| Patent | Date |
|---|
Wiring harness and method of assembling the same
Grant 9,762,040 - Ogawa , et al. September 12, 2 | 2017-09-12 |
Power supply structure for sliding door
Grant 9,637,070 - Ogawa , et al. May 2, 2 | 2017-05-02 |
Power Supply Structure For Sliding Door
App 20160236630 - OGAWA; Tatsuo ; et al. | 2016-08-18 |
Substrate for mounting light-emitting element and light-emitting device
Grant 9,076,714 - Nakatani , et al. July 7, 2 | 2015-07-07 |
Light Emitting Apparatus And Method For Manufacturing Same
App 20150084080 - Kawakita; Koji ; et al. | 2015-03-26 |
Method for manufacturing flexible semiconductor device having gate electrode disposed within an opening of a resin film
Grant 8,895,373 - Suzuki , et al. November 25, 2 | 2014-11-25 |
Method For Manufacturing Flexible Semiconductor Device Having Gate Electrode Disposed Within An Opening Of A Resin Film
App 20140038366 - SUZUKI; Takeshi ; et al. | 2014-02-06 |
Flexible semiconductor device having gate electrode disposed within an opening of a resin film
Grant 8,581,247 - Suzuki , et al. November 12, 2 | 2013-11-12 |
Flexible semiconductor device
Grant 8,525,172 - Hirano , et al. September 3, 2 | 2013-09-03 |
Flexible Semiconductor Device And Method For Manufacturing Same
App 20130168677 - HIRANO; Koichi ; et al. | 2013-07-04 |
Method for manufacturing flexible semiconductor device
Grant 8,435,842 - Hirano , et al. May 7, 2 | 2013-05-07 |
Wire harness and method of installation thereof
Grant 8,410,365 - Ogawa , et al. April 2, 2 | 2013-04-02 |
Wiring Harness And Method Of Assembling The Same
App 20130068522 - Ogawa; Tatsuo ; et al. | 2013-03-21 |
Flexible semiconductor device and method for manufacturing same
Grant 8,343,822 - Hirano , et al. January 1, 2 | 2013-01-01 |
Substrate For Light-emitting Element, Method For Manufacturing The Same And Light-emitting Device
App 20120319159 - Nakatani; Seiichi ; et al. | 2012-12-20 |
Flexible Semiconductor Device And Method For Manufacturing Same
App 20120001173 - Suzuki; Takeshi ; et al. | 2012-01-05 |
Circuit board, method for manufacturing the same, and semiconductor device
Grant 8,063,486 - Hirano , et al. November 22, 2 | 2011-11-22 |
Wire Harness And Method Of Installation Thereof
App 20110061932 - OGAWA; Tatsuo ; et al. | 2011-03-17 |
Flexible Semiconductor Device And Method For Manufacturing Same
App 20100283054 - Hirano; Koichi ; et al. | 2010-11-11 |
Method For Manufacturing Flexible Semiconductor Device
App 20100261321 - Hirano; Koichi ; et al. | 2010-10-14 |
Clip structure and wire-like member fixing method
Grant 7,533,853 - Ogawa May 19, 2 | 2009-05-19 |
Circuit Board, Method For Manufacturing The Same, And Semiconductor Device
App 20070262447 - HIRANO; Koichi ; et al. | 2007-11-15 |
Titanium-Containing Silica Sol and Process for Producing the Same, Antifouling Film and Base Material with Ink-Receptive Layer, and Method for Reproducing Recording Base Material
App 20070249736 - Watanabe; Manabu ; et al. | 2007-10-25 |
Printed wiring board
App 20070137890 - Tagi; Hiroyoshi ; et al. | 2007-06-21 |
Method of manufacturing circuit board
Grant 7,047,629 - Kokufu , et al. May 23, 2 | 2006-05-23 |
Clip structure and wire-like member fixing method
App 20050253026 - Ogawa, Tatsuo | 2005-11-17 |
Grommet-mounting structure and grommet
App 20050047859 - Santanda, Tsutomu ; et al. | 2005-03-03 |
Wiring board and production method thereof
Grant 6,774,316 - Suzuki , et al. August 10, 2 | 2004-08-10 |
Circuit board and its manufacture method
App 20040080918 - Kokufu, Shinobu ; et al. | 2004-04-29 |
Circuit board and its manufacture method
Grant 6,713,688 - Kokufu , et al. March 30, 2 | 2004-03-30 |
Method of producing a circuit board
Grant 6,691,409 - Suzuki , et al. February 17, 2 | 2004-02-17 |
Printed wiring board
App 20040012935 - Tagi, Hiroyoshi ; et al. | 2004-01-22 |
Motor Apparatus and control method therefor
Grant 6,670,784 - Odachi , et al. December 30, 2 | 2003-12-30 |
Circuit board and production of the same
App 20030066683 - Suzuki, Takeshi ; et al. | 2003-04-10 |
Motor apparatus and control method therefor
App 20030011340 - Odachi, Yasuharu ; et al. | 2003-01-16 |
Circuit board and its manufacture method
App 20020131248 - Kokufu, Shinobu ; et al. | 2002-09-19 |
Circuit board and production of the same
App 20020038725 - Suzuki, Takeshi ; et al. | 2002-04-04 |
Electric compressor
App 20010022939 - Morita, Katsuyuki ; et al. | 2001-09-20 |
Connecting member of a circuit substrate and method of manufacturing multilayer circuit substrates by using the same
App 20010003610 - Nakatani, Seiichi ; et al. | 2001-06-14 |
Printed circuit board and method of manufacturing the same
App 20010002294 - Hatakeyama, Akihito ; et al. | 2001-05-31 |
Wire harness protector
Grant 6,229,091 - Ogawa , et al. May 8, 2 | 2001-05-08 |
Printed circuit board and method of manufacturing the same
Grant 6,211,487 - Hatakeyama , et al. April 3, 2 | 2001-04-03 |
Conductive paste for filling via-hole, double-sided and multilayer printed circuit boards using the same, and method for producing the same
Grant 6,139,777 - Omoya , et al. October 31, 2 | 2000-10-31 |
Connecting member of a circuit substrate and method of manufacturing multilayer circuit substrates by using the same
Grant 6,108,903 - Nakatani , et al. August 29, 2 | 2000-08-29 |
Conductive paste composition for via hole filling and printed circuit board using the same
Grant 6,096,411 - Nakatani , et al. August 1, 2 | 2000-08-01 |
Corrugate tube fixing protector
Grant 6,085,795 - Ogawa , et al. July 11, 2 | 2000-07-11 |
Conductive paste compound for via hole filling, printed circuit board which uses the conductive paste, and method of manufacturing the same
Grant 5,977,490 - Kawakita , et al. November 2, 1 | 1999-11-02 |
Printed circuit board and method of manufacturing the same
Grant 5,972,482 - Hatakeyama , et al. October 26, 1 | 1999-10-26 |
Conductive paste compound for via hole filling, printed circuit board which uses the conductive paste, and method of manufacturing the same
Grant 5,914,358 - Kawakita , et al. June 22, 1 | 1999-06-22 |
Conductive paste compound for via hole filling, printed circuit board which uses the conductive paste, and method of manufacturing the same
Grant 5,733,467 - Kawakita , et al. March 31, 1 | 1998-03-31 |
Conductive paste compound for via hole filling, printed circuit board which uses the conductive paste
Grant 5,652,042 - Kawakita , et al. July 29, 1 | 1997-07-29 |
Ladder type filter with adjustable resonator positioning member
Grant 5,572,173 - Ogawa , et al. November 5, 1 | 1996-11-05 |
Method of adjusting a frequency response in a ladder-type electric filter
Grant 5,570,070 - Ogawa , et al. October 29, 1 | 1996-10-29 |
Connecting member of a circuit substrate and method of manufacturing multilayer circuit substrates by using the same
Grant 5,484,647 - Nakatani , et al. January 16, 1 | 1996-01-16 |
Piezoelectric filter in a casing sealed by an insulating filler and having cranked connecting legs
Grant 5,392,012 - Iwata , et al. February 21, 1 | 1995-02-21 |
Ladder-type electric filter device
Grant 5,260,675 - Ogawa , et al. November 9, 1 | 1993-11-09 |
Laser trimable capacitor
Grant 5,159,524 - Hasegawa , et al. October 27, 1 | 1992-10-27 |
Ladder-type piezoelectric filter having higher input and output Qm values
Grant 5,077,544 - Ogawa , et al. December 31, 1 | 1991-12-31 |
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