein encompass all
types of electromagnetic radiation, including ultraviolet (UV)
radiation (e.g. having a wavelength of or about 365, 248, 193, 157
or 126 nm) and extreme ultra-violet (EUV) radiation (e.g. having a
wavelength in the range of 5-20 nm), as well as particle beams,
such as ion beams or electron beams.
[0086] The term "lens", where the context allows, may refer to any
one or combination of various types of optical components,
including refractive, reflective, magnetic, electromagnetic and
electrostatic optical components.
[0087] While specific embodiments of the invention have been
described above, it will be appreciated that the invention may be
practiced otherwise than as described. For example, the invention
may take the form of a computer program containing one or more
sequences of machine-readable instructions describing a method as
disclosed above, or a data storage medium (e.g. semiconductor
memory, magnetic or optical disk) having such a computer program
stored therein.
[0088] The descriptions above are intended to be illustrative, not
limiting. Thus, it will be apparent to one skilled in the art that
modifications may be made to the invention as described without
departing from the scope of the claims set out below.
* * * * *