Jiang; Tongbi

Patent Applications and Registrations

Patent applications and USPTO patent grants for Jiang; Tongbi.The latest application filed is for "packaged microelectronic devices having stacked interconnect elements and methods for manufacturing the same".

Company Profile

3.200.200

Jiang; Tongbi - Santa Clara CA
Jiang; Tongbi - Boise ID

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Packaged integrated circuit devices with through-body conductive vias, and methods of making same Grant 11,398,457 - Jiang , et al. July 26, 2	2022-07-26
Packaged Microelectronic Devices Having Stacked Interconnect Elements And Methods For Manufacturing The Same App 20220122938 - Kweon; Young Do ; et al.	2022-04-21
Packaged microelectronic devices having stacked interconnect elements and methods for manufacturing the same Grant 11,217,556 - Kweon , et al. January 4, 2	2022-01-04
Semiconductor Components Having Conductive Vias With Aligned Back Side Conductors App 20210134674 - Li; Jin ; et al.	2021-05-06
Packaged Integrated Circuit Devices With Through-body Conductive Vias, And Methods Of Making Same App 20200279834 - Jiang; Tongbi ; et al.	2020-09-03
Packaged integrated circuit devices with through-body conductive vias, and methods of making same Grant 10,593,653 - Jiang , et al.	2020-03-17
Packaged Microelectronic Devices Having Stacked Interconnect Elements And Methods For Manufacturing The Same App 20180358324 - Kweon; Young Do ; et al.	2018-12-13
Packaged microelectronic devices having stacked interconnect elements and methods for manufacturing the same Grant 10,083,931 - Kweon , et al. September 25, 2	2018-09-25
Various stress free sensor packages using wafer level supporting die and air gap technique Grant 10,041,847 - Han , et al. August 7, 2	2018-08-07
Method of lower profile MEMS package with stress isolations Grant 9,656,856 - Jiang , et al. May 23, 2	2017-05-23
Method and apparatus of making MEMS packages Grant 9,624,093 - Jiang , et al. April 18, 2	2017-04-18
Various Stress Free Sensor Packages Using Wafer Level Supporting Die And Air Gap Technique App 20170089783 - Han; Caleb C. ; et al.	2017-03-30
Various stress free sensor packages using wafer level supporting die and air gap technique Grant 9,574,959 - Han , et al. February 21, 2	2017-02-21
Method Of Lower Profile Mems Package With Stress Isolations App 20160340175 - Jiang; Tongbi ; et al.	2016-11-24
Method of lower profile MEMS package with stress isolations Grant 9,446,941 - Jiang , et al. September 20, 2	2016-09-20
Method Of Lower Profile Mems Package With Stress Isolations App 20160167949 - Jiang; Tongbi ; et al.	2016-06-16
Method And Apparatus Of Making Mems Packages App 20160137488 - Jiang; Tongbi ; et al.	2016-05-19
Packaged Microelectronic Devices And Methods For Manufacturing Packaged Microelectronic Devices App 20160086910 - Kweon; Young Do ; et al.	2016-03-24
Various Stress Free Sensor Packages Using Wafer Level Supporting Die And Air Gap Technique App 20160061677 - Han; Caleb C. ; et al.	2016-03-03
Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices Grant 9,240,385 - Kweon , et al. January 19, 2	2016-01-19
Packaged Integrated Circuit Devices With Through-body Conductive Vias, And Methods Of Making Same App 20150325554 - Jiang; Tongbi ; et al.	2015-11-12
Packaged integrated circuit devices with through-body conductive vias, and methods of making same Grant 9,099,571 - Jiang , et al. August 4, 2	2015-08-04
Packaged Microelectronic Devices And Methods For Manufacturing Packaged Microelectronic Devices App 20150118796 - Kweon; Young Do ; et al.	2015-04-30
Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices Grant 8,922,002 - Kweon , et al. December 30, 2	2014-12-30
Multi-lens solid state lighting devices Grant 8,846,424 - Li , et al. September 30, 2	2014-09-30
Packaged Integrated Circuit Devices With Through-body Conductive Vias, And Methods Of Making Same App 20140242751 - Jiang; Tongbi ; et al.	2014-08-28
Methods Of Forming A Poruous Insulator, And Related Methods Of Forming Semiconductor Device Structures App 20140206203 - Farnworth; Warren M. ; et al.	2014-07-24
Multi-lens Solid State Lighting Devices App 20140175468 - Li; Jin ; et al.	2014-06-26
Solid state lighting devices having side reflectivity and associated methods of manufacture Grant 8,729,590 - Gandhi , et al. May 20, 2	2014-05-20
Packaged integrated circuit devices with through-body conductive vias, and methods of making same Grant 8,723,307 - Jiang , et al. May 13, 2	2014-05-13
Methods of forming integrated circuit packages Grant 8,709,866 - Fee , et al. April 29, 2	2014-04-29
Semiconductor devices including porous insulators Grant 8,680,680 - Farnworth , et al. March 25, 2	2014-03-25
Integrated Circuit Packages, Methods of Forming Integrated Circuit Packages, And Methods of Assembling Integrated Circuit Packages App 20130330882 - Fee; Setho Sing ; et al.	2013-12-12
Multi-lens solid state lighting devices Grant 8,552,438 - Li , et al. October 8, 2	2013-10-08
Solid State Lighting Devices Having Side Reflectivity And Associated Methods Of Manufacture App 20130240939 - Gandhi; Jaspreet S. ; et al.	2013-09-19
Integrated circuit packages Grant 8,531,031 - Fee , et al. September 10, 2	2013-09-10
Substrate comprising a plurality of integrated circuitry die, and a substrate Grant 8,461,685 - Jiang , et al. June 11, 2	2013-06-11
Solid state lighting devices having side reflectivity and associated methods of manufacture Grant 8,436,386 - Gandhi , et al. May 7, 2	2013-05-07
Solid State Lighting Devices Having Side Reflectivity And Associated Methods Of Manufacture App 20120305957 - Gandhi; Jaspreet ; et al.	2012-12-06
Flip chip with interposer Grant 8,178,984 - Corisis , et al. May 15, 2	2012-05-15
Microelectronic devices Grant 8,138,613 - Kweon , et al. March 20, 2	2012-03-20
Covers for microelectronic imagers and methods for wafer-level packaging of microelectronics imagers Grant 8,092,734 - Jiang , et al. January 10, 2	2012-01-10
High density stacked die assemblies, structures incorporated therein and methods of fabricating the assemblies Grant 8,072,055 - Corisis , et al. December 6, 2	2011-12-06
Semiconductor Components Having Conductive Vias With Aligned Back Side Conductors App 20110272822 - Li; Jin ; et al.	2011-11-10
Integrated Circuit Packages App 20110233745 - Fee; Setho Sing ; et al.	2011-09-29
Multi-lens Solid State Lighting Devices App 20110235306 - Li; Jin ; et al.	2011-09-29
Semiconductor substrate for build-up packages Grant 8,022,536 - Jiang September 20, 2	2011-09-20
Method for fabricating semiconductor components using maskless back side alignment to conductive vias Grant 7,998,860 - Li , et al. August 16, 2	2011-08-16
Microelectronic Devices And Methods For Manufacturing Microelectronic Devices App 20110169154 - Kweon; Young Do ; et al.	2011-07-14
Methods of forming integrated circuit packages, and methods of assembling integrated circuit packages Grant 7,977,157 - Fee , et al. July 12, 2	2011-07-12
Method of fabricating microelectronic devices Grant 7,910,385 - Kweon , et al. March 22, 2	2011-03-22
Method of fabicating a microelectronic die having a curved surface Grant 7,888,188 - Jiang , et al. February 15, 2	2011-02-15
Packaged Integrated Circuit Devices With Through-body Conductive Vias, And Methods Of Making Same App 20100320585 - Jiang; Tongbi ; et al.	2010-12-23
Microelectronic device wafers including an in-situ molded adhesive, molds for in-situ molding adhesives on microelectronic device wafers, and methods of molding adhesives on microelectronic device wafers Grant 7,851,266 - Jiang , et al. December 14, 2	2010-12-14
Packaged Microelectronic Devices And Methods For Manufacturing Packaged Microelectronic Devices App 20100237494 - Kweon; Young Do ; et al.	2010-09-23
Method For Fabricating Semiconductor Components Using Maskless Back Side Alignment To Conductive Vias App 20100230794 - Li; Jin ; et al.	2010-09-16
Packaged integrated circuit devices with through-body conductive vias, and methods of making same Grant 7,781,877 - Jiang , et al. August 24, 2	2010-08-24
Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices Grant 7,749,882 - Kweon , et al. July 6, 2	2010-07-06
Methods of Forming Integrated Circuit Packages, and Methods of Assembling Integrated Circuit Packages App 20100151630 - Fee; Setho Sing ; et al.	2010-06-17
Wafer back side coating to balance stress from passivation layer on front of wafer and be used as die attach adhesive Grant 7,727,785 - Connell , et al. June 1, 2	2010-06-01
Microelectronic Device Wafers Including An In-situ Molded Adhesive, Molds For In-situ Molding Adhesives On Microelectronic Device Wafers, And Methods Of Molding Adhesives On Microelectronic Device Wafers App 20100127409 - Jiang; Tongbi ; et al.	2010-05-27
Flip Chip With Interposer, And Methods Of Making Same App 20100109149 - Corisis; David J. ; et al.	2010-05-06
Semiconductor Substrate For Build-up Packages App 20100096761 - Jiang; Tongbi	2010-04-22
Methods of assembling integrated circuit packages Grant 7,700,406 - Fee , et al. April 20, 2	2010-04-20
Methods for applying front side and edge protection material to electronic devices at the wafer level, devices made by the methods, and systems including the devices Grant 7,696,011 - Jiang , et al. April 13, 2	2010-04-13
Microelectronic Devices And Methods For Manufacturing Microelectronic Devices App 20100062571 - Jiang; Tongbi ; et al.	2010-03-11
Flip chip with interposer, and methods of making same Grant 7,659,151 - Corisis , et al. February 9, 2	2010-02-09
Packaged microelectronic devices and methods for packaging microelectronic devices Grant 7,655,500 - Jiang , et al. February 2, 2	2010-02-02
High Density Stacked Die Assemblies, Structures Incorporated Therein And Methods Of Fabricating The Assemblies App 20100013074 - Corisis; David J. ; et al.	2010-01-21
Semiconductor substrate for build-up packages Grant 7,635,611 - Jiang December 22, 2	2009-12-22
Microelectronic devices having a curved surface and methods for manufacturing the same Grant 7,633,157 - Jiang , et al. December 15, 2	2009-12-15
Method and apparatus for attaching microelectronic substrates and support members Grant 7,615,871 - Jiang November 10, 2	2009-11-10
Semiconductor Devices Including Porous Insulators App 20090256262 - Farnworth; Warren M. ; et al.	2009-10-15
High density stacked die assemblies, structures incorporated therein and methods of fabricating the assemblies Grant 7,592,691 - Corisis , et al. September 22, 2	2009-09-22
Semiconductor assemblies including redistribution layers and packages and assemblies formed therefrom Grant 7,589,426 - Jiang , et al. September 15, 2	2009-09-15
Method of coating contacts on a surface of a flip chip Grant 7,578,056 - Johnson , et al. August 25, 2	2009-08-25
Semiconductor device assemblies and packages including multiple semiconductor device components Grant 7,573,136 - Jiang , et al. August 11, 2	2009-08-11
Micro-lens configuration for small lens focusing in digital imaging devices Grant 7,557,337 - Jiang , et al. July 7, 2	2009-07-07
Semiconductor devices including porous insulators Grant 7,554,200 - Farnworth , et al. June 30, 2	2009-06-30
Packaged microelectronic devices and methods for packaging microelectronic devices Grant 7,550,847 - Jiang , et al. June 23, 2	2009-06-23
Underfill process Grant 7,547,579 - Jiang June 16, 2	2009-06-16
Microelectronic Imaging Units Having An Infrared-absorbing Layer And Associated Systems And Methods App 20090146234 - Luo; Shijian ; et al.	2009-06-11
Method for fabricating board on chip (BOC) semiconductor package with circuit side polymer layer Grant 7,537,966 - Connell , et al. May 26, 2	2009-05-26
Packaged Semiconductor Assemblies And Associated Systems And Methods App 20090102002 - Chia; Yong Poo ; et al.	2009-04-23
Packaged Integrated Circuit Devices With Through-body Conductive Vias, And Methods Of Making Same App 20090039523 - Jiang; Tongbi ; et al.	2009-02-12
Electronic device package Grant 7,485,971 - Fuller , et al. February 3, 2	2009-02-03
Method for fabricating semiconductor package with circuit side polymer layer Grant 7,479,413 - Connell , et al. January 20, 2	2009-01-20
Apparatus for improving stencil/screen print quality Grant 7,476,277 - Jiang , et al. January 13, 2	2009-01-13
Integrated Circuit Packages, Methods of Forming Integrated Circuit Packages, And Methods of Assembling Integrated Circuit Packages App 20080284000 - Fee; Setho Sing ; et al.	2008-11-20
Underfill compounds including electrically charged filler elements, microelectronic devices having underfill compounds including electrically charged filler elements, and methods of underfilling micoelectronic devices Grant 7,442,578 - Jiang , et al. October 28, 2	2008-10-28
Flip Chip With Interposer, And Methods Of Making Same App 20080251943 - Corisis; David J. ; et al.	2008-10-16
Electronic devices at the wafer level having front side and edge protection material and systems including the devices Grant 7,417,305 - Jiang , et al. August 26, 2	2008-08-26
Microfeature devices and methods for manufacturing microfeature devices Grant 7,411,297 - Luo , et al. August 12, 2	2008-08-12
Micro-lens configuration for small lens focusing in digital imaging devices Grant 7,405,385 - Jiang , et al. July 29, 2	2008-07-29
Device Having Contact Pad With A Conductive Layer And A Conductive Passivation Layer App 20080142983 - Jiang; Tongbi ; et al.	2008-06-19
Packaged Microelectronic Devices And Methods For Packaging Microelectronic Devices App 20080132006 - Jiang; Tongbi ; et al.	2008-06-05
Packaged Microelectronic Devices And Methods For Packaging Microelectronic Devices App 20080099917 - Jiang; Tongbi ; et al.	2008-05-01
Device having contact pad with a conductive layer and a conductive passivation layer Grant 7,358,185 - Jiang , et al. April 15, 2	2008-04-15
Multi-functional solder and articles made therewith, such as microelectronic components Grant 7,344,061 - Yamashita , et al. March 18, 2	2008-03-18
High density stacked die assemblies, structures incorporated therein and methods of fabricating the assemblies App 20080054432 - Corisis; David J. ; et al.	2008-03-06
Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices App 20080050901 - Kweon; Young Do ; et al.	2008-02-28
Packaged microelectronic devices and methods for packaging microelectronic devices Grant 7,329,949 - Jiang , et al. February 12, 2	2008-02-12
Packaged microelectronic devices and methods for packaging microelectronic devices Grant 7,312,101 - Jiang , et al. December 25, 2	2007-12-25
Multiple substrate microelectronic devices and methods of manufacture Grant 7,298,031 - Jiang , et al. November 20, 2	2007-11-20
Fabrication of stacked microelectronic devices Grant 7,297,412 - Connell , et al. November 20, 2	2007-11-20
Microelectronic devices and methods for manufacturing microelectronic devices App 20070262436 - Kweon; Young Do ; et al.	2007-11-15
Methods for forming porous insulator structures on semiconductor devices Grant 7,285,502 - Farnworth , et al. October 23, 2	2007-10-23
Methods for securing components of semiconductor device assemblies to each other with adhesive materials that include pressure-sensitive and curable components Grant 7,268,059 - Reeder , et al. September 11, 2	2007-09-11
Methods for fabrication of thin semiconductor assemblies including redistribution layers and packages and assemblies formed thereby Grant 7,268,012 - Jiang , et al. September 11, 2	2007-09-11
Semiconductor devices and other electronic components including porous insulators created from "void" creating materials Grant 7,262,487 - Farnworth , et al. August 28, 2	2007-08-28
Multiple substrate microelectronic devices and methods of manufacture Grant 7,253,025 - Jiang , et al. August 7, 2	2007-08-07
Microfeature devices and methods for manufacturing microfeature devices Grant 7,253,089 - Luo , et al. August 7, 2	2007-08-07
Methods for fabricating chip-scale packages having carrier bonds App 20070166882 - Jiang; Tongbi ; et al.	2007-07-19
Microelectronic devices and methods for manufacturing microelectronic devices App 20070132089 - Jiang; Tongbi ; et al.	2007-06-14
Flip chip dip coating encapsulant App 20070102491 - Johnson; Farrah J. ; et al.	2007-05-10
Method for forming stencil Grant 7,213,331 - Jiang , et al. May 8, 2	2007-05-08
Method and apparatus for attaching a workpiece to a workpiece support App 20070095280 - Schrock; Ed ; et al.	2007-05-03
Semiconductor Substrate For Build-up Packages App 20070082429 - Jiang; Tongbi	2007-04-12
Multi-functional solder and articles made therewith, such as microelectronic components Grant 7,201,304 - Yamashita , et al. April 10, 2	2007-04-10
Microfeature devices and methods for manufacturing microfeature devices Grant 7,199,037 - Luo , et al. April 3, 2	2007-04-03
Method and structure for manufacturing improved yield semiconductor packaged devices Grant 7,199,463 - Jiang April 3, 2	2007-04-03
Semiconductor device structures including protective layers formed from healable materials Grant 7,199,464 - Luo , et al. April 3, 2	2007-04-03
Methods for assembling multiple semiconductor devices Grant 7,198,980 - Jiang , et al. April 3, 2	2007-04-03
Method and apparatus for reducing substrate bias voltage drop Grant 7,189,602 - Jiang , et al. March 13, 2	2007-03-13
Underfill compounds including electrically charged filler elements, microelectronic devices having underfill compounds including electrically charged filler elements, and methods of underfilling microelectronic devices App 20070048900 - Jiang; Tongbi ; et al.	2007-03-01
Multi-functional solder and articles made therewith, such as microelectronic components Grant 7,182,241 - Yamashita , et al. February 27, 2	2007-02-27
Wafer back side coating to balance stress from passivation layer on front of wafer and be used as die attach adhesive Grant 7,169,685 - Connell , et al. January 30, 2	2007-01-30
Treatment of a ground semiconductor die to improve adhesive bonding to a substrate Grant 7,170,184 - Jiang , et al. January 30, 2	2007-01-30
Method and apparatus for attaching microelectronic substrates and support members App 20070018337 - Jiang; Tongbi	2007-01-25
Method and apparatus for attaching microelectronic substrates and support members App 20070020811 - Jiang; Tongbi	2007-01-25
Semiconductor assemblies including redistribution layers and packages and assemblies formed therefrom App 20070001293 - Jiang; Tongbi ; et al.	2007-01-04
Method for fabricating board on chip (BOC) semiconductor package with circuit side polymer layer App 20060292752 - Connell; Mike ; et al.	2006-12-28
Method and apparatus for attaching a workpiece to a workpiece support Grant 7,153,788 - Schrock , et al. December 26, 2	2006-12-26
Methods for forming porous insulators from "void" creating materials and structures and semiconductor devices including same Grant 7,153,754 - Farnworth , et al. December 26, 2	2006-12-26
Chip-on-board assemblies App 20060284319 - Jiang; Tongbi	2006-12-21
Flip chip dip coating encapsulant Grant 7,150,390 - Johnson , et al. December 19, 2	2006-12-19
Semiconductor substrate for build-up packages Grant 7,135,780 - Jiang November 14, 2	2006-11-14
Methods for applying front side and edge protection material to electronic devices at the wafer level, devices made by the methods, and systems including the devices App 20060246626 - Jiang; Tongbi ; et al.	2006-11-02
Electronic device package Grant 7,122,908 - Jiang , et al. October 17, 2	2006-10-17
Electronic Device Package App 20060220243 - Jiang; Tongbi ; et al.	2006-10-05
Micro-lens configuration for small lens focusing in digital imaging devices Grant 7,115,853 - Jiang , et al. October 3, 2	2006-10-03
Method and apparatus for attaching microelectronic substrates and support members Grant 7,109,588 - Jiang September 19, 2	2006-09-19
Semiconductor substrate for build-up packages Grant 7,109,063 - Jiang September 19, 2	2006-09-19
Method for in-line testing of flip-chip semiconductor assemblies Grant 7,105,366 - Cobbley , et al. September 12, 2	2006-09-12
Die attach material for TBGA or flexible circuitry App 20060197233 - Jiang; Tongbi	2006-09-07
Microfeature devices and methods for manufacturing microfeature devices App 20060194424 - Luo; Shijian ; et al.	2006-08-31
Microfeature devices and methods for manufacturing microfeature devices App 20060189118 - Luo; Shijian ; et al.	2006-08-24
Semiconductor constructions Grant 7,095,095 - Jiang , et al. August 22, 2	2006-08-22
Underfill compounds including electrically charged filler elements, microelectronic devices having underfill compounds including electrically charged filler elements, and methods of underfilling microelectronic devices Grant 7,094,628 - Jiang , et al. August 22, 2	2006-08-22
Method of making a center bond flip chip semiconductor carrier Grant 7,091,065 - Jiang , et al. August 15, 2	2006-08-15
Method and apparatus for attaching microelectronic substrates and support members Grant 7,091,064 - Jiang August 15, 2	2006-08-15
Apparatus for modifying the configuration of an exposed surface of a viscous fluid Grant 7,087,116 - Moden , et al. August 8, 2	2006-08-08
Fabrication of stacked microelectronic devices App 20060172510 - Connell; Michael ; et al.	2006-08-03
Electronic device package Grant 7,084,515 - Fuller , et al. August 1, 2	2006-08-01
Fabrication of stacked microelectronic devices App 20060159947 - Connell; Michael ; et al.	2006-07-20
Methods of fabricating integrated circuitry Grant 7,078,267 - Jiang , et al. July 18, 2	2006-07-18
Method for packaging flip-chip semiconductor assemblies Grant 7,074,648 - Cobbley , et al. July 11, 2	2006-07-11
Method of making a flexible substrate with a filler material Grant 7,071,030 - Jiang , et al. July 4, 2	2006-07-04
Methods for securing components of semiconductor device assemblies to each other with hybrid adhesive materials Grant 7,071,078 - Reeder , et al. July 4, 2	2006-07-04
Plastic lead frames for semiconductor devices, packages including same, and methods of fabrication App 20060138619 - Jiang; Tongbi ; et al.	2006-06-29
Tape attachment chip-on-board assemblies Grant 7,061,119 - Jiang June 13, 2	2006-06-13
Die attach material for TBGA or flexible circuitry App 20060103032 - Jiang; Tongbi	2006-05-18
Stacked microelectronic devices and methods of fabricating same Grant 7,037,756 - Jiang , et al. May 2, 2	2006-05-02
Method of forming semiconductor constructions Grant 7,037,808 - Jiang , et al. May 2, 2	2006-05-02
Fabrication of stacked microelectronic devices Grant 7,037,751 - Connell , et al. May 2, 2	2006-05-02
Fabrication of stacked microelectronic devices Grant 7,022,418 - Connell , et al. April 4, 2	2006-04-04
Die attach material for TBGA or flexible circuitry Grant 7,019,410 - Jiang March 28, 2	2006-03-28
Method of tuning a multi-path circuit Grant 7,012,811 - Jiang , et al. March 14, 2	2006-03-14
Wafer back side coating to balance stress from passivation layer on front of wafer and be used as die attach adhesive App 20060051938 - Connell; Michael E. ; et al.	2006-03-09
Methods for fabrication of thin semiconductor assemblies including redistribution layers and packages and assemblies formed thereby App 20060046350 - Jiang; Tongbi ; et al.	2006-03-02
Methods for applying front side and edge protection material to electronic devices at the wafer level, devices made by the methods, and systems including the devices App 20060043364 - Jiang; Tongbi ; et al.	2006-03-02
Plastic lead frames for semiconductor devices and packages including same Grant 7,005,731 - Jiang , et al. February 28, 2	2006-02-28
Method for in-line testing of flip-chip semiconductor assemblies Grant 7,005,878 - Cobbley , et al. February 28, 2	2006-02-28
Micro-lens configuration for small lens focusing in digital imaging devices App 20060038112 - Jiang; Tongbi ; et al.	2006-02-23
Total internal reflection (TIR) CMOS imager Grant 7,001,795 - Jiang , et al. February 21, 2	2006-02-21
Micro-lens configuration for small lens focusing in digital imaging devices App 20060033010 - Jiang; Tongbi ; et al.	2006-02-16
Substrate comprising a plurality of integrated circuitry die, and a substrate App 20060030077 - Jiang; Tongbi ; et al.	2006-02-09
Packaged microelectronic devices and methods for packaging microelectronic devices App 20060030150 - Jiang; Tongbi ; et al.	2006-02-09
Methods of fabricating integrated circuitry App 20060030078 - Jiang; Tongbi ; et al.	2006-02-09
Method for fabricating semiconductor package with circuit side polymer layer App 20060030081 - Connell; Mike ; et al.	2006-02-09
Methods for securing components of semiconductor device assemblies to each other with adhesive materials that include pressure-sensitive and curable components App 20060030073 - Reeder; W. Jeff ; et al.	2006-02-09
Total internal reflection (TIR) CMOS imager Grant 6,995,442 - Jiang , et al. February 7, 2	2006-02-07
Semiconductor package with circuit side polymer layer and wafer level fabrication method Grant 6,995,041 - Connell , et al. February 7, 2	2006-02-07
Device having contact pad with a conductive layer and a conductive passivation layer App 20060017163 - Jiang; Tongbi ; et al.	2006-01-26
Electronic device package App 20060006553 - Fuller; Jason L. ; et al.	2006-01-12
Method for in-line testing of flip-chip semiconductor assemblies Grant 6,982,177 - Cobbley , et al. January 3, 2	2006-01-03
Method and structure for manufacturing improved yield semiconductor packaged devices App 20050285279 - Jiang, Tongbi	2005-12-29
Methods of forming semiconductor constructions App 20050285256 - Jiang, Tongbi ; et al.	2005-12-29
Circuit board App 20050283975 - Jiang, Tongbi ; et al.	2005-12-29
Electronic device package App 20050287706 - Fuller, Jason L. ; et al.	2005-12-29
Semiconductor constructions App 20050285232 - Jiang, Tongbi ; et al.	2005-12-29
Plastic lead frames for semiconductor devices Grant 6,979,889 - Jiang , et al. December 27, 2	2005-12-27
Method of attaching a leadframe to singulated semiconductor dice Grant 6,979,598 - Jiang , et al. December 27, 2	2005-12-27
Microfeature devices and methods for manufacturing microfeature devices App 20050277279 - Luo, Shijian ; et al.	2005-12-15
Total Internal Reflection (tir) Cmos Imager App 20050274993 - Jiang, Tongbi ; et al.	2005-12-15
Method for manufacturing flip-chip semiconductor assembly Grant 6,972,200 - Cobbley , et al. December 6, 2	2005-12-06
Integrated circuit assemblies and assembly methods App 20050263888 - Jiang, Tongbi ; et al.	2005-12-01
Electronic device package Grant 6,969,914 - Fuller , et al. November 29, 2	2005-11-29
Selectively configurable circuit board App 20050258535 - Jiang, Tongbi ; et al.	2005-11-24
Method for in-line testing of flip-chip semiconductor assemblies Grant 6,967,113 - Cobbley , et al. November 22, 2	2005-11-22
Method for electroless plating a contact pad Grant 6,967,164 - Jiang , et al. November 22, 2	2005-11-22
Method of attaching a leadframe to singulated semiconductor dice App 20050255612 - Jiang, Tongbi ; et al.	2005-11-17
Covers for microelectronic imagers and methods for wafer-level packaging of microelectronics imagers App 20050253213 - Jiang, Tongbi ; et al.	2005-11-17
Method for in-line testing of flip-chip semiconductor assemblies Grant 6,962,826 - Cobbley , et al. November 8, 2	2005-11-08
Method for in-line testing of flip-chip semiconductor assemblies Grant 6,953,700 - Cobbley , et al. October 11, 2	2005-10-11
Method for in-line testing of flip-chip semiconductor assemblies Grant 6,954,081 - Cobbley , et al. October 11, 2	2005-10-11
Method for in-line testing of flip-chip semiconductor assemblies Grant 6,953,699 - Cobbley , et al. October 11, 2	2005-10-11
Semiconductor device assemblies and packages including multiple semiconductor device components App 20050218518 - Jiang, Tongbi ; et al.	2005-10-06
Method for in-line testing of flip-chip semiconductor assemblies Grant 6,949,943 - Cobbley , et al. September 27, 2	2005-09-27
Stacked semiconductor package with circuit side polymer layer Grant 6,949,834 - Connell , et al. September 27, 2	2005-09-27
Selectively configurable circuit board Grant 6,936,775 - Jiang , et al. August 30, 2	2005-08-30
Method for underfilling semiconductor components using no flow underfill Grant 6,933,221 - Jiang August 23, 2	2005-08-23
Integrated circuit assemblies and assembly methods Grant 6,926,190 - Jiang , et al. August 9, 2	2005-08-09
Protective layer for use in packaging a semiconductor die and method for forming same App 20050158910 - Jiang, Tongbi ; et al.	2005-07-21
Semiconductor device structures including protective layers formed from healable materials App 20050156328 - Luo, Shijian ; et al.	2005-07-21
Apparatus for improving stencil/screen print quality App 20050145169 - Jiang, Tongbi ; et al.	2005-07-07
Semiconductor device assemblies and packages including multiple semiconductor devices and methods Grant 6,906,415 - Jiang , et al. June 14, 2	2005-06-14
Ball grid array utilizing solder balls having a core material covered by a metal layer Grant 6,906,417 - Jiang , et al. June 14, 2	2005-06-14
Method and structure for manufacturing improved yield semiconductor packaged devices Grant 6,902,956 - Jiang June 7, 2	2005-06-07
Microelectronic package with reduced underfill and methods for forming such packages Grant 6,900,080 - Jiang , et al. May 31, 2	2005-05-31
Fabrication of stacked microelectronic devices Grant 6,896,760 - Connell , et al. May 24, 2	2005-05-24
Methods of forming a ball grid array including a non-conductive polymer core and a silver or silver alloy outer layer Grant 6,893,952 - Jiang , et al. May 17, 2	2005-05-17
Packaged stacked semiconductor die and method of preparing same Grant 6,894,380 - Jiang , et al. May 17, 2	2005-05-17
Apparatus and method for modifying the configuration of an exposed surface of a viscous fluid Grant 6,890,384 - Moden , et al. May 10, 2	2005-05-10
Semiconductor packages and methods for making the same Grant 6,891,108 - Prindiville , et al. May 10, 2	2005-05-10
Method of selectively adjusting surface tension of soldermask material Grant 6,889,430 - Jiang , et al. May 10, 2	2005-05-10
Protective layers formed on semiconductor device components so as to reduce or eliminate the occurrence of delamination thereof and cracking therein Grant 6,885,108 - Luo , et al. April 26, 2	2005-04-26
Semiconductor substrate for build-up packages App 20050085014 - Jiang, Tongbi	2005-04-21
Method for forming a protective layer for use in packaging a semiconductor die Grant 6,881,606 - Jiang , et al. April 19, 2	2005-04-19
Plastic lead frames for semiconductor devices, packages including same, and methods of fabrication Grant 6,872,600 - Jiang , et al. March 29, 2	2005-03-29
Micro-lens configuration for small lens focusing in digital imaging devices App 20050061950 - Jiang, Tongbi ; et al.	2005-03-24
Methods employing hybrid adhesive materials to secure components of semiconductor device assemblies and packages to one another Grant 6,864,153 - Reeder , et al. March 8, 2	2005-03-08
Semiconductor devices including porous insulators App 20050040533 - Farnworth, Warren M. ; et al.	2005-02-24
Semiconductor devices and other electronic components including porous insulators created from "void" creating materials App 20050040534 - Farnworth, Warren M. ; et al.	2005-02-24
Semiconductor packages and methods for making the same Grant 6,858,927 - Prindiville , et al. February 22, 2	2005-02-22
Insulative materials including voids and precursors thereof App 20050037606 - Farnworth, Warren M. ; et al.	2005-02-17
Multi-functional solder and articles made therewith, such as microelectronic components App 20050029334 - Yamashita, Tsuyoshi ; et al.	2005-02-10
Multi-functional solder and articles made therewith, such as microelectronic components App 20050028887 - Yamashita, Tsuyoshi ; et al.	2005-02-10
Multi-functional solder and articles made therewith, such as microelectronic components App 20050029667 - Yamashita, Tsuyoshi ; et al.	2005-02-10
Methods for forming porous insulator structures on semiconductor devices App 20050032395 - Farnworth, Warren M. ; et al.	2005-02-10
Methods for securing components of semiconductor device assemblies to each other with hybrid adhesive materials App 20050032270 - Reeder, W. Jeff ; et al.	2005-02-10
Electronic device package App 20050023572 - Fuller, Jason L. ; et al.	2005-02-03
Method for in-line testing of flip-chip semiconductor assemblies App 20050024080 - Cobbley, Chad A. ; et al.	2005-02-03
Fabrication of stacked microelectronic devices App 20050026395 - Connell, Michael ; et al.	2005-02-03
Fabrication of stacked microelectronic devices App 20050026415 - Connell, Michael ; et al.	2005-02-03
Microelectronic package with reduced underfill and methods for forming such packages App 20050016751 - Jiang, Tongbi ; et al.	2005-01-27
Multiple substrate microelectronic devices and methods of manufacture App 20050019984 - Jiang, Tongbi ; et al.	2005-01-27
Method and apparatus for attaching microelectronic substrates and support members App 20050019988 - Jiang, Tongbi	2005-01-27
Method for underfilling semiconductor components Grant 6,844,052 - Jiang January 18, 2	2005-01-18
Microelectronic package with reduced underfill and methods for forming such packages Grant 6,844,618 - Jiang , et al. January 18, 2	2005-01-18
Method for in-line testing of flip-chip semiconductor assemblies App 20050007141 - Cobbley, Chad A. ; et al.	2005-01-13
Method for in-line testing of flip-chip semiconductor assemblies App 20050007142 - Cobbley, Chad A. ; et al.	2005-01-13
Plastic lead frames for semiconductor devices, packages including same, and methods of fabrication Grant 6,841,422 - Jiang , et al. January 11, 2	2005-01-11
Method for in-line testing of flip-chip semiconductor assemblies App 20040263197 - Cobbley, Chad A. ; et al.	2004-12-30
Method for in-line testing of flip-chip semiconductor assemblies App 20040263196 - Cobbley, Chad A. ; et al.	2004-12-30
Method for in-line testing of flip-chip semiconductor assemblies App 20040263195 - Cobbley, Chad A. ; et al.	2004-12-30
Semiconductor packages and methods for making the same Grant 6,833,510 - Prindiville , et al. December 21, 2	2004-12-21
BGA package having substrate with patterned solder mask defining open die attach area Grant 6,825,569 - Jiang , et al. November 30, 2	2004-11-30
Resistance-reducing conductive adhesives for attachment of electronic components Grant 6,825,570 - Jiang , et al. November 30, 2	2004-11-30
High resolution pressure-sensing device having an insulating flexible matrix loaded with filler particles Grant 6,820,502 - Jiang , et al. November 23, 2	2004-11-23
Total internal reflection (TIR) CMOS imager App 20040227170 - Jiang, Tongbi ; et al.	2004-11-18
Method for applying adhesives to a lead frame Grant 6,818,460 - Moden , et al. November 16, 2	2004-11-16
Circuit board App 20040217463 - Jiang, Tongbi ; et al.	2004-11-04
Ozone treatment of a ground semiconductor die to improve adhesive bonding to a substrate Grant 6,812,064 - Jiang , et al. November 2, 2	2004-11-02
Packaged microelectronic devices and methods for packaging microelectronic devices App 20040214373 - Jiang, Tongbi ; et al.	2004-10-28
Gravitationally-assisted control of spread of viscous material applied to semiconductor assembly components Grant 6,803,657 - Jiang , et al. October 12, 2	2004-10-12
Methods for forming protective layers on semiconductor device components so as to reduce or eliminate the occurrence of delamination thereof and cracking therein App 20040198023 - Luo, Shijian ; et al.	2004-10-07
Underfill compounds including electrically charged filler elements, microelectronic devices having underfill compounds including electrically charged filler elements, and methods of underfilling microelectronic devices App 20040191962 - Jiang, Tongbi ; et al.	2004-09-30
Protective layers formed on semiconductor device components so as to reduce or eliminate the occurrence of delamination thereof and cracking therein App 20040183210 - Luo, Shijian ; et al.	2004-09-23
Method for Forming a Protective Layer for Use In Packaging a Semiconductor Die App 20040183163 - Jiang, Tongbi ; et al.	2004-09-23
Semiconductor package with circuit side polymer layer and wafer level fabrication method Grant 6,791,168 - Connell , et al. September 14, 2	2004-09-14
Plastic lead frames for semiconductor devices and packages including same App 20040173882 - Jiang, Tongbi ; et al.	2004-09-09
Plastic lead frames for semiconductor devices App 20040173896 - Jiang, Tongbi ; et al.	2004-09-09
Pressure and heat cured semiconductor die packages having reduced voids in a die attach bondline App 20040173916 - Jiang, Tongbi	2004-09-09
Method of attaching a leadframe to singulated semiconductor dice App 20040175863 - Jiang, Tongbi ; et al.	2004-09-09
Method and apparatus for reducing substrate bias voltage drop Grant 6,788,552 - Jiang , et al. September 7, 2	2004-09-07
Plastic lead frames for semiconductor devices, packages including same, and methods of fabrication Grant 6,787,399 - Jiang , et al. September 7, 2	2004-09-07
Selectively configurable circuit board App 20040168826 - Jiang, Tongbi ; et al.	2004-09-02
Stacked semiconductor package with circuit side polymer layer App 20040171191 - Connell, Mike ; et al.	2004-09-02
Die attach curing method for semiconductor device Grant 6,784,024 - Jiang August 31, 2	2004-08-31
Semiconductor packages and methods for making the same Grant 6,779,258 - Prindiville , et al. August 24, 2	2004-08-24
Method of fabricating tape attachment chip-on-board assemblies Grant 6,777,268 - Jiang August 17, 2	2004-08-17
Semiconductor substrate for build-up packages App 20040157361 - Jiang, Tongbi	2004-08-12
Method and structure for manufacturing improved yield semiconductor packaged devices Grant 6,774,480 - Jiang August 10, 2	2004-08-10
Underfill Compounds Including Electrically Charged Filler Elements, Microelectronic Devices Having Underfill Compounds Including Electrically Charged Filler Elements, And Methods Of Underfilling Microelectronic Devices App 20040150079 - Jiang, Tongbi ; et al.	2004-08-05
Method for attaching a semiconductor die to a substrate Grant 6,770,164 - Schrock , et al. August 3, 2	2004-08-03
Composite interposer for BGA packages Grant 6,770,981 - Jiang , et al. August 3, 2	2004-08-03
Underfill Compounds Including Electrically Charged Filler Elements, Microelectronic Devices Having Underfill Compounds Including Electrically Charged Filler Elements, And Methods Of Underfilling Microelectronic Devices Grant 6,768,209 - Jiang , et al. July 27, 2	2004-07-27
Forming thermally curable materials on a support structure in an electronic device Grant 6,765,652 - Jiang July 20, 2	2004-07-20
Plastic lead frames for semiconductor devices Grant 6,762,485 - Jiang , et al. July 13, 2	2004-07-13
Circuit board Grant 6,757,176 - Jiang , et al. June 29, 2	2004-06-29
Process for manufacturing flip-chip semiconductor assembly Grant 6,750,070 - Cobbley , et al. June 15, 2	2004-06-15
Stencil/screen print apparatus App 20040107902 - Jiang, Tongbi ; et al.	2004-06-10
Method for in-line testing of flip-chip semiconductor assemblies App 20040104741 - Cobbley, Chad A. ; et al.	2004-06-03
Wafer back side coating to balance stress from passivation layer on front of wafer and be used as a die attach adhesive App 20040104491 - Connell, Michael E. ; et al.	2004-06-03
Methods for assembling multiple semiconductor devices App 20040106229 - Jiang, Tongbi ; et al.	2004-06-03
Methods of fabricating integrated circuitry App 20040102022 - Jiang, Tongbi ; et al.	2004-05-27
Selectively configurable circuit board Grant 6,740,821 - Jiang , et al. May 25, 2	2004-05-25
Method for packaging flip-chip semiconductor assemblies App 20040097009 - Cobbley, Chad A. ; et al.	2004-05-20
Thermally conductive adhesive tape for semiconductor devices and method for using the same Grant 6,737,299 - Jiang May 18, 2	2004-05-18
Apparatus for improving stencil/screen print quality App 20040089171 - Jiang, Tongbi ; et al.	2004-05-13
Method for electroless plating a contact pad App 20040087142 - Jiang, Tongbi ; et al.	2004-05-06
Method for manufacturing flip-chip semiconductor assembly App 20040080332 - Cobbley, Chad A. ; et al.	2004-04-29
No flow underfill material and method for underfilling semiconductor components App 20040080055 - Jiang, Tongbi	2004-04-29
Z-axis electrical contact for microelectronic devices App 20040078967 - Jiang, Tongbi ; et al.	2004-04-29
Plastic lead frames for semiconductor devices and packages including same Grant 6,724,073 - Jiang , et al. April 20, 2	2004-04-20
Methods Employing Hybrid Adhesive Materials To Secure Components Of Semiconductor Device Assemblies And Packages To One Another And Assemblies And Packages Including Components Secured To One Another With Such Hybrid Adhesive Materials Grant 6,717,259 - Reeder , et al. April 6, 2	2004-04-06
Method of making a center bond flip chip semiconductor carrier App 20040057222 - Jiang, Tongbi ; et al.	2004-03-25
Composite interposer for BGA packages Grant 6,710,456 - Jiang , et al. March 23, 2	2004-03-23
Methods for use in packaging applications using an adhesive composition Grant 6,709,896 - Cobbley , et al. March 23, 2	2004-03-23
Method of pressure curing for reducing voids in a die attach bondline and applications thereof Grant 6,710,462 - Jiang March 23, 2	2004-03-23
Substrates and assemblies including pre-applied adhesion promoter Grant 6,707,147 - Dickey , et al. March 16, 2	2004-03-16
Method of attaching a leadframe to singulated semiconductor dice Grant 6,706,559 - Jiang , et al. March 16, 2	2004-03-16
Porous insulator created from a "void" creating material, structures and semiconductor devices including same, and methods of forming App 20040041240 - Farnworth, Warren M. ; et al.	2004-03-04
Electronic device package App 20040041279 - Fuller, Jason L. ; et al.	2004-03-04
Low temperature die attaching material for BOC packages and products comprising such material Grant 6,700,183 - Jiang March 2, 2	2004-03-02
Adhesive composition for use in packaging applications Grant 6,699,928 - Cobbley , et al. March 2, 2	2004-03-02
Methods of die attachment for BOC and F/C surface mount Grant 6,691,406 - Prindivill , et al. February 17, 2	2004-02-17
Multi-functional solder and articles made therewith, such as microelectronic components App 20040026484 - Yamashita, Tsuyoshi ; et al.	2004-02-12
Apparatus and method for face-to-face connection of a die to a substrate with polymer electrodes Grant 6,689,635 - Cobbley , et al. February 10, 2	2004-02-10
Ultrasonic vibration mode for wire bonding Grant 6,685,083 - Jiang , et al. February 3, 2	2004-02-03
High resolution pressure-sensing device having an insulating flexible matrix loaded with filler particles Grant 6,684,717 - Jiang , et al. February 3, 2	2004-02-03
Semiconductor package with circuit side polymer layer and wafer level fabrication method App 20040009631 - Connell, Mike ; et al.	2004-01-15
Method and apparatus for improving stencil/screen print quality Grant 6,669,781 - Jiang , et al. December 30, 2	2003-12-30
Semiconductor device assemblies and packages including multiple semiconductor devices and methods App 20030230801 - Jiang, Tongbi ; et al.	2003-12-18
Z-axis electrical contact for microelectric devices Grant 6,662,440 - Jiang , et al. December 16, 2	2003-12-16
Method of forming ruthenium interconnect for an integrated circuit Grant 6,664,175 - Jiang , et al. December 16, 2	2003-12-16
Microelectronic assembly with pre-disposed fill material and associated method of manufacture Grant 6,661,104 - Jiang , et al. December 9, 2	2003-12-09
Method of making center bond flip chip semiconductor carrier Grant 6,647,620 - Jiang , et al. November 18, 2	2003-11-18
Methods employing hybrid adhesive materials to secure components of semiconductor device assemblies and packages to one another and assemblies and packages including components secured to one another with such hybrid adhesive materials App 20030211677 - Reeder, W. Jeff ; et al.	2003-11-13
Adhesive composition and methods for use in packaging applications Grant 6,646,354 - Cobbley , et al. November 11, 2	2003-11-11
Method and apparatus for improving stencil/screen print quality Grant 6,641,669 - Jiang , et al. November 4, 2	2003-11-04
Method and apparatus for attaching microelectronic substrates and support members App 20030189262 - Jiang, Tongbi	2003-10-09
Microelectronic package with reduced underfill and methods for forming such packages App 20030189243 - Jiang, Tongbi ; et al.	2003-10-09
Method for electroless plating a contact pad Grant 6,630,400 - Jiang , et al. October 7, 2	2003-10-07
Method and apparatus for attaching a workpiece to a workpiece support App 20030178475 - Schrock, Ed ; et al.	2003-09-25
Integrated circuit assemblies and assembly methods App 20030178474 - Jiang, Tongbi ; et al.	2003-09-25
Z-axis electrical contact for microelectronic devices Grant 6,616,864 - Jiang , et al. September 9, 2	2003-09-09
Composite interposer for BGA packages App 20030164556 - Jiang, Tongbi ; et al.	2003-09-04
Wafer back side coating to balance stress from passivation layer on front of wafer and be used as a die attach adhesive App 20030162368 - Connell, Michael E. ; et al.	2003-08-28
Methods of ball grid array Grant 6,610,591 - Jiang , et al. August 26, 2	2003-08-26
Apparatus for improving stencil/screen print quality Grant 6,607,599 - Jiang , et al. August 19, 2	2003-08-19
Method of making a flexible substrate with a filler material App 20030153099 - Jiang, Tongbi ; et al.	2003-08-14
Plastic lead frames for semiconductor devices, packages including same, and methods of fabrication App 20030153131 - Jiang, Tongbi ; et al.	2003-08-14
Plastic lead frames for semiconductor devices, packages including same, and methods of fabrication App 20030153132 - Jiang, Tongbi ; et al.	2003-08-14
Plastic lead frames for semiconductor devices, packages including same, and methods of fabrication App 20030153133 - Jiang, Tongbi ; et al.	2003-08-14
Method for making a packaged semiconductor device Grant 6,601,294 - Jiang , et al. August 5, 2	2003-08-05
Method for gravitation-assisted control of spread of viscous material applied to a substrate Grant 6,602,730 - Jiang , et al. August 5, 2	2003-08-05
Method for in-line testing of flip-chip semiconductor assemblies App 20030141888 - Cobbley, Chad A. ; et al.	2003-07-31
Method for in-line testing of flip-chip semiconductor assemblies App 20030132776 - Cobbley, Chad A. ; et al.	2003-07-17
Method And Apparatus For Improving Stencil/screen Print Quality App 20030121473 - JIANG, TONGBI ; et al.	2003-07-03
Adhesive Composition For Use In Packaging Applications App 20030122226 - COBBLEY, CHAD A. ; et al.	2003-07-03
High resolution pressure-sensing device having an insulating flexible matrix loaded with filler particles App 20030115970 - Jiang, Tongbi ; et al.	2003-06-26
Apparatus for modifying the configuration of an exposed surface of a viscous fluid App 20030116085 - Moden, Walter L. ; et al.	2003-06-26
Methods of ball grid array App 20030119299 - Jiang, Tongbi ; et al.	2003-06-26
Ozone treatment of a ground semiconductor die to improve adhesive bonding to a substrate App 20030109081 - Jiang, Tongbi ; et al.	2003-06-12
Substrates and assemblies including pre-applied adhesion promoter App 20030094690 - Dickey, Brenton L. ; et al.	2003-05-22
Ozone treatment of a ground semiconductor die to improve adhesive bonding to a substrate App 20030087507 - Jiang, Tongbi ; et al.	2003-05-08
Packaged stacked semiconductor die and method of preparing same App 20030067083 - Jiang, Tongbi ; et al.	2003-04-10
Flip chip dip coating encapsulant App 20030062400 - Johnson, Farrah J. ; et al.	2003-04-03
Method for manufacturing flip-chip semiconductor assembly App 20030054587 - Cobbley, Chad A. ; et al.	2003-03-20
Methods Of Thinning Microelectronic Workpieces App 20030045072 - Jiang, Tongbi	2003-03-06
Stacked Microelectronic Devices And Methods Of Fabricating Same App 20030042615 - Jiang, Tongbi ; et al.	2003-03-06
Flip Chip Dip Coating Encapsulant App 20030045027 - Johnson, Farrah J. ; et al.	2003-03-06
Method of attaching a leadframe to singulated semiconductor dice App 20020197772 - Jiang, Tongbi ; et al.	2002-12-26
Gravitationally assisted control of spread of viscous material applied to semiconductor assembly components App 20020197843 - Jiang, Tongbi ; et al.	2002-12-26
Method of fabricating tape attachment chip-on-board assemblies App 20020173082 - Jiang, Tongbi	2002-11-21
Ruthenium interconnect for an integrated circuit and method for its fabrication App 20020158336 - Jiang, Tongbi ; et al.	2002-10-31
Methods employing hybrid adhesive materials to secure components of semiconductor device assemblies and packages to one another and assemblies and packages including components secured to one another with such hybrid adhesive materials App 20020140086 - Reeder, W. Jeff ; et al.	2002-10-03
Method Of Fabricating Chip-Scale Packages And Resulting Structures App 20020125568 - Jiang, Tongbi ; et al.	2002-09-12
Low temperature die attaching material for BOC packages App 20020119331 - Jiang, Tongbi	2002-08-29
Low temperature die attaching material for BOC packages App 20020119601 - Jiang, Tongbi	2002-08-29
Electronic device package App 20020100989 - Jiang, Tongbi ; et al.	2002-08-01
Novel ultrasonic vibration mode for wire bonding App 20020096554 - Jiang, Tongbi ; et al.	2002-07-25
Pre-applied adhesion promoter App 20020074645 - Dickey, Brenton L. ; et al.	2002-06-20
Apparatus And Methods For Providing Substrate Structures Having Metallic Layers For Microelectronics Devices App 20020070047 - JIANG, TONGBI ; et al.	2002-06-13
Adhesive composition for use in packaging applications App 20020068379 - Cobbley, Chad A. ; et al.	2002-06-06
Underfile process App 20020060368 - Jiang, Tongbi	2002-05-23
Die attach curing method for semiconductor device App 20020060370 - Jiang, Tongbi	2002-05-23
Method and structure for manufacturing improved yield semiconductor packaged devices App 20020058358 - Jiang, Tongbi	2002-05-16
Method and apparatus for reducing substrate bias voltage drop App 20020055246 - Jiang, Tongbi ; et al.	2002-05-09
Ball grid array App 20020047216 - Jiang, Tongbi ; et al.	2002-04-25
Semiconductor packages and methods for making the same App 20020043401 - Prindiville, Casey ; et al.	2002-04-18
Method of selectively adjusting surface tension of soldermask material App 20020043397 - Jiang, Tongbi ; et al.	2002-04-18
Apparatus and method for modifying the configuration of an exposed surface of a viscous fluid App 20020029742 - Moden, Walter L. ; et al.	2002-03-14
Method and apparatus for applying adhesives to a lead frame App 20020029743 - Moden, Walter L. ; et al.	2002-03-14
Semiconductor packages and methods for making the same App 20020030575 - Prindiville, Casey ; et al.	2002-03-14
Resistance-reducing conductive adhesives for attachment of electronic components App 20020030286 - Jiang, Tongbi ; et al.	2002-03-14
Method of pressure curing for reducing voids in a die attach bondline and applications thereof App 20020031866 - Jiang, Tongbi	2002-03-14
Resistance-reducing conductive adhesives for attachment of electronic components App 20020030287 - Jiang, Tongbi ; et al.	2002-03-14
Methods employing hybrid adhesive materials to secure components of semiconductor device assemblies and packages to one another and assemblies and packages including components secured to one another with such hybrid adhesive materials App 20020028599 - Reeder, W. Jeff ; et al.	2002-03-07
Microelectronic assembly with pre-disposed fill material and associated method of manufacture App 20020025602 - Jiang, Tongbi ; et al.	2002-02-28
Passivation layer for packaged integrated circuits App 20020022305 - Jiang, Tongbi ; et al.	2002-02-21