Kawakita; Kouji

Patent Applications and Registrations

Patent applications and USPTO patent grants for Kawakita; Kouji.The latest application filed is for "vehicle control method and system".

Company Profile

1.15.5

Kawakita; Kouji - Kariya JP
KAWAKITA; Kouji - Kariya-city JP
Kawakita; Kouji - Jyoyo JP
Kawakita, Kouji - Kyoto JP
KAWAKITA, KOUJI - JOYO-SHI JP
Kawakita, Kouji - Jouyou-shi JP
Kawakita; Kouji - Joyo JP
Kawakita; Kouji - Jouyou JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Vehicle control method and system Grant 11,345,369 - Kawakita , et al. May 31, 2	2022-05-31
Vehicle Control Method And System App 20200353950 - KAWAKITA; Kouji ; et al.	2020-11-12
Laminated electronic component, laminated duplexer and communication device Grant 6,822,534 - Uriu , et al. November 23, 2	2004-11-23
Multilayer electronic part, multilayer antenna duplexer, and communication apparatus App 20030147197 - Uriu, Kazuhide ; et al.	2003-08-07
Ceramic Sintered Body And Production Method Thereof App 20010035253 - KAWAKITA, KOUJI ; et al.	2001-11-01
Connecting member of a circuit substrate and method of manufacturing multilayer circuit substrates by using the same App 20010003610 - Nakatani, Seiichi ; et al.	2001-06-14
Printed circuit board and method of manufacturing the same App 20010002294 - Hatakeyama, Akihito ; et al.	2001-05-31
Piezoelectric actuator, infrared sensor and piezoelectric light deflector Grant 6,222,302 - Imada , et al. April 24, 2	2001-04-24
Printed circuit board and method of manufacturing the same Grant 6,211,487 - Hatakeyama , et al. April 3, 2	2001-04-03
Connecting member of a circuit substrate and method of manufacturing multilayer circuit substrates by using the same Grant 6,108,903 - Nakatani , et al. August 29, 2	2000-08-29
Conductive paste composition for via hole filling and printed circuit board using the same Grant 6,096,411 - Nakatani , et al. August 1, 2	2000-08-01
Conductive paste compound for via hole filling, printed circuit board which uses the conductive paste, and method of manufacturing the same Grant 5,977,490 - Kawakita , et al. November 2, 1	1999-11-02
Printed circuit board and method of manufacturing the same Grant 5,972,482 - Hatakeyama , et al. October 26, 1	1999-10-26
Conductive paste compound for via hole filling, printed circuit board which uses the conductive paste, and method of manufacturing the same Grant 5,914,358 - Kawakita , et al. June 22, 1	1999-06-22
Printed circuit board Grant 5,817,404 - Kawakita , et al. October 6, 1	1998-10-06
Conductive paste compound for via hole filling, printed circuit board which uses the conductive paste, and method of manufacturing the same Grant 5,733,467 - Kawakita , et al. March 31, 1	1998-03-31
Conductive paste compound for via hole filling, printed circuit board which uses the conductive paste Grant 5,652,042 - Kawakita , et al. July 29, 1	1997-07-29
Method of manufacturing two-sided and multi-layered printed circuit boards Grant 5,588,207 - Kawakita , et al. December 31, 1	1996-12-31
Connecting member of a circuit substrate and method of manufacturing multilayer circuit substrates by using the same Grant 5,484,647 - Nakatani , et al. January 16, 1	1996-01-16
Dielectric ceramic composition Grant 5,006,956 - Kawakita , et al. April 9, 1	1991-04-09

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