Moden; Walter L.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Moden; Walter L..The latest application filed is for "ball grid arrays and associated apparatuses and systems".

Company Profile

0.111.108

Moden; Walter L. - Boise ID
Moden; Walter L. - Meridian ID
Moden, Walter L. - Meridlan ID
MODEN, WALTER L. - MERODIAN ID

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Ball Grid Arrays And Associated Apparatuses And Systems App 20210375738 - Ovard; David K. ; et al.	2021-12-02
Semiconductor devices and packages and methods of forming semiconductor device packages Grant 10,083,937 - Veches , et al. September 25, 2	2018-09-25
Semiconductor Devices And Packages And Methods Of Forming Semiconductor Device Packages App 20170069603 - Veches; Anthony D. ; et al.	2017-03-09
Semiconductor devices and packages Grant 9,502,369 - Veches , et al. November 22, 2	2016-11-22
Semiconductor Devices And Packages And Methods Of Forming Semiconductor Device Packages App 20160225734 - Veches; Anthony D. ; et al.	2016-08-04
Grid array packages and assemblies including the same Grant 8,299,598 - Moden October 30, 2	2012-10-30
Methods for providing and using grid array packages Grant 8,198,138 - Moden June 12, 2	2012-06-12
Stackable semiconductor device assemblies Grant 8,164,175 - Moden April 24, 2	2012-04-24
Stackable ball grid array package Grant RE43,112 - Corisis , et al. January 17, 2	2012-01-17
Grid array packages Grant 8,049,317 - Moden November 1, 2	2011-11-01
Integrated circuit package support system Grant 8,035,974 - Corisis , et al. October 11, 2	2011-10-11
Vertical Surface Mount Assembly And Methods App 20110101514 - Kinsman; Larry D. ; et al.	2011-05-05
Integrated circuit package support system Grant 7,894,192 - Corisis , et al. February 22, 2	2011-02-22
Vertical surface mount assembly and methods Grant 7,871,859 - Kinsman , et al. January 18, 2	2011-01-18
Stackable ceramic FBGA for high thermal applications Grant 7,829,991 - Moden , et al. November 9, 2	2010-11-09
Grid Array Packages App 20100155966 - Moden; Walter L.	2010-06-24
Stackable Semiconductor Device Assemblies App 20100155930 - Moden; Walter L.	2010-06-24
Intergrated Circuit Package Support System App 20100148334 - Corisis; David J. ; et al.	2010-06-17
Grid Array Packages And Assemblies Including The Same App 20100148352 - Moden; Walter L.	2010-06-17
Semiconductor BGA package having a segmented voltage plane Grant 7,663,224 - Morrison , et al. February 16, 2	2010-02-16
Methods for securing packaged semiconductor devices to carrier substrates Grant 7,569,418 - Kinsman , et al. August 4, 2	2009-08-04
Method of making semiconductor BGA package having a segmented voltage plane Grant 7,501,313 - Morrison , et al. March 10, 2	2009-03-10
Assembly for stacked BGA packages Grant 7,408,255 - Corisis , et al. August 5, 2	2008-08-05
Module assembly for stacked BGA packages Grant 7,400,032 - Corisis , et al. July 15, 2	2008-07-15
Module assembly and method for stacked BGA packages Grant 7,396,702 - Corisis , et al. July 8, 2	2008-07-08
Flip-chip adaptor package for bare die Grant 7,381,591 - Moden June 3, 2	2008-06-03
Stackable Ceramic Fbga For High Thermal Applications App 20080042252 - Moden; Walter L. ; et al.	2008-02-21
Flip-chip adaptor package for bare die Grant 7,329,945 - Moden February 12, 2	2008-02-12
Flip Chip Adaptor Package For Bare Die App 20080023853 - Moden; Walter L.	2008-01-31
Methods of making semiconductor fuses App 20080003712 - Moden; Walter L. ; et al.	2008-01-03
Stackable ceramic FBGA for high thermal applications Grant 7,285,442 - Moden , et al. October 23, 2	2007-10-23
Module assembly and method for stacked BGA packages Grant 7,279,797 - Corisis , et al. October 9, 2	2007-10-09
Semiconductor BGA package having a segmented voltage plane and method of making Grant 7,233,064 - Morrison , et al. June 19, 2	2007-06-19
Vertical surface mount assembly and methods Grant 7,227,261 - Kinsman , et al. June 5, 2	2007-06-05
Apparatus and method for mounting microelectronic devices on a mirrored board assembly App 20070115712 - Martin; Chris G. ; et al.	2007-05-24
Apparatus and method for mounting microelectronic devices on a mirrored board assembly Grant 7,200,022 - Martin , et al. April 3, 2	2007-04-03
Apparatus and method for mounting microelectronic devices on a mirrored board assembly Grant 7,161,821 - Martin , et al. January 9, 2	2007-01-09
Semiconductor BGA package having a segmented voltage plane App 20060267177 - Morrison; Michael W. ; et al.	2006-11-30
Method of making semiconductor BGA package having a segmented voltage plane App 20060270107 - Morrison; Michael W. ; et al.	2006-11-30
Method for a low profile multi-IC chip package connector App 20060252180 - Moden; Walter L. ; et al.	2006-11-09
Flip-chip adaptor package for bare die App 20060211174 - Moden; Walter L.	2006-09-21
Method of temporarily securing a die to a burn-in carrier Grant 7,105,380 - Moden , et al. September 12, 2	2006-09-12
Apparatus for modifying the configuration of an exposed surface of a viscous fluid Grant 7,087,116 - Moden , et al. August 8, 2	2006-08-08
Methods for modifying a vertical surface mount package Grant 7,082,681 - Kinsman , et al. August 1, 2	2006-08-01
Module assembly and method for stacked BGA packages App 20060060957 - Corisis; David J. ; et al.	2006-03-23
Module assembly and method for stacked BGA packages App 20060049504 - Corisis; David J. ; et al.	2006-03-09
Module assembly and method for stacked BGA packages App 20060051953 - Corisis; David J. ; et al.	2006-03-09
Vertically mountable and alignable semiconductor device packages and assemblies including the same App 20060033190 - Kinsman; Larry D. ; et al.	2006-02-16
Methods for securing packaged semiconductor devices to carrier substrates App 20060030072 - Kinsman; Larry D. ; et al.	2006-02-09
Alignment devices for securing semiconductor devices to carrier substrates, and assemblies including the alignment devices App 20060001150 - Kinsman; Larry D. ; et al.	2006-01-05
Semiconductor device packages including leads with substantially planar exposed portions extending from bottom edges of the packages, and assemblies including the packages App 20060001155 - Kinsman; Larry D. ; et al.	2006-01-05
Electronic device package App 20050287716 - Moden, Walter L. ; et al.	2005-12-29
Method of attaching a leadframe to singulated semiconductor dice Grant 6,979,598 - Jiang , et al. December 27, 2	2005-12-27
Interconnections for a semiconductor device Grant 6,974,725 - Moden , et al. December 13, 2	2005-12-13
Method of temporarily securing a die to a burn-in carrier App 20050272172 - Moden, Walter L. ; et al.	2005-12-08
Reduced-sized memory card package, length-extending adaptor and method of forming adaptor Grant 6,970,359 - Gochnour , et al. November 29, 2	2005-11-29
Method of attaching a leadframe to singulated semiconductor dice App 20050255612 - Jiang, Tongbi ; et al.	2005-11-17
Semiconductor device structure with adhesion-enhanced semiconductor die App 20050253243 - King, Jerrold L. ; et al.	2005-11-17
Vertically mountable and alignable semiconductor device assembly Grant 6,963,128 - Kinsman , et al. November 8, 2	2005-11-08
Semiconductor BGA package having a segmented voltage plane and method of making App 20050218486 - Morrison, Michael W. ; et al.	2005-10-06
Flip-chip adaptor package for bare die App 20050167850 - Moden, Walter L.	2005-08-04
Low profile multi-IC chip package connector App 20050158912 - Moden, Walter L. ; et al.	2005-07-21
Stackable ceramic FBGA for high thermal applications App 20050146010 - Moden, Walter L. ; et al.	2005-07-07
Module assembly and method for stacked BGA packages App 20050110135 - Corisis, David J. ; et al.	2005-05-26
Burn-in carrier for a semiconductor die Grant 6,894,521 - Moden , et al. May 17, 2	2005-05-17
Apparatus and method for modifying the configuration of an exposed surface of a viscous fluid Grant 6,890,384 - Moden , et al. May 10, 2	2005-05-10
Apparatus and method for mounting microelectronic devices on a mirrored board assembly Grant 6,876,562 - Martin , et al. April 5, 2	2005-04-05
Apparatus and method to secure an adaptor to a reduced-sized memory card Grant 6,865,086 - Gochnour , et al. March 8, 2	2005-03-08
Flip-chip adaptor package for bare die Grant 6,861,290 - Moden March 1, 2	2005-03-01
Stackable ceramic FBGA for high thermal applications Grant 6,858,926 - Moden , et al. February 22, 2	2005-02-22
Apparatus and method for mounting microelectronic devices on a mirrored board assembly App 20050007807 - Martin, Chris G. ; et al.	2005-01-13
Apparatus and method for mounting microelectronic devices on a mirrored board assembly App 20050007806 - Martin, Chris G. ; et al.	2005-01-13
Reduced-sized memory card package, length-extending, adaptor and method of forming adaptor App 20050007745 - Gochnour, Derek J. ; et al.	2005-01-13
Adhesion enhanced semiconductor die for mold compound packaging App 20050001295 - King, Jerrold L. ; et al.	2005-01-06
Module assembly for stacked BGA packages Grant 6,838,768 - Corisis , et al. January 4, 2	2005-01-04
Semiconductor device including edge bond pads and methods Grant 6,828,173 - Farnworth , et al. December 7, 2	2004-12-07
Semiconductor device including edge bond pads Grant 6,825,547 - Farnworth , et al. November 30, 2	2004-11-30
Method for applying adhesives to a lead frame Grant 6,818,460 - Moden , et al. November 16, 2	2004-11-16
Semiconductor device including combed bond pad opening Grant 6,803,656 - Farnworth , et al. October 12, 2	2004-10-12
Semiconductor device including edge bond pads and related methods Grant 6,800,505 - Farnworth , et al. October 5, 2	2004-10-05
Interconnections for a semiconductor device App 20040178512 - Moden, Walter L. ; et al.	2004-09-16
Method of attaching a leadframe to singulated semiconductor dice App 20040175863 - Jiang, Tongbi ; et al.	2004-09-09
Low profile multi-IC chip package connector App 20040168316 - Moden, Walter L. ; et al.	2004-09-02
Vertical surface mount apparatus with thermal carrier and method Grant 6,781,839 - Kinsman , et al. August 24, 2	2004-08-24
Low profile multi-IC chip package connector Grant 6,773,955 - Moden , et al. August 10, 2	2004-08-10
Semiconductor device socket Grant 6,765,803 - Farnworth , et al. July 20, 2	2004-07-20
Heat sink with alignment and retaining features Grant 6,760,224 - Moden , et al. July 6, 2	2004-07-06
Stackable ceramic FBGA for high thermal applications App 20040104408 - Moden, Walter L. ; et al.	2004-06-03
Adhesion enhanced semiconductor die for mold compound packaging Grant 6,740,545 - King , et al. May 25, 2	2004-05-25
Stackable ball grid array package Grant 6,738,263 - Corisis , et al. May 18, 2	2004-05-18
Vertically mountable interposer and assembly Grant 6,734,529 - Kinsman , et al. May 11, 2	2004-05-11
Apparatus and method for mounting microelectronic devices on a mirrored board assembly App 20040076030 - Martin, Chris G. ; et al.	2004-04-22
Interconnections for a semiconductor device and method for forming same Grant 6,709,893 - Moden , et al. March 23, 2	2004-03-23
Method of attaching a leadframe to singulated semiconductor dice Grant 6,706,559 - Jiang , et al. March 16, 2	2004-03-16
Vertical surface mount assembly and methods App 20040034997 - Kinsman, Larry D. ; et al.	2004-02-26
Low profile multi-IC chip package connector Grant 6,686,655 - Moden , et al. February 3, 2	2004-02-03
Vertically mountable interposer, assembly and method Grant 6,684,493 - Kinsman , et al. February 3, 2	2004-02-03
Apparatus and method to secure an adaptor to a reduced-sized memory card App 20040009708 - Gochnour, Derek J. ; et al.	2004-01-15
Underfill coating for LOC package Grant 6,670,550 - Moden December 30, 2	2003-12-30
Stackable ball grid array package Grant 6,670,702 - Corisis , et al. December 30, 2	2003-12-30
Flip chip adaptor package for bare die Grant 6,667,556 - Moden December 23, 2	2003-12-23
Electronic device package App 20030223181 - Moden, Walter L. ; et al.	2003-12-04
Stackable ceramic fbga for high thermal applications Grant 6,650,007 - Moden , et al. November 18, 2	2003-11-18
Method of temporarily securing a die to a burn-in carrier App 20030206034 - Moden, Walter L. ; et al.	2003-11-06
Method of tape bonding Grant 6,637,103 - Moden October 28, 2	2003-10-28
Methods for modifying a vertical surface mount package App 20030196323 - Kinsman, Larry D. ; et al.	2003-10-23
Vertical surface mount apparatus with thermal carrier and method App 20030198020 - Kinsman, Larry D. ; et al.	2003-10-23
Module assembly for stacked BGA packages App 20030197271 - Corisis, David J. ; et al.	2003-10-23
Methods for assembling, modifying and manufacturing a vertical surface mount package Grant 6,634,098 - Kinsman , et al. October 21, 2	2003-10-21
Vertical surface mount assembly and methods Grant 6,611,058 - Kinsman , et al. August 26, 2	2003-08-26
Underfill Coating For Loc Package App 20030141091 - Moden, Walter L.	2003-07-31
Method of temporarily securing a die to a burn-in carrier App 20030138980 - Moden, Walter L. ; et al.	2003-07-24
Heat sink with alignment and retaining features App 20030128523 - Moden, Walter L. ; et al.	2003-07-10
Apparatus for modifying the configuration of an exposed surface of a viscous fluid App 20030116085 - Moden, Walter L. ; et al.	2003-06-26
Vertically mountable and alignable semiconductor device assembly App 20030111718 - Kinsman, Larry D. ; et al.	2003-06-19
Apparatus and methods of packaging and testing die Grant 6,558,966 - Mess , et al. May 6, 2	2003-05-06
Adhesion enhanced semiconductor die for mold compound packaging App 20030082849 - King, Jerrold L. ; et al.	2003-05-01
Vertical surface mount assembly App 20030076667 - Kinsman, Larry D. ; et al.	2003-04-24
Stackable ball grid array package Grant 6,549,421 - Corisis , et al. April 15, 2	2003-04-15
Flip chip adaptor package for bare die App 20030062629 - Moden, Walter L.	2003-04-03
Heat sink with alignment and retaining features Grant 6,525,943 - Moden , et al. February 25, 2	2003-02-25
Flip chip adaptor package for bare die Grant 6,512,303 - Moden January 28, 2	2003-01-28
Apparatus and methods of packaging and testing die Grant 6,512,302 - Mess , et al. January 28, 2	2003-01-28
Semiconductor device including edge bond pads assemblies including the same and related methods App 20030003689 - Farnworth, Warren M. ; et al.	2003-01-02
Method of attaching a leadframe to singulated semiconductor dice App 20020197772 - Jiang, Tongbi ; et al.	2002-12-26
Stackable ball grid array package App 20020191383 - Corisis, David J. ; et al.	2002-12-19
Vertical surface mount assembly and methods App 20020187626 - Kinsman, Larry D. ; et al.	2002-12-12
Low profile multi-IC chip package connector App 20020185725 - Moden, Walter L. ; et al.	2002-12-12
Semiconductor device socket, assembly and methods App 20020182920 - Farnworth, Warren M. ; et al.	2002-12-05
Low profile multi-IC chip package connector App 20020182772 - Moden, Walter L. ; et al.	2002-12-05
Apparatus and method for packaging circuits App 20020182926 - Moden, Walter L.	2002-12-05
Vertical surface mount apparatus with thermal carrier App 20020176230 - Kinsman, Larry D. ; et al.	2002-11-28
Methods for a low profile multi-IC chip package connector Grant 6,475,831 - Moden , et al. November 5, 2	2002-11-05
Underfill coating for LOC package App 20020153154 - Moden, Walter L.	2002-10-24
Vertically mountable interposer, assembly and method App 20020149100 - Kinsman, Larry D. ; et al.	2002-10-17
Stackable ball grid array package App 20020135066 - Corisis, David J. ; et al.	2002-09-26
Vertical surface mount assembly and methods Grant 6,455,351 - Kinsman , et al. September 24, 2	2002-09-24
Module assembly for stacked BGA packages App 20020125571 - Corisis, David J. ; et al.	2002-09-12
Semiconductor device including edge bond pads and methods App 20020123171 - Farnworth, Warren M. ; et al.	2002-09-05
Semiconductor device including edge bond pads and methods App 20020121677 - Farnworth, Warren M. ; et al.	2002-09-05
Semiconductor device including edge bond pads and methods App 20020119596 - Farnworth, Warren M. ; et al.	2002-08-29
Semiconductor device socket, assembly and methods Grant 6,442,044 - Farnworth , et al. August 27, 2	2002-08-27
Vertically mountable interposer, assembly and method App 20020095786 - Kinsman, Larry D. ; et al.	2002-07-25
Stress relieving tape bonding interconnect App 20020084097 - Moden, Walter L.	2002-07-04
Low profile multi-IC chip package connector App 20020084520 - Moden, Walter L. ; et al.	2002-07-04
Semiconductor device including edge bond pads and methods Grant 6,414,374 - Farnworth , et al. July 2, 2	2002-07-02
Module assembly for stacked BGA packages with a common bus bar in the assembly Grant 6,414,391 - Corisis , et al. July 2, 2	2002-07-02
Stress relieving tape bonding interconnect App 20020079124 - Moden, Walter L.	2002-06-27
Burn-in carrier and semiconductor die assembly App 20020079919 - Moden, Walter L. ; et al.	2002-06-27
Semiconductor device including edge bond pads and methods Grant 6,410,406 - Farnworth , et al. June 25, 2	2002-06-25
Apparatus And Methods For Providing Substrate Structures Having Metallic Layers For Microelectronics Devices App 20020070047 - JIANG, TONGBI ; et al.	2002-06-13
Underfill Coating For Loc Package App 20020053451 - Moden, Walter L.	2002-05-09
Stackable ball grid array package App 20020051352 - Corisis, David J. ; et al.	2002-05-02
Apparatus and methods of packaging and testing die Grant 6,380,631 - Mess , et al. April 30, 2	2002-04-30
Stress Relieving Tape Bonding Interconnect App 20020046857 - MODEN, WALTER L.	2002-04-25
Apparatus and methods of packaging and testing die App 20020043658 - Mess, Leonard E. ; et al.	2002-04-18
Interconnections for a semiconductor device and method for forming same App 20020041034 - Moden, Walter L. ; et al.	2002-04-11
Apparatus And Method For Packaging Circuits App 20020037665 - MODEN, WALTER L.	2002-03-28
Stress relieving tape bonding interconnect Grant 6,362,429 - Moden March 26, 2	2002-03-26
Method and apparatus for applying adhesives to a lead frame App 20020029743 - Moden, Walter L. ; et al.	2002-03-14
Apparatus and method for modifying the configuration of an exposed surface of a viscous fluid App 20020029742 - Moden, Walter L. ; et al.	2002-03-14
Heat sink with alignment and retaining features App 20020024798 - Moden, Walter L. ; et al.	2002-02-28
Vertically mountable semiconductor device, assembly, and methods App 20020008310 - Kinsman, Larry D. ; et al.	2002-01-24
Vertical surface mount apparatus with thermal carrier App 20020003694 - Kinsman, Larry D. ; et al.	2002-01-10
Method Of Connecting A Die In An Integrated Circuit Module App 20020003301 - FARNWORTH, WARREN M. ; et al.	2002-01-10
Method of attaching a leadframe to singulated semiconductor dice App 20010055837 - Jiang, Tongbi ; et al.	2001-12-27
Stackable ball grid array package Grant 6,331,939 - Corisis , et al. December 18, 2	2001-12-18
Semiconductor device including combed bond pad opening, assemblies and methods App 20010050845 - Farnworth, Warren M. ; et al.	2001-12-13
Stackable ceramic fbga for high thermal applications App 20010048152 - Moden, Walter L. ; et al.	2001-12-06
Semiconductor package with heat sink and method of fabrication Grant 6,326,242 - Brooks , et al. December 4, 2	2001-12-04
Semiconductor Package With Heat Sink And Method Of Fabrication App 20010041370 - BROOKS, MIKE ; et al.	2001-11-15
Apparatus and methods of packaging and testing die App 20010040279 - Mess, Leonard E. ; et al.	2001-11-15
Stackable ball grid array package App 20010040282 - Corisis, David J. ; et al.	2001-11-15
Flip chip adaptor package for bare die App 20010040299 - Moden, Walter L.	2001-11-15
Underfill coating for loc package Grant 6,310,288 - Moden October 30, 2	2001-10-30
Apparatus and methods of packaging and testing die App 20010026013 - Mess, Leonard E. ; et al.	2001-10-04
Vertically mountable and alignable semiconductor device, assembly, and methods App 20010026023 - Kinsman, Larry D. ; et al.	2001-10-04
Heat sink with alignment and retaining features Grant 6,297,960 - Moden , et al. October 2, 2	2001-10-02
Stackable ceramic FBGA for high thermal applications Grant 6,297,548 - Moden , et al. October 2, 2	2001-10-02
Adhesion enhanced semiconductor die for mold compound packaging App 20010024840 - King, Jerrold L. ; et al.	2001-09-27
Apparatus and methods of packaging and testing die Grant 6,294,839 - Mess , et al. September 25, 2	2001-09-25
Semiconductor device including combed bond pad opening, assemblies and methods Grant 6,295,209 - Farnworth , et al. September 25, 2	2001-09-25
Semiconductor device including edge bond pads and methods App 20010022393 - Farnworth, Warren M. ; et al.	2001-09-20
Low profile multi-IC chip package connector App 20010020740 - Moden, Walter L. ; et al.	2001-09-13
Apparatus and methods for providing substrate structures having metallic layers for microelectronics devices App 20010016374 - Jiang, Tongbi ; et al.	2001-08-23
Vertical surface mount assembly and methods App 20010011769 - Kinsman, Larry D. ; et al.	2001-08-09
Vertical surface mount assembly and methods App 20010010399 - Kinsman, Larry D. ; et al.	2001-08-02
Stackable ball grid array package Grant 6,268,649 - Corisis , et al. July 31, 2	2001-07-31
Vertical surface mount assembly and methods App 20010009781 - Kinsman, Larry D. ; et al.	2001-07-26
Flip chip adaptor package for bare die Grant 6,265,766 - Moden July 24, 2	2001-07-24
Vertically mountable and alignable semiconductor device, assembly, and methods Grant 6,265,773 - Kinsman , et al. July 24, 2	2001-07-24
Low profile multi-IC chip package connector Grant 6,258,623 - Moden , et al. July 10, 2	2001-07-10
Low profile multi-IC chip package connector App 20010006829 - Moden, Walter L. ; et al.	2001-07-05
Semiconductor device including edge bond pads and methods Grant 6,235,551 - Farnworth , et al. May 22, 2	2001-05-22
Low profile multi-IC chip package connector Grant 6,225,689 - Moden , et al. May 1, 2	2001-05-01
Semiconductor device socket, assembly and methods App 20010000304 - Farnworth, Warren M. ; et al.	2001-04-19
Flip chip adaptor package for bare die Grant 6,201,304 - Moden March 13, 2	2001-03-13
Vertically mountable interposer assembly and method Grant 6,191,474 - Kinsman , et al. February 20, 2	2001-02-20
Vertical surface mount assembly and methods Grant 6,087,723 - Kinsman , et al. July 11, 2	2000-07-11
Semiconductor device socket, assembly and methods Grant 6,088,237 - Farnworth , et al. July 11, 2	2000-07-11
Stackable ball grid array package Grant 6,072,233 - Corisis , et al. June 6, 2	2000-06-06
Adhesion enhanced semiconductor die for mold compound packaging Grant 6,066,514 - King , et al. May 23, 2	2000-05-23
Semiconductor package with heat sink and method of fabrication Grant 6,049,125 - Brooks , et al. April 11, 2	2000-04-11
Preventing movement of integrated circuit packages relative to their support surface Grant 6,031,733 - Corisis , et al. February 29, 2	2000-02-29
Method of attaching a leadframe to singulated semiconductor dice Grant 6,017,776 - Jiang , et al. January 25, 2	2000-01-25
Semiconductor device socket, assembly and methods Grant 5,995,378 - Farnworth , et al. November 30, 1	1999-11-30
Structure for attaching a semiconductor wafer section to a support Grant 5,945,733 - Corbett , et al. August 31, 1	1999-08-31
Integrated circuit package support system Grant 5,944,199 - Corisis , et al. August 31, 1	1999-08-31
Multichip module assembly having via contacts and method of making the same Grant 5,920,123 - Moden July 6, 1	1999-07-06
Encapsulant dam standoff for shell-enclosed die assemblies Grant 5,895,222 - Moden , et al. April 20, 1	1999-04-20
Underfill coating for LOC package Grant 5,733,800 - Moden March 31, 1	1998-03-31
Flip chip adaptor package for bare die Grant 5,719,440 - Moden February 17, 1	1998-02-17
Method for attaching a semiconductor die to a support Grant 5,656,551 - Corbett , et al. August 12, 1	1997-08-12
Adhesion enhanced semiconductor die for mold compound packaging Grant 5,583,372 - King , et al. December 10, 1	1996-12-10
Tie bar over chip lead frame design Grant 5,539,251 - Iverson , et al. July 23, 1	1996-07-23
Dissimilar adhesive die attach for semiconductor devices Grant 5,304,842 - Farnworth , et al. April 19, 1	1994-04-19
Method for producing high speed integrated circuits Grant 5,214,845 - King , et al. June 1, 1	1993-06-01
Method for attaching a semiconductor die to a leadframe using a thermoplastic covered carrier tape Grant 5,177,032 - Fogal , et al. January 5, 1	1993-01-05
Semiconductor device manufactured by a method for attaching a semiconductor die to a leadframe using a thermoplastic covered carrier tape Grant 5,140,404 - Fogal , et al. August 18, 1	1992-08-18