U.S. patent application number 11/069561 was filed with the patent office on 2005-08-25 for substrate cleaning apparatus.
This patent application is currently assigned to m-FSI LTD.. Invention is credited to Iga, Masao, Kanayasu, Jun, Matsuno, Kousaku, Shikami, Satoshi, Ueda, Takeji.
Application Number | 20050183749 11/069561 |
Document ID | / |
Family ID | 19008291 |
Filed Date | 2005-08-25 |
United States Patent
Application |
20050183749 |
Kind Code |
A1 |
Matsuno, Kousaku ; et
al. |
August 25, 2005 |
Substrate cleaning apparatus
Abstract
A substrate cleaning apparatus comprises an outer shell
constructed such that the outer shell is selectively openable or
hermetically closable to form a sealed space, an inner shell
enclosed within the outer shell and having a holding member for
holding a substrate, and a dispenser unit for feeding at least one
of gas and liquid into the inner shell. Within the sealed space
formed by the outer shell, a highly gas-tight space is formed by
the inner shell to permit cleaning of the substrate within the
highly gas-tight space. Also disclosed are a dispenser, a substrate
holding mechanism and a substrate cleaning chamber, which are
suitable for use with the substrate cleaning apparatus, and
substrate cleaning processes making use of these dispenser,
substrate holding mechanism and substrate cleaning chamber,
respectively.
Inventors: |
Matsuno, Kousaku;
(Okayama-shi, JP) ; Iga, Masao; (Okayama-shi,
JP) ; Ueda, Takeji; (Okayama-shi, JP) ;
Kanayasu, Jun; (Okayama-shi, JP) ; Shikami,
Satoshi; (Okayama-shi, JP) |
Correspondence
Address: |
OBLON, SPIVAK, MCCLELLAND, MAIER & NEUSTADT, P.C.
1940 DUKE STREET
ALEXANDRIA
VA
22314
US
|
Assignee: |
m-FSI LTD.
Tokyo
JP
|
Family ID: |
19008291 |
Appl. No.: |
11/069561 |
Filed: |
March 2, 2005 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
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11069561 |
Mar 2, 2005 |
|
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|
10157155 |
May 30, 2002 |
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6874516 |
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Current U.S.
Class: |
134/33 ; 134/148;
134/153; 134/157; 134/902 |
Current CPC
Class: |
H01L 21/67051 20130101;
Y10S 134/902 20130101; B08B 3/04 20130101 |
Class at
Publication: |
134/033 ;
134/148; 134/153; 134/157; 134/902 |
International
Class: |
B08B 003/00 |
Foreign Application Data
Date |
Code |
Application Number |
May 31, 2001 |
JP |
2001-165644 |
Claims
1-8. (canceled)
9. A dispenser useful in cleaning a substrate, comprising: a pair
of upper and lower members provided at inner end portions thereof
with flat areas capable of extending over at least parts of front
and back sides of a substrate, respectively, a vertical movement
control mechanism for fixing said flat areas substantially in
parallel with said substrate, with desired clearances between said
front and back sides of said substrate and the corresponding ones
of said flat areas, without any contact between said front and back
sides of said substrate and said corresponding flat areas, and at
least one nozzle arranged at one of said flat areas and at least
one nozzle arranged at the other flat area such that at least one
of gas and liquid can be fed to said front and back sides of said
substrate.
10. A dispenser according to claim 9, wherein said flat areas are
each provided with plural nozzles arranged at equal intervals in a
concentric or linear pattern or over the entire area.
11-16. (canceled)
Description
BACKGROUND OF THE INVENTION
[0001] a) Field of the Invention
[0002] This invention relates to an apparatus (hereinafter called
"a substrate cleaning apparatus") useful in cleaning, for example,
a semiconductor substrate material such as a silicon wafer
(hereinafter called "a substrate"). This invention is also
concerned with a dispenser, a substrate holding mechanism and a
substrate cleaning chamber, which are suitable for use with the
substrate cleaning apparatus. This invention also pertains to
substrate cleaning processes making use of the dispenser, substrate
holding mechanism and/or substrate cleaning chamber.
[0003] Keeping in step with abrupt developments of the
semiconductor industry, requirements for semiconductor substrate
materials such as silicon wafers are becoming stricter year by
year, resulting in an outstanding desire for the development of a
substrate cleaning apparatus and process capable of completely
performing cleaning-off of unwanted substances, such as mist, from
a surface of a substrate and/or treatment for the removal of
undesired parts from a surface of a substrate (hereinafter simply
called "cleaning"). In these days, cleaning of a substrate is not
limited to its front side but cleaning of its back side is also
desired. Conventional substrate cleaning apparatuses, however, can
hardly perform high-accuracy cleaning, because in most of such
conventional apparatuses, a closed section (hereinafter called "a
chamber") in which cleaning is performed is not completely divided
into a substrate cleaning section and its peripheral section but
includes these sections in a structurally undivided form. There are
some conventional substrate cleaning apparatuses with internally
divided chambers. The division of each of such chambers is,
however, limited to such an extent as arrangement of a partition
wall, which exhibits shielding or straightening effect, for the
purpose of preventing mist from mixing in a chemical or rise water
to be provided for the cleaning of a substrate.
[0004] It is also known to divide a chamber of a substrate cleaning
apparatus into two sections, one being a section for conducting
cleaning with a chemical or the like and the other a section for
rinsing the chemical or the like, and to conduct both cleaning and
rinsing in situ, in other words, in the same chamber. This is to
divide the interior of the same chamber into different sections
depending on the types of treatments, and is not to isolate a
section, in which cleaning is conducted, from its peripheral
section and vice versa.
[0005] In conventional substrate cleaning apparatuses, the vacuum
chuck system that a substrate to be cleaned is held at its back
side under a vacuum is widely employed as a means for holding the
substrate. This system is excellent in that, as long as control of
a vacuum does not cease, the substrate can be held stably even when
the substrate is spun at high rpm. Under the current situation that
cleaning is also required for the back side of a substrate, the
above-described system is improper because a holder remains in
direct contact with the back side of the substrate.
[0006] As a system involving no contact between a holder and the
back side of a substrate, on the other hand, a non-contact
substrate holding system making use of the Bernoulli effect has
been proposed. Compared with the conventional system that a holder
remains in direct contact with a substrate, this system is superior
from the viewpoint of avoiding contamination by a mechanical cause,
and has possibility of finding wide-spread utility. However, this
system generally uses a gaseous fluid so that a high degree of
control is required on the gaseous fluid. This system is effective
as a chuck mechanism for holding a substrate. From the viewpoint of
surface cleaning, however, this system cannot treat both sides of a
substrate at the same time because only one side is exposed to gas
which is continuously fed.
[0007] In each of the conventional substrate cleaning apparatuses,
the interior of the chamber is exposed to a treatment chemical and
a rinse solution. Most of the conventional substrate cleaning
apparatus are, however, not equipped with any means for positively
washing inner walls of their chambers. Proposed means are limited
to those for washing a periphery of a treatment section with water.
It is, however, difficult to wash the interior of a chamber with
water in the course of a series of cleaning of substrates. The
above-proposed means, therefore, require frequent allocations of
time exclusively for washing the chamber.
[0008] In cleaning a substrate, it is a common practice to
exclusively clean only a part of the substrate, for example, its
front side, its back side or a bevel (a swell of copper formed on
an outer periphery of the substrate upon plating). The
above-described exclusive cleaning of only a part of a substrate is
excellent from the viewpoint of high-accuracy cleaning, but at a
fabrication site, requires purchase of different apparatuses for
different parts, resulting in the need for higher cost and broader
installation space. Even when cleaning a substrate at the entire
surfaces thereof, its surfaces may be exclusively cleaned part by
part in some instances. This is attributed to actual circumstances
that cleaning must unavoidably be performed exclusively part by
part because except for complete dipping of a substrate in a
chemical or the like, a substrate is often spun in such equipment
as treating substrates one by one as in single wafer treatment and
a limitation is hence imposed on the cleaning by a mechanism for
holding the substrate.
SUMMARY OF THE INVENTION
[0009] An object of the present invention is, therefore, to provide
a substrate cleaning apparatus and process capable of performing
high-accuracy cleaning to completely remove unwanted substances,
such as mist, and/or undesired parts from a surface of a substrate
and also various units suitable for use in the apparatus and
process.
[0010] Another object of the present invention is to provide a
substrate cleaning apparatus capable of minimizing contamination of
a substrate by a substrate holding member and also capable of
applying high-accuracy cleaning to both front and back sides of the
substrate, a peripheral edge face (which may hereinafter be called
simply "the edge") of the substrate and also one or more desired
parts of the substrate in the same chamber in single wafer
treatment; a dispenser, a substrate holding mechanism and a
substrate cleaning chamber, all of which are suitable for use in
the substrate cleaning apparatus; and also substrate cleaning
processes making use of these dispenser, holding mechanism and/or
chamber, respectively.
[0011] A further object of the present invention is to provide a
substrate cleaning apparatus which can also be used in the cleaning
of a substrate with dangerous gas or high-concentration gas and can
perform high-accuracy and high-safety cleaning such that waste
water and mist are surely discharged without occurrence of
recontamination after the cleaning; a substrate holding mechanism
and a substrate cleaning chamber, both of which are suitable for
use in the substrate cleaning apparatus; and also substrate
cleaning processes making use of these holding mechanism and/or
chamber, respectively.
[0012] The above-described objects can be achieved by the present
invention to be described hereinafter. Described specifically, the
present invention, in one aspect thereof, provides a substrate
cleaning apparatus comprising: an outer shell constructed such that
the outer shell is selectively openable or hermetically closable to
form a sealed space, an inner shell enclosed within the outer shell
and having a holding member for holding a substrate, and a
dispenser unit for feeding at least one of gas and liquid into the
inner shell, wherein within the sealed space formed by the outer
shell, a highly gas-tight space is formed by the inner shell to
permit cleaning of the substrate within the highly gas-tight space.
In another aspect of the present invention, there is also provided
a substrate cleaning apparatus comprising: an outer shell
constructed such that the outer shell is selectively openable or
hermetically closable, an inner shell enclosed within the outer
shell and having an upper and lower openings and an outlet for
discharging effluent, and an upper and lower dispenser units
arranged for vertical movements such that the upper and lower
dispenser units can be inserted into or removed from the upper and
lower openings, respectively, said dispenser units being provided
on inner end portions thereof with flat areas each of which has at
least one nozzle, and, when the upper and lower dispenser units are
inserted into the upper and lower openings of the inner shell,
respectively, a highly gas-tight space is formed by the inner end
portions and an inner wall of the inner shell, wherein the inner
shell is provided through the inner wall thereof with an outlet for
discharging at least one of waste gas and waste liquid and is also
provided on the inner wall thereof with a holding member for
holding a substrate (hereinafter simply called the "substrate"),
which is under cleaning, out of contact with the end portions of
the dispenser units, and the inner shell is constructed for
rotation about a vertical axis thereof with the substrate held by
the holding member.
[0013] Each of the substrate cleaning apparatus according to the
present invention has a double shell structure that a treatment
space is isolated from a peripheral section, thereby making it
possible to minimize the contact between a substrate under cleaning
and an external atmosphere. As a result, safe and high-accuracy
cleaning is feasible. Described specifically, the above-described
possession of the double shell structure makes it possible to
safely perform desired cleaning because, even when a gas or
chemical harmful to the human body is used in the treatment space,
the double shell structure does not permit leakage of the harmful
gas or chemical into the external atmosphere. Further, the
possession of the double shell structure also realizes a very high
level of sealing in the treatment space, enables easy control of
physical quantities such as pressure, temperature and humidity in
the treatment space in accordance with desired treatment
conditions, and therefore, permits high-accuracy cleaning. In
addition, provision of an optional space between the treatment
space and the peripheral section to enhance the sealing of the
peripheral section allows the peripheral section to play a role as
a buffer for minimizing effects from the external environment on
the treatment space. In this respect too, high-accuracy cleaning of
a substrate is feasible.
[0014] A need for various chemicals and gases in the cleaning of a
substrate unavoidably results in a large substrate cleaning
apparatus. The substrate cleaning apparatuses make it possible to
simplify a system for feeding a chemical, so that the substrate
cleaning apparatuses are each expected to be constructed in a
smaller size.
[0015] In a further aspect of the present invention, there is also
provided a dispenser useful in cleaning a substrate, comprising: a
pair of upper and lower members provided at inner end portions with
flat areas capable of extending over at least parts of front and
back sides of a substrate, respectively, a vertical movement
control mechanism for fixing the flat areas substantially in
parallel with the substrate, with desired clearances between the
front and back sides of the substrate and the corresponding ones of
the flat areas, without any contact between the front and back
sides of the substrate and the corresponding flat areas, and at
least one nozzle arranged at one of the flat areas and at least one
nozzle arranged at the other flat area such that at least one of
gas and liquid can be fed to the front and back sides of the
substrate. In a still further aspect of the present invention,
there is also provided a process for cleaning a substrate by the
dispenser, which comprises the following step: maintaining the
clearances between the front and back sides of the substrate and
the corresponding ones of the flat areas at a value not greater
than 3 mm and feeding the liquid through from the nozzles such that
films of the liquid are formed between the front and back sides of
the substrate and the corresponding flat areas.
[0016] The dispenser according to the present invention comprises
the pair of upper and lower members provided at the inner end
portions thereof with the flat areas capable of extending over at
least parts of the front and back sides of the substrate,
respectively, and has the vertical movement control mechanism for
fixing the flat areas substantially in parallel with the substrate,
with desired clearances between the front and back sides of the
substrate and the corresponding ones of the flat areas, without any
contact between the front and back sides of the substrate and the
corresponding flat areas. It is, therefore, possible to form films
of liquid between the substrate and the flat areas by making use of
a surface tension of the liquid and to perform cleaning while
retaining these liquid films. Desired parts of the surfaces of the
substrate can be subjected to cleaning while protecting the desired
parts with the liquid films. Surface areas of the substrate, which
are to be subjected to cleaning, can be determined as desired by
choosing the number and position(s) of nozzle(s) to be arranged at
each of the flat areas for feeding liquid or gas to the substrate.
The conventional substrate cleaning apparatuses each requires
arrangement of devices, units or the like for exclusively cleaning
specific parts of a substrate, respectively. Owing to the use of
the dispenser constructed as described above, however, the present
invention has made it possible to apply cleaning to one or both of
the sides of the substrate as desired in the same treatment space.
Moreover, the formation of the liquid films can be achieved with a
least amount of the liquid, so that the present invention is also
excellent in economy.
[0017] Further, the use of the dispenser according to the present
invention can also cause a liquid to pass between the substrate and
the flat areas while retaining gas bubbles there by arranging the
substrate and the flat areas close to each other, forming films of
the liquid between the substrate and the flat areas, respectively,
and then feeding gas into the liquid films. This treatment makes it
possible to bring a small amount of reactive gas into contact with
the substrate without diluting of the reactive gas and moreover, to
allow boundaries of gas bubbles to run on and along the substrate.
Cleaning effect such as physical separation of contaminants can
also be expected, thereby making it possible to economically
perform high-accuracy cleaning of the substrate.
[0018] By ingeniously determining the position(s), number and
orifice size of nozzle(s) to be arranged at each of the flat areas,
the dispenser according to the present invention can perform
cleaning by feeding liquid to desired position or positions and
therefore, can achieve uniform cleaning.
[0019] In a still further aspect of the present invention, there is
also provided a substrate cleaning chamber capable of forming a
highly gas-tight space for use in cleaning a substrate, comprising:
plural holding members for holding the substrate in a horizontal
plane, at least one nozzle for feeding at least one of gas and
liquid to at least one of a front and back sides of the substrate
arranged by the holding members, an outlet arranged at a position
lower than the horizontal plane, in which the substrate is held,
such that the at least one of the gas and liquid can be discharged,
and a mechanism for rotating the substrate cleaning chamber about a
vertical axis thereof with the substrate held therein. According to
a still further aspect of the present invention, there is provided
a process for cleaning a substrate by the substrate cleaning
chamber, which comprises, while rotating the substrate cleaning
chamber about the vertical axis thereof with the substrate held
therein, feeding at least one of gas and liquid to at least one of
a front and back sides of the substrate from at least one nozzle
such that the at least one of the front and back sides of the
substrate is subjected to at least one of washing and rinsing.
[0020] Conventional substrate cleaning apparatuses are observed to
involve a problem that parts of a substrate, where the substrate is
in direct contact with a holding member, are abraded to result in a
considerable damage on the substrate itself. As the substrate
cleaning chamber according to the present invention has the
mechanism for rotating the substrate cleaning chamber about the
vertical axis thereof with the substrate held therein, the
above-mentioned problem can be lessened to increase the efficiency
of cleaning.
[0021] According to the substrate cleaning chamber of the present
invention, unwanted substances, such as liquid and mist, spread
around by centrifugal force or a flow of liquid can be adequately
and promptly discharged through the outlet. Preferably, the outlet
may be constructed such that such unwanted substances can be
promptly discharged out of the treatment space by using the kinetic
energy of the liquid so spread out. This can effectively avoid the
problem that a chemical employed for the cleaning of the substrate
may remain in the treatment space and causes recontamination of the
substrate, and therefore, can achieve high-accuracy cleaning. In a
more preferred embodiment, plural discharge outlets may be arranged
at positions lower than the horizontal plane in which the substrate
is disposed. These discharge outlets allow liquid and gas, which
have been employed for cleaning, to smoothly flow out in their
entirety. As a result, it is possible to effectively prevent a
chemical, rinse water or mist from flowing back to the side of the
substrate. Because cleaning can be performed as described above, no
special means is needed for washing or drying the interior of the
treatment space. As the interior of the treatment space can be
washed or dried concurrently with cleaning, the substrate cleaning
chamber according to the present invention permits economical
cleaning.
[0022] In a yet further aspect of the present invention, there is
provided a substrate holding mechanism useful in cleaning a
substrate, comprising: plural clamps each of which has an upper and
lower members for holding a peripheral edge portion of the
substrate at an upper and lower sides thereof such that the
substrate is maintained in a substantially horizontal plane, and a
control mechanism for operating the upper and lower members such
that the upper and lower members repeat holding and release of the
substrate in a successive order. Preferably, six clamps as defined
above may be arranged at equal angular intervals therebetween at
such locations that the peripheral edge portion of the substrate is
held at the upper and lower sides thereof by the clamps arranged as
three pairs of diametrically opposite clamps, and the three pairs
of diametrically opposite clamps may each independently be operable
in a pair by the control mechanism such that the three pairs of
diametrically opposite clamps can repeatedly hold and release the
substrate in a successive order. According to the substrate holding
mechanism of the present invention, the peripheral edge portion of
the substrate can be held at plural points, and moreover, the upper
and lower members which are brought into contact with the substrate
can hold and release the substrate in a successive order. It is,
therefore, possible to completely clean the substrate over the
entire surfaces thereof. By ingeniously designing the substrate
holding mechanism such that the substrate is held at minimized
areas, the substrate holding mechanism can stably hold the
substrate without bringing a holder into the entire back side as in
conventional substrate cleaning apparatuses, and accordingly, can
minimize the contamination by contact with such a holder. In
addition, the substrate holding mechanism according to the present
invention makes it possible to clean the both sides of a substrate
and its edge at the same time in the same treatment space. It is,
therefore, no longer needed to arrange plural devices or units for
exclusively cleaning specific areas, thereby permitting economical
cleaning.
BRIEF DESCRIPTION OF THE DRAWINGS
[0023] FIG. 1 is a cross-sectional view showing principal parts of
a substrate cleaning apparatus according to the present
invention;
[0024] FIG. 2 is a cross-sectional view showing the principal parts
of the substrate cleaning apparatus according to the present
invention as taken at an angle different from FIG. 1;
[0025] FIG. 3A is a schematic perspective view of an inner shell
for use in the substrate cleaning apparatus according to the
present invention;
[0026] FIG. 3B is a vertical cross-sectional view of the inner
shell of FIG. 3A as taken in the direction of arrows IIIB-IIIB of
the same figure;
[0027] FIG. 4A is a simplified schematic illustration of channels
in the inner shell of FIGS. 3A and 3B;
[0028] FIG. 4B is a simplified schematic illustration of a
modification of the channels of FIG. 4A;
[0029] FIGS. 5A and 5B are simplified fragmentary perspective views
of the substrate cleaning apparatus according to the present
invention, illustrating how a substrate is automatically arranged
in a treatment space of the apparatus;
[0030] FIGS. 6A through 6D and FIGS. 6a and 6b schematically
illustrate the operation of a holding member applicable to the
inner shell of the substrate cleaning apparatus according to the
present invention;
[0031] FIG. 7 is a schematic illustration showing how a substrate
is cleaned by the substrate cleaning apparatus according to the
present invention;
[0032] FIG. 8A is a perspective view of an example of each
dispenser unit for use in the substrate cleaning apparatus
according to the present invention;
[0033] FIG. 8B is similar to FIG. 8A but illustrates a modification
of the dispenser unit;
[0034] FIG. 9A is a schematic illustration of a nozzle face
according to another modification of the dispenser unit;
[0035] FIG. 9B is a schematic perspective view showing one of
annular ring members for use in a form assembled in the another
modification;
[0036] FIG. 10A is a schematic illustration of a nozzle face
according to a further modification of the dispenser unit;
[0037] FIG. 10B is a schematic perspective view showing a linear
ring member for use in a form assembled in the further
modification;
[0038] FIG. 11 is a simplified front elevation of a substrate
cleaning system with the apparatus according to the present
invention incorporated therein;
[0039] FIG. 12 is a flow diagram showing illustrative feeding of
gases and liquids to the apparatus according to the present
invention;
[0040] FIG. 13 is a schematic illustration of a substrate and
dispenser units under cleaning by the apparatus according to the
present invention;
[0041] FIGS. 14A through 14F are a series of schematic
illustrations of a substrate and the dispenser units while the
substrate is being cleaned by the apparatus according to the
present invention under conditions different from those employed in
FIG. 13;
[0042] FIG. 15A is a perspective view of one of dispenser units in
the substrate cleaning apparatus according to the present invention
employed in an Example; and
[0043] FIG. 15B is a schematic illustration of a substrate and the
dispenser units under cleaning in the Example.
DETAILED DESCRIPTION OF THE INVENTION AND PREFERRED EMBODIMENTS
[0044] The above-described various excellent advantageous effects
can be obtained all together provided that the above-described
apparatus of the double shell structure, which is composed of the
outer shell and the inner shell and de-fines a doubly-sealed space
in the inner shell, is used as a basis, the above-described
substrate cleaning chamber with a highly gas-tight space formed for
cleaning a substrate therein is used in the inner shell, the
above-described dispensers are used as the dispenser units to feed
gas and liquid and further, the above-described substrate holding
mechanism is used as a holding member for holding the substrate
within the chamber. The substrate cleaning apparatus according to
the present invention, which has the above-described construction,
will hereinafter be described with reference to the drawings.
[0045] FIGS. 1 through 4 illustrate the principal parts of the
substrate cleaning apparatus according to the present invention
(hereinafter called "the apparatus of the present invention") in
which the above-described construction have been specifically
embodied. As shown in FIG. 1 and FIG. 2, the apparatus of this
invention comprises an outer shell 2 constructed such that the
outer shell is selectively openable or hermetically closable to
form a sealed space, an inner shell 1 enclosed within the outer
shell 2 and provided with openings in at least upper and lower
portions thereof, respectively, and a pair of upper and lower
dispenser units 13,14 arranged for vertical movements such that the
upper and lower dispenser units can be inserted into or removed
from the upper and lower openings of the inner shell 1,
respectively. By inner end portions of these dispenser units 13,14
and an inner wall of the inner shell 1, a highly gas-tight space
(hereinafter called "the treatment space") is formed. These outer
shell 2, inner shell 1 and dispenser units 13,14 are arranged such
that, when a substrate is arranged in the treatment space, the
substrate is held with its front and back sides kept out of contact
with the lower and upper end portions of the dispenser units 13,14
to permit efficient cleaning of the substrate. Further, the inner
shell 1 is constructed such that the inner shell 1 is rotatable
about a vertical axis thereof while holding the substrate 20. The
dispenser units 13,14 are provided on peripheral end portions
thereof with supply ports 12 for feeding a chemical and/or a gas
into the space. Upon using the above-described apparatus, the inner
shell 1 is rotated about the vertical axis thereof while holding
the substrate 20 in such a state as if the substrate 20 is floating
in the treatment space, and a chemical, gas or the like is fed
toward the front and back sides of the substrate 20 from nozzles,
which are arranged on the dispenser units 13,14 and are located
opposite the substrates 20, to perform cleaning of the
substrate.
[0046] A description will firstly be made about the outer shell 2.
The outer shell 2 is arranged to form within the inner shell 1 the
treatment space which satisfies pressure-resistant sealing
conditions for conducting cleaning. It is, therefore, preferred to
construct the outer shell 2 such that the outer shell is
selectively openable and hermetically closable and can withstand at
least 2 atm. As the material making up the outer shell 2, it is
desired to use a material capable of forming a high-pressure
vessel, such as titanium or SUS. Because a chemical and/or gas is
used under gas-tight conditions, the inner shell 2 may desirably be
coated on at least an inner wall thereof with a fluorinated resin
excellent in chemical resistance.
[0047] To permit placing the substrate in the treatment space of
the inner shell 1 accommodated within the outer shell 2 and also
taking it out of the treatment space, an upper section 3 of the
outer shell 2 is constructed openable and closable. Further, to
form the treatment space within the inner shell 1, it is necessary
to establish sealing between the upper section 3 and a lower
section 4. For this purpose, the outer shell 2 may preferably be
provided, for example, with hydraulic, pneumatic or electromagnetic
lifting devices 16 to selectively open and close the upper section
3 of the outer shell 2. These lifting devices 16 can selectively
open and close the upper section 3 of the outer shell 2 and, when
the upper section 3 is closed, can maintain the interior of the
outer shell 2 in a sealed state. According to an investigation by
the present inventors, this sealing of the interior of the outer
shell 2 requires to hold the upper section 3 and the lower section
4 of the outer shell 2 in place under a pressure of at least 2 atm.
In addition to the above-described mechanism for sealing the upper
section 3 of the outer shell 2 concurrently with the closure of the
upper section 3, it is also preferred, for example, to mechanically
lock the upper and lower sections 3,4 together subsequent to the
closure of the upper and lower sections 3,4 such that the upper
section 3 is protected from failing to withstand a positive
pressure and being raised upwards.
[0048] A description will next be made about the inner shell 1
accommodated within the outer shell 2. The inner shell 1 is
provided with openings in upper and lower parts thereof,
respectively, and also with outlets 9 for discharging waste water.
On an inner wall of the inner shell 1, holding members 8 are
arranged to hold within the treatment space the substrate 20 to be
cleaned. Further, the inner shell 1 is constructed such that the
inner shell 1 is rotatable about a vertical axis thereof while
holding the substrate 20 by the holding members 8. The inner shell
1 constructed as described above serves to effectively perform
cleaning owing to its rotation with the substrate 20 held thereon
and also to protect the substrate 20 from a contaminated liquid to
be discharged upon cleaning the substrate 20. As the inner shell 1
is brought into contact with high-concentration gas and/or a
chemical employed for the cleaning, it is preferred to form the
inner shell 1 with a fluorinated resin excellent in chemical
resistance or to coat at least the interior of the inner shell 1
with such a fluorinated resin. Preferred embodiments can include
the inner shell shown in FIGS. 3A, 3B and 4A and its modification
illustrated in FIG. 4B. A description will herein after be made
about the embodiment shown in FIGS. 3A, 3B and 4A and its
modification illustrated in FIG. 4B.
[0049] The preferred embodiment of the inner shell 1 is depicted as
the schematic perspective view in FIG. 3A. In the external
appearance of the inner shell 1, the inner shell 1 is in the form
of a truncated right cone internally having a treatment space and
open at upper and lower ends thereof. On an outer peripheral wall
of an upper section 6 of the inner shell 1, plural wheels 11 are
arranged to rotate the inner shell 1 about the vertical axis
thereof. In the embodiment shown in FIGS. 3A, 3B and 4A and its
modification depicted in FIG. 4B, the wheels 11 are arranged at 6
locations on the outer peripheral wall of the inner shell 1. These
wheels 11 are caused to run on and along a rail 5 (see FIGS. 1 and
2) arranged on the inner wall of the lower section 4 of the outer
shell 2 so that the inner shell 1 is rotated about the vertical
axis thereof. The wheels 11 can be rotated in any desired manner.
For example, a motor can be arranged on the inner shell 1 and the
wheels 11 themselves can be driven by using the motor as a source
of their drive force. As an alternative, permanent magnets and
electromagnets can be arranged on the inner shell 1 and in the rail
5, respectively, such that the inner shell 1 itself can be rotated
by using he thus-constructed linear motor as a source of its drive
force. In this connection, it is desired to design the inner shell
1 such that the rotation of the wheels 11 can be controlled at will
within a range of from 0 to at least 3,000 rpm. As the inner shell
1 itself is constructed to rotate with the substrate held thereon
in the present invention as described above, it is possible to
effectively avoid the potential problem of the conventional
apparatuses, in each of which cleaning is performed while spinning
only a substrate, that by a sudden acceleration or deceleration,
the substrate may be caused to spin in a position slid from holding
members and may not be cleaned well.
[0050] As described above, the holding members 8 are arranged on
the inner wall of the inner shell 1 to hold the substrate. It is
preferred to arrange these holding members 8 such that, as
illustrated in the cross-sectional view of FIG. 3B, the substrate
20 is held in a horizontal plane substantially centrally within a
highly gas-tight treatment space formed surrounded by the inner
wall of the inner shell 1 and the like. This makes it possible to
effectively perform cleaning of the substrate and also to
effectively prevent recontamination of the substrate with a
contaminated liquid such as a chemical or water employed in the
cleaning.
[0051] No particular limitations are imposed on the holding members
8 insofar as the substrate can be firmly held in a stable state
within the treatment space. Usable examples of the holding members
can include clamps capable of holding a peripheral edge portion of
the substrate at both the upper and lower sides thereof (for
example, see FIGS. 6A through 6D) or at both a vertical site of a
peripheral edge of the substrate and the vertical site of the edge
opposite to the former(for example, see FIGS. 6a and 6b) and
mechanisms capable of holding the substrate at an peripheral edge
thereof in a point-to-point contact manner so that a contact area
of the substrate and the holding member 8 is 2 to 10 mm.sup.2,
preferably 4 to 7 mm.sup.2. In the embodiment shown in FIGS. 3A, 3B
and 4A and the modification depicted in FIG. 4B, insertion of a
disk-shaped substrate into the treatment space within the inner
shell 1 results in holding of the substrate at the peripheral edge
portion thereof at equally spaced 6 points by the six holding
members 8. As a consequence, the substrate is held in a horizontal
plane within the treatment space.
[0052] As mentioned above, the substrate to be cleaned may
preferably be held stably in a horizontal plane substantially
centrally within the treatment space. As illustrated in FIGS. 5A
and 5B, upon using the apparatus according to the present
invention, the substrate 20 is carried by a carrier robot 50 into a
clearance defined between the upper section 3 of the outer shell 2
and the inner shell 1 as a result of raising of the upper section 3
by the lifting device 16, and subsequently, the substrate 20 is
placed at a desired position in the inner shell 1. Here, no problem
would arise insofar as the carrier robot 50 can, for example,
suspend the wafer only at edges thereof by claws and carry it in
the suspended state to the center of the treatment space. When a
carrier robot such as that illustrated in FIG. 5B is used, a
carrier arm may interfere with the substrate cleaning apparatus so
that the substrate may not be smoothly placed within the treatment
space. If this is proven to be the case, it is necessary to
perform, for example, operation such that chuck mechanisms equipped
with lifting function as shown in FIGS. 6A through 6D and FIGS. 6a
and 6b are used, plural holding members are raised by the lifting
function, and the holding members then receive the substrate in
their raised positions and place it in the treatment space. With
reference to the schematic illustrations of FIGS. 6A through 6D,
the operation of each chuck mechanism will be described. When the
substrate 20 approaches the upper opening of the inner shell 1, an
upper holding member 8a is firstly lifted, and the substrate 20 is
supported on a claw portion arranged on an inner wall of the
holding member 8a (see FIG. 6A). Next, the holding member 8a
descends with the substrate 20 still supported on the claw portion,
and at the same time, a lower holding member 8b ascends (see FIG.
6B). When the upper holding member 8a turns counterclockwise, the
substrate is transferred onto the lower holding member 8b from the
claw portion arranged on the inner wall of the upper holding member
8a (see FIG. 6C). Finally, a clamp portion of the upper holding
member 8a descends onto the substrate 20 placed on the lower
holding member 8b, and the substrate 20 is firmed held in place
between the upper holding member 8a and the lower holding member 8b
(see FIG. 6D) Further, arrangement of plural holding members 8 of
the above-described mechanism makes it possible to hold a substrate
stably in a horizontal plane substantially centrally within the
treatment space.
[0053] The operation of a chuck mechanism shown in FIGS. 6a and 6b
will also be described. The substrate 20 is hold at both a vertical
site of an peripheral edge thereof and the vertical site of the
edge opposite to the former. The holding is performed by clamping
both the vertical sites of the substrate using two of the holding
members 8c as shown in FIGS. 6a and 6b.
[0054] In addition, it is preferred to construct the
above-described holding members 8, which are arranged at 6
locations, respectively, that as shown in FIGS. 4A and 4B, three
pairs of diametrically opposite chuck mechanisms are each
independently operable in a pair and these three pairs of
diametrically opposite clamps can repeatedly hold and release the
substrate in a successive order. As will be described subsequently
herein, this construction makes it possible to solve the problem
that the substrate 20 remains without being cleaned at areas where
the substrate 20 is in contact with the holding members 8, so that
the substrate 20 can be completely cleaned on both the front and
back sides thereof.
[0055] In the case of the conventional holding method making use of
a vacuum chuck mechanism which holds a substrate at the back side
thereof under a vacuum, on the other hand, a holder covers the
whole back side of the substrate. Therefore, the back side may
become a contamination source, to say nothing of the problem that
the substrate cannot be washed on the back side. In the case of a
holder equipped with a conventional mechanical chuck mechanism to
grip a substrate at only an end thereof, the substrate can be fixed
stably insofar as the mechanical chuck mechanism contacts at a
large area thereof with the substrate. However, the substrate
cannot be cleaned at a gripped part so that the gripped part
remains not cleaned. If the area of contact between the holder and
the substrate is made very small in this case, the part which
remains not cleaned can be made very small. In this case, however,
the substrate tends to slip off from the holder and to rotate, for
example, when rotation suddenly changes from high-speed rotation to
low-speed rotation. A new problem, therefore, arises in that a
limitation is imposed on the manner of application of rotation and
sufficient cleaning can be hardly performed. A holding method
called "the Bernoulli chuck", which makes use of a stream of air,
has difficulty in manufacturing a hermetically sealed apparatus,
leading to a problem that a limitation is imposed on chemicals
usable for treatment.
[0056] A description will hereinafter be made about the
above-explained mechanism including the holding members 8 arranged
at the six locations and permitting entirely cleaning a substrate,
including its edge and back side, while establishing an area of
contact sufficient to enable stable holding of the substrate. For
example, the six holding members 8 can be arranged and constructed
such that the holding members 8 oppose each other in three pairs
across the center of the substrate as indicated by signs a-c,
respectively, and the three pairs of the holding members 8 are each
independently operable in a pair. This makes it possible, for
example, to release the holding members 8 at the points a,a and to
hold the substrate only at the remaining 4 points b,b,c,c. By
successively changing the holding points of the substrate in this
manner, the areas of the substrate at which the substrate are in
contact with the holding members 8 can be successively exposed and
cleaned. As a result, the front and back sides of the substrate can
be cleaned over the entire areas thereof. According to an
investigation by the present inventors, it has been found
preferable to arrange these holding members at six locations or
more on the inner wall of the inner shell 1 if one wants to hold a
substrate stably and to cause it to spin in the thus-held state
together with the inner shell 1. In such a case, it may be possible
to perform cleaning of a substrate, for example, by holding the
substrate at three points arranged at the vertices of an
equilateral triangle and then changing the holding points to
different three points arranged likewise. The investigation by the
present inventors has, however, revealed that the above-described
manner, in which three pairs of diametrically opposing holding
members are each independently operated in a pair to always hold a
substrate at four points, can hold the substrate stably and
moreover, can completely perform cleaning of the areas of the
substrate where the substrate is brought into contact with the
holding members.
[0057] As illustrated in FIG. 1 and FIG. 2, the outlets 9 are
arranged between the upper section 6 and a lower section 7 of the
inner shell 1 to discharge waste liquids, such as a chemical and
water, used in cleaning. No particular limitation is imposed on the
number of these outlets 9. In the embodiment shown in FIGS. 3A, 3B
and 4A and its modification depicted in FIG. 4B, these outlets 9
are arranged at six locations. To assure that the waste liquid is
also discharged smoothly by free falling and the substrate is
protected from recontamination with the waste liquid, it is
preferred that as illustrated in FIG. 3B, the positions of the
outlets 9 are set lower than the position at which the substrate is
arranged, channels 10 are arranged extending to the outlets 9,
respectively, and therefore, the channels 10 are inclined
downwardly toward the corresponding outlets 9. No particular
limitation is imposed in shape on the channels 10. For example, the
channels 10 can be linear as shown in FIG. 4A or can be curved in
the direction of rotation of the inner shell 1 as illustrated in
FIG. 4B. When the inner shell 1 is rotated, the formation of the
channels 10 as described above makes it possible to effectively
prevent the waste liquid from splashing back onto the substrate and
hence to lessen the potential problem of recontamination of the
substrate, thereby permitting efficient discharge of fluids such as
waste liquid and gas.
[0058] As illustrated in FIG. 1 and FIG. 2, the paired upper and
lower dispenser units 13,14 are inserted in the upper and lower
openings of the inner shell 1 constructed as described above. As a
consequence, a highly gas-tight treatment space is formed by the
inner wall of the inner shell 1 and the inner end portions of the
dispenser units 13,14. The dispenser units 13,14 are each provided
on the inner side thereof with a flat area having at least one
nozzle. When the substrate 20 is arranged within the inner shell 1,
these flat areas extend substantially in parallel with the
substrate. Further, the dispenser units 13,14 are accommodated
within the outer shell 2 which allows the formation of the
treatment space within the inner shell 1 such that the treatment
space meets predetermined pressure-resistant sealing conditions
(see FIG. 1 and FIG. 2), and the dispenser units 13,14 are
constructed such that the sealing of the treatment space is not
disturbed by vertical movements of the dispenser units. As a means
for vertically moving the dispenser units, an appropriate
conventional means such as one making use of a motor as a drive
source can be chosen and used. To permit efficient performance of
cleaning no matter how the cleaning is conducted, it is preferred
to arrange a means for precisely controlling vertical movements of
the dispenser units such that the distances between the flat areas
on the inner end portions of the dispenser units and the
corresponding sides of the substrate can be accurately adjusted as
desired.
[0059] When the substrate is arranged, the flat areas on the end
portions of the paired upper and lower dispenser units are located
opposite the front and back sides of the substrate, respectively.
These dispenser units are constructed such that a liquid or gas can
be fed from the at least one nozzle arranged at each of the flat
areas (see the schematic view of FIG. 7). It is preferred to
arrange a sensor at the flat area on the inner end portion of each
dispenser unit to measure the distance from the substrate. It is
also desired to construct these dispenser units such that in
positioning these dispenser units, the dispenser units can be
feedback controlled using information from the sensors. Feeding of
a liquid or gas to the dispenser units is effected through the
supply ports 12 shown in FIG. 2 and FIG. 7 while maintaining the
treatment space in a highly gas-tight state.
[0060] As described above, each dispenser unit is provided with at
least one nozzle at the flat area on the inner end portion thereof.
No limitation is imposed on the number and location(s) of such
nozzle(s). As illustrated by way of example in FIG. 8A, one nozzle
21 may be arranged around the center of the flat area. As shown in
FIG. 8B, on the other hand, a plurality of nozzles 21 may be
arranged over the entire surface of the flat area. As also depicted
in FIGS. 9A and 9B, a plurality of nozzles 21 may be arranged
concentrically at each angular intervals. A still further
alternative example is shown in FIGS. 10A and 10B, in which a
plurality of nozzles 21 are arrayed linearly at equal intervals.
These nozzles 21 are constructed to permit feeding of a gas and/or
a liquid, such as a cleaning solution or rinse water, from them.
With the apparatus according to the present invention, cleaning of
various substrates can be performed by suitably choosing gas(es)
and liquid(s) to be fed from these nozzles.
[0061] For example, arrangement of plural nozzles 21 at appropriate
locations on the flat area of each dispenser unit makes it possible
to feed a liquid to the entire surfaces of a substrate without
relying upon flows of the liquid, said flows requiring to spin the
substrate. As an alternative example, arrangement of plural sets of
nozzles 21, which are arranged concentrically at equal angular
intervals as illustrated in FIG. 9A, at different locations on the
flat area makes it possible to separately feed gas (es), cleaning
solution(s), rinse water and the like from the different locations.
This can provide the apparatus according to the present invention
with additional functions such as bringing a gas and a liquid,
which have been fed separately from the nozzles at different
locations, separately into contact with a substrate or mixing them
together before they reach the substrate, so that the apparatus can
perform a variety of treatments. To realize this, nozzle units of
such a construction as illustrated in FIG. 9B or 10B, for example,
can be incorporated in each of the dispenser units.
[0062] A description will next be described about a manner of use
of the apparatus according to the present invention having the
above-described construction. As illustrated by way of example in
FIG. 11, a treatment unit (hereinafter called "the chamber") which
is composed primarily of the above-described outer shell, inner
shell and dispenser units is arranged centrally, a gas and liquid
transportation/process performing unit 23 is arranged underneath
the treatment unit, and an electric control unit 22 is arranged
above the treatment unit. This arrangement can reduce the floor
area required for the installation of a substrate cleaning system
and moreover, is desired from the standpoint of safety.
[0063] Upon cleaning a substrate, the substrate is firstly arranged
in the inner shell 1 in accordance with the above-described
procedure, and the internal atmosphere of the chamber is controlled
to meet an atmosphere condition required for a desired treatment.
The atmosphere condition for the interior of the chamber can be
either a chemical atmosphere or a gas-flowing atmosphere developed
as a result of an off-balance in pressure by evacuation. According
to the apparatus of the present invention, the former atmosphere
can be established by sealing the interior of the chamber and
feeding desired gas or gases, while the latter atmosphere can be
established by adjusting the openings of a waste water/solution
drain valve 18 and an exhaust on/off valve 19 (hereinafter simply
called "the valves 18,19"), both of which serve to establish or cut
off connection between an exhaust pipe 17 and the chamber (see FIG.
2), or by adjusting the degree of opening of the upper section 3
itself of the outer shell 2.
[0064] With reference to FIG. 2, a description will be made about a
manner of control of atmosphere conditions within the chamber. Upon
arranging the substrate 20 in the inner shell 1, the chamber is
filled with air. Subsequent to the arrangement of the substrate 20
in the inner shell 1, the valves 18, 19 are firstly kept open, and
a desired gas is introduced into the chamber from the dispenser
units 13,14 to replace the air in the chamber with the desired gas.
After completion of this replacement, the valves 18,19 are closed
to bring the chamber into a sealed state, and the feeding of the
gas is continued until a predetermined internal pressure is
reached. Cleaning of a substrate is conducted by bringing the
chamber into such a sealed system for the following reasons: (1) to
establish a desired chemical atmosphere, which is required for the
cleaning, by using a gas in a small amount, (2) to increase the
amount of a gas, which is to be dissolved in a cleaning solution,
by raising the pressure of the gas, (3) to realize cleaning without
being affected by fluctuations in the feed pressure of a gas, and
(4) to avoid leakage of a dangerous gas to the outside of the
chamber.
[0065] When stripping off a resist film formed on a surface of a
substrate, for example, the resist film is treated with ozone/warm
water, followed by the cleaning with ammonia/oxygen/warm water.
Taking this stripping as an example, a description will be made
specifically. Firstly, the substrate 20 is arranged in the inner
shell 1, and the air in the chamber is replaced with ozone gas. The
valves 18,19 are then closed to fill the chamber with ozone gas.
After conducting ozone gas/warm water treatment under sealed
conditions, the valves 18,19 are opened while rinsing the substrate
20 and charging nitrogen gas, so that ozone gas and wastewater are
discharged from the chamber. After the interior of the chamber is
again placed under sealed conditions, ammonia and oxygen gas are
charged until a predetermined pressure is reached, and warm water
treatment is then conducted. By this procedure, the gas atmosphere
is adjusted. In the above-described case, the amount of each gas
dissolved in warm water is determined by the partial pressure of
the gas upon its contact with the warm water, so that it is desired
to maintain the internal pressure of the chamber at 1 atm or
higher. No particular limitation is imposed on a means for feeding
a gas or liquid to the nozzles in the above procedure. This feeding
can be achieved, for example, by arranging feed lines such that a
gas, a cleaning solution and rinse water can be selectively caused
to merge feed lines to the supply ports 12 of the dispenser units
13,14 via air operated valves or the like, and then by selectively
opening one or more of the air operated valves or the like as
needed.
[0066] Referring to FIG. 12, a description will be made about the
feeding of gas and/or liquid in the apparatus according to the
present invention. In the diagram, numeral 24 indicates lines for
feeding nitrogen gas to be employed for diluting or carrying
reactive gases, numeral 25 designates lines for feeding reactive
gases such as ozone and ammonia, and numeral 26 shows lines for
feeding pure water to be used for cleaning or rinsing. The diagram
also shows pressure control valves 27, flowmeters 28, flow control
valves 29, static mixers 30 for mixing gas(es) and/or liquid(s) to
be fed, and aspirators 31. These lines and devices are arranged as
illustrated in FIG. 12, gas(es) and/or liquid(s) are suitably
chosen to conform with the objective of each treatment, and
open/closure conditions for the pressure control valves 27 and flow
control valves 29 and operating conditions for the static mixers 30
and aspirators 31 are appropriately controlled to meet
predetermined conditions for the treatment. As a result, the
kind(s) and amount(s) of gas(es) and/or liquid(s) to be fed toward
the substrate 20 from the dispenser units 13,14 can be controlled
as desired.
[0067] A description will next be made about various manners for
feeding a gas or a liquid, such as a cleaning solution or rinse
water, from the nozzles 21 arranged at the flat areas (hereinafter
simply called "the flat areas") on the inner end portions of the
dispenser units 13,14 (hereinafter simply called "the flat areas").
As already explained, the apparatus of the present invention
enables cleaning in various manners by changing the number and
position(s) of the nozzle(s) 21 on each dispenser unit and/or the
distances between a substrate and the above-described flat areas.
Reference is firstly had to FIG. 13. When each flat area is moved
closer to the substrate until a certain clearance is left
therebetween, the clearance between the substrate and the flat area
can be filled with a film of liquid by making use of the surface
tension of water. According to an investigation by the present
inventors, it has been found that for the realization of this
state, the flat area has to be brought to a distance of 3 mm or
less from the corresponding side of the substrate without causing
any contact therebetween. For the formation of such a liquid film,
it is hence needed to accurately control the interval between the
flat area and its corresponding side of the substrate to 3 mm or
smaller. Further, in order to stably maintain a liquid film formed
under the above-described conditions, it is important to place in a
horizontal plane the substrate. For the realization of this
requirement, it is, therefore, necessary to horizontally arrange
the inner shell, on which the substrate is to be held, and also the
outer shell which supports the inner shell by the rail.
[0068] Reference will next be had to FIGS. 14A through 14F. The
nozzles on the dispenser units 13,14 are brought close to the
corresponding sides of the substrate while spinning the substrate
and feeding water through the nozzles, and a gas is fed with the
clearances between the substrate 20 and the respective flat areas
being filled with water (see FIGS. 14A through 14C). This makes it
possible to cause gas bubbles G to run on and along the substrate
(see FIGS. 14C and 14D). When the feeding of water is stopped. Now
assume that, while the liquid films are maintained, the feeding of
water is stopped and a gas such as ammonia gas is fed under
low-speed rotation. This makes it possible to bring the gas at high
concentration and also water into contact with the substrate at a
very low flow rate of the gas without needing filling the outer
shell with the gas to a high pressure. Even in this case, it is
desired for the sake of safety to maintain the outer shell in a
sealing state to prevent the gas from leaking to the outside. When
the above-described manner is applied to treatment with a chemical,
the clearances between the flat areas and the corresponding sides
of the substrate can be filled with the chemical to form liquid
films there without discharging the chemical as an effluent, and
the chemical can be maintained evenly in this state for a long
time. It is, therefore, possible to substantially reduce the amount
of the chemical to be used.
[0069] According to the apparatus of this invention, drying of a
substrate subsequent to its treatment with the chemical can be
surely performed without recontamination of the substrate. As a
problem commonly observed in a drying step in conventional
substrate cleaning apparatuses, recontamination of a substrate may
take place in the post-treatment drying step when water droplets
still remain on the wall of the chamber even after the substrate
has been dried or when a gas inside the chamber contains mist
abundantly. In the apparatus of the present invention, on the other
hand, the chamber is of the double shell structure formed of the
outer shell and the inner shell accommodated within the outer
shell, the substrate is surrounded by the inner wall of the inner
shell and the inner end portions of the dispenser units, and the
inner shell and dispenser units are surrounded by the outer shell
which can be hermetically closed. The treatment space is,
therefore, in a state isolated from the remaining parts or
sections. Compared with treatment of a substrate mounted on a spin
table in an exposed treatment space within a chamber of a
conventional apparatus not equipped with a double shell or wall
structure, the apparatus of the present invention can also bring
about a pronounced advantageous effect for the inhibition of
recontamination of the substrate in the above-described drying
step.
[0070] According to an investigation by the present inventors on
the problem of recontamination of a substrate in a drying step, no
liquid was observed to remain on the substrate or in the treatment
space in the case of the apparatus of the present invention when an
experiment was conducted by rinsing the substrate to make it wet
and then spinning it at 3,000 rpm for 30 seconds. With a
conventional apparatus, on the other hand, water droplets were
observed remaining on a wall of a chamber. It has, therefore, been
found that in a drying step, a substrate may be recontaminated with
these water droplets.
[0071] As a potential problem specific to the apparatus of the
present invention, arrangement of many nozzles at the flat area of
each dispenser unit may result in penetration of a liquid into the
nozzles during cleaning, and depending on the diameter of the
nozzles, the liquid may drip off in a drying step or the like so
that recontamination of the substrate may not be completely
avoided. If the liquid remaining in the dispenser units is
concerned in the drying step or the like, the potential problem can
be resolved by drawing, before entering the drying step, the liquid
out of the dispenser units through the aspirators 31 (see FIG. 12)
to avoid dripping of the liquid.
[0072] Another potential problem may arise when the apparatus of
the present invention is used to wash the back side of a substrate.
In this application, the substrate is conveyed to the apparatus
with the back side thereof in a contaminated state. When a carrier
robot constructed as shown in FIG. 5B is employed, recontamination
may take place if the cleaned substrate is carried out by the
robot. For this application, it is desired to arrange different
robots, one being for arranging a substrate and the other for
taking it out subsequent to cleaning, or to wash substrate-holding
portions of a carrier robot subsequent to the arrangement of the
substrate.
[0073] The present invention will hereinafter be described in
detail based on an Example.
EXAMPLE 1
[0074] A CVD (chemical vapor deposition) process may include such a
step that subsequent to formation of a Ti film on a substrate, a W
film is formed successively. In a subsequent cleaning step, it may
be desired, in some instances, to eliminate adhered Ti or W
contaminant from the edge and back side of the substrate without
dissolving the surface W film or the Ti film lying under the W
film. In this Example, the apparatus of the present invention was
applied to the cleaning step. For use in the cleaning, an 8-inch
silicon substrate with 10-nm thick thermal oxidation SiO.sub.2
films formed on both sides thereof was fabricated and provided. The
substrate was subjected to etching such that the substrate was
selectively etched on only the back side and edge thereof. The
substrate cleaning apparatus had the construction described above
with reference to FIGS. 1 through 4A, and was provided at six
locations with holding members constructed as illustrated in FIG.
6.
[0075] The substrate was placed in the inner shell 1 with the side,
on which the W film was exposed, facing up and the side, on which
the thermal oxidation SiO.sub.2 film was exposed, facing down.
Firstly, the dispenser units 13,14 were moved to set their
distances from the front and rear sides at 3 cm, respectively.
While rotating the inner shell such that the substrate was spun at
10 rpm, the substrate was rinsed for 10 seconds to make the
substrate wet evenly on all the surfaces thereof. The rinsing was
conducted by feeding pure water at a rate of 1 L/min from the upper
and lower dispenser units, respectively. After the flow rate of the
rinse water was then changed to 200 mL/min, the upper dispenser
unit 13 was brought closer to a distance of 3 mm from the upper
side of the substrate. Fifteen (15) seconds later, a liquid film
was formed between the upper side of the substrate and the flat
area as shown in FIG. 13. When the liquid film became stable, a
0.5% hydrogen fluoride (HF) solution was fed from the dispenser
units 13,14. During that feeding of the HF solution, the feeding of
the HF solution from the upper dispenser unit 13 was conducted at a
flow rate of 100 mL/min from only an area A illustrated in FIG. 15A
while the feeding of the HF solution from the lower dispenser unit
14 was effected at room temperature and a flow rate of 500 mL/min
from both areas A,B shown in FIG. 15A. The substrate was treated
for 1 minute. After the dispenser unit 13 was next lifted to a
position 3 cm apart from the upper side of the substrate, the
substrate was rinsed with pure water and then dried to complete the
cleaning.
[0076] The results of the cleaning are summarized in Table 1.
Between the edge and back side to which the HF solution was applied
and the front side protected with the water film, the application
and non-application of the treatment with the HF solution were
recognized as pronounced differences in etched depth.
1TABLE 1 Etched depths at respective locations Treated location
Etched depth (nm) Front side protected by water film 0 HF-applied
Edge 2.7 substrate location Back side 3.0
[0077] This application claims the priority of Japanese Patent
Application 2000-165644 filed May 31, 2001, which is incorporated
herein by reference.
* * * * *