U.S. patent application number 09/741001 was filed with the patent office on 2001-05-31 for printed circuit board and method of manufacturing the same.
Invention is credited to Hatakeyama, Akihito, Kawakita, Kouji, Kojima, Tamao, Nakatani, Seiichi, Ogawa, Tatsuo, Sogou, Hiroshi.
Application Number | 20010002294 09/741001 |
Document ID | / |
Family ID | 26532555 |
Filed Date | 2001-05-31 |
United States Patent
Application |
20010002294 |
Kind Code |
A1 |
Hatakeyama, Akihito ; et
al. |
May 31, 2001 |
Printed circuit board and method of manufacturing the same
Abstract
A printed circuit board includes an uncured substrate material
with closed voids which are disposed with a through-hole. When the
through-hole is formed, voids which exist in the substrate material
open from inner wall of the through-hole to form a hollow-shaped
part. By filling the through-hole and the hollow-shaped part with
conductive paste, the adhesion improves by the increased holding
effect between the conductive paste and the wall surface of the
through-hole.
Inventors: |
Hatakeyama, Akihito; (Osaka,
JP) ; Nakatani, Seiichi; (Osaka, JP) ;
Kawakita, Kouji; (Jouyou-shi, JP) ; Sogou,
Hiroshi; (Nishinomiya-shi, JP) ; Ogawa, Tatsuo;
(Amagasaki-shi, JP) ; Kojima, Tamao; (Osaka,
JP) |
Correspondence
Address: |
MORRISON & FOERSTER LLP
2000 PENNSYLVANIA AVE, NW
SUITE 5500
WASHINGTON
DC
20006-1888
US
|
Family ID: |
26532555 |
Appl. No.: |
09/741001 |
Filed: |
December 21, 2000 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
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09741001 |
Dec 21, 2000 |
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09379008 |
Aug 23, 1999 |
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6211487 |
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09379008 |
Aug 23, 1999 |
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08740261 |
Oct 25, 1996 |
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5972482 |
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08740261 |
Oct 25, 1996 |
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08607249 |
Mar 4, 1996 |
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08607249 |
Mar 4, 1996 |
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08309735 |
Sep 21, 1994 |
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Current U.S.
Class: |
428/209 ;
174/264; 29/846; 428/304.4; 428/321.3; 428/901 |
Current CPC
Class: |
Y10T 29/49126 20150115;
H05K 2201/10378 20130101; Y10T 428/249953 20150401; H05K 1/0366
20130101; H05K 3/4614 20130101; Y10T 29/49155 20150115; H05K 3/4652
20130101; H05K 2201/2072 20130101; H05K 2201/0278 20130101; H05K
2203/0191 20130101; H05K 3/462 20130101; H05K 2203/1461 20130101;
Y10T 428/24917 20150115; H05K 3/4069 20130101; Y10S 428/901
20130101; H05K 2201/0116 20130101; H05K 2201/0154 20130101; H05K
2201/0355 20130101; Y10T 428/249996 20150401 |
Class at
Publication: |
428/209 ;
428/321.3; 428/304.4; 428/901; 174/264; 29/846 |
International
Class: |
H05K 001/09; H05K
001/14 |
Foreign Application Data
Date |
Code |
Application Number |
Sep 22, 1993 |
JP |
5-236220 |
Oct 20, 1993 |
JP |
5-262175 |
Claims
What is claimed is:
1. A printed circuit board comprising a resin impregnate fiber
sheet substrate with through-holes formed in a thickness direction
and a conductive resin compound comprising a resin filled in said
through-holes in the thickness direction for electrical connection,
wherein said substrate and said conductive resin compound are
bonded to each other.
2. The printed circuit board as in claim 1, wherein said substrate
and said conductive resin compound are bonded to each other such
that said conductive resin compound penetrates into said
substrate.
3. The printed circuit board as in claim 1, wherein said conductive
resin compound comprises metallic particulates and resin, and
wherein said substrate and said conductive resin compound are
bonded to each other through impregnation of the resin of said
conductive resin compound into said substrate.
4. The printed circuit board as in claim 1, wherein said substrate
and said conductive resin compound are bonded to each other through
covalent bonding, or self-adhesion between the resin of said
conductive resin compound and the impregnate resin in said
substrate.
5. The printed circuit board as in claim 1, wherein said substrate
and said conductive resin compound are bonded to each other such
that the fiber of said fiber sheet substrate penetrates into said
conductive resin compound.
6. The printed circuit board as in claim 1, wherein the impregnate
resin of said substrate and the resin of said conductive resin
compound are both thermosetting resin.
7. The printed circuit board as in claim 6, wherein said
thermosetting resin comprises at least one resin selected from the
group consisting of epoxy resin, thermosetting polybutadiene resin,
phenol resin, and polyimide resin.
8. The printed circuit board as in claim 1, wherein said resin
impregnate fiber sheet of the substrate comprises at least one
fiber selected from the group consisting of heat-resisting
synthetic fiber and glass fiber.
9. The printed circuit board as in claim 8, wherein said
heat-resisting synthetic fiber comprises at least one fiber
selected from the group consisting of aromatic polyamide fiber and
polyimide fiber.
10. The printed circuit board as in claim 1, wherein said resin
impregnate fiber sheet of the substrate is a nonwoven fabric.
11. The printed circuit board as claimed in claim 3, wherein said
metallic particulate in the conductive resin compound is at least
one metal selected from the group consisting of gold, silver,
copper, palladium, nickel, gold alloy, silver alloy, copper alloy,
palladium alloy, and nickel alloy.
12. The printed circuit board as in claim 3, wherein said metallic
particulates are present in the conductive resin compound in an
amount of from 80 to 92.5 percent by weight.
13. The printed circuit board as in claim 3, wherein each metallic
particulate in said conductive resin compound has an average
diameter of from 0.2 to 20 .mu.m.
14. The printed circuit board as in claim 1, wherein the
through-hole filled with said conductive resin compound has an
average diameter of from 50 to 300 .mu.m.
15. The printed circuit board as in claim 1, wherein a circuit is
formed on the surface of said substrate, and also formed at a
terminal of said conductive resin compound.
16. The printed circuit board as in claim 1, wherein said substrate
is either one sheet or a plurality of sheets.
17. A method of manufacturing a printed circuit board, comprising
the steps of: (a) laminating both sides of an uncured resin
impregnate fiber sheet substrate material having voids with cover
films; (b) forming through-holes in said substrate material in a
thickness direction by laser irradiation; (c) filling said
through-holes with conductive paste; (d) removing said cover films
and applying a metal foil on at least one side of said substrate
material; (e) bonding said substrate material with said conductive
paste by compressing and hardening said substrate material through
heating and pressurization; and (f) forming predetermined patterns
on said metal foil.
18. The method of manufacturing a printed circuit board as claimed
in claim 17, wherein metal foils are applied on both sides of said
substrate material.
19. The method of manufacturing a printed circuit board as claimed
in claim 17, comprising the steps of: (a) laminating both sides of
an uncured resin impregnate fiber sheet substrate material having
voids with cover films; (b) forming through-holes in said substrate
material in the thickness direction by laser irradiation; (c)
filling said through-holes with conductive paste; (d) removing said
cover films and applying a metal foil on one side of each sheet,
thereby forming two sheets of intermediate; (e) disposing said
intermediates such that sides with metal foils face outside; (f)
holding at least two layers of circuit substrates having circuit
patterns in a core; (f) bonding said substrate material with said
conductive paste by compressing and hardening through heating and
pressurization; and (g) forming predetermined patterns on said
metal foil.
20. The method of manufacturing a printed circuit board as claimed
in claim 17, comprising the steps of: (a) laminating both sides of
an uncured resin impregnate fiber sheet substrate material having
voids with cover films; (b) forming through-holes in said substrate
material in the thickness direction by laser irradiation; (c)
filling said through-holes with conductive paste; (d) removing said
cover films, thereby forming an intermediate connecting member; (e)
positioning said intermediate connecting member between a plurality
of double sided printed circuit boards; and (f) bonding said
substrate material with said conductive paste by compressing and
hardening through heating and pressurization.
21. The method of manufacturing a printed circuit board as in claim
17, wherein said voids in the uncured resin impregnate fiber sheet
substrate material are closed holes.
22. The method of manufacturing a printed circuit board as in claim
21, wherein said closed hole has a diameter of 5 to 20 .mu.m in
said uncured substrate material.
23. The method of manufacturing a printed circuit board as in claim
17, wherein said uncured substrate material with holes has a
porosity of from 2 to 35%.
24. The method of manufacturing a printed circuit board as in claim
17, wherein the heating is carried out at a temperature of said
substrate material of from 170 and 260.degree. C.
25. The method of manufacturing a printed circuit board as in claim
17, wherein the pressurization is carried out at a pressure on said
substrate material of from 20 to 80 kg/cm.sup.2.
26. The method of manufacturing a printed circuit board as in claim
17, wherein a part of fiber in said substrate material is allowed
to remain in said through-holes by laser irradiation.
27. The method of manufacturing a printed circuit board as in claim
17, wherein a compound of metallic particulates and resin is used
as said conductive resin compound to fill said through-holes, and
the resin of said conductive resin compound is bonded to said
substrate through impregnation.
28. A method of manufacturing a printed circuit board as claimed in
claim 17, wherein the resin of said conductive resin compound and
the impregnate resin of said substrate belong to the resin having
the same functional group, and are bonded to each other through
covalent bonding, or self-adhesion.
29. The method of manufacturing a printed circuit board as in claim
17, wherein the impregnate resin in said substrate and the resin of
said conductive resin compound are both thermosetting resins, and
each comprises at least one resin selected from the group
consisting of epoxy resin, thermosetting polybutadiene resin,
phenol resin, and polyimide resin.
30. The method of manufacturing a printed circuit board as in claim
17, wherein said filling is carried out using a roll coating
method.
31. The method of manufacturing a printed circuit board as in claim
17, wherein said resin impregnate fiber sheet of the substrate
comprises at least one fiber selected from the group consisting of
heat-resisting synthetic fiber and glass fiber.
32. The method of manufacturing a printed circuit board as in claim
31, wherein said heat-resisting synthetic fiber comprises at least
one fiber selected from the group consisting of aromatic polyamide
fiber and polyimide fiber.
33. The method of manufacturing a printed circuit board as in claim
17, wherein said resin impregnate fiber sheet of the substrate is a
nonwoven fabric.
34. The method of manufacturing a printed circuit board as in claim
27, wherein said metallic particulate in the conductive resin
compound comprises at least one element selected from the group
consisting of gold, silver, copper, palladium, nickel, gold alloy,
silver alloy, copper alloy, palladium alloy, and nickel alloy.
35. The method of manufacturing a printed circuit board as in claim
27, wherein said metallic particulates are present in the
conductive resin compound in an amount of from 80 to 92.5 percent
by weight.
36. The method of manufacturing a printed circuit board as in claim
27, wherein each metallic particulate in said conductive resin
compound has an average diameter of from 0.2 to 20 .mu.m.
37. The method of manufacturing a printed circuit board as in claim
17, wherein the through-hole filled with said conductive resin
compound has an average diameter of from 50 to 300 .mu.m.
38. The method of manufacturing a printed circuit board as in claim
17, wherein said laser beam is selected from the group consisting
of carbon dioxide laser, YAG laser, and excimer laser.
Description
FIELD OF THE INVENTION
[0001] This invention relates to a printed circuit board used for
electronic devices, and further relates to a method of
manufacturing the printed circuit board.
BACKGROUND OF THE INVENTION
[0002] Recently, following the tendency of electronic devices
towards compact size and higher mounting density, multilayer
printed circuit boards have been strongly demanded, not only for
industrial but also for consumer use. This type of multilayer
printed circuit boards requires employing inner-via-hole
connections between a plurality of circuit patterns and also
requires high reliability.
[0003] A conventional method of manufacturing a double sided
printed circuit board is described as follows. FIGS. 8(a) to (e)
are cross-sectional views showing a method of manufacturing a
conventional double sided printed circuit board. First, an
insulating substrate 801 such as glass-epoxy is provided as shown
in FIG. 8(a). Then, copper foils 802 are applied on both sides of
insulating substrate 801 as shown in FIG. 8(b). Subsequently,
insulating substrate 801 and copper foils 802 are bonded to each
other through heating and pressurization. Thereafter, by using a
conventional technique such as etching or the like, copper foils
802 are formed into a first circuit pattern 805 and a second
circuit pattern 806 as illustrated in FIG. 8(c). Next, as shown in
FIG. 8(d), through-holes 803 are drilled at places where first
circuit pattern 805 and second circuit pattern 806 will be
electrically connected. After that, conductive paste 804 is filled
into through-holes 803 by a printing process as shown in FIG. 8(e),
and the paste is hardened.
[0004] In the manner as described above, first circuit pattern 805
and second circuit pattern 806 are connected by conductive paste
804 filled into through-holes 803, and thus, a double sided printed
circuit board 807 is obtained.
[0005] However, the above-mentioned conventional structure has the
problem that adhesion between the conductive paste and the wall
surface of the through-hole is poor. In addition, there is a gap in
coefficient of thermal expansion between the conductive paste and
the insulating substrate so that a boundary face of the conductive
paste and the through-hole breaks due to the thermal shock of
solder dipping. As a result, a failure in continuity occurs.
SUMMARY OF THE INVENTION
[0006] It is an objective of this invention to solve the
above-noted problems in the conventional system by improving
adhesion between the conductive resin compound and the wall surface
of the through-hole in the substrate. Another object of this
invention is to provide a printed circuit board with high
reliability. A further object of this invention is to provide a
method of manufacturing this printed circuit board.
[0007] In order to accomplish these and other objects and
advantages, a printed circuit board of the first embodiment of the
invention comprises a resin impregnate fiber sheet substrate with
through-holes formed in the thickness direction and a conductive
resin compound filled into the through-holes in the thickness
direction for electrical connection, wherein the substrate and the
conductive resin compound are bonded to each other chemically and
physically.
[0008] It is preferable that the substrate and the conductive resin
compound are bonded to each other such that the conductive resin
compound penetrates into the substrate.
[0009] Furthermore, it is preferable that the conductive resin
compound comprises metallic particulates and resin, and in
addition, that the substrate and the conductive resin compound are
bonded to each other through impregnation of the resin which is one
component of the conductive resin compound that penetrates into the
substrate.
[0010] It is also preferable that the substrate and the conductive
resin compound are bonded to each other through covalent bonding,
or self-adhesion between the resin which is one component of the
conductive resin compound and the impregnate resin in the
substrate.
[0011] Furthermore, it is preferable that the substrate and the
conductive resin compound are bonded to each other such that the
fiber of the substrate penetrates into the conductive resin
compound.
[0012] It is preferable that the impregnate resin of the substrate
and the resin which is one component of the conductive resin
compound are both thermosetting resins.
[0013] It is also preferable that the thermosetting resin comprises
at least one resin selected from the group consisting of epoxy
resin, thermosetting polybutadiene resin, phenol resin, and
polyimide resin.
[0014] Furthermore, it is preferable that the resin impregnate
fiber sheet of the substrate comprises at least one fiber selected
from the group consisting of heat-resisting synthetic fiber and
glass fiber.
[0015] In addition, it is preferable in this example that the
heat-resisting synthetic fiber comprises at least one fiber
selected from the group consisting of aromatic polyamide fiber and
polyimide fiber.
[0016] It is also preferable in this example that the resin
impregnate fiber sheet of the substrate is a nonwoven fabric.
[0017] Furthermore, it is preferable that the metallic particulate
in the conductive resin compound is at least one metal selected
from the group consisting of gold, silver, copper, palladium,
nickel, and an alloy thereof.
[0018] Furthermore, it is preferable that the metallic particulates
in the conductive resin compound are present in an amount of from
80 to 92.5 percent by weight.
[0019] It is preferable that each metallic particulate in the
conductive resin compound has an average diameter of from 0.2 to 20
.mu.m. The average diameter can be measured using a microscopic
method or a light scattering method.
[0020] In addition, it is preferable in this example that the
average diameter of the through-hole filled with the conductive
resin compound is from 50 to 300 .mu.m.
[0021] Furthermore, it is preferable in this example that a circuit
is formed on both the surface of the substrate and at the terminal
of the conductive resin compound.
[0022] It is also preferable in this example that the substrate is
either one sheet or a plurality of sheets.
[0023] A second embodiment of this invention is a method of
manufacturing a printed circuit board comprising the steps of:
laminating both sides of an uncured resin impregnate fiber sheet
substrate material having inner holes or voids with cover films,
forming through-holes in the substrate material in the thickness
direction by laser irradiation, filling the through-holes with
conductive paste, removing the cover films and applying a metal
foil on at least one side of the substrate material, bonding the
substrate material with the conductive paste by compressing and
hardening the substrate material through heating and
pressurization, and forming predetermined patterns on the metal
foil. The above-mentioned "uncured resin" in the substrate material
also includes semi-hardened resin.
[0024] It is preferable in this embodiment that metal foil is
applied on both sides of the substrate material.
[0025] Furthermore, it is preferable in this embodiment that a
method of manufacturing a printed circuit board comprises the steps
of: laminating both sides of an uncured resin impregnate fiber
sheet substrate material having inner holes or voids with cover
films, forming through-holes in the substrate material in the
thickness direction by laser irradiation, filling the through-holes
with conductive paste, removing the cover films and applying a
metal foil on one side of each sheet, thereby forming two sheets of
intermediate, disposing the intermediates in a state in which the
sides with metal foils face outside, holding at least two layers of
circuit substrates with circuit patterns in a core, bonding the
substrate material with the conductive paste by compressing and
hardening with heating and pressurization, and forming
predetermined patterns on the metal foils.
[0026] Furthermore, it is preferable in this embodiment that the
method of manufacturing a printed circuit board comprises the steps
of: laminating both sides of an uncured resin impregnate fiber
sheet substrate material having inner holes or voids with cover
films, forming through-holes in the substrate material in the
thickness direction by laser irradiation, filling the through-holes
with conductive paste, removing the cover films, thereby forming an
intermediate connecting member, holding the intermediate connecting
member between a plurality of double sided printed circuit boards,
and bonding the substrate material with the conductive paste by
compressing and hardening the whole through heating and
pressurization.
[0027] Furthermore, it is preferable that the inner holes in the
uncured resin impregnate fiber sheet substrate material are closed
voids.
[0028] It is also preferable that each closed void has a diameter
ranging from 5 to 20 .mu.m in the uncured substrate material.
[0029] Furthermore, it is preferable that the porosity of the
uncured substrate material having voids ranges from 2 to 35%.
[0030] In addition, it is preferable that the temperature of the
substrate material in the heating step ranges from 170 to
260.degree. C.
[0031] Furthermore, it is preferable that the pressure on the
substrate material in the pressurizing step ranges from 20 to 80
kg/cm.sup.2.
[0032] It is also preferable that a part of the fiber in the
substrate material remains in the through-holes by laser
irradiation.
[0033] Furthermore, it is preferable that a compound of metallic
particulates and resin is used as the conductive resin compound to
fill the through-holes, and that they are bonded together through
impregnation of the resin which is one component of the conductive
resin compound that penetrates into the substrate.
[0034] In addition, it is preferable that the resin which is one
component of the conductive resin compound and the impregnate resin
in the substrate belong to the resin having the same functional
group, and that they are bonded to each other through covalent
bonding, or self-adhesion.
[0035] Furthermore, it is preferable that the impregnate resin in
the substrate and the resin which is one component of the
conductive resin compound are both thermosetting resins, and
further, that they comprise at least one resin selected from the
group consisting of epoxy resin, thermosetting polybutadiene resin,
phenol resin, and polyimide resin.
[0036] Furthermore, it is preferable that a roll coating method is
used to fill the conductive resin compound in the
through-holes.
[0037] It is also preferable that the resin impregnate fiber sheet
of the substrate comprises at least one fiber selected from the
group consisting of heat-resisting synthetic fiber and glass
fiber.
[0038] Furthermore, it is preferable that the heat-resisting
synthetic fiber comprises at least one fiber selected from the
group consisting of aromatic polyamide fiber and polyimide
fiber.
[0039] In addition, it is preferable that the resin impregnate
fiber sheet of the substrate is a nonwoven fabric.
[0040] It is preferable that the metallic particulate in the
conductive resin compound is at least one metal selected from the
group consisting of gold, silver, copper, palladium, nickel, and an
alloy thereof.
[0041] Furthermore, it is preferable that the metallic particulates
in the conductive resin compound are present in an amount of from
80 to 92.5 percent by weight.
[0042] It is also preferable that each metallic particulate in the
conductive resin compound has an average diameter of from 0.2 to 20
.mu.m.
[0043] Furthermore, it is preferable that an average diameter of
the through-hole filled with the conductive resin compound is from
50 to 300 .mu.m.
[0044] Furthermore, it is preferable that the-laser beam is
selected from the group consisting of carbon dioxide laser, YAG
laser, and excimer laser.
[0045] According to the first embodiment of the invention, a
printed circuit board comprises a resin impregnate fiber sheet
substrate with through-holes formed in the thickness direction and
a conductive resin compound filled into the through-holes in the
thickness direction for electrical connection, wherein the
substrate and the conductive resin compound are bonded to each
other. Thus, the adhesion between the conductive resin compound and
the wall surface of the through-hole in the substrate is improved,
thereby attaining a highly reliable printed circuit board.
[0046] According to the above-noted embodiment, it is preferable
that the substrate and the conductive resin compound are bonded to
each other so that the conductive resin compound penetrates into
the substrate. This serves to "anchor" and to improve the adhesion
between the conductive paste and the wall surface of the
through-hole.
[0047] Furthermore, it is preferable that the conductive resin
compound is composed of metallic particulates and resin, and in
addition, the substrate and the conductive resin compound are
bonded to each other through impregnation of the resin which is one
component of the conductive resin compound in the substrate. As a
result, the substrate and the conductive resin compound are bonded
strongly together. In addition, the conductive component in the
conductive resin compound has a higher concentration, and
therefore, a printed circuit board of high conductive reliability
can be attained.
[0048] According to the first embodiment, it is also preferable
that the substrate and the conductive resin compound are bonded to
each other through covalent bonding, or self-adhesion between the
resin which is one component of the conductive resin compound and
the impregnate resin in the substrate, thereby enforcing the
binding.
[0049] Furthermore, it is preferable that the substrate and the
conductive resin compound are bonded to each other so that the
fiber of the substrate penetrates into the conductive resin
compound. This configuration enlarges the contact area surrounding
the fiber. Thus, the substrate and the conductive resin compound
are bonded even stronger.
[0050] Furthermore, it is preferable that the impregnate resin of
the substrate and the resin which is one component of the
conductive resin compound are both thermosetting resins, in order
to provide excellent heat resistance.
[0051] It is also preferable that the thermosetting resin comprises
at least one resin selected from the group consisting of epoxy
resin, thermosetting polybutadiene resin, phenol resin, and
polyimide resin. As a result, the resin has an excellent practical
use from the viewpoint of heat resistance.
[0052] Furthermore, it is preferable that the resin impregnate
fiber sheet of the substrate comprises at least one fiber selected
from the group consisting of heat-resisting synthetic fiber and
glass fiber, to provide excellent heat resistance.
[0053] Additionally, it is preferable that the heat-resisting
synthetic fiber comprises at least one fiber selected from the
group consisting of aromatic polyamide fiber and polyimide fiber,
to provide excellent heat resistance. In addition, it is easy to
make holes in this fiber by using a laser beam.
[0054] Furthermore, according to the above-noted example, it is
preferable that the resin impregnate fiber sheet of the substrate
is a nonwoven fabric. As a result, it is easy to control the
thickness of the substrate, and furthermore, cost can be reduced.
The thickness can vary according to the use of the substrate, but a
suitable thickness is from 30 to 50 .mu.m.
[0055] It is preferable that the metallic particulate in the
conductive resin compound is at least one metal selected from the
group consisting of gold, silver, copper, palladium, nickel, and an
alloy thereof, in order to maintain high electrical
conductivity.
[0056] Furthermore, it is preferable that the metallic particulates
are present in the conductive resin compound in an amount of from
80 to 92.5 percent by weight, for practical use.
[0057] It is preferable that each metallic particulate in the
conductive resin compound has an average diameter of from 0.2 to 20
.mu.m, to provide a stable paste (coating material).
[0058] Furthermore, it is preferable that the average diameter of
the through-hole filled with the conductive resin compound is from
50 to 300 .mu.m, to maintain high electrical conductivity.
[0059] In addition, it is preferable that a circuit is formed both
on the surface of the substrate and at the terminal of the
conductive resin compound. As a result, it is easy to attain a
circuit substrate using a haploid or a multilayer substrate. When
using a multilayer substrate, the substrate can be combined
flexibly as needed.
[0060] According to the second embodiment of the invention, a
method of manufacturing a printed circuit board comprises the steps
of: laminating both sides of an uncured resin impregnate fiber
sheet substrate material having voids with cover films, forming
through-holes in the substrate material in the thickness direction
by laser irradiation, filling the through-holes with conductive
paste, removing the cover films and applying a metal foil on at
least one side of the substrate material, bonding the substrate
material with the conductive paste by compressing and hardening the
substrate material through heating and pressurization, and forming
predetermined patterns on the metal foil. In this way, a circuit
substrate can be produced efficiently. In particular, when laser
irradiation is used for forming the through-holes, not only can
precise and fine work be conducted, but also a clean production
environment can be maintained without creating cutting scraps. This
is an advantage over a conventional drilling method.
[0061] According to the above-noted embodiment, it is preferable
that metal foil is applied on both sides of the substrate material.
In this way, the substrate material can be used effectively either
as a haploid substrate or as a component comprising a multilayer
substrate.
[0062] Furthermore, it is preferable that the method of
manufacturing a printed circuit board comprises the steps of:
laminating both sides of an uncured resin impregnate fiber sheet
substrate material having voids with cover films, forming
through-holes in the substrate material in the thickness direction
by laser irradiation, filling the through-holes with conductive
paste, removing the cover films, applying a metal foil on one side
of each sheet, thereby forming two sheets of an intermediate,
disposing the intermediates so that the sides with metal foils face
outside, positioning at least two layers of circuit substrates
having circuit patterns in the core, bonding the substrate material
with the conductive paste by compressing and hardening through
heating and pressurization, and forming predetermined patterns on
the metal foil. As a result, a multilayer substrate can be produced
easily.
[0063] Furthermore, according to the above-noted example, it is
preferable that a method of manufacturing a printed circuit board
comprises the steps of: laminating both sides of an uncured resin
impregnate fiber sheet substrate material having voids with cover
films, forming through-holes in the substrate material in the
thickness direction by laser irradiation, filling the through-holes
with conductive paste, removing the cover films, thereby forming an
intermediate connecting member, holding the intermediate connecting
member between a plurality of double sided printed circuit boards,
and bonding the substrate material with the conductive paste by
compressing and hardening through heating and pressurization. As a
result, a multilayer substrate can be produced easily.
[0064] Furthermore, it is preferable that the voids in the uncured
resin impregnate fiber sheet substrate material are closed holes.
Thus, even if the density of the through-hole is high, it does not
mix with the conductive paste of an adjoining through-hole in a
closed state so that a short circuit can be prevented effectively.
It is also preferable that the closed hole has a diameter of from 5
to 20 .mu.m in the uncured substrate material. When the conductive
resin compound is impregnated in the substrate, an "anchor" effect
with the conductive paste can be attained.
[0065] It is preferable that the porosity of the uncured substrate
material with holes is from 2 to 35%. This is practical since an
"anchor" effect with the conductive paste can be attained.
[0066] It is preferable that the temperature of the substrate
material during the heating step is from 170 to 260.degree. C. When
a thermosetting resin is used, a hardening reaction can be
effectively conducted.
[0067] Furthermore, it is preferable that the pressure put on the
substrate material during the compressing step is from 20 to 80
kg/cm.sup.2. The substrate has effective properties by
substantially diminishing air holes inside the substrate.
[0068] In addition, it is preferable that a part of fiber in the
substrate material remains in the through-holes by laser
irradiation. In this way, the conductive paste and the substrate
material are bonded strongly.
[0069] It is preferable that a compound of metallic particulates
and resin is used as the conductive resin compound to fill the
through-holes, and that the resin which is one component of the
conductive resin compound is bonded to the substrate through
impregnation. In this way, the conductive paste and the substrate
material can be bonded strongly.
[0070] Furthermore, according to the above-noted example, it is
preferable that the resin which is one component of the conductive
resin compound and the impregnate resin of the substrate belong to
the resin having the same functional group, and that they are
bonded to each other through covalent bonding and self-adhesion. In
this way, the conductive paste and the substrate material can be
bonded strongly. It is also preferable that the impregnate resin in
the substrate and the resin which is one component of the
conductive resin compound are both thermosetting resins, and
further, that the resin comprises at least one resin selected from
the group consisting of epoxy resin, thermosetting polybutadiene
resin, phenol resin, and polyimide resin. Accordingly, the
conductive paste and the substrate material can be bonded strongly,
and in addition, the resin has excellent heat resistance.
[0071] Furthermore, it is preferable that a roll coating method is
used to fill the conductive resin compound in the through-holes.
This method enables filling easily by simply applying the
conductive paste on top of the cover film (peeling film).
[0072] Additionally, it is preferable that the laser beam is
selected from the group consisting of carbon dioxide laser, YAG
laser, and excimer laser. By using this laser, the opening process
can take place efficiently.
[0073] As described above, by filling the through-holes disposed in
the uncured substrate material with closed voids and also filling
the hollow-shaped part which is formed on the inner wall of the
through-hole by opening the voids which are present inside the
substrate material when the through-holes are formed, an "anchor"
effect is increased, and the adhesion between the conductive paste
and the wall surface of the through-hole is improved. In addition,
since circuit patterns are disposed on top of the through-holes
filled with the conductive paste, the contact area between the
conductive paste and the metal foil is increased. As a result, a
printed circuit board with excellent heat- and impact-resisting
properties can be attained.
BRIEF DESCRIPTION OF THE FIGURES
[0074] FIG. 1 is a cross-sectional view of a first embodiment of
this invention showing a circuit board.
[0075] FIGS. 2(a) to 2(g) are cross-sectional views explaining a
method of manufacturing a circuit board of an embodiment of this
invention.
[0076] FIGS. 3(a) to 3(h) are cross-sectional views explaining a
method of manufacturing a multilayer circuit board of an embodiment
of this invention.
[0077] FIGS. 4(a) to 4(f) are cross-sectional views explaining a
method of manufacturing a printed circuit board of an embodiment of
this invention.
[0078] FIGS. 5(a) to 5(h) are cross-sectional views explaining a
method of manufacturing a printed circuit board of an embodiment of
this invention.
[0079] FIGS. 6(a) to 6(e) are cross-sectional views explaining a
method of manufacturing a printed circuit board of an embodiment of
this invention.
[0080] FIGS. 7(a) to 7(c) are schematic views showing bonding
substrate material and a conductive resin compound of an embodiment
of this invention.
[0081] FIGS. 8(a) to 8(e) are cross-sectional views explaining a
method of manufacturing a conventional double sided printed circuit
board.
[0082] FIG. 9 is a graph showing results of a dipping test of a
printed circuit board of an embodiment of this invention.
[0083] FIG. 10 is a graph showing the relationship between pressure
for compressing a porous substrate material, the average hole
diameter and the porosity in the uncured substrate material with
closed holes of an embodiment of this invention.
[0084] FIG. 11 is a graph showing the relationship between the
average hole diameter in the uncured substrate material with closed
holes and amount of resistance change due to solder dipping of a
printed circuit board of an embodiment of this invention.
[0085] FIG. 12 is a graph showing the relationship between the
porosity in the uncured substrate material with closed holes and
amount of resistance change due to solder dipping of a printed
circuit board of an embodiment of this invention.
[0086] FIG. 13 is a graph showing results of a solder dipping test
of a multilayer printed circuit board of an embodiment of this
invention.
[0087] FIG. 14 is a graph showing the results of a solder dipping
test of a multilayer printed circuit board of an embodiment of this
invention.
DETAILED DESCRIPTION OF THE INVENTION
[0088] This invention will be described by referring to the
following illustrative examples and attached figures.
Example 1
[0089] FIG. 1 is a cross-sectional view of one embodiment of this
invention showing a circuit substrate. FIGS. 2(a) to 2(e) are
cross-sectional views explaining a method of manufacturing a
circuit substrate. As shown in FIG. 1, a circuit substrate of this
embodiment comprises an insulating substrate 101 formed by
compressing and hardening a porous base material impregnated with
thermosetting resin through heating and pressurization, circuit
patterns 102 formed by etching metal foil adhered on the porous
base material through heating and pressurization, conductive paste
103 filled into through-holes disposed in the porous base material,
and a part of binder resin 103a in conductive paste 103 which is
impregnate in the porous base material.
[0090] With reference to FIG. 2(a), the above-mentioned circuit
substrate comprises a porous base material 202 of 180 .mu.m in
thickness which is provided with protective films 201 made of
polyethylene terephthalate or the like on both sides with a
thickness of 12 .mu.m. Porous base material 202 used here was a
base material having small holes or voids 202a in the inside, for
example, a base material consisting of a composite material
prepared by impregnating thermosetting epoxy resin (e.g.
"EPON1151B60" manufactured by Shell) into a nonwoven fabric of
aromatic polyamide (aramid) fibers (e.g. "Kevlar" manufactured by
Dupont, fineness: 1.5 denier, length: 7 mm, METSUKE: 70 g/m.sup.2).
This base material is hereinafter referred to as aramid-epoxy
sheet. The ratio in volume of voids 202a to aramid-epoxy sheet 202
is 40%.
[0091] Subsequently, as shown in FIG. 2(b), through-holes 203 of
200 .mu.m in diameter were formed at predetermined places in
aramid-epoxy sheet 202 by utilizing a laser processing method such
as with a carbon dioxide laser.
[0092] Next, as shown in FIG. 2(c), through-holes 203 were filled
with conductive paste 204. It is to be noted here that conductive
paste 204 is composed of copper powder with an average particulate
diameter of 2 .mu.m as the conductive substance and epoxy resin of
non-solvent type as the binder resin. The conductive paste was
prepared by mixing and kneading the copper powder and the binder
resin in three roles, with the content of the copper powder set at
85 wt %. For filling conductive paste 204, aramid-epoxy sheet 22
having through-holes 203 was placed on a table of a printing
machine (not shown), and conductive paste 204 was directly printed
from above protective films 201. It is possible to use a roll
decalcomania or the like as the printing method. In this case,
protective film 201 on the upper surface plays the part of a
printing mask and also prevents the surface of aramid-epoxy sheet
202 from soiling. At this stage, a part of binder resin 204a in
conductive paste 204 had already penetrated into the side of
aramid-epoxy sheet 202, and a composition ratio of the conductive
substance to the binder resin increased gradually in conductive
paste 204 (FIG. 2(d)). After that, protective films 201 were
separated from both sides of aramid-epoxy sheet 202.
[0093] Then, as shown in FIG. 2(e), copper foil of 35 .mu.m in
thickness was applied on both sides of aramid-epoxy sheet 202 as
metal foil 205. Through heating and pressurization in this state,
aramid-epoxy sheet 202 was compressed, and at the same time,
aramid-epoxy sheet 202 and metal foil 205 were adhered, as shown in
FIG. 2(f). In this case, conditions for the heating and
pressurization are such that the temperature was raised from room
temperature up to 200.degree. C. in 30 minutes while applying
pressure of 60 kgf/cm.sup.2 in vacuum. The temperature was held at
200.degree. C. for 60 minutes and subsequently lowered down to room
temperature in 30 minutes. The conductive paste was also compressed
during this process, and the binder component was pressed out
between the conductive substances, thereby strengthening the
binding among the conductive substances and the binding between the
conductive substances and the binding between the conductive
substance and the metal foil. The conductive substance within
conductive paste 24 was compacted, and at the same time, epoxy
resin which is one component of aramid-epoxy sheet 22, conductive
paste 204, and binder component 204a of conductive paste 204
impregnated into aramid-epoxy sheet 202 cured or hardened. At this
moment, the content of the conductive substance contained in the
conductive paste 204 raised up to 92.5 wt %. Moreover, the porosity
of the voids 202a in porous base material 202 was reduced to 0 to 1
vol. % through heating and pressurization, and the size of the
voids 202a also became smaller.
[0094] Lastly, metal foils 205 were formed into circuit patterns
205a by using a usual etching method, as shown in FIG. 2(g). In the
manner as described above, a circuit board 206 was obtained.
[0095] It was possible to confirm the phenomenon of the binder
component contained in conductive paste 204 penetrating into porous
base material 202 by replacing a part of the binder with dye and
filling it into through-holes 203. Binder component 204a contained
in conductive paste 204 which had penetrated into porous base
material 202 hardened, and therefore, the boundary face between
conductive paste 204 and porous base material 202 was bonded
strongly. Furthermore, by choosing the binder component contained
in conductive paste 204 from the resin which has the same component
with the thermosetting resin contained in porous base material 202,
or by choosing the binder component which reacts and hardens
against the thermosetting resin contained in porous base member
202, the impregnated part of the binder resin and the thermosetting
resin contained in the porous base material are bonded chemically
so that the anchor effect of the impregnated part of the binder
resin became greater.
Example 2
[0096] A method of manufacturing a multilayer circuit substrate
according to one embodiment of this invention will be described by
referring to the figures.
[0097] FIGS. 3(a) to (h) are cross-sectional views showing a method
of manufacturing a multilayer circuit substrate in one embodiment
of the invention. In these figures, 3(a) and 3(e) denote a first
and a second metal foil; 3(b) and 3(d), a first and a second
intermediate connecting member; and 3(c), a circuit substrate.
FIGS. 3(f) to (h) show a method of forming a multilayer circuit
substrate by first disposing the circuit substrate between the
first and the second intermediate connecting members, laminating
the upper and lower sides with the first and the second metal
foils, and forming patterns on the first and the second metal
foils.
[0098] Firstly, circuit substrate 303 (substantially equivalent to
circuit substrate 206) was prepared which had been manufactured by
the method shown in FIGS. 2(a) to (g) of the above-mentioned first
embodiment (FIG. 3(c)). Then, besides circuit substrate 303, a
first intermediate connecting member 301 (FIG. 3(b)) and a second
intermediate connecting member 302 (FIG. 3(d)) were prepared
according to a method shown in FIGS. 2(a) to (d) which had been
seperated from protective films. In FIGS. 3(a) and 3(e), 304 and
305 denote metal foils (copper foil).
[0099] As shown in FIG. 3(f), circuit substrate 303 was placed in a
predetermined position between the first intermediate connecting
member 301 and the second intermediate connecting member 302, and
the first metal foil 304 and the second metal foil 304 were
laminated on its upper and lower sides. Then, as shown in FIG.
3(g), circuit substrate 303 and metal foils 304, 305 were adhered
via intermediate connecting members 301 and 302 through heating and
pressurization. Metal foil 304 and 305 were formed into circuit
patterns by using a usual etching method. In this way, a multilayer
circuit board consisting of four layers was obtained. The number of
layers can be increased by replacing circuit substrate 303 in FIG.
3(c) with multilayer circuit board 306 and repeating the laminating
procedure shown in FIGS. 3(a) to (h).
[0100] Another method of forming a multilayer circuit board further
comprises holding an intermediate connecting member between a
plurality of circuit substrates, and then, heating and
pressurizing.
Example 3
[0101] FIGS. 4(a) to (f) are cross-sectional views showing a method
of manufacturing a printed circuit board in another embodiment of
this invention. Referring to FIGS. 4(a) to (f), reference numeral
401 denotes a porous base material; 402, a tackfree film; 403, an
uncured substrate material having closed voids; 404, voids; 405, a
through-hole; 406, hollow-shaped parts; 407, conductive paste; 408,
metal foils; and 409, an insulating layer; 410, circuit patterns.
In this embodiment, the size and the rate of the voids contained in
porous base material 401 were controlled by using the
compressibility so that it was preferable to use a sheet-type
laminated substance characterized by compressibility in heated and
pressurized conditions as porous base material 401 shown in FIG.
4(a). In this case, a composite material consisting of aromatic
polyamide which is a nonwoven fabric impregnated with thermosetting
resin and epoxy resin was used. FIG. 4(b) shows the state in which
porous base material 401 shown in FIG. 4(a) is compressed at the
fixed rate in the thickness direction by preliminary heating and
pressurization and formed into an uncured substrate material having
closed voids 403 whose size and rate are controlled. FIG. 4(c)
shows the state in which uncured substrate material having closed
voids 403 shown in FIG. 4(b) and tackfree film 402 are disposed
with through-hole 405. When through-hole 405 was formed, voids 404
contained in uncured substrate material having closed voids 403
opened and formed a plurality of hollow-shaped parts 406 on the
inner wall of through-hole 405. It is possible to form through-hole
405 and hollow-shaped parts 406 by utilizing a drilling processing
or other kinds of laser processing methods. The most suitable
processing method in this embodiment was using a carbon dioxide
laser.
[0102] FIG. 4(d) shows the state in which through-hole 405 and a
plurality of hollow-shaped parts 406 formed on the inner wall of
the through-hole which were made in uncured substrate material
having closed voids 403 are first filled with conductive paste 407
via tackfree films 402, and tackfree films 402 are seperated
afterwards. FIG. 4(e) shows the state in which FIG. 4(d) applied
with metal foils 408 on the upper and lower sides is subjected to
heating and pressurization, thereby hardening the thermosetting
resin, and the metal foils are electrically connected via
conductive paste 407. Uncured substrate material having closed
voids 403 is further compressed until voids 404 contained in the
substrate disappear, finally forming insulating layer 409. However,
a plurality of hollow-shaped parts 406 formed on the inner wall of
the through-hole do not disappear since they are filled with
conductive paste 407. Accordingly, the adhesion between conductive
paste 407 and the wall surface of through-hole 405 improves by the
increased anchor effect, and thus, a printed circuit board with
excellent heat- and impact-resistance is obtained. FIG. 4(f) shows
that metal foils 408 on the surface were etched into a double sided
printed circuit board.
Example 4
[0103] A method of manufacturing a multilayer printed circuit board
according to another embodiment of this invention will be described
by referring to the figures.
[0104] FIGS. 5(a) to (h) are cross-sectional views showing a method
of manufacturing a multilayer printed circuit board in one
embodiment of the invention. Referring to FIGS. 5(a) to (h),
reference numeral 501 denotes a first metal foil; 502, a second
metal foil; 503, an uncured substrate material having closed voids;
504, voids; 505, conductive paste; 506, a second circuit pattern;
507, a third circuit pattern; 508, an insulating layer; 509 and
510, a first and second intermediate connecting member used for
laminating and interconnecting the metal foils with a double sided
printed circuit board; 511, a double sided printed circuit board;
512, a first circuit pattern; 513, a fourth circuit pattern; and
514, a multilayer printed circuit board consisting of four
layers.
[0105] Furthermore, FIGS. 5(f) to (h) show a process of forming a
multilayer printed circuit board by-placing double sided printed
circuit board 511 between first intermediate connecting member 509
and second intermediate connecting member 510, and then, laminating
the upper and lower sides with first metal foil 501 and second
metal foil 502, and finally forming first metal foil 501 and second
metal foil 502 into circuit patterns of the multilayer printed
circuit board. As for intermediate connecting members 509 and 510,
the uncured substrate material having closed voids manufactured in
the method shown in FIGS. 4(a) to (d) was used which was filled
with the conductive paste in the through-hole and in the plurality
of hollow-shaped parts formed on the inner wall of the
through-hole.
[0106] As shown in FIG. 5(f), double sided printed circuit board
511 was placed in a predetermined position between first
intermediate connecting member 509 and second intermediate
connecting member 510, and first metal foil 501 the second metal
foil 502 were laminated on its upper and lower sides. Then, as
shown in FIG. 5(g), double sided printed circuit board 511 and
first and second metal foils 501 and 502 were adhered via
intermediate connecting members 509 and 510 through heating and
pressurization. At the same time, first metal foil 501 was
electrically connected to second circuit pattern 506, and the
second metal foil 502 was connected to third circuit pattern 507.
During this process, second circuit pattern 506 encroached on first
intermediate connecting member 509 and third circuit pattern 507
encroached on second intermediate connecting member 510, forming
the internal layer structure as shown in FIG. 5(g). Subsequently,
first metal foil 501 and second metal foil 502 were etched into
first circuit pattern 512 and fourth circuit pattern 513. Thus, a
multilayer printed circuit board consisting of four layers 514 was
obtained as shown in FIG. 5(h).
[0107] Furthermore, the number of layers could be increased easily
by replacing double sided printed circuit board 511 of FIG. 3(c) in
the process of FIG. 5(a) to (h) with a multilayer printed circuit
board.
Example 5
[0108] A method of manufacturing a multilayer printed circuit board
according to another embodiment of this invention will be described
by referring to the figures.
[0109] FIGS. 6(a) to (e) are cross-sectional views showing a method
of manufacturing a multilayer printed circuit board in one
embodiment of the invention. Referring to FIGS. 6(a) to (e),
reference numeral 601 denotes a first circuit pattern; 602, a
second circuit pattern; 603, conductive paste; 604, an insulating
layer; 605, a third circuit pattern; 606, a fourth circuit pattern;
607, voids; 608, an uncured substrate material having closed voids;
609 and 610, a first and a second double sided printed circuit
board; 611, an intermediate connecting member used for laminating
and interconnecting first double sided printed circuit board 609
with second double sided printed circuit board 610; and 612, a
multilayer printed circuit board consisting of four layers.
[0110] FIGS. 6(d) and (e) show a method of manufacturing a
multilayer printed circuit board by laminating first double sided
printed circuit board 609 with second double sided printed circuit
board 610 via intermediate connecting member 611. As for
intermediate connecting member 611, the uncured substrate material
having closed voids manufactured in the method shown in FIGS. 4(a)
to (d) was used which was filled with the conductive paste in the
through-hole and the plurality of hollow-shaped parts formed on the
inner wall of the through-hole. As shown in FIG. 6(d), intermediate
connecting member 611 was laminated on top of second double sided
printed circuit board 610, and first double sided printed circuit
board 611 was laminated thereon. Next, as shown in FIG. 6(e), first
double sided printed circuit board 609 and second double sided
printed circuit board 610 were adhered through heating and
pressurization. At the same time, second circuit pattern 602 and
third circuit pattern 605 were electrically connected via
conductive paste 603. During this process, first circuit pattern
601 and fourth circuit pattern 606 encroached on insulating layer
604, and second circuit pattern 602 encroached on intermediate
connecting member 608, thereby smoothing the outside layers. In
this way, multilayer printed circuit board 612 consisting of four
layers was obtained.
[0111] Furthermore, in order to manufacture a multilayer printed
circuit board consisting of more layers, it is possible to attain
this by first preparing a necessary number of double sided printed
circuit boards and intermediate connecting members to connect among
those boards. After the intermediate connecting members are
inserted between each double sided printed circuit board, the whole
assembly can be laminated at once through heating and
pressurization. The same result can be attained by replacing the
double sided printed circuit board of FIG. 6(a) or (b) with a
multilayer printed circuit board.
Example 6
[0112] In this embodiment, the bonding of the substrate material
with the conductive resin compound will be described by referring
to the figures.
[0113] FIG. 7(a) is a schematic cross-sectional view showing a
sheet 701 disposed with copper foils 702 on both sides before being
compressed. A porous base material used here is an aramid-epoxy
sheet 701 of 200 .mu.m in thickness, and polyethylene terephthalate
films of 12 .mu.m in thickness were used as tackfree films provided
on both sides. This was preliminary heated and pressurized two
minutes with press temperature of 100.degree. C. and pressure 30
kg/cm.sup.2 by using heat pressing to form an uncured substrate
material having closed voids 701a. Carbon dioxide laser was used to
form through-hole 703 of 0.2 mm in diameter. At the same time, a
plurality of hollow-shaped parts 703a were formed in a part (inner
wall of the through-hole) of closed voids 701a. Through-hole 703
and the plurality of hollow-shaped parts 703a formed on the inner
wall of the through-hole were filled with conductive paste composed
of dispersing silver powder as metallic particles into epoxy resin
of non-solvent type. As a result, by filling hollow-shaped part
703a with the conductive paste, the anchor effect increases,
thereby enhancing the adhesion between the conductive paste and the
wall surface of the through-hole.
[0114] FIG. 7(b) is another schematic cross-sectional view showing
sheet 701 disposed with copper foils 702 on both sides before being
compressed. The same porous base material was used as mentioned
above. When irradiated energy from the carbon dioxide laser is low,
fiber composing sheet 701 remains partially in through-hole 703 and
sticks out. By filling through-hole 703 in this condition with the
conductive paste, a surrounding part 703b of composite fiber 701b
is also filled with the conductive paste. Thus, the anchor effect
increases, thereby enhancing the adhesion between the conductive
paste and the wall surface of the through-hole.
[0115] FIG. 7(c) is another schematic cross-sectional view showing
sheet 701 disposed with copper foils 702 on both sides before being
compressed. The same porous base material was used as mentioned
above. Provided that reciprocal solubility between a resin compound
in the conductive paste and a resin compound in the base material
sheet is good, the resin compound in the conductive paste
impregnates into the base material side when the conductive paste
is filled into through-hole 703. Thus, a mixed layer 703c can be
formed. The presence of mixed layer 703c enhances the adhesion
between the conductive paste and the wall surface of the
through-hole. Furthermore, the concentration of the conductive
compound (for example metallic particulates) in the conductive
paste becomes higher, thereby improving the conductivity.
Example 7
[0116] In this embodiment, a porous base material is an
aramid-epoxy sheet of 200 .mu.m in thickness, and polyethylene
terephthalate films of 4 to 50 .mu.m in thickness were used as
tackfree films provided on both sides. This was preliminarily
heated and pressurized two minutes with press temperature of
100.degree. C. and pressure of 5 to 50 kg/cm.sup.2 by using heat
pressing to form an uncured base material having closed voids. A
carbon dioxide laser was used to form a through-hole of 0.2 mm in
diameter. At the same time, a plurality of hollow-shaped parts were
formed on the inner wall of the through-hole by opening voids
contained in the uncured base material having closed voids. Then,
this through-hole and the plurality of hollow-shaped parts formed
on the inner wall were filled with conductive paste composed of
dispersing silver powder as metallic particles into epoxy resin of
non-solvent type. After that, the tackfree films were separated,
and copper films of 35 .mu.m in thickness were applied on both
sides. This was preliminarily heated and pressurized one hour with
press temperature of 170.degree. C. and pressure of 30 kg/cm.sup.2
by using heat pressing to form a double sided copper plate. After
being formed in the manner mentioned above, the copper foil layer
was formed into circuit patterns by using a usual etching method,
and accordingly, a double sided printed circuit board was
produced.
[0117] FIG. 9 shows the results of solder dipping (reflow) tests
conducted to the printed circuit board obtained in the
manufacturing method of this embodiment. The ordinate in FIG. 9
shows an amount of connection resistance change per via 500 holes
before and after the solder dipping, and the abscissa shows a
frequency of the solder dipping. For comparative purpose, the
results of tests conducted to a conventional printed circuit board
are also shown. As the frequency of the solder dipping increased,
there was hardly any change in the amount of connection resistance
in case of the printed circuit board of this embodiment, whereas
the amount of connection resistance increased remarkably in case of
the conventional printed circuit board.
[0118] FIG. 10 shows the relationship between pressure, average
hole diameter and porosity of an uncured substrate material having
closed voids when a porous base material was formed to the uncured
substrate material having closed voids through heating and
pressurization in this embodiment. With the increase in pressure,
the average hole diameter and porosity decreased.
[0119] FIG. 11 shows the relationship between average hole diameter
of an uncured substrate material having closed voids and amount of
connection resistance change due to a solder dipping of a printed
circuit board. The ordinate in FIG. 11 shows an amount of
connection resistance change per via 500 holes before and after the
solder dipping, and the abscissa shows average hole diameter. High
reliability was attained when the average hole diameter was 5 to 20
.mu.m.
[0120] FIG. 12 shows the relationship between porosity of an
uncured substrate material having closed voids and amount of
connection resistance change due to a solder dipping of a printed
circuit board. The ordinate in FIG. 12 shows amount of connection
resistance change per via 500 holes before and after the solder
dipping, and the abscissa shows the porosity. High reliability was
attained when the porosity was 2 to 35%.
[0121] With regard to the conductive substance contained in the
conductive paste of this embodiment, high reliability could be
attained when metallic particles used were at least one metal
selected for the group consisting of gold, silver, copper,
palladium, nickel and an alloy thereof.
Example 8
[0122] In this embodiment, the metal foil was copper foil of 35
.mu.m in thickness, and a double sided printed circuit board was
used as the printed circuit board, as in Example 1. As for an
intermediate connecting member, an aramid-epoxy sheet was used
which comprises a through-hole of 0.2 mm and hollow-shaped parts on
the inner wall of the through-hole which were filled with the
conductive paste described in Example 1. Intermediate connecting
members were disposed above and below the double sided printed
circuit board, and copper foil was applied above and below. Then,
this was heated and pressurized for one hour with a press
temperature of 170.degree. C. and a pressure of 30 kg/cm.sup.2 by
using heat pressing to form a laminated layer. Next, the copper
foils were formed into patterns by a conventional etching method,
thereby manufacturing a four-layer printed circuit board.
[0123] FIG. 13 shows the results of solder dipping tests conducted
to the multilayer printed circuit board obtained in the
manufacturing method of this embodiment. The ordinate in FIG. 13
shows the amount of connection resistance change per 500 holes
before and after the solder dipping, and the abscissa shows the
frequency of the solder reflow. As for the multilayer printed
circuit board of this embodiment, there was hardly any change found
in the amount of connection resistance due to the solder
dipping.
Example 9
[0124] In this embodiment, a double sided printed circuit board was
used, and the printed circuit board was manufactured as in Example
1, and an intermediate connecting member was an aramid-epoxy sheet
which comprises a through-hole of 0.2 mm and hollow-shaped parts on
the inner wall of the through-hole which were filled with the
conductive paste described in the first embodiment. The double
sided printed circuit boards were disposed above and below the
intermediate connecting member, and then, this was heated and
pressurized one hour with press temperature of 170.degree. C. and
pressure of 30 kg/cm.sup.2 by using heat pressing to manufacture a
four-layer printed circuit board.
[0125] FIG. 14 shows the results of solder dipping tests conducted
to the multilayer printed circuit board obtained in the
manufacturing method of this embodiment. The ordinate in FIG. 14
shows the amount of connection resistance change per 500 holes
before and after the solder dipping, and the abscissa shows a
frequency of the solder dipping. As for the multilayer printed
circuit board of this embodiment, there was hardly any change found
in the amount of connection resistance due to the solder
dipping.
[0126] With respect to the double sided printed circuit boards in
the above-mentioned Examples 1 to 9, it is also possible to use a
compound material of glass fiber and epoxy resin or a compound
material of glass fiber and polyimide resin or a compound material
of glass fiber and thermosetting polybutadiene resin (BT resin) in
addition to the printed circuit board manufactured in Example 1.
Furthermore, as for a conductive substance contained in the
conductive paste, the same results could be attained when metallic
particles used were at least one metal selected from the group
consisting of gold, silver, copper, palladium, nickel, and an alloy
thereof.
Example 10
[0127] Monolayer substrates were opened by processing using carbon
dioxide laser which consisted of 8 kinds of composites: an aramid
woven fabric plus phenol resin, epoxy resin, BT resin, and
polyimide which are all of thermosetting and uncured nature, and an
aramid nonwoven fabric plus phenol resin, epoxy resin, BT resin,
and polyimide which are all of thermo-setting and uncured nature.
Tables 1-1, 1-2 show the conditions of laser processing, the hole
diameter in each case, and the constitution of the holes in 8 kinds
of monolayer substrates.
1TABLE 1-1 Opening and processing conditions and results by carbon
dioxide laser Laser conditions Maximum on the surface penetration
of base material amount of Energy Beam Hole base material Sample
Impregnate density size size into holes No. Fiber resin
(mJ/cm.sup.2) (.mu.m) (.mu.m) (.mu.m) 1 aramid epoxy 10.0 80 110 14
2 woven 13.5 170 200 17 3 fabric 16.0 250 290 19 4 phenol 10.0 80
100 11 5 13.5 170 190 14 6 16.0 250 280 17 7 BT 10.0 80 90 14 8
13.5 170 200 18 9 16.0 250 270 22 10 polyimide 10.0 80 100 10 11
13.5 170 200 12 12 16.0 220 250 15 13 aramid epoxy 10.0 80 100 12
14 non- 13.5 170 200 16 15 woven 16.0 250 280 18 16 fabric phenol
10.0 80 110 11 17 13.5 170 205 17 18 16.0 250 280 21 19 BT 10.0 80
95 14 20 13.5 170 190 16 21 16.0 250 280 17 22 polyimide 10.0 80
100 10 23 13.5 170 185 12 24 16.0 250 270 15
[0128]
2TABLE 1-2 Results of conductive Results of paste reliability of
3000 filled into holes holes Sample Impregnate Number of fallen-
Number of defective No. Fiber resin out holes holes 1 aramid epoxy
0 0 2 woven 0 0 3 fabric 0 0 4 phenol 0 1 5 0 0 6 1 0 7 BT 0 0 8 0
0 9 0 0 10 polyimide 0 0 11 0 0 12 0 0 13 aramid epoxy 0 0 14 non-
0 0 15 woven 0 0 16 fabric phenol 0 1 17 0 0 18 0 0 19 BT 0 0 20 0
0 21 1 0 22 polyimide 0 0 23 0 0 24 0 0
[0129] First, conductive paste was applied with an even thickness
on a peeling film of the substrate by using a screen printing
machine. Then, an aspirator was disposed under the substrate having
holes through a medium-quality paper of 50 .mu.m in thickness, and
the conductive paste was filled into the holes by decompression to
form the filling-via-holes. The monolayer substrates used here all
had thicknesses between 120 to 140 .mu.m. The conductive paste used
here was composed of 85% by weight of copper powder with an average
particle diameter of 3 micron, 12% by weight of liquid epoxy resin,
and 2% by weight of a mixture of a hardener and an accelerator.
According to the viscosity of the paste used, the epoxy resin, the
hardener and the accelerator can be chosen on the market. Among the
total number of filled via holes, a number of via holes of each
monolayer substrate material was compared, in which the filling
fell off when the medium-quality paper was separated after the
application. The results are shown in the above-noted Tables 1-1
and 1-2. As a result, it is clear that the substrates having the
via structure of this invention which were opened with carbon
dioxide laser have excellent paste holding properties in the
filling process.
[0130] Copper foils were applied on both sides of the monolayer
substrate which were then bonded for one hour with a press
temperature of 180.degree. C. and a pressure of 50 kg/cm.sup.2 by
thermo-compression in vacuum. Next, the copper foils were patterned
into circuits to constitute a double sided board. Then, the
above-noted filled via monolayer substrates were disposed on both
sides of this double sided board, and copper foils were applied
thereon. This was thermocompressed in vacuum under the same
conditions as mentioned above. By patterning the copper foils into
circuits, a four-layer circuit board was formed which was then
tested by heat and impact experiments which were conducted under
the conditions of maintaining 30 minutes with 500 cycles at
-55.degree. C. and 125.degree. C. 3000 vias disposed with copper
foils on both sides were selected in the circuit, and those which
had more than twice of resistance amount after the experiments were
counted as no good. The results are shown in the above-noted Table
1. As a result, it is clear that the substrates having the via
structure of this invention excellent heat shock resistance.
Example 11
[0131] Monolayer substrates were opened by processing using YAG
laser which consisted of 8 kinds of composites: an aramid woven
fabric plus phenol resin, epoxy resin, BT resin, and polyimide
which are all of thermosetting and uncured nature, and an aramid
nonwoven fabric plus phenol resin, epoxy resin, BT resin, and
polyimide which are all of thermosetting and uncured nature. Tables
2-1 and 2-2 show the conditions of laser processing, the hole
diameter in each case, and the constitution of the holes in 8 kinds
of monolayer substrates.
3TABLE 2-1 Opening and processing conditions and results by YAG
laser Laser conditions Maximum on the surface penetration of base
material amount of Energy Beam Hole base material Sample Impregnate
density size size into holes No. Fiber resin (mJ/cm.sup.2) (.mu.m)
(.mu.m) (.mu.m) 25 aramid epoxy 12.2 100 120 8 26 woven 15.4 160
180 10 27 fabric 19.0 230 250 14 28 phenol 12.2 100 115 10 29 15.4
160 180 11 30 19.0 230 255 17 31 BT 12.2 100 110 9 32 15.4 160 175
11 33 19.0 230 255 14 34 polyimide 12.2 100 115 12 35 15.4 160 185
15 36 19.0 230 260 17 37 aramid epoxy 12.2 100 120 9 38 non- 15.4
160 185 13 39 woven 19.0 230 260 16 40 fabric phenol 12.2 100 120
11 41 15.4 160 180 16 42 19.0 230 260 20 43 BT 12.2 100 110 9 44
15.4 160 175 11 45 19.0 230 260 16 46 polyimide 12.2 100 115 12 47
15.4 160 185 15 48 19.0 230 270 16
[0132]
4TABLE 2-2 Results of conductive Results of paste reliability of
3000 filled into holes holes Sample Impregnate Number of fallen-
Number of defective No. Fiber resin out holes holes 25 aramid epoxy
0 0 26 woven 0 0 27 fabric 0 0 28 phenol 0 1 29 0 0 30 1 0 31 BT 0
0 32 0 0 33 1 0 34 polyimide 0 0 35 0 0 36 0 0 37 aramid epoxy 0 1
38 non- 0 0 39 woven 0 0 40 fabric phenol 0 1 41 0 0 42 1 0 43 BT 0
0 44 0 0 45 1 0 46 polyimide 0 1 47 0 1 48 0 0
[0133] First, conductive paste was applied with an even thickness
on a peeling film of the substrate by using a screen printing
machine. Then, an aspirator was disposed under the substrate having
holes through a medium-quality paper of 50 .mu.m in thickness, and
the conductive paste was filled into the holes by decompression to
form the filling-via-holes. The monolayer substrates used here had
all thicknesses between 120 to 140 .mu.m. The conductive paste used
here was composed of 87% by weight of copper powder with an average
particle diameter of 4 micron, 10% by weight of liquid epoxy resin,
and 3% by weight of a mixture of a hardener and an accelerator.
According to the viscosity of the paste used, the epoxy resin, the
hardener and the accelerator can be chosen on the market, as in the
first embodiment. Among the total number of filled via holes, a
number of via holes of each monolayer substrate material was
compared, in which the filling fell off when the medium-quality
paper was seperated after the application. The results are shown in
the above-noted Table 2. As a result, it is clear that the
substrates having the via structure of this invention which were
opened with YAG laser have excellent paste holding properties in
the filling process.
[0134] Copper foils were applied on both sides of the monolayer
substrate which were then bonded one hour with press temperature of
180.degree. C. and pressure of 50 kg/cm.sup.2 by thermocompression
in vacuum. After that, the copper foils were patterned into
circuits to constitute a double sided board. Furthermore, the
above-mentioned filled via monolayer substrates were disposed on
both sides of this double sided board, and copper foils were
applied thereon. This was thermocompressed in vacuum under the same
conditions as mentioned above. By patterning the copper foils into
circuits, a four-layer circuit board was formed which was then
tested by heat and impact experiments which were conducted under
the conditions of maintaining 30 minutes with 500 cycles at
-55.degree. C. and 125.degree. C. 3000 vias disposed with copper
foil on both sides were selected in the circuit, and those which
had more than twice of resistance amount after the experiments were
counted as no good. The results are shown in the above-noted Table
2. As a result, it is clear that the substrates having the via
structure of this invention excellent heat and impact
resistance.
Example 12
[0135] Monolayer substrates were opened by the via processing using
excimer laser which consisted of 8 kinds of composites: an aramid
woven fabric plus phenol resin, epoxy resin, BT resin, and
polyimide which are all of thermosetting and uncured nature, and an
aramid nonwoven fabric plus phenol resin, epoxy resin, BT resin,
and polyimide which are all of thermosetting and uncured nature.
Tables 3-1 and 3-2 show the conditions of laser processing, the
hole diameter in each case, and the constitution of the holes in 8
kinds of monolayer boards.
5TABLE 3-1 Opening and processing conditions and results by excimer
laser Laser conditions Maximum on the surface penetration of base
material amount of Energy Beam Hole base material Sample Impregnate
density size size into holes No. Fiber resin (mJ/cm.sup.2) (.mu.m)
(.mu.m) (.mu.m) 49 aramid epoxy 0.8 40 50 -*1 50 woven 1.2 80 100
-*1 51 fabric 1.6 140 170 -*1 52 phenol 0.8 40 55 -*1 53 1.2 80 110
-*1 54 1.6 140 180 -*1 55 BT 0.8 40 50 -*1 56 1.2 80 95 -*1 57 1.6
140 160 -*1 58 polyimide 0.8 40 50 -*1 59 1.2 80 90 -*1 60 1.6 140
50 -*1 61 aramid epoxy 0.8 40 50 8 62 non- 1.2 80 95 10 63 woven
1.6 140 160 13 64 fabric phenol 0.8 40 55 7 65 1.2 80 100 10 66 1.6
140 160 12 67 BT 0.8 40 55 9 68 1.2 80 100 9 69 1.6 140 165 11 70
polyimide 0.8 40 50 8 71 1.2 80 90 8 72 1.6 140 155 9 *1 glass
fiber remained inside holes
[0136]
6TABLE 3-2 Results of conductive Results of paste reliability of
3000 filled into holes holes Sample Impregnate Number of fallen-
Number of defective No. Fiber resin out holes holes 49 aramid epoxy
0 0 50 woven 0 0 51 fabric 0 0 52 phenol 0 1 53 0 0 54 0 i 55 BT 0
0 56 0 0 57 0 0 58 polyimide 0 0 59 0 1 60 0 0 61 aramid epoxy 0 1
62 non- 0 0 63 woven 1 0 64 fabric phenol 0 1 65 0 0 66 1 0 67 BT 0
0 68 0 0 69 0 0 70 polyimide 0 1 71 0 1 72 0 0
[0137] First, conductive paste was applied with an even thickness
on a peeling film of the substrate by using a screen printing
machine. Then, an aspirator was disposed under the substrate having
holes through a medium-quality paper of 50 .mu.m in thickness, and
the conductive paste was filled into the holes by decompression to
form the filling via holes. The monolayer substrates used here all
had thicknesses between 120 to 140 .mu.m. The conductive paste used
here was the same as in the first embodiment. Among the total
number of filled via holes, a number of via holes of each monolayer
substrate material was compared, in which the filling fell off when
the medium-quality paper was seperated after the application. The
results are shown in the above-noted Table 3. As a result, it is
clear that the substrates having the via structure of this
invention which were opened with an excimer laser have excellent
paste holding properties in the process of filling.
[0138] Copper foils were applied on both sides of the monolayer
substrate which were then bonded one hour with press temperature of
180.degree. C. and pressure of 50 kg/cm.sup.2 by thermocompression
in vacuum. After that, the copper foils were patterned into
circuits to constitute a double sided board. Furthermore, the
above-mentioned filled via monolayer substrates were disposed on
both sides of this double sided board, and copper foils were
applied thereon. This was thermocompressed in vacuum under the same
conditions as mentioned above. By patterning the copper foils into
circuits, a four-layer circuit board was formed which was then
tested by heat and impact experiments which were conducted under
the conditions of maintaining 30 minutes with 500 cycles at
-55.degree. C. and 125.degree. C. 3000 vias disposed with copper
foils on both sides were selected in the circuit, and those which
had more than twice the resistance amount after the experiments
were counted as no good. The results are shown in the above-noted
Tables 3-1 and 3-2. As a result, it is clear that the substrates
having the via structure of this invention have excellent heat and
impact resistance.
[0139] As described above, a printed circuit board of this
invention comprises an uncured substrate material with closed voids
which are disposed with through-holes. When the through-holes are
formed, voids which exist in the substrate material open from inner
wall of the through-hole to form a hollow-shaped part. By filling
the through-hole and the hollow-shaped part with conductive paste,
the adhesion improves by the increased anchor effect between the
conductive paste and the wall surface of the through-hole. As a
result, a printed circuit board of excellent heat-and impact
resisting properties can be attained.
[0140] According to this invention as mentioned above, a printed
circuit board comprises a resin impregnate fiber sheet substrate
with through-holes formed in the thickness direction, and a
conductive resin compound filled into the through-holes in the
direction of thickness for electrical connection, wherein the
substrate and the conductive resin compound are bonded to each
other. Thus, the adhesion between the conductive resin compound and
the wall surface of the through-hole in the substrate improves,
thereby attaining a printed circuit board of high reliability.
[0141] According to this invention as mentioned above, a method of
manufacturing a printed circuit board comprises the steps of:
laminating both sides of an uncured resin impregnate fiber sheet
substrate material having voids with cover films, forming
through-holes into the substrate material in the thickness
direction by laser irradiation, filling the through-holes with
conductive paste, removing the cover films and applying a metal
foil on at least one side of the substrate material, bonding the
substrate material with the conductive paste by compressing and
hardening the substrate material through heating and
pressurization, and forming predetermined patterns on the metal
foil in due time. In this way, a circuit board can be produced
efficiently and rationally. Especially, by using laser irradiation
for forming the through-holes, not only precise and fine work can
be conducted, but also a clean production environment can be
preserved without creating cutting scraps. This is an advantage
over a conventional drilling method.
[0142] The invention may be embodied in other forms without
departing from the spirit or essential characteristics thereof. The
embodiments disclosed in this application are to be considered in
all respects as illustrative and not restrictive, the scope of the
invention is indicated by the appended claims rather than by the
foregoing description, and all changes which come within the
meaning and range of equivalency of the claims are intended to be
embraced therein.
* * * * *