| Patent | Date |
|---|
Conductive paste for forming conductive film for semiconductor devices, semiconductor device, and method for producing semiconductor device
Grant 10,030,156 - Takagi , et al. July 24, 2 | 2018-07-24 |
Electronic component package and method for manufacturing the same
Grant 9,825,209 - Mima , et al. November 21, 2 | 2017-11-21 |
Light-emitting device and method for manufacturing the same
Grant 9,627,583 - Sawada , et al. April 18, 2 | 2017-04-18 |
Electronic component package and method for manufacturing same
Grant 9,595,651 - Yamashita , et al. March 14, 2 | 2017-03-14 |
Electrochemical detector and method for producing same
Grant 9,541,518 - Yamashita , et al. January 10, 2 | 2017-01-10 |
Semiconductor device and method for manufacturing the same
Grant 9,449,937 - Kawakita , et al. September 20, 2 | 2016-09-20 |
Electronic component package and method for manufacturing same
Grant 9,449,944 - Sawada , et al. September 20, 2 | 2016-09-20 |
Electronic component package and method for manufacturing the same
Grant 9,425,122 - Kawakita , et al. August 23, 2 | 2016-08-23 |
Electronic component assembly
Grant 9,426,899 - Kitae , et al. August 23, 2 | 2016-08-23 |
Electronic component package and method of manufacturing same
Grant 9,368,469 - Nakatani , et al. June 14, 2 | 2016-06-14 |
Transparent electrode and method for manufacturing the same
Grant 9,330,811 - Ichiryu , et al. May 3, 2 | 2016-05-03 |
Ceramic substrate composite and method for manufacturing ceramic substrate composite
Grant 9,320,155 - Kuroiwa , et al. April 19, 2 | 2016-04-19 |
Built-up substrate, method for manufacturing same, and semiconductor integrated circuit package
Grant 9,236,338 - Nakatani , et al. January 12, 2 | 2016-01-12 |
Light Emitting Device, Method For Manufacturing Same, And Body Having Light Emitting Device Mounted Thereon
App 20150280093 - Tomita; Yoshihiro ; et al. | 2015-10-01 |
Electronic Component Package And Method For Manufacturing Same
App 20150236233 - Yamashita; Yoshihisa ; et al. | 2015-08-20 |
Electronic Component Package And Method For Manufacturing Same
App 20150228619 - Sawada; Susumu ; et al. | 2015-08-13 |
Hybrid substrate, method for manufacturing the same, and semiconductor integrated circuit package
Grant 9,107,306 - Nakatani , et al. August 11, 2 | 2015-08-11 |
Electronic Component Package And Method For Producing Same
App 20150221842 - Mima; Kazuma ; et al. | 2015-08-06 |
Electronic Component Package And Method For Manufacturing The Same
App 20150214129 - Kawakita; Koji ; et al. | 2015-07-30 |
Electronic Component Package And Method For Manufacturing The Same
App 20150206819 - Ichiryu; Takashi ; et al. | 2015-07-23 |
Substrate for mounting light-emitting element and light-emitting device
Grant 9,076,714 - Nakatani , et al. July 7, 2 | 2015-07-07 |
Conductive Paste for Forming Conductive Film for Semiconductor Devices, Semiconductor Device, and Method for Producing Semiconductor Device
App 20150159025 - Takagi; Kazuya ; et al. | 2015-06-11 |
Semiconductor Device And Method For Producing Same
App 20150155251 - Kawakita; Koji ; et al. | 2015-06-04 |
Light Emitting Apparatus And Method For Manufacturing Same
App 20150084080 - Kawakita; Koji ; et al. | 2015-03-26 |
Electronic Component Package And Method Of Manufacturing Same
App 20150076545 - Nakatani; Seiichi ; et al. | 2015-03-19 |
Flexible semiconductor device
Grant 8,975,626 - Suzuki , et al. March 10, 2 | 2015-03-10 |
Light-emitting Device And Method For Manufacturing The Same
App 20150008467 - Sawada; Susumu ; et al. | 2015-01-08 |
Method for manufacturing flexible semiconductor device having gate electrode disposed within an opening of a resin film
Grant 8,895,373 - Suzuki , et al. November 25, 2 | 2014-11-25 |
Electrode structure and method for forming bump
Grant 8,887,383 - Taniguchi , et al. November 18, 2 | 2014-11-18 |
Electrochemical Detector And Method For Producing Same
App 20140151225 - Yamashita; Yoshihisa ; et al. | 2014-06-05 |
Transparent Electrode And Method For Manufacturing The Same
App 20140151085 - Ichiryu; Takashi ; et al. | 2014-06-05 |
Ceramic Substrate Composite And Method For Manufacturing Ceramic Substrate Composite
App 20140131076 - Kuroiwa; Taiji ; et al. | 2014-05-15 |
Built-up Substrate, Method For Manufacturing Same, And Semiconductor Integrated Circuit Package
App 20140124777 - Nakatani; Seiichi ; et al. | 2014-05-08 |
Flip-chip mounting resin composition and bump forming resin composition
Grant 8,709,293 - Kitae , et al. April 29, 2 | 2014-04-29 |
Flip-chip mounting method and bump formation method
Grant 8,691,683 - Hirano , et al. April 8, 2 | 2014-04-08 |
Method For Manufacturing Flexible Semiconductor Device Having Gate Electrode Disposed Within An Opening Of A Resin Film
App 20140038366 - SUZUKI; Takeshi ; et al. | 2014-02-06 |
Method for making a semiconductor device on a flexible substrate
Grant 08617943 - | 2013-12-31 |
Method for making a semiconductor device on a flexible substrate
Grant 8,617,943 - Ichiryu , et al. December 31, 2 | 2013-12-31 |
Electronic paper and method for producing same
Grant 8,593,720 - Hirano , et al. November 26, 2 | 2013-11-26 |
Flexible semiconductor device having gate electrode disposed within an opening of a resin film
Grant 8,581,247 - Suzuki , et al. November 12, 2 | 2013-11-12 |
Flexible semiconductor device and method for producing the same
Grant 8,525,178 - Ichiryu , et al. September 3, 2 | 2013-09-03 |
Flexible semiconductor device
Grant 8,525,172 - Hirano , et al. September 3, 2 | 2013-09-03 |
Hybrid Substrate, Production Method Therefor, And Semiconductor Integrated Circuit Package
App 20130200516 - Nakatani; Seiichi ; et al. | 2013-08-08 |
Method for connecting between substrates, flip-chip mounting structure, and connection structure between substrates
Grant 8,501,583 - Kitae , et al. August 6, 2 | 2013-08-06 |
Flexible Semiconductor Device And Method For Manufacturing Same
App 20130168677 - HIRANO; Koichi ; et al. | 2013-07-04 |
Method for manufacturing flexible semiconductor device
Grant 8,435,842 - Hirano , et al. May 7, 2 | 2013-05-07 |
Manufacturing method of flexible semiconductor device
Grant 8,367,488 - Ichiryu , et al. February 5, 2 | 2013-02-05 |
Flexible semiconductor device and method for manufacturing same
Grant 8,343,822 - Hirano , et al. January 1, 2 | 2013-01-01 |
Substrate For Light-emitting Element, Method For Manufacturing The Same And Light-emitting Device
App 20120319159 - Nakatani; Seiichi ; et al. | 2012-12-20 |
Semiconductor chip, semiconductor mounting module, mobile communication device, and process for producing semiconductor chip
Grant 8,324,623 - Hirano , et al. December 4, 2 | 2012-12-04 |
Flexible Semiconductor Device, Method For Manufacturing The Same And Image Display Device
App 20120286264 - Suzuki; Takeshi ; et al. | 2012-11-15 |
Bump forming method using self-assembling resin and a wall surface
Grant 8,297,488 - Karashima , et al. October 30, 2 | 2012-10-30 |
Semiconductor device having semiconductor elements formed inside a resin film substrate
Grant 8,288,778 - Nakatani , et al. October 16, 2 | 2012-10-16 |
Flip chip mounting method and bump forming method
Grant 8,283,246 - Kitae , et al. October 9, 2 | 2012-10-09 |
Flexible Semiconductor Device And Method For Producing The Same
App 20120181543 - Ichiryu; Takashi ; et al. | 2012-07-19 |
Transistor having an organic semiconductor with a hollow space
Grant 8,193,526 - Nakatani , et al. June 5, 2 | 2012-06-05 |
Electronic Paper And Method For Producing Same
App 20120113500 - Hirano; Koichi ; et al. | 2012-05-10 |
Semiconductor device, semiconductor device manufacturing method and image display device
Grant 8,143,617 - Yamashita , et al. March 27, 2 | 2012-03-27 |
Flip chip connection structure having powder-like conductive substance and method of producing the same
Grant 8,097,958 - Sawada , et al. January 17, 2 | 2012-01-17 |
Flexible Semiconductor Device And Method For Manufacturing Same
App 20120001173 - Suzuki; Takeshi ; et al. | 2012-01-05 |
Flip chip mounting body, flip chip mounting method and flip chip mounting apparatus
Grant 8,071,425 - Nakatani , et al. December 6, 2 | 2011-12-06 |
Hybrid Substrate And Method For Producing The Same
App 20110293874 - TOYOOKA; Takashi ; et al. | 2011-12-01 |
Circuit board, method for manufacturing the same, and semiconductor device
Grant 8,063,486 - Hirano , et al. November 22, 2 | 2011-11-22 |
Module with a built-in component, and electronic device with the same
Grant 8,064,213 - Asahi , et al. November 22, 2 | 2011-11-22 |
Mounted body and method for manufacturing the same
Grant 8,039,307 - Kojima , et al. October 18, 2 | 2011-10-18 |
Flip chip mounting process and flip chip assembly
Grant 8,012,801 - Karashima , et al. September 6, 2 | 2011-09-06 |
Semiconductor Device, Method For Manufacturing The Same And Image Display
App 20110204366 - Nakatani; Seiichi ; et al. | 2011-08-25 |
Semiconductor Device, Method For Manufacturing The Same And Image Display
App 20110204367 - Nakatani; Seiichi ; et al. | 2011-08-25 |
Flip Chip Mounting Method And Bump Forming Method
App 20110201195 - KITAE; Takashi ; et al. | 2011-08-18 |
Semiconductor Chip, Semiconductor Mounting Module, Mobile Communication Device, And Process For Producing Semiconductor Chip
App 20110180900 - HIRANO; Koichi ; et al. | 2011-07-28 |
Magnetic sheet with stripe-arranged magnetic grains, RFID magnetic sheet, magnetic shielding sheet and method of manufacturing the same
Grant 7,981,528 - Nakatani , et al. July 19, 2 | 2011-07-19 |
Manufacturing method of flexible semiconductor device and flexible semiconductor device
Grant 7,977,741 - Hirano , et al. July 12, 2 | 2011-07-12 |
Flip-chip Mounting Method And Bump Formation Method
App 20110162578 - Hirano; Koichi ; et al. | 2011-07-07 |
Method for connecting electronic components, method for forming bump and conductive connection film and fabrication apparatus for electronic component mounted body, bump and conductive connection film
Grant 7,963,310 - Shiraishi , et al. June 21, 2 | 2011-06-21 |
Flip chip mounting method and bump forming method
Grant 7,951,700 - Kitae , et al. May 31, 2 | 2011-05-31 |
Manufacturing Method Of Flexible Semiconductor Device
App 20110121298 - Ichiryu; Takashi ; et al. | 2011-05-26 |
Semiconductor chip, semiconductor mounting module, mobile communication device, and process for producing semiconductor chip
Grant 7,943,518 - Hirano , et al. May 17, 2 | 2011-05-17 |
Flip-chip mounting method and bump formation method
Grant 7,927,997 - Hirano , et al. April 19, 2 | 2011-04-19 |
Electronic component mounting method
Grant 7,921,551 - Yamashita , et al. April 12, 2 | 2011-04-12 |
Method for mutually connecting substrates, flip chip mounting body, and mutual connection structure between substrates
Grant 7,919,357 - Sawada , et al. April 5, 2 | 2011-04-05 |
Mounted body and method for manufacturing the same
Grant 7,911,064 - Komatsu , et al. March 22, 2 | 2011-03-22 |
Bump forming method and bump forming apparatus
Grant 7,905,011 - Taniguchi , et al. March 15, 2 | 2011-03-15 |
Method For Connecting Electronic Components, Method For Forming Bump And Conductive Connection Film And Fabrication Apparatus For Electronic Component Mounted Body, Bump And Conductive Connection Film
App 20110049218 - SHIRAISHI; Tsukasa ; et al. | 2011-03-03 |
Manufacturing Method Of Flexible Semiconductor Device And Flexible Semiconductor Device
App 20110049598 - HIRANO; Koichi ; et al. | 2011-03-03 |
Flexible Semiconductor Device And Method For Manufacturing The Same
App 20110042677 - Suzuki; Takeshi ; et al. | 2011-02-24 |
Transfer material used for producing a wiring substrate
Grant 7,888,789 - Sugaya , et al. February 15, 2 | 2011-02-15 |
Flip chip mounting method, flip chip mounting apparatus and flip chip mounting body
Grant 7,875,496 - Nakatani , et al. January 25, 2 | 2011-01-25 |
Module and mounted structure using the same
Grant 7,859,855 - Nakatani , et al. December 28, 2 | 2010-12-28 |
Method for connecting electronic components, method for forming bump and conductive connection film and fabrication apparatus for electronic component mounted body, bump and conductive correction film
Grant 7,850,803 - Shiraishi , et al. December 14, 2 | 2010-12-14 |
Manufacturing method of flexible semiconductor device and flexible semiconductor device
Grant 7,851,281 - Hirano , et al. December 14, 2 | 2010-12-14 |
Flexible Semiconductor Device And Method For Manufacturing Same
App 20100283054 - Hirano; Koichi ; et al. | 2010-11-11 |
Method For Fabricating Flexible Semiconductor Device And Layered Film Used Therefore
App 20100276691 - Ichiryu; Takashi ; et al. | 2010-11-04 |
Flip chip mounting method and method for connecting substrates
Grant 7,820,021 - Karashima , et al. October 26, 2 | 2010-10-26 |
Method For Manufacturing Flexible Semiconductor Device
App 20100261321 - Hirano; Koichi ; et al. | 2010-10-14 |
Process for forming bumps and solder bump
Grant 7,799,607 - Karashima , et al. September 21, 2 | 2010-09-21 |
Mounted Body And Method For Manufacturing The Same
App 20100224986 - Kojima; Toshiyuki ; et al. | 2010-09-09 |
Flip Chip Mounting Body, Flip Chip Mounting Method And Flip Chip Mounting Apparatus
App 20100203675 - NAKATANI; Seiichi ; et al. | 2010-08-12 |
Flexible substrate, multilayer flexible substrate
Grant 7,773,386 - Yamashita , et al. August 10, 2 | 2010-08-10 |
Semiconductor Device, Semiconductor Device Manufacturing Method And Image Display Device
App 20100181558 - Yamashita; Yoshihisa ; et al. | 2010-07-22 |
Rfid Magnetic Sheet, Noncontact Ic Card And Portable Mobile Communication Apparatus
App 20100182144 - Yamashita; Yoshihisa ; et al. | 2010-07-22 |
Flip chip mounting process and flip chip assembly
Grant 7,759,162 - Karashima , et al. July 20, 2 | 2010-07-20 |
Method for producing connection member
Grant 7,748,110 - Asahi , et al. July 6, 2 | 2010-07-06 |
Semiconductor Chip, Semiconductor Mounting Module, Mobile Communication Device, And Process For Producing Semiconductor Chip
App 20100164061 - Hirano; Koichi ; et al. | 2010-07-01 |
Flip Chip Mounting Process And Flip Chip Assembly
App 20100148376 - Karashima; Seiji ; et al. | 2010-06-17 |
Flip chip mounting body, flip chip mounting method and flip chip mounting apparatus
Grant 7,732,920 - Nakatani , et al. June 8, 2 | 2010-06-08 |
Module And Mounted Structure Using The Same
App 20100133664 - Nakatani; Seiichi ; et al. | 2010-06-03 |
Flip chip mounting process and bump-forming process using electrically-conductive particles as nuclei
Grant 7,726,545 - Ichiryu , et al. June 1, 2 | 2010-06-01 |
Conductive resin composition, connection method between electrodes using the same, and electric connection method between electronic component and circuit substrate using the same
Grant 7,714,444 - Nakatani , et al. May 11, 2 | 2010-05-11 |
Mounted body and method for manufacturing the same
Grant 7,713,787 - Kojima , et al. May 11, 2 | 2010-05-11 |
System-in-package optical transceiver in optical communication with a plurality of other system-in-package optical transceivers via an optical transmission line
Grant 7,689,129 - Karashima , et al. March 30, 2 | 2010-03-30 |
Electrode Structure And Method For Forming Bump
App 20100044091 - Taniguchi; Yasushi ; et al. | 2010-02-25 |
Module and mounted structure using the same
Grant 7,667,974 - Nakatani , et al. February 23, 2 | 2010-02-23 |
Manufacturing Method Of Flexible Semiconductor Device And Flexible Semiconductor Device
App 20100012936 - Hirano; Koichi ; et al. | 2010-01-21 |
Electronic Component Assembly, Electric Component With Solder Bump And Process For Producing The Same
App 20100011572 - Kitae; Takashi ; et al. | 2010-01-21 |
Method For Connecting Between Substrates, Flip-chip Mounting Structure, And Connection Structure Between Substrates
App 20100007033 - KITAE; Takashi ; et al. | 2010-01-14 |
Method For Mutually Connecting Substrates, Flip Chip Mounting Body, And Mutual Connection Structure Between Substrates
App 20100001411 - SAWADA; Susumu ; et al. | 2010-01-07 |
Electronic component transporting method
Grant 7,640,654 - Nakatani , et al. January 5, 2 | 2010-01-05 |
Method for forming conductive pattern and wiring board
Grant 7,640,659 - Karashima , et al. January 5, 2 | 2010-01-05 |
Flip chip mounting method and bump forming method
Grant 7,638,883 - Karashima , et al. December 29, 2 | 2009-12-29 |
Method for forming solder bump and method for mounting semiconductor device using a solder powder resin composition
Grant 7,611,040 - Kitae , et al. November 3, 2 | 2009-11-03 |
Mounted Body And Method For Manufacturing The Same
App 20090230546 - Komatsu; Shingo ; et al. | 2009-09-17 |
Bump Forming Method And Bump Forming Apparatus
App 20090229120 - Taniguchi; Yasushi ; et al. | 2009-09-17 |
Electronic Component Mounting Method and Electronic Circuit Device
App 20090223705 - Yamashita; Yoshihisa ; et al. | 2009-09-10 |
Multilevel semiconductor module and method for fabricating the same
Grant 7,586,183 - Kawabata , et al. September 8, 2 | 2009-09-08 |
Conductive Resin Composition, Connection Method Between Electrodes Using The Same, And Electric Connection Method Between Electronic Component And Circuit Substrate Using The Same
App 20090200522 - NAKATANI; Seiichi ; et al. | 2009-08-13 |
Flip Chip Mounting Method, Flip Chip Mounting Apparatus And Flip Chip Mounting Body
App 20090203170 - Nakatani; Seiichi ; et al. | 2009-08-13 |
Method For Forming Conductive Pattern And Wiring Board
App 20090133901 - Karashima; Seiji ; et al. | 2009-05-28 |
Conductive resin composition, connection method between electrodes using the same, and electric connection method between electronic component and circuit substrate using the same
Grant 7,537,961 - Nakatani , et al. May 26, 2 | 2009-05-26 |
Flip chip mounting method and method for connecting substrates
App 20090126876 - Karashima; Seiji ; et al. | 2009-05-21 |
Flip chip mounting method and method for connecting substrates
Grant 7,531,385 - Karashima , et al. May 12, 2 | 2009-05-12 |
Flexible substrate having interlaminar junctions, and process for producing the same
Grant 7,531,754 - Yamashita , et al. May 12, 2 | 2009-05-12 |
Flip chip mounting method and bump forming method
Grant 7,531,387 - Karashima , et al. May 12, 2 | 2009-05-12 |
Flip Chip Mounting Method And Bump Forming Method
App 20090117688 - Karashima; Seiji ; et al. | 2009-05-07 |
Connection Structure And Method Of Producing The Same
App 20090102064 - Sawada; Susumu ; et al. | 2009-04-23 |
Flip-chip Mounting Body And Flip-chip Mounting Method
App 20090085227 - Shiraishi; Tsukasa ; et al. | 2009-04-02 |
Bump Forming Method And Bump Forming Apparatus
App 20090078746 - Karashima; Seiji ; et al. | 2009-03-26 |
Method for manufacturing component built-in module, and component built-in module
Grant 7,488,895 - Hayashi , et al. February 10, 2 | 2009-02-10 |
Flip Chip Mounting Method And Bump Forming Method
App 20090023245 - Kitae; Takashi ; et al. | 2009-01-22 |
Flip Chip Mounting Body, Flip Chip Mounting Method And Flip Chip Mounting Apparatus
App 20090008800 - Nakatani; Seiichi ; et al. | 2009-01-08 |
Electronic Component Mounted Body, Electronic Component with Solder Bump, Solder Resin Mixed Material, Electronic Component Mounting Method and Electronic Component Manufacturing Method
App 20090008776 - Kitae; Takashi ; et al. | 2009-01-08 |
Flip chip mounting method and bump forming method
App 20080284046 - Karashima; Seiji ; et al. | 2008-11-20 |
Electronic component packaging structure and method for producing the same
Grant 7,443,021 - Nakatani October 28, 2 | 2008-10-28 |
Mounted Body and Method for Manufacturing the Same
App 20080251894 - Kojima; Toshiyuki ; et al. | 2008-10-16 |
Flexible substrate, multilayer flexible substrate and process for producing the same
App 20080210458 - Yamashita; Yoshihisa ; et al. | 2008-09-04 |
Method for Forming Solder Bump and Method for Mounting Semiconductor Device
App 20080197173 - Kitae; Takashi ; et al. | 2008-08-21 |
Module incorporating a capacitor, method for manufacturing the same, and capacitor used therefor
Grant 7,400,512 - Hirano , et al. July 15, 2 | 2008-07-15 |
Flip Clip Mounting Process And Bump-Forming Process Using Electrically-Conductive Particles
App 20080165518 - Ichiryu; Takashi ; et al. | 2008-07-10 |
Electronic component built-in module and method of manufacturing the same
Grant 7,394,663 - Yamashita , et al. July 1, 2 | 2008-07-01 |
Semiconductor device and method for manufacturing the same
Grant 7,390,692 - Sugaya , et al. June 24, 2 | 2008-06-24 |
Flip-Chip Mounting Resin Composition and Bump Forming Resin Composition
App 20080128664 - Kitae; Takashi ; et al. | 2008-06-05 |
Multi-level semiconductor module and method for fabricating the same
Grant 7,365,416 - Kawabata , et al. April 29, 2 | 2008-04-29 |
Module Incorporating A Capacitor, Method For Manufacturing The Same, And Capacitor Used Therefor
App 20080089043 - HIRANO; Koichi ; et al. | 2008-04-17 |
Magnetic Sheet With Stripe-arranged Magnetic Grains, Rfid Magnetic Sheet, Magnetic Shielding Sheet And Method Of Manufacturing The Same
App 20080070003 - NAKATANI; Seiichi ; et al. | 2008-03-20 |
Connection member and mount assembly and production method of the same
App 20080047137 - Asahi; Toshiyuki ; et al. | 2008-02-28 |
Module and Mounted Structure Using the Same
App 20080048307 - Nakatani; Seiichi ; et al. | 2008-02-28 |
Flip Chip Mounting Process and Flip Chip Assembly
App 20080017995 - Karashima; Seiji ; et al. | 2008-01-24 |
Flexible substrate, multilayer flexible substrate and process for producing the same
Grant 7,321,496 - Yamashita , et al. January 22, 2 | 2008-01-22 |
Method for connecting electronic components, method for forming bump and conductive connection film and fabrication apparatus for electronic component mounted body, bump and conductive connection film
App 20080011402 - Shiraishi; Tsukasa ; et al. | 2008-01-17 |
Module incorporating a capacitor, method for manufacturing the same, and capacitor used therefor
Grant 7,319,599 - Hirano , et al. January 15, 2 | 2008-01-15 |
Circuit Board, Method For Manufacturing The Same, And Semiconductor Device
App 20070262447 - HIRANO; Koichi ; et al. | 2007-11-15 |
Module With Built-In Semiconductor And Method For Manufacturing The Module
App 20070262470 - Ichiryu; Takashi ; et al. | 2007-11-15 |
Component built-in module and method for producing the same
Grant 7,294,587 - Asahi , et al. November 13, 2 | 2007-11-13 |
Process for Forming Bumps and Solder Bump
App 20070257362 - Karashima; Seiji ; et al. | 2007-11-08 |
Flip-Chip Mounting Method and Bump Formation Method
App 20070243664 - Hirano; Koichi ; et al. | 2007-10-18 |
Optical Transmission Channel Board, Board With Built-in Optical Transmission Channel, And Data Processing Apparatus
App 20070224735 - Karashima; Seiji ; et al. | 2007-09-27 |
Conductive Resin Composition, Connection Method Between Electrodes Using The Same, And Electric Connection Method Between Electronic Component And Circuit Substrate Using The Same
App 20070216023 - Nakatani; Seiichi ; et al. | 2007-09-20 |
Connection member and mount assembly and production method of the same
Grant 7,258,549 - Asahi , et al. August 21, 2 | 2007-08-21 |
Electronic component transporting method
App 20070175024 - Nakatani; Seiichi ; et al. | 2007-08-02 |
Module with built-in circuit component and method for producing the same
Grant 7,248,482 - Asahi , et al. July 24, 2 | 2007-07-24 |
Capacitor and method for producing the same, and circuit board with a built-in capacitor and method for producing the same
Grant 7,247,178 - Hirano , et al. July 24, 2 | 2007-07-24 |
Optical transmission channel board, board with built-in optical transmission channel, and data processing apparatus
Grant 7,242,823 - Karashima , et al. July 10, 2 | 2007-07-10 |
Flexible substrate having interlaminar junctions, and process for producing the same
App 20070151756 - Yamashita; Yoshihisa ; et al. | 2007-07-05 |
Circuit Board And Method For Manufacturing The Same
App 20070124926 - Ishimaru; Yukihiro ; et al. | 2007-06-07 |
Method for manufacturing component built-in module, and component built-in module
App 20070119617 - Hayashi; Yoshitake ; et al. | 2007-05-31 |
Flexible substrate having interlaminar junctions, and process for producing the same
Grant 7,205,483 - Yamashita , et al. April 17, 2 | 2007-04-17 |
Electronic Component Packaging Structure And Method For Producing The Same
App 20070081314 - NAKATANI; Seiichi | 2007-04-12 |
Component built-in module and method for producing the same
Grant 7,198,996 - Nakatani , et al. April 3, 2 | 2007-04-03 |
Wiring board embedded with spherical semiconductor element
App 20070069393 - Asahi; Toshiyuki ; et al. | 2007-03-29 |
Module with built-in circuit elements
App 20070035013 - Handa; Hiroyuki ; et al. | 2007-02-15 |
Capacitor and method for producing the same, and circuit board with a built-in capacitor and method for producing the same
App 20070022590 - Hirano; Koichi ; et al. | 2007-02-01 |
Semiconductor device and method for manufacturing the same
Grant 7,157,789 - Hirano , et al. January 2, 2 | 2007-01-02 |
Semiconductor device and method for manufacturing the same
App 20060290009 - Sugaya; Yasuhiro ; et al. | 2006-12-28 |
Method of producing circuit component built-in module with embedded circuit component
Grant 7,140,104 - Hirano , et al. November 28, 2 | 2006-11-28 |
Electronic component packaging structure and method for producing the same
Grant 7,141,874 - Nakatani November 28, 2 | 2006-11-28 |
Module with a built-in semiconductor and method for producing the same
Grant 7,141,884 - Kojima , et al. November 28, 2 | 2006-11-28 |
Method for manufacturing electric element built-in module with sealed electric element
Grant 7,134,198 - Nakatani , et al. November 14, 2 | 2006-11-14 |
Semiconductor device and method for manufacturing the same
Grant 7,132,756 - Sugaya , et al. November 7, 2 | 2006-11-07 |
Capacitor and method for producing the same, and circuit board with a built-in capacitor and method for producing the same
Grant 7,126,811 - Hirano , et al. October 24, 2 | 2006-10-24 |
Multilevel semiconductor module and method for fabricating the same
App 20060231939 - Kawabata; Takeshi ; et al. | 2006-10-19 |
Lead frame and production process thereof and production process of thermally conductive substrate
Grant 7,087,467 - Yamashita , et al. August 8, 2 | 2006-08-08 |
Printed circuit board and method manufacturing the same
Grant 7,068,519 - Nakatani , et al. June 27, 2 | 2006-06-27 |
Multi-level semiconductor module and method for fabricating the same
App 20060131740 - Kawabata; Takeshi ; et al. | 2006-06-22 |
Method of manufacturing a thermal conductive circuit board with grounding pattern connected to a heat sink
Grant 7,059,042 - Hirano , et al. June 13, 2 | 2006-06-13 |
Power module and method of manufacturing the same
Grant 7,041,535 - Yamashita , et al. May 9, 2 | 2006-05-09 |
Semiconductor module, process for producing the same, and film interposer
App 20060091524 - Karashima; Seiji ; et al. | 2006-05-04 |
Power module with improved heat dissipation
Grant 7,038,310 - Nakatani , et al. May 2, 2 | 2006-05-02 |
Semiconductor device and method for producing the same
App 20060087020 - Hirano; Koichi ; et al. | 2006-04-27 |
Thermally conductive substrate, thermally conductive substrate manufacturing method and power module
Grant 7,033,865 - Yamashita , et al. April 25, 2 | 2006-04-25 |
Transfer sheet and wiring board using the same, and method of manufacturing the same
App 20060078669 - Sugaya; Yasuhiro ; et al. | 2006-04-13 |
Method for manufacturing circuit board and circuit board and power conversion module using the same
Grant 7,022,276 - Hirano , et al. April 4, 2 | 2006-04-04 |
Circuit component built-in module with embedded semiconductor chip and method of manufacturing
Grant 7,018,866 - Sugaya , et al. March 28, 2 | 2006-03-28 |
Method for producing a capacitor-embedded circuit board
Grant 7,013,561 - Nakatani , et al. March 21, 2 | 2006-03-21 |
Transfer sheet and wiring board using the same, and method of manufacturing the same
Grant 7,001,662 - Sugaya , et al. February 21, 2 | 2006-02-21 |
Multiprocessor
App 20060036831 - Karashima; Seiji ; et al. | 2006-02-16 |
Component built-in module and method for producing the same
Grant 6,975,516 - Asahi , et al. December 13, 2 | 2005-12-13 |
Component built-in module and method for producing the same
App 20050269681 - Asahi, Toshiyuki ; et al. | 2005-12-08 |
Semiconductor device and method for manufacturing the same
App 20050263860 - Hirano, Koichi ; et al. | 2005-12-01 |
Dielectric resonator, dielectric filter and method of producing the same, filter device combined to a transmit-receive antenna and communication apparatus using the same
App 20050236103 - Sugaya, Yasuhiro ; et al. | 2005-10-27 |
Thermal conductive substrate and semiconductor module using the same
Grant 6,958,535 - Hirano , et al. October 25, 2 | 2005-10-25 |
Component built-in module and method for producing the same
App 20050230848 - Nakatani, Seiichi ; et al. | 2005-10-20 |
Method of manufacturing a component built-in module
Grant 6,955,948 - Asahi , et al. October 18, 2 | 2005-10-18 |
Flexible substrate, Multilayer flexible substrate and process for producing the same
App 20050205294 - Yamashita, Yoshihisa ; et al. | 2005-09-22 |
Flexible substrate having interlaminar junctions, and process for producing the same
App 20050205291 - Yamashita, Yoshihisa ; et al. | 2005-09-22 |
Circuit board and method for manufacturing the same
App 20050199420 - Ishimaru, Yukihiro ; et al. | 2005-09-15 |
Fabrication method for optical transmission channel board, optical transmission channel board, board with built-in optical transmission channel, fabrication method for board with built-in optical transmission channel, and data processing apparatus
App 20050196095 - Karashima, Seiji ; et al. | 2005-09-08 |
Component built-in module and method for producing the same
Grant 6,939,738 - Nakatani , et al. September 6, 2 | 2005-09-06 |
Wiring substrate produced by transfer material method
Grant 6,936,774 - Sugaya , et al. August 30, 2 | 2005-08-30 |
Wiring substrate produced by transfer material method
App 20050186768 - Sugaya, Yasuhiro ; et al. | 2005-08-25 |
Three-dimensional mounting structure and method for producing the same
App 20050184372 - Asahi, Toshiyuki ; et al. | 2005-08-25 |
Connection member and mount assembly and production method of the same
App 20050184381 - Asahi, Toshiyuki ; et al. | 2005-08-25 |
Circuit component built-in module, radio device having the same, and method for producing the same
Grant 6,931,725 - Sugaya , et al. August 23, 2 | 2005-08-23 |
Module with a built-in component, and electronic device with the same
App 20050168960 - Asahi, Toshiyuki ; et al. | 2005-08-04 |
Thermal conductive board, method of manufacturing the same, and power module with the same incorporated therein
App 20050158916 - Hirano, Koichi ; et al. | 2005-07-21 |
Module incorporating a capacitor, method for manufacturing the same, and capacitor used therefor
App 20050073818 - Hirano, Koichi ; et al. | 2005-04-07 |
Transfer material for wiring substrate
Grant 6,871,396 - Sugaya , et al. March 29, 2 | 2005-03-29 |
Lead frame and production process thereof and production process of thermally conductive substrate
Grant 6,870,244 - Yamashita , et al. March 22, 2 | 2005-03-22 |
Connector sheet and wiring board, and production processes of the same
App 20050057906 - Nakatani, Seiichi ; et al. | 2005-03-17 |
Sheet for a thermal conductive substrate, a method for manufacturing the same, a thermal conductive substrate using the sheet and a method for manufacturing the same
Grant 6,863,962 - Nakatani , et al. March 8, 2 | 2005-03-08 |
Method of manufacturing a thermally conductive circuit board with a ground pattern connected to a heat sink
Grant 6,860,004 - Hirano , et al. March 1, 2 | 2005-03-01 |
High-frequency semiconductor device
App 20050040522 - Takehara, Hideki ; et al. | 2005-02-24 |
Insulation sheet, multi-layer wiring substrate and production processes thereof
Grant 6,855,892 - Komatsu , et al. February 15, 2 | 2005-02-15 |
Circuit component, circuit component package, circuit component built-in module, circuit component package production and circuit component built-in module production
App 20050005420 - Hirano, Koichi ; et al. | 2005-01-13 |
Module with a built-in semiconductor and method for producing the same
App 20050001331 - Kojima, Toshiyuki ; et al. | 2005-01-06 |
Capacitor, laminated capacitor, and capacitor built-in-board
Grant 6,836,401 - Yoshida , et al. December 28, 2 | 2004-12-28 |
Module with built-in circuit component and method for producing the same
App 20040226744 - Asahi, Toshiyuki ; et al. | 2004-11-18 |
Electronic component packaging structure and method for producing the same
App 20040227258 - Nakatani, Seiichi | 2004-11-18 |
High-frequency semiconductor device
Grant 6,818,979 - Takehara , et al. November 16, 2 | 2004-11-16 |
High-frequency semiconductor device
Grant 6,815,810 - Takehara , et al. November 9, 2 | 2004-11-09 |
Multilayer printed wiring board and integrated circuit using the same
App 20040211590 - Tagi, Hiroyoshi ; et al. | 2004-10-28 |
Thermally conductive substrate, thermally conductive substrate manufacturing method and power module
App 20040207053 - Yamashita, Yoshihisa ; et al. | 2004-10-21 |
Transfer sheet and wiring board using the same, and method of manufacturing the same
App 20040191491 - Sugaya, Yasuhiro ; et al. | 2004-09-30 |
Module with built-in electronic elements and method of manufacture thereof
Grant 6,798,121 - Nakatani , et al. September 28, 2 | 2004-09-28 |
Circuit component, circuit component package, circuit component built-in module, circuit component package production and circuit component built-in module production
Grant 6,787,884 - Hirano , et al. September 7, 2 | 2004-09-07 |
Circuit component built-in module with embedded semiconductor chip and method of manufacturing
Grant 6,784,530 - Sugaya , et al. August 31, 2 | 2004-08-31 |
Electronic component built-in module and method of manufacturing the same
App 20040160752 - Yamashita, Yoshihisa ; et al. | 2004-08-19 |
Component built-in module and method for producing the same
App 20040158980 - Nakatani, Seiichi ; et al. | 2004-08-19 |
Power module and method of manufacturing the same
App 20040145046 - Yamashita, Yoshihisa ; et al. | 2004-07-29 |
Circuit component built-in module with embedded semiconductor chip and method of manufacturing
App 20040145044 - Sugaya, Yasuhiro ; et al. | 2004-07-29 |
Lead frame and production process thereof and production process of thermally conductive substrate
App 20040142511 - Yamashita, Yoshihisa ; et al. | 2004-07-22 |
Capacitor and method for producing the same, and circuit board with a built-in capacitor and method for producing the same
App 20040125543 - Hirano, Koichi ; et al. | 2004-07-01 |
Component built-in module and method for producing the same
Grant 6,734,542 - Nakatani , et al. May 11, 2 | 2004-05-11 |
Printed circuit board and method manufacturing the same
App 20040088416 - Nakatani, Seiichi ; et al. | 2004-05-06 |
Semiconductor device and method for manufacturing the same
App 20040084769 - Sugaya, Yasuhiro ; et al. | 2004-05-06 |
Power module and method of manufacturing the same
Grant 6,707,671 - Yamashita , et al. March 16, 2 | 2004-03-16 |
Capacitor, laminated capacitor, and capacitor built-in-board
App 20040047112 - Yoshida, Tsunenori ; et al. | 2004-03-11 |
Electric element built-in module and method for manufacturing the same
App 20040040740 - Nakatani, Seiichi ; et al. | 2004-03-04 |
Thermally conductive substrate, thermally conductive substrate manufacturing method and power module
Grant 6,700,182 - Yamashita , et al. March 2, 2 | 2004-03-02 |
Method for manufacturing circuit board and circuit board and power conversion module using the same
Grant 6,692,818 - Hirano , et al. February 17, 2 | 2004-02-17 |
High-frequency semiconductor device
App 20040026780 - Takehara, Hideki ; et al. | 2004-02-12 |
Composition for substrate materials and process for the same as well as a heat conductive substrate and process for the same
Grant 6,666,392 - Hirano , et al. December 23, 2 | 2003-12-23 |
Method for manufacturing circuit board and circuit board and power conversion module using the same
App 20030230813 - Hirano, Koichi ; et al. | 2003-12-18 |
Circuit component, circuit component package,, circuit component built-in module, circuit component package production and circuit component built-in module production
App 20030222335 - Hirano, Koichi ; et al. | 2003-12-04 |
Printed circuit board and method manufacturing the same
Grant 6,625,037 - Nakatani , et al. September 23, 2 | 2003-09-23 |
Composition for substrate materials and process for the same as well as a heat conductive substrate and process for the same
App 20030155455 - Hirano, Koichi ; et al. | 2003-08-21 |
Thermal conductive substrate and the method for manufacturing the same
App 20030148079 - Hirano, Koichi ; et al. | 2003-08-07 |
Circuit component built-in module, radio device having the same, and method for producing the same
App 20030141105 - Sugaya, Yasuhiro ; et al. | 2003-07-31 |
Circuit component built-in module and method of manufacturing the same
App 20030137045 - Sugaya, Yasuhiro ; et al. | 2003-07-24 |
Metal wiring board, semiconductor device, and method for manufacturing the same
App 20030127725 - Sugaya, Yasuhiro ; et al. | 2003-07-10 |
Sheet for a thermal conductive substrate, a method for manufacturing the same, a thermal conductive substrate using the sheet and a method for manufacturing the same
App 20030124326 - Nakatani, Seiichi ; et al. | 2003-07-03 |
Capacitor-mounted metal foil and a method for producing the same, and a circuit board and a method for producing the same
App 20030116348 - Nakatani, Seiichi ; et al. | 2003-06-26 |
Transfer material method for producing the same and wiring substrate produced by using the same
App 20030102153 - Sugaya, Yasuhiro ; et al. | 2003-06-05 |
Thermal conductive substrate and the method for manufacturing the same
Grant 6,570,099 - Hirano , et al. May 27, 2 | 2003-05-27 |
Component built-in module and method for producing the same
App 20030090883 - Asahi, Toshiyuki ; et al. | 2003-05-15 |
Insulation sheet and multi-layer wiring substrate and production processes thereof
App 20030085058 - Komatsu, Shingo ; et al. | 2003-05-08 |
Thermal conductive board, method of manufacturing the same, and power module with the same incorporated therein
App 20030076663 - Hirano, Koichi ; et al. | 2003-04-24 |
High-frequency semiconductor device
App 20030071350 - Takehara, Hideki ; et al. | 2003-04-17 |
Component built-in module and method of manufacturing the same
App 20030062624 - Asahi, Toshiyuki ; et al. | 2003-04-03 |
Circuit component built-in module, radio device having the same, and method for producing the same
Grant 6,538,210 - Sugaya , et al. March 25, 2 | 2003-03-25 |
Capacitor-mounted metal foil and a method for producing the same, and a circuit board and a method for producing the same
Grant 6,525,921 - Nakatani , et al. February 25, 2 | 2003-02-25 |
Dielectric resonator, dielectric filter and method of producing the same, filter device combined to a transmit-receive antenna and communication apparatus using the same
App 20030034124 - Sugaya, Yasuhiro ; et al. | 2003-02-20 |
Thermally conductive board, method of manufacturing the same, and power module with the same incorporated therein
Grant 6,522,555 - Hirano , et al. February 18, 2 | 2003-02-18 |
Electrolytic capacitor, circuit board containing electrolytic capacitor, and method for producing the same
Grant 6,504,705 - Shimada , et al. January 7, 2 | 2003-01-07 |
Method for manufacturing circuit board and circuit board and power conversion module using the same
App 20020187321 - Hirano, Koichi ; et al. | 2002-12-12 |
Lead frame and production process thereof and production process of thermally conductive substrate
App 20020187318 - Yamashita, Yoshihisa ; et al. | 2002-12-12 |
Power module and method of manufacturing the same
App 20020179289 - Yamashita, Yoshihisa ; et al. | 2002-12-05 |
Component built-in module and method of manufacturing the same
Grant 6,489,685 - Asahi , et al. December 3, 2 | 2002-12-03 |
Module with built-in electronic elements and method of manufacture thereof
App 20020159242 - Nakatani, Seiichi ; et al. | 2002-10-31 |
Capacitor unit, method for producing the same, and solid electrolytic capacitor
Grant 6,473,293 - Shimada , et al. October 29, 2 | 2002-10-29 |
Component built-in module and method of manufacturing the same
App 20020135058 - Asahi, Toshiyuki ; et al. | 2002-09-26 |
Component built-in module and method for producing the same
App 20020117743 - Nakatani, Seiichi ; et al. | 2002-08-29 |
Thermal conductive substrate and semiconductor module using the same
App 20020096759 - Hirano, Koichi ; et al. | 2002-07-25 |
Capacitor unit, method for producing the same, and solid electrolytic capacitor
App 20020097550 - Shimada, Mikinari ; et al. | 2002-07-25 |
Electrolytic capacitor, circuit board containing electrolytic capacitor, and method for producing the same
App 20020075633 - Shimada, Mikinari ; et al. | 2002-06-20 |
Magnetic element and method of manufacturing the same
Grant 6,392,525 - Kato , et al. May 21, 2 | 2002-05-21 |
Sheet for a thermal conductive substrate, a method for manufacturing the same, a thermal conductive substrate using the sheet and a method for manufacturing the same
App 20020040760 - Nakatani, Seiichi ; et al. | 2002-04-11 |
Printed circuit board and method manufacturing the same
App 20020036054 - Nakatani, Seiichi ; et al. | 2002-03-28 |
Semiconductor chip bonded to a thermal conductive sheet having a filled through hole for electrical connection
App 20020028536 - Hirano, Koichi ; et al. | 2002-03-07 |
Sheet for a thermal conductive substrate, a method for manufacturing the same, a thermal conductive substrate using the sheet and a method for manufacturing the same
App 20020026980 - Nakatani, Seiichi ; et al. | 2002-03-07 |
Thermally conductive substrate, thermally conductive substrate manufacturing method and power module
App 20020020897 - Yamashita, Yoshihisa ; et al. | 2002-02-21 |
Circuit component built-in module and method for producing the same
Grant 6,338,767 - Nakatani , et al. January 15, 2 | 2002-01-15 |
Thermally conductive board, method of manufacturing the same, and power module with the same incorporated therein
App 20010036065 - Hirano, Koichi ; et al. | 2001-11-01 |
Circuit component built-in module, radio device having the same, and method for producing the same
App 20010030059 - Sugaya, Yasuhiro ; et al. | 2001-10-18 |
Semiconductor chip bonded to a thermal conductive sheet having a filled through hole for electrical connection
Grant 6,300,686 - Hirano , et al. October 9, 2 | 2001-10-09 |
Composition for substrate materials and process for the same as well as a heat conductive substrate and process for the same
App 20010026863 - Hirano, Koichi ; et al. | 2001-10-04 |
Transfer material, method for producing the same and wiring substrate produced by using the same
App 20010023779 - Sugaya, Yasuhiro ; et al. | 2001-09-27 |
Connecting member of a circuit substrate and method of manufacturing multilayer circuit substrates by using the same
App 20010003610 - Nakatani, Seiichi ; et al. | 2001-06-14 |
Printed circuit board and method of manufacturing the same
App 20010002294 - Hatakeyama, Akihito ; et al. | 2001-05-31 |
Printed circuit board and method of manufacturing the same
Grant 6,211,487 - Hatakeyama , et al. April 3, 2 | 2001-04-03 |
Printed circuit board and method for producing the same
Grant 6,174,589 - Kawakita , et al. January 16, 2 | 2001-01-16 |
Connecting member of a circuit substrate and method of manufacturing multilayer circuit substrates by using the same
Grant 6,108,903 - Nakatani , et al. August 29, 2 | 2000-08-29 |
Conductive paste composition for via hole filling and printed circuit board using the same
Grant 6,096,411 - Nakatani , et al. August 1, 2 | 2000-08-01 |
Sheet for a thermal conductive substrate, a method for manufacturing the same, a thermal conductive substrate using the sheet and a method for manufacturing the same
Grant 6,060,150 - Nakatani , et al. May 9, 2 | 2000-05-09 |
Circuit component built-in module and method for producing the same
Grant 6,038,133 - Nakatani , et al. March 14, 2 | 2000-03-14 |
Conductive paste compound for via hole filling, printed circuit board which uses the conductive paste, and method of manufacturing the same
Grant 5,977,490 - Kawakita , et al. November 2, 1 | 1999-11-02 |
Printed circuit board and method of manufacturing the same
Grant 5,972,482 - Hatakeyama , et al. October 26, 1 | 1999-10-26 |
Conductive paste compound for via hole filling, printed circuit board which uses the conductive paste, and method of manufacturing the same
Grant 5,914,358 - Kawakita , et al. June 22, 1 | 1999-06-22 |
Printed circuit board and method for the manufacture of same
Grant 5,888,627 - Nakatani March 30, 1 | 1999-03-30 |
Printed circuit board
Grant 5,817,404 - Kawakita , et al. October 6, 1 | 1998-10-06 |
Conductive paste compound for via hole filling, printed circuit board which uses the conductive paste, and method of manufacturing the same
Grant 5,733,467 - Kawakita , et al. March 31, 1 | 1998-03-31 |
Conductive paste compound for via hole filling, printed circuit board which uses the conductive paste
Grant 5,652,042 - Kawakita , et al. July 29, 1 | 1997-07-29 |
Semiconductor device and method of manufacturing the same
Grant 5,622,590 - Kunitomo , et al. April 22, 1 | 1997-04-22 |
Method of manufacturing two-sided and multi-layered printed circuit boards
Grant 5,588,207 - Kawakita , et al. December 31, 1 | 1996-12-31 |
Assembly formed from conductive paste and insulating paste
Grant 5,496,619 - Itagaki , et al. March 5, 1 | 1996-03-05 |
Connecting member of a circuit substrate and method of manufacturing multilayer circuit substrates by using the same
Grant 5,484,647 - Nakatani , et al. January 16, 1 | 1996-01-16 |
Semiconductor device and method of manufacturing the same
Grant 5,436,503 - Kunitomo , et al. July 25, 1 | 1995-07-25 |
Process for forming a sintered conductor circuit board
Grant 5,407,511 - Nakatani , et al. April 18, 1 | 1995-04-18 |
Surface mounting module for an electric circuit board
Grant 5,406,459 - Tsukamoto , et al. April 11, 1 | 1995-04-11 |
Conductive resin composition containing zinc oxide whiskers having a tetrapod structure
Grant 5,183,594 - Yoshinaka , et al. * February 2, 1 | 1993-02-02 |
Electrophotographic photosensitive member containing a conductive layer which comprises a resin and a conductive zinc oxide having a tetrapad structure
Grant 5,171,480 - Yoshinaka , et al. December 15, 1 | 1992-12-15 |
Laminated ceramic capacitor
Grant 5,014,158 - Nishimura , et al. May 7, 1 | 1991-05-07 |
Dielectric ceramic composition and a multilayer ceramic capacitor and a method of manufacturing a multilayer ceramic capacitor
Grant 5,004,715 - Hakotani , et al. April 2, 1 | 1991-04-02 |
Multilayered ceramic substrates and method for manufacturing the same
Grant 5,004,640 - Nakatani , et al. April 2, 1 | 1991-04-02 |
Copper conductor composition
Grant 4,906,404 - Suehiro , et al. March 6, 1 | 1990-03-06 |
Conductor paste and method of manufacturing a multilayered ceramic body using the paste
Grant 4,863,683 - Nakatani , et al. September 5, 1 | 1989-09-05 |
Method of manufacturing a multilayer ceramic body
Grant 4,795,512 - Nakatani , et al. January 3, 1 | 1989-01-03 |
Conductor paste and method of manufacturing a multilayered ceramic body using the paste
Grant 4,714,570 - Nakatani , et al. December 22, 1 | 1987-12-22 |
Thick film conductor composition
Grant 4,695,403 - Nishimura , et al. September 22, 1 | 1987-09-22 |
Combustible gas detecting element
Grant 4,241,019 - Nakatani , et al. December 23, 1 | 1980-12-23 |
Reducing gas sensor
Grant 4,045,178 - Okinaka , et al. August 30, 1 | 1977-08-30 |
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