U.S. patent application number 11/188156 was filed with the patent office on 2005-11-17 for method of attaching a leadframe to singulated semiconductor dice.
Invention is credited to Ahmad, Syed S., Jiang, Tongbi, Moden, Walter L..
Application Number | 20050255612 11/188156 |
Document ID | / |
Family ID | 25282292 |
Filed Date | 2005-11-17 |
United States Patent
Application |
20050255612 |
Kind Code |
A1 |
Jiang, Tongbi ; et
al. |
November 17, 2005 |
Method of attaching a leadframe to singulated semiconductor
dice
Abstract
The present invention is directed to a method of attaching a
leadframe to a singulated good die using a wet film adhesive
applied in a predetermined pattern on the active surface of the
good die, the lead finger of a leadframe, or both. By applying the
adhesive only to identified good dice, time and material are saved
over a process that applies adhesive to the entire wafer. By
attaching the leadframe to the good die with a wet film, it is
possible to remove the leadframe from the good die for rework if
the good die subsequently tests unacceptable.
Inventors: |
Jiang, Tongbi; (Boise,
ID) ; Ahmad, Syed S.; (Boise, ID) ; Moden,
Walter L.; (Meridian, ID) |
Correspondence
Address: |
TRASK BRITT
P.O. BOX 2550
SALT LAKE CITY
UT
84110
US
|
Family ID: |
25282292 |
Appl. No.: |
11/188156 |
Filed: |
July 22, 2005 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
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11188156 |
Jul 22, 2005 |
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10799948 |
Mar 12, 2004 |
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10799948 |
Mar 12, 2004 |
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10231727 |
Aug 28, 2002 |
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6706559 |
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10231727 |
Aug 28, 2002 |
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09938105 |
Aug 23, 2001 |
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6506628 |
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09938105 |
Aug 23, 2001 |
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09651461 |
Aug 30, 2000 |
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6312977 |
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09651461 |
Aug 30, 2000 |
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09433440 |
Nov 4, 1999 |
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6200833 |
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09433440 |
Nov 4, 1999 |
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08840403 |
Apr 29, 1997 |
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6017776 |
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Current U.S.
Class: |
438/15 ;
257/E23.039; 257/E23.04; 438/118; 438/123 |
Current CPC
Class: |
H01L 23/49513 20130101;
H01L 2224/32245 20130101; H01L 2924/01013 20130101; H01L 2224/05599
20130101; H01L 2224/48091 20130101; H01L 2224/73215 20130101; H01L
23/4951 20130101; H01L 2224/73257 20130101; H01L 2924/01006
20130101; H01L 2924/01005 20130101; H01L 2224/85399 20130101; H01L
24/32 20130101; H01L 2224/48247 20130101; H01L 2224/4826 20130101;
H01L 2924/00014 20130101; H01L 2924/01033 20130101; H01L 2224/32014
20130101; H01L 2924/00014 20130101; H01L 2924/01082 20130101; H01L
2924/00014 20130101; H01L 2224/48091 20130101; H01L 2224/83855
20130101; H01L 24/48 20130101; H01L 2224/83856 20130101; H01L
2224/05599 20130101; H01L 2924/01019 20130101; H01L 2924/01077
20130101; H01L 2224/85399 20130101; H01L 2224/73215 20130101; H01L
2924/01023 20130101; H01L 2224/32245 20130101; H01L 2924/207
20130101; H01L 2924/00014 20130101; H01L 2924/00014 20130101; H01L
2224/45099 20130101; H01L 2224/45015 20130101; H01L 2924/00
20130101; H01L 2224/4826 20130101; H01L 2924/00014 20130101 |
Class at
Publication: |
438/015 ;
438/123; 438/118 |
International
Class: |
H01L 021/66 |
Claims
What is claim:
1. A method of attaching at least one semiconductor die to at least
one lead of a plurality of leads of a lead frame, comprising:
applying an adhesive in a wet film state in a form of one of a
liquid and a paste to portions of the semiconductor die for
partially curing the adhesive from the wet film state to an
intermediate tacky and flowable state; and removably attaching a
portion of the at least one lead of the plurality of leads of the
lead frame to a portion of the semiconductor die using the
partially cured adhesive for determining if the semiconductor die
is one of an acceptable semiconductor die or an unacceptable
semiconductor die.
2. The method of claim 1, further comprising: testing the
semiconductor die to for determining if it is one of an acceptable
semiconductor die or an unacceptable semiconductor die.
3. The method of claim 2, further comprising: identifying criteria
for an acceptable semiconductor die including identifying criteria
from one of before an acceptable semiconductor die is separated
from a semiconductor wafer and after an acceptable semiconductor
die is separated from the semiconductor wafer.
4. The method of claim 2, further comprising: applying the adhesive
to the acceptable semiconductor die only after the acceptable
semiconductor die has been tested.
5. The method of claim 1, further comprising: curing the adhesive
after removably attaching the portion of the at least one lead of
the plurality of leads of the lead frame to the acceptable
semiconductor die.
6. The method of claim 1, wherein the adhesive is applied to more
than one separated semiconductor die at a time.
7. The method of claim 2, wherein the at least one lead of the
plurality of leads of the lead frame is attached to the acceptable
semiconductor die before the adhesive is partially cured to the
intermediate tacky and flowable state.
8. The method of claim 1, wherein the adhesive forms an adhesive
layer that is between 8 microns and 200 microns thick.
9. The method of claim 1, further comprising: applying the adhesive
to the plurality of leads of the lead frame before attaching the at
least one lead of the plurality of leads of the lead frame to the
acceptable semiconductor die.
10. An assembly of a semiconductor die and at least one lead of a
plurality of leads of a lead frame, comprising: a semiconductor die
having an uncured adhesive in a form of one of a liquid and a paste
to portions of the semiconductor die for partially curing the
adhesive to an intermediate tacky and flowable state; and removably
attaching a portion of the at least one lead of the plurality of
leads of the lead frame to a portion of a surface of the
semiconductor die using the adhesive when partially cured for
determining when the semiconductor die is one of an acceptable
semiconductor die or an unacceptable semiconductor die.
11. The method of claim 10, further comprising: testing the
semiconductor die to for determining if it is one of an acceptable
semiconductor die or an unacceptable semiconductor die.
12. The method of claim 11, further comprising: identifying
criteria for an acceptable semiconductor die including identifying
criteria from one of before an acceptable semiconductor die is
separated from a semiconductor wafer and after an acceptable
semiconductor die is separated from the semiconductor wafer.
13. The method of claim 11, further comprising: applying the
adhesive to the acceptable semiconductor die only after the
acceptable semiconductor die has been tested.
14. The method of claim 10, further comprising: curing the adhesive
after removably attaching the portion of the at least one lead of
the plurality of leads of the lead frame to the acceptable
semiconductor die.
15. The method of claim 10, wherein the adhesive is applied to more
than one separated semiconductor die at a time.
16. The method of claim 11, wherein the at least one lead of the
plurality of leads of the lead frame is attached to the acceptable
semiconductor die before the adhesive is partially cured to the
intermediate tacky and flowable state.
17. The method of claim 10, wherein the adhesive forms an adhesive
layer that is between 8 microns and 200 microns thick.
18. The method of claim 10, further comprising: applying the
adhesive to the plurality of leads of the lead frame before
attaching the at least one lead of the plurality of leads of the
lead frame to the acceptable semiconductor die.
Description
CROSS-REFERENCE TO RELATED APPLICATIONS
[0001] This application is a continuation of application Ser. No.
10/799,948, filed Mar. 12, 2004, pending, which is a continuation
of application Ser. No. 10/231,727, filed Aug. 28, 2002, now U.S.
Pat. No. 6,706,559, issued Mar. 16, 2004, which is a continuation
of application Ser. No. 09/938,105, filed Aug. 23, 2001, now U.S.
Pat. No. 6,506,628, issued Jan. 14, 2003, which is a continuation
of application Ser. No. 09/651,461, filed Aug. 30, 2000, now U.S.
Pat. No. 6,312,977, issued Nov. 6, 2001, which is a continuation of
application Ser. No. 09/433,440, filed Nov. 4, 1999, now U.S. Pat.
No. 6,200,833, issued Mar. 13, 2001, which is a continuation of
application Ser. No. 08/840,403, filed Apr. 29, 1997, now U.S. Pat.
No. 6,017,776, issued Jan. 25, 2000.
BACKGROUND OF THE INVENTION
[0002] 1. Field of the Invention
[0003] The present invention relates to semiconductor device
packaging. More particularly, the present invention relates to a
method for attaching a singulated good die, determined to be a good
die by the probe testing thereof while in wafer form, not to be
confused with known-good-die (KGD), which is a die known to be good
after the burn-in and testing thereof, to a leadframe by applying a
liquid or paste mixture of unreacted monomers or polymers or a
diluted resin deposited in a predetermined pattern on the active
surface of the semiconductor device, the leadframe, or both, after
the die has been separated from the wafer and probe tested.
[0004] 2. State of the Art
[0005] Well known types of semiconductor devices are connected to
components, typically a leadframe, and subsequently encapsulated in
thermo-setting plastic materials for use in a wide variety of
applications. A conventional type leadframe is typically formed
from a single, continuous sheet of metal, typically using metal
stamping operations. The leadframe includes an outer supporting
frame, a central semiconductor device supporting pad (die paddle)
and a plurality of lead fingers, each lead finger having, in turn,
a terminal bonding portion near the die paddle on which the
semiconductor device is located. Ultimately, the outer supporting
frame portions of the leadframe are removed after wire bonds are
connected between the contact pads of the semiconductor device and
the lead fingers of the leadframe and the encapsulation of the
semiconductor device and portions of the lead fingers.
[0006] In the assembly of semiconductor devices utilizing such
leadframes, a semiconductor device is secured to the die paddle
(such as by a solder or epoxy die-attach material, although a
double-sided adhesive tape has also been suggested in the art) and
then the entire leadframe, with the semiconductor device thereon,
is placed into a wire bonding apparatus, including a clamp assembly
for holding the leadframe and semiconductor device assembly, and
clamping the lead fingers for bonding.
[0007] In a standard wire bonding process, the bond wires are
attached, one at a time, from each bond pad on the semiconductor
device to a lead finger. The bond wires are generally attached
through one of three industry-standard wire bonding techniques:
ultrasonic bonding--using a combination of pressure and ultrasonic
vibration bursts to form a metallurgical cold weld;
thermocompression bonding--using a combination of pressure and
elevated temperature to form a weld; and thermosonic bonding--using
a combination of pressure, elevated temperature, and ultrasonic
vibration bursts.
[0008] U.S. Pat. No. 4,862,245, issued Aug. 29, 1989, to Pashby et
al., illustrates a so-called "leads over chip" arrangement ("LOC")
on the semiconductor die. A plurality of lead fingers extend over
the active surface of a semiconductor device toward a line of bond
pads wherein bond wires make the electrical connection between the
lead fingers and the bond pads. An alpha barrier, such as a
polyimide (for example, Kapton.TM.) tape, is adhered between the
semiconductor die and the lead fingers. This configuration, which
eliminates the use of the previously-referenced central die attach
pad (die paddle), may assist in limiting the ingress of corrosive
environment contaminants, achieve a larger portion of the lead
finger path length encapsulated in the packaging material, and
reduce electrical resistance caused by the bond wires (i.e. the
longer the bond wire, the higher the resistance) and potential wire
sweep problems aggravated by long wire loops. Clearly, such is in
contrast to a conventional leadframe and semiconductor die wherein
a larger semiconductor die cannot be encapsulated to form a smaller
package assembly, as the overall size of the conventional leadframe
having lead fingers extending adjacent the semiconductor device
governs the size of the encapsulated package.
[0009] The typical method for attaching the die to the lead fingers
in a LOC configuration is to use an adhesive tape having a
thermoplastic adhesive on both sides. The face of the die and the
lead fingers are attached to the adhesive tape using heat and
pressure. This process is expensive and complicated. The tape must
be precisely attached to the lead fingers and die face so that the
bond pads on the die face are not covered by the adhesive tape. In
addition, different sizes of tapes and different tape punches must
be used for each die size.
[0010] U.S. Pat. No. 5,286,679, issued Feb. 15, 1994, to Farnworth
et al., and assigned to the assignee of the present invention
illustrates a method for attaching a die to a leadframe comprising
the steps of: forming an adhesive layer on a semiconductor wafer;
patterning the adhesive layer to clear streets for saw cutting and
to clear wire bond pads; separating the dice from the wafer;
heating the adhesive layer; and attaching the lead fingers by
pressing the lead fingers and die together. In an alternative
embodiment, the adhesive layer is applied to the lead fingers of
the leadframe rather than to the wafer. The adhesive used is either
a thermoplastic adhesive, such as a polyimide, or a thermoset
adhesive, such as a phenolic resin. Suggested methods for
depositing and patterning the adhesive are: hot screen printing,
cold screen printing, resist etch back, and photopatterning. One
problem with such a method is that the adhesive layer is applied
and patterned to all dice on a wafer prior to sawing. It is not
unusual for the yield rate in die production to be low. Therefore,
adhesive is applied to many dice that are already known to be
defective after the probe testing thereof or that will be
subsequently rejected after singulation due to a failure to meet
acceptable performance criteria. This results in material waste and
decreased efficiency. Alternately, the '679 patent discloses the
application and patterning of adhesive after the dice have been
singulated. However, such requires the adhesive to be applied and
subsequently patterned, rather than adhesive applied in a
predetermined pattern to the singulated die in a single step.
[0011] In addition, it is difficult to rework or fix a die after
the lead fingers have been attached to the die face if a
thermoplastic or thermoset adhesive has been used. If a thermoset
adhesive was used, the lead fingers are permanently attached to the
die face. If a thermoplastic adhesive was used, it is necessary to
reheat the die and leadframe at a substantially elevated
temperature. Alternately, the adhesive has been applied to the lead
fingers of the leadframes which have been subsequently bonded to
the active surface of the semiconductor device before testing of
the semiconductor device has been completed, thereby making it
difficult or impossible to rework the semiconductor device if found
to be defective during testing.
[0012] Thus, it would be advantageous to develop a process for
packaging semiconductor devices that would reduce process steps and
reduce material waste.
BRIEF SUMMARY OF THE INVENTION
[0013] The present invention relates to a method for attaching a
singulated semiconductor die or batches of singulated semiconductor
dice to a leadframe by applying a liquid or paste mixture of
unreacted monomers or polymers or a diluted resin deposited in a
predetermined pattern on the die face, the leadframe, or both,
after the semiconductor die has been separated from the wafer and
tested sufficiently before or after separation to be referred to as
a good die.
[0014] The method of the present invention comprises the steps of
separating individual dice from a wafer; testing the dice or,
optionally, separating dice probe tested and found to be
acceptable; applying adhesive in a predetermined pattern to the
good die or expected to be good dice from the testing thereof; and
attaching the leadframe to the dice, either a die singly or in
batches of singulated dice. An intermediate curing step may be used
prior to attaching the leadframe to the dice. A post cure step may
also be used after the leadframe has been attached to the dice. The
adhesive is applied in a predetermined pattern to the die face or
the lead fingers of the leadframe or both. In addition, the
adhesive is applied as a wet film. Therefore, it is possible to
remove the leadframe from the die for reworking if the die is
subsequently determined to be bad. Because the adhesive is applied
only to good dice determined from the testing thereof, time and
material are saved as opposed to a process that applies adhesive to
all dice in a wafer or to singulated dice wherein the adhesive is
first applied to the dice and patterned thereafter.
BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWINGS
[0015] While the specification concludes with claims particularly
pointing out and distinctly claiming that which is regarded as the
present invention, the advantages of this invention can be more
readily ascertained from the following description of the invention
when read in conjunction with the accompanying drawings in
which:
[0016] FIG. 1 is a side view of a semiconductor device which
illustrates a semiconductor device produced with the method of the
present invention;
[0017] FIG. 2 is a top view of a semiconductor die coated with an
adhesive layer in accordance with the method of the present
invention;
[0018] FIG. 3 is a bottom view of a leadframe with the lead fingers
coated with an adhesive layer in accordance with the method of the
present invention;
[0019] FIG. 4 is a top view of a semiconductor wafer; and
[0020] FIG. 5 is a perspective view, partially broken away, of a
conventional packaged semiconductor device using a LOC type
configuration.
DETAILED DESCRIPTION OF THE INVENTION
[0021] As illustrated in drawing FIGS. 1 through 3, the lead
fingers 10 of a leadframe 30 have been secured to the active
surface 12 of semiconductor device 14 using a wet film adhesive 16
in accordance with the method of the present invention. The
leadframe 30 is electrically connected to the semiconductor device
(or good die) 14 by lead wires 18 (wire bonds) which connect the
bond pads 20 on the active surface 12 of the semiconductor device
14 to the lead fingers 10 of the leadframe 30.
[0022] Generally speaking, the method of the present invention
involves the following steps:
[0023] 1. Identifying individual dice known to be good or
acceptable for the intended usage thereof while still in wafer
form.
[0024] 2. Separating identified good dice individually from the
wafer.
[0025] 3. Further identifying the individual dice that meet
acceptable performance criteria (good die), if necessary, to the
extent necessary to identify the individual dice.
[0026] 4. Applying an adhesive in a predetermined pattern to the
active surface of the identified good die, the lead fingers of the
leadframe, or both.
[0027] 5. Attaching the lead fingers of the leadframe to the active
surface of the identified good die.
[0028] After the dice have been removed from the wafer, the next
step is to identify the individual dice that meet acceptable
performance criteria (good die). Identifying good dice involves
using any of the well-known testing methods. Preferably, the dice
are initially tested when in wafer form using well-known probe
testing techniques in the industry. The dice are removed from the
wafer after such probe testing, being subsequently tested
individually, if desired, or if probe testing cannot determine all
the desired information from the dice, because of the ease of
testing an individual die as opposed to the difficulty of probe
testing the dice of an entire wafer. After testing a die, it is
either moved on for further processing if it is good, or discarded
or sent for reworking if it is bad. In this manner, valuable
process time, adhesives, insulation tape, leadframes, and
encapsulation material are not wasted on dice that are bad.
[0029] In the first step of the method of the present invention, a
semiconductor wafer is diced to separate or remove individual dice
from the wafer, the wafer typically being diced by sawing. As
illustrated in drawing FIG. 2, a semiconductor device (good die) 14
has been removed from a semiconductor wafer. The semiconductor
wafer 40, as shown in drawing FIG. 4, contains a plurality of
semiconductor devices (dice) 42. Frequently, yield rates in
semiconductor device production are quite low because defects in
the individual die hinder the ability of a die to reach acceptable
performance standards set by the customer while the die may be
capable of meeting some performance standards. Processing the dice
while in the wafer state results in a tremendous waste of time and
material because many of the dice may be subsequently rejected due
to failure to meet acceptable performance criteria.
[0030] After the dice have been tested and the good dice have been
identified, the good dice are then placed in a fixture, either
singularly or in groups, for processing. The good dice are aligned
in the fixture to match the dice sites of the leadframe to which
they will be attached and connected.
[0031] The next step of the present invention involves applying an
adhesive 16 in a predetermined pattern on the active surface 12 of
a good die 14. Alternately, the adhesive may be applied in a
predetermined pattern to the lead fingers 10 of a leadframe 30, or
both, to the active surface 12 of a good die 14 and the lead
fingers 10 of a leadframe 30. As illustrated in drawing FIG. 2, the
active surface 12 of a good die 14 is selectively coated with the
adhesive 16 in a predetermined pattern using any well-known
technique, such as screen printing, roll-on, spray-on, stencil,
etc. In screen printing, the adhesive is applied with a squeegee
through a fine screen mesh that is coated in various areas to
define the desired application pattern. In a roll-on technique, the
adhesive is transferred to a soft, grooved roller and then onto the
surface. In spray-on applications, the adhesive is sprayed onto the
surface in the desired pattern using a spray gun. A stencil may be
used to obtain the desired pattern or non-application areas may be
masked to prevent application of the adhesive.
[0032] Alternatively, as illustrated in drawing FIG. 3, the
adhesive 16 may be applied to the lead fingers 10 of the leadframe
30. The adhesive 16 is applied in a predetermined pattern such that
the bond pads 20 and other desired areas are free from adhesive 16,
as shown in drawing FIGS. 2 and 3. The adhesive 16 may even be
applied to both the lead fingers 10 and the active surface 12 of
the good die 14.
[0033] In addition, the active surface 12 of the good die may be
coated with the adhesive 16 in-line on the die attacher by write
dispensing, stamp pad transfer, screen printing, or syringe
dispensing. In stamp pad transfer applications, the adhesive is
applied to a negative of the desired adhesive pattern. A pad then
transfers the desired adhesive pattern to the surface by first
contacting the negative and then being stamped on the active
surface of the good die. In syringe applications, a positive
pressure is applied to a syringe containing the adhesive in order
to extrude the adhesive onto the desired surface in the desired
predetermined pattern on the good die. In-line application of the
adhesive has the advantage of maintaining efficient production
rates while minimizing the use of adhesive in a predetermined
pattern on a good die.
[0034] The adhesive 16 is either a liquid or paste mixture of
unreacted monomers or polymers or a diluted resin. The adhesive 16
may be of two kinds of chemical mixtures. First, a curing type
contains solvent, monomers or intermediate polymers, and filler.
Second, a drying type contains solvent, polymeric resin
(pre-cured), and filler. In addition, the adhesive 16 may also be a
combination of the two types. The filler is used to increase the
thixotropic index and flowability, if desired or required. The
filler also decreases the coefficient of thermal expansion (CTE)
mismatch among the good die-adhesive-leadframe interfaces. The
filler may be of any well-known type such as fused or fumed silica.
The solvent and filler determine the rheologic characteristics
(form and flow) of the adhesive for various deposition techniques.
For example, screen printing requires a higher thixotropy and a
medium viscosity. As another example, the spray-on technique uses a
medium thixotropy and a lower viscosity. Conventional adhesives
suited for this application include polyimide or polyimide
siloxane. In addition, snap (or fast) cure epoxies can be used to
reduce cycle time.
[0035] The adhesive 16 is applied as a wet film in either a liquid
or paste, the optimal thickness typically being between 8 microns
and 200 microns. Because the good die 14 and leadframe 30 are
attached by a wet film and before the adhesive 16 has cured, the
leadframe 30 may be removed from the good die 14 subsequently for
whatever reason after the attachment of the leadframe 30 thereto.
Therefore, under the process of the present invention, if required,
rework of good dice becomes easier and less expensive.
[0036] If necessary, an intermediate curing step may be used. After
the adhesive 16 has been applied to the active surface 12 of the
good die 14 or lead fingers 10 of the leadframe 30 and before the
leadframe 30 is attached to the good die 14, the adhesive 16 can
then be "B staged" or partially cured. A "B-stage" resin is a resin
in an intermediate state of flow in a thermosetting reaction and is
tacky and capable of further flow.
[0037] The next step involves combining the leadframe 30 and the
good die 14. The leadframe 30 is attached to the good die 14 using
any well-known method, such as applying a force 21 to press the
leadframe 30 (see FIG. 3), adhesive 16, and good die 14 together,
as shown in drawing FIG. 1.
[0038] If necessary, a post curing step may be utilized. The liquid
layer of adhesive 16 may be cured or dried using ultraviolet (UV),
infrared (IR), or conventional or temperature zone ovens. If a
curing type adhesive is used, the monomers or intermediate polymers
will react under external energies such as ultraviolet light or
heat through chain polymerization and condensation. The chain
polymerization reaction is preferred as the condensation reaction
is susceptible to moisture attack because of potential voids and
byproducts, such as water, formed inside the adhesive. If a drying
type adhesive is used, the adhesive must be completely baked to
drive out the solvent. If a snap (or fast) cure epoxy is used, a
temperature zone oven may be employed.
[0039] Depending on application and manufacturing needs, an in-line
drying or curing system may be used to improve efficiency and
reliability. For example, a five and eight temperature zone oven
can increase throughput and help reduce voiding.
[0040] For increased efficiency, the process of the present
invention may be integrated into a die lamination process. This has
the advantage of reducing required floor space, reducing the number
of equipment pieces, reducing processing steps, and reducing the
logistics control. The result is a reduction in capital expenditure
and labor costs as well as increased throughput.
[0041] In a further embodiment, the present invention includes the
following additional steps:
[0042] 6. Identifying the good dice, now with attached lead
fingers, that fail to meet acceptable performance criteria (bad
die).
[0043] 7. Removing the lead fingers from the active surface of the
bad die.
[0044] 8. Fixing or reworking the die.
[0045] After the lead fingers 10 of the leadframe 30 have been
attached to the good die 14, the good die 14 may be tested again
using any well-known methods to identify dice that do not meet
acceptable performance standards (bad die). If the die meets
acceptable performance criteria, it is moved on for further
processing. If the die does not meet acceptable performance
standards as previously determined to be considered an acceptable
die, it may be sent for reworking in an attempt to meet such
acceptable performance standards. Because the good die 14 was
directly attached to the lead fingers 10 of the leadframe 30 with a
wet film adhesive 16 or an adhesive 16 that was only partially
cured, the leadframe 30 may be removed from the unacceptable
semiconductor device 14 for rework. In this manner, valuable
process time is not wasted on dice that are bad.
[0046] Having thus described in detail preferred embodiments of the
present invention, it is to be understood that the invention
defined by the appended claims is not to be limited by particular
details set forth in the above description as many apparent
variations thereof are possible without departing from the spirit
or scope thereof.
* * * * *