Ahmad; Syed S.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Ahmad; Syed S..The latest application filed is for "sloped vias in a substrate, spring-like deflecting contacts, and methods of making".

Company Profile

0.13.13

Ahmad; Syed S. - Fargo ND
Ahmad; Syed S. - Boise ID
Ahmad; Syed S. - Lanham MD

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Devices including sloped vias in a substrate and devices including spring-like deflecting contacts Grant 7,928,579 - Wark , et al. April 19, 2	2011-04-19
Sloped vias in a substrate, spring-like contacts, and methods of making Grant 7,390,740 - Wark , et al. June 24, 2	2008-06-24
Sloped vias in a substrate, spring-like deflecting contacts, and methods of making App 20070045857 - Wark; James M. ; et al.	2007-03-01
Apparatus for modifying the configuration of an exposed surface of a viscous fluid Grant 7,087,116 - Moden , et al. August 8, 2	2006-08-08
Sloped vias in a substrate, spring-like deflecting contacts, and methods of making App 20060046475 - Wark; James M. ; et al.	2006-03-02
Method of attaching a leadframe to singulated semiconductor dice Grant 6,979,598 - Jiang , et al. December 27, 2	2005-12-27
Method of attaching a leadframe to singulated semiconductor dice App 20050255612 - Jiang, Tongbi ; et al.	2005-11-17
Apparatus and method for modifying the configuration of an exposed surface of a viscous fluid Grant 6,890,384 - Moden , et al. May 10, 2	2005-05-10
Method for applying adhesives to a lead frame Grant 6,818,460 - Moden , et al. November 16, 2	2004-11-16
Gravitationally-assisted control of spread of viscous material applied to semiconductor assembly components Grant 6,803,657 - Jiang , et al. October 12, 2	2004-10-12
Method of attaching a leadframe to singulated semiconductor dice App 20040175863 - Jiang, Tongbi ; et al.	2004-09-09
Method of attaching a leadframe to singulated semiconductor dice Grant 6,706,559 - Jiang , et al. March 16, 2	2004-03-16
Method for gravitation-assisted control of spread of viscous material applied to a substrate Grant 6,602,730 - Jiang , et al. August 5, 2	2003-08-05
Apparatus for modifying the configuration of an exposed surface of a viscous fluid App 20030116085 - Moden, Walter L. ; et al.	2003-06-26
Method of attaching a leadframe to singulated semiconductor dice App 20020197772 - Jiang, Tongbi ; et al.	2002-12-26
Gravitationally assisted control of spread of viscous material applied to semiconductor assembly components App 20020197843 - Jiang, Tongbi ; et al.	2002-12-26
Method and apparatus for applying adhesives to a lead frame App 20020029743 - Moden, Walter L. ; et al.	2002-03-14
Apparatus and method for modifying the configuration of an exposed surface of a viscous fluid App 20020029742 - Moden, Walter L. ; et al.	2002-03-14
Gravitationally-assisted Control Of Spread Of Viscous Material Applied To Semiconductor Assembly Components App 20020001879 - JIANG, TONGBI ; et al.	2002-01-03
Method of attaching a leadframe to singulated semiconductor dice App 20010055837 - Jiang, Tongbi ; et al.	2001-12-27
Gravitationally-assisted control of spread of viscous material applied to semiconductor assembly components App 20010018234 - Jiang, Tongbi ; et al.	2001-08-30
Gravitationally-assisted control of spread of viscous material applied to semiconductor assembly components App 20010017413 - jiang, Tongbi ; et al.	2001-08-30
Gravitationally-assisted control of spread of viscous material applied to semiconductor assembly components Grant 6,083,768 - Jiang , et al. July 4, 2	2000-07-04
Method of attaching a leadframe to singulated semiconductor dice Grant 6,017,776 - Jiang , et al. January 25, 2	2000-01-25
Lead frame surface finish enhancement Grant 5,616,953 - King , et al. April 1, 1	1997-04-01
Pressure-sensitive adhesives Grant 4,810,523 - Williams , et al. March 7, 1	1989-03-07

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