Subtron Technology Co., Ltd.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Subtron Technology Co., Ltd..The latest application filed is for "substrate structure".
Company Profile
11.93.114
- Subtron Technology Co., Ltd. - Hsinchu County TW
- Subtron Technology Co., Ltd. - Hsinshu County TW
- SUBTRON TECHNOLOGY CO. LTD. - Hsinchu TW
- SUBTRON TECHNOLOGY CO., LTD - Hsin-chu TW
- SUBTRON TECHNOLOGY CO., LTD. - Hsin-Chu TW
Patent Activity
| Patent | Date |
|---|---|
| Substrate Structure App 20220157674 - Lu; Chung Ying | 2022-05-19 |
| Waveguide Structure App 20210384618 - Tarng; Jenn-Hwan ; et al. | 2021-12-09 |
| Heat dissipation substrate and manufacturing method thereof Grant 11,171,072 - Wu , et al. November 9, 2 | 2021-11-09 |
| Optical Waveguide Circuit Substrate And Manufacturing Method Thereof App 20210096298 - Wang; Pei-Wei ; et al. | 2021-04-01 |
| Heat dissipation substrate and fabricating method thereof Grant 10,957,614 - Wu , et al. March 23, 2 | 2021-03-23 |
| Heat Dissipation Substrate And Manufacturing Method Thereof App 20210050276 - Wu; Chien-Hung ; et al. | 2021-02-18 |
| Method of manufacturing a component embedded package carrier Grant 10,798,822 - Yang October 6, 2 | 2020-10-06 |
| Heat Dissipation Substrate And Fabricating Method Thereof App 20200303271 - Wu; Chien-Hung ; et al. | 2020-09-24 |
| Package carrier Grant 10,319,610 - Wang , et al. | 2019-06-11 |
| Manufacturing method of package carrier Grant 10,297,517 - Cheng | 2019-05-21 |
| Manufacturing method of package carrier Grant 10,177,067 - Wang , et al. J | 2019-01-08 |
| Component Embedded Package Carrier And Manufacturing Method Thereof App 20180352658 - Yang; Jing-Cyuan | 2018-12-06 |
| Package substrate and manufacturing method thereof Grant 10,123,413 - Chuang , et al. November 6, 2 | 2018-11-06 |
| Manufacturing method of circuit substrate Grant 9,961,784 - Huang May 1, 2 | 2018-05-01 |
| Package Carrier And Manufacturing Method Thereof App 20180114739 - Wang; Chin-Sheng ; et al. | 2018-04-26 |
| Illumination apparatus Grant 9,933,149 - Tseng , et al. April 3, 2 | 2018-04-03 |
| Package Carrier App 20180090339 - Wang; Chin-Sheng ; et al. | 2018-03-29 |
| Manufacturing method for multi-layer circuit board having cavity Grant 9,883,599 - Wu January 30, 2 | 2018-01-30 |
| Substrate structure for packaging chip Grant 9,883,594 - Huang , et al. January 30, 2 | 2018-01-30 |
| Manufacturing Method Of Package Carrier App 20180025956 - Cheng; Chih-Hsien | 2018-01-25 |
| Package carrier and manufacturing method thereof Grant 9,870,931 - Wang , et al. January 16, 2 | 2018-01-16 |
| Manufacturing Method Of Circuit Substrate App 20170325330 - Wang; Chin-Sheng ; et al. | 2017-11-09 |
| Substrate Structure And Manufacturing Method Thereof App 20170311450 - Huang; Yu-Chi ; et al. | 2017-10-26 |
| Substrate structure Grant 9,761,515 - Wang September 12, 2 | 2017-09-12 |
| Package Substrate And Manufacturing Method Thereof App 20170251552 - Chuang; Chih-Hong ; et al. | 2017-08-31 |
| Substrate Structure App 20170207156 - Wang; Chao-Min | 2017-07-20 |
| Manufacturing Method Of Circuit Substrate App 20170208696 - Huang; Tzu-Wei | 2017-07-20 |
| Package substrate and manufacturing method thereof Grant 9,693,468 - Chuang , et al. June 27, 2 | 2017-06-27 |
| Package carrier and manufacturing method thereof Grant 9,668,351 - Wang May 30, 2 | 2017-05-30 |
| Manufacturing method of circuit substrate Grant 9,655,254 - Huang May 16, 2 | 2017-05-16 |
| Substrate structure and manufacturing method thereof Grant 9,648,760 - Wang May 9, 2 | 2017-05-09 |
| Package Carrier And Manufacturing Method Thereof App 20170086293 - Cheng; Chih-Hsien | 2017-03-23 |
| Manufacturing method of circuit substrate Grant 9,603,263 - Chuang , et al. March 21, 2 | 2017-03-21 |
| Package Carrier And Manufacturing Method Thereof App 20170079128 - Wang; Chin-Sheng ; et al. | 2017-03-16 |
| Circuit board and manufacturing method thereof Grant 9,591,753 - Wang , et al. March 7, 2 | 2017-03-07 |
| Package structure and manufacturing method thereof Grant 9,589,942 - Chen March 7, 2 | 2017-03-07 |
| Package carrier and manufacturing method thereof Grant 9,578,750 - Sun February 21, 2 | 2017-02-21 |
| Circuit Board And Manufacturing Method Thereof App 20170013710 - Wang; Chin-Sheng ; et al. | 2017-01-12 |
| Package Substrate And Manufacturing Method Thereof App 20170006713 - Chuang; Chih-Hong ; et al. | 2017-01-05 |
| Substrate structure and manufacturing method thereof Grant 9,538,647 - Wang January 3, 2 | 2017-01-03 |
| Manufacturing method of package structure Grant 9,532,494 - Sun December 27, 2 | 2016-12-27 |
| Package carrier Grant 9,510,453 - Sun November 29, 2 | 2016-11-29 |
| Manufacturing method of cover structure Grant 9,491,894 - Chen November 8, 2 | 2016-11-08 |
| Package substrate and manufacturing method thereof Grant 9,458,540 - Wang , et al. October 4, 2 | 2016-10-04 |
| Heat Dissipation Plate And Package Structure App 20160282055 - Chen; Ching-Sheng | 2016-09-29 |
| Package carrier Grant 9,433,099 - Wang , et al. August 30, 2 | 2016-08-30 |
| Package structure and manufacturing method thereof Grant 9,418,931 - Chen August 16, 2 | 2016-08-16 |
| Package Substrate And Manufacturing Method Thereof App 20160230286 - Wang; Chin-Sheng ; et al. | 2016-08-11 |
| Illumination Apparatus App 20160209023 - Tseng; Tzyy-Jang ; et al. | 2016-07-21 |
| Package Carrier And Manufacturing Method Thereof App 20160204054 - Wang; Chao-Min | 2016-07-14 |
| Package Carrier App 20160197034 - Sun; Shih-Hao | 2016-07-07 |
| Substrate Structure And Manufacturing Method Thereof App 20160174390 - Wang; Chao-Min | 2016-06-16 |
| Package Structure And Manufacturing Method Thereof App 20160163614 - Chen; Chien-Ming | 2016-06-09 |
| Package Structure And Manufacturing Method Thereof App 20160155702 - Chen; Chien-Ming | 2016-06-02 |
| Package carrier and manufacturing method thereof Grant 9,330,941 - Sun May 3, 2 | 2016-05-03 |
| Substrate structure and manufacturing method thereof Grant 9,313,886 - Wang April 12, 2 | 2016-04-12 |
| Heat Dissipation Module App 20160095256 - Chen; Ching-Sheng | 2016-03-31 |
| Multi-layer Circuit Board Having Cavity And Manufacturing Method Thereof App 20160095231 - Wu; Chien-Hung | 2016-03-31 |
| Core substrate and method for fabricating circuit board Grant 9,282,643 - Wang , et al. March 8, 2 | 2016-03-08 |
| Substrate Structure And Method Of Manuifacturing The Same App 20160050761 - Tseng; Tzyy-Jang ; et al. | 2016-02-18 |
| Cover structure and manufacturing method thereof Grant 9,247,632 - Lee January 26, 2 | 2016-01-26 |
| Package carrier and manufacturing method thereof Grant 9,236,364 - Sun January 12, 2 | 2016-01-12 |
| Manufacturing method of package carrier Grant 9,204,560 - Sun December 1, 2 | 2015-12-01 |
| Circuit board and manufacturing method thereof Grant 9,204,546 - Wang , et al. December 1, 2 | 2015-12-01 |
| Substrate Structure And Manufacturing Method Thereof App 20150342040 - Wang; Chao-Min | 2015-11-26 |
| Substrate Structure And Manufacturing Method Thereof App 20150313007 - Wang; Chao-Min | 2015-10-29 |
| Substrate Structure And Manufacturing Method Thereof App 20150296618 - Huang; Yu-Chi ; et al. | 2015-10-15 |
| Method of manufacturing a package carrier Grant 9,153,521 - Sun October 6, 2 | 2015-10-06 |
| Process of electronic structure and electronic structure Grant 9,137,899 - Ho September 15, 2 | 2015-09-15 |
| Manufacturing method of substrate structure Grant 9,131,635 - Huang September 8, 2 | 2015-09-08 |
| Cover Structure And Manufacturing Method Thereof App 20150216032 - Lee; Ying-Ming | 2015-07-30 |
| Core Substrate And Method For Fabricating Circuit Board App 20150195917 - Wang; Chin-Sheng ; et al. | 2015-07-09 |
| Circuit Board And Manufacturing Method Thereof App 20150163908 - Wang; Chin-Sheng ; et al. | 2015-06-11 |
| Heat Dissipation Substrate App 20150144315 - Chen; Ching-Sheng | 2015-05-28 |
| Manufacturing method of circuit structure Grant 9,041,166 - Chen May 26, 2 | 2015-05-26 |
| Heat Dissipation Device App 20150136364 - Chuang; Chih-Hong | 2015-05-21 |
| Substrate Structure And Manufacturing Method Thereof App 20150114698 - Huang; Tzu-Wei ; et al. | 2015-04-30 |
| Package Carrier And Manufacturing Method Thereof App 20150090481 - Sun; Shih-Hao | 2015-04-02 |
| Package Carrier App 20150092358 - Wang; Chin-Sheng ; et al. | 2015-04-02 |
| Package Carrier And Manufacturing Method Thereof App 20150090476 - Sun; Shih-Hao | 2015-04-02 |
| Manufacturing method of a circuit board structure Grant 8,991,043 - Wang March 31, 2 | 2015-03-31 |
| Manufacturing Method Of Package Carrier App 20150068034 - Sun; Shih-Hao | 2015-03-12 |
| Manufacturing method of substrate structure Grant 8,973,258 - Chen March 10, 2 | 2015-03-10 |
| Edge separation equipment and operating method thereof Grant 8,939,188 - Ho , et al. January 27, 2 | 2015-01-27 |
| Heat Dissipation Plate App 20140345841 - Chen; Ching-Sheng | 2014-11-27 |
| Manufacturing method of package structure Grant 8,893,379 - Sun , et al. November 25, 2 | 2014-11-25 |
| Manufacturing Method Of Package Structure App 20140317907 - Sun; Shih-Hao | 2014-10-30 |
| Package carrier Grant 8,859,908 - Wang , et al. October 14, 2 | 2014-10-14 |
| Manufacturing method of circuit structure Grant 8,853,102 - Chen October 7, 2 | 2014-10-07 |
| Manufacturing Method Of Circuit Structure App 20140295353 - Chen; Ching-Sheng | 2014-10-02 |
| Process of fabricating heat dissipation substrate Grant 8,845,909 - Shen September 30, 2 | 2014-09-30 |
| Manufacturing Method Of Cover Structure App 20140224411 - Chen; Chien-Ming | 2014-08-14 |
| Circuit structure and manufacturing method thereof Grant 8,803,295 - Chen August 12, 2 | 2014-08-12 |
| Method For Bonding Heat-conducting Substrate And Metal Layer App 20140209665 - Chen; Chien-Ming | 2014-07-31 |
| Package carrier Grant 8,766,463 - Sun July 1, 2 | 2014-07-01 |
| Optical Touch Sensing Structure App 20140168163 - Yang; Ming-Huei ; et al. | 2014-06-19 |
| Manufacturing method of package carrier Grant 8,746,308 - Sun June 10, 2 | 2014-06-10 |
| Method for bonding heat-conducting substrate and metal layer Grant 8,740,044 - Chen June 3, 2 | 2014-06-03 |
| Package Carrier App 20140144677 - Wang; Chin-Sheng ; et al. | 2014-05-29 |
| Cover structure and manufacturing method thereof Grant 8,737,081 - Chen May 27, 2 | 2014-05-27 |
| Package carrier and manufacturing method thereof Grant 8,704,101 - Sun April 22, 2 | 2014-04-22 |
| Manufacturing Method Of Substrate Structure App 20140096382 - Huang; Tzu-Wei | 2014-04-10 |
| Method of manufacturing package structure Grant 8,669,142 - Sun March 11, 2 | 2014-03-11 |
| Package Carrier And Manufacturing Method Thereof App 20140041922 - Sun; Shih-Hao | 2014-02-13 |
| Package carrier and manufacturing method thereof Grant 8,624,388 - Sun January 7, 2 | 2014-01-07 |
| Manufacturing Method Of Substrate Structure App 20140000109 - Chen; Ching-Sheng | 2014-01-02 |
| Package Carrier And Manufacturing Method Thereof App 20130329386 - Wang; Chin-Sheng ; et al. | 2013-12-12 |
| Board Separation Apparatus And Operating Method Thereof App 20130319620 - Ho; Chung W. ; et al. | 2013-12-05 |
| Manufacturing Method Of Circuit Structure App 20130323927 - Chen; Ching-Sheng | 2013-12-05 |
| Heat dissipation substrate and manufacturing method thereof Grant 8,587,115 - Sun November 19, 2 | 2013-11-19 |
| Package Carrier App 20130285252 - Sun; Shih-Hao | 2013-10-31 |
| Fabricating method of semiconductor package structure Grant 8,563,363 - Tseng , et al. October 22, 2 | 2013-10-22 |
| Heat Dissipation Substrate And Manufacturing Method Thereof App 20130273388 - Sun; Shih-Hao | 2013-10-17 |
| Package Carrier And Manufacturing Method Thereof App 20130269986 - Sun; Shih-Hao | 2013-10-17 |
| Circuit structure and manufacturing method thereof Grant 8,552,303 - Chen October 8, 2 | 2013-10-08 |
| Method Of Manufacturing Package Structure App 20130260512 - Sun; Shih-Hao | 2013-10-03 |
| Process Of Fabricating Heat Dissipation Substrate App 20130260018 - Shen; Tzu-Shih | 2013-10-03 |
| Package structure and manufacturing method thereof Grant 8,541,881 - Sun September 24, 2 | 2013-09-24 |
| Manufacturing method of package carrier Grant 8,510,936 - Chuang , et al. August 20, 2 | 2013-08-20 |
| Package carrier and manufacturing method thereof Grant 8,513,530 - Sun August 20, 2 | 2013-08-20 |
| Edge Separation Equipment And Operating Method Thereof App 20130206331 - Ho; Chung W. ; et al. | 2013-08-15 |
| Package Carrier And Manufacturing Method Thereof App 20130170148 - Sun; Shih-Hao | 2013-07-04 |
| Manufacturing Method Of Package Carrier App 20130137221 - Sun; Shih-Hao | 2013-05-30 |
| Package carrier and manufacturing method thereof Grant 8,441,121 - Sun May 14, 2 | 2013-05-14 |
| Optical Touch Sensing Structure And Manufacturing Method Thereof App 20130107246 - Yang; Ming-Huei | 2013-05-02 |
| Circuit Board Structure And Manufacturing Method Thereof App 20130092422 - Wang; Chao-Min | 2013-04-18 |
| Package structure Grant 8,420,951 - Sun , et al. April 16, 2 | 2013-04-16 |
| Package carrier and manufacturing method thereof Grant 8,415,780 - Sun April 9, 2 | 2013-04-09 |
| Semiconductor package structure and fabricating method of semiconductor package structure Grant 8,390,013 - Tseng , et al. March 5, 2 | 2013-03-05 |
| Package structure and manufacturing method thereof Grant 8,384,216 - Sun February 26, 2 | 2013-02-26 |
| Structure And Process Of Heat Dissipation Substrate App 20130043016 - Shen; Tzu-Shih | 2013-02-21 |
| Fabricating Method Of Semiconductor Package Structure App 20130011971 - TSENG; TZYY-JANG ; et al. | 2013-01-10 |
| Package Carrier And Package Structure App 20120314369 - Wu; Chien-Nan | 2012-12-13 |
| Package Structure And Manufacturing Method Thereof App 20120292780 - Sun; Shih-Hao | 2012-11-22 |
| Package Structure And Manufacturing Method Thereof App 20120293977 - Sun; Shih-Hao | 2012-11-22 |
| Package Structure And Manufacturing Method Thereof App 20120292762 - Sun; Shih-Hao | 2012-11-22 |
| Cover Structure And Manufacturing Method Thereof App 20120285719 - Chen; Chien-Ming | 2012-11-15 |
| Circuit Structure And Manufacturing Method Thereof App 20120280371 - Chen; Ching-Sheng | 2012-11-08 |
| Package Structure And Manufacturing Method Thereof App 20120279772 - Sun; Shih-Hao ; et al. | 2012-11-08 |
| Package Carrier And Manufacturing Method Thereof App 20120279760 - Sun; Shih-Hao | 2012-11-08 |
| Package Carrier And Method Of Manufacturing The Same App 20120279962 - Sun; Shih-Hao | 2012-11-08 |
| Manufacturing Method Of Circuit Substrate App 20120280022 - Huang; Tzu-Wei | 2012-11-08 |
| Circuit Structure And Manufacturing Method Thereof App 20120282738 - Chen; Ching-Sheng | 2012-11-08 |
| Manufacturing Method Of Circuit Substrate App 20120279630 - Chuang; Chih-Hong ; et al. | 2012-11-08 |
| Process Of Electronic Structure And Electronic Structure App 20120228015 - Ho; Chung W. | 2012-09-13 |
| Package Carrier And Manufacturing Method Thereof App 20120199955 - Sun; Shih-Hao | 2012-08-09 |
| Package Carrier And Manufacturing Method Thereof App 20120181290 - Sun; Shih-Hao | 2012-07-19 |
| Package Carrier App 20120181066 - Chuang; Chih-Hong | 2012-07-19 |
| Package Carrier And Manufacturing Method Thereof App 20120181696 - Sun; Shih-Hao | 2012-07-19 |
| Manufacturing Method Of Thermal Conductivity Substrate App 20120175044 - Wang; Chin-Sheng ; et al. | 2012-07-12 |
| Substrate Structure App 20120088117 - Chuang; Chih-Hong | 2012-04-12 |
| Thermal Conductivity Substrate And Manufacturing Method Thereof App 20120070684 - Wang; Chin-Sheng ; et al. | 2012-03-22 |
| Semiconductor Package Structure And Fabricating Method Of Semiconductor Package Structure App 20120007252 - TSENG; TZYY-JANG ; et al. | 2012-01-12 |
| Circuit Substrate And Manufacturing Method Thereof App 20110253439 - Huang; Tzu-Wei | 2011-10-20 |
| Method Of Making Fine-pitch Circuit Lines App 20110204021 - WU; Chien-Nan ; et al. | 2011-08-25 |
| Circuit Substrate And Manufacturing Method Thereof App 20110154658 - Chuang; Chih-Hong ; et al. | 2011-06-30 |
| Manufacturing Method Of Package Carrier App 20110154657 - Chuang; Chih-Hong ; et al. | 2011-06-30 |
| Laminate For Printed Circuit Board App 20110151273 - WU; Chien-Nan | 2011-06-23 |
| Fabricating process of thermal enhanced substrate Grant 7,838,338 - Shen November 23, 2 | 2010-11-23 |
| Fabricating process and structure of thermal enhanced substrate Grant 7,786,501 - Shen August 31, 2 | 2010-08-31 |
| Fabricating Process Of Thermal Enhanced Substrate App 20100206463 - Shen; Tzu-Shih | 2010-08-19 |
| Process Of Package Substrate App 20090314650 - Tseng; Tzyy-Jang ; et al. | 2009-12-24 |
| Non-cylinder Via Structure And Thermal Enhanced Substrate Having The Same App 20090288859 - Ho; Wen-Cheng ; et al. | 2009-11-26 |
| Fabricating Process For Substrate With Embedded Passive Component App 20090280617 - Cheng; Shih-Lian | 2009-11-12 |
| Inkjet Printing Process For Circuit Board App 20090196979 - Cheng; Shih-Lian ; et al. | 2009-08-06 |
| Fabricating Process Of Circuit Board With Embedded Passive Component App 20090139756 - Lee; Ying-Ming | 2009-06-04 |
| High thermal conducting circuit substrate and manufacturing process thereof Grant 7,540,969 - Ho , et al. June 2, 2 | 2009-06-02 |
| Fabricating Process And Structure Of Thermal Enhanced Substrate App 20080308925 - Shen; Tzu-Shih | 2008-12-18 |
| Fabrication process circuit board with embedded passive component Grant 7,441,329 - Cheng October 28, 2 | 2008-10-28 |
| High Thermal Conducting Circuit Substrate And Manufacturing Process Thereof App 20070126093 - HO; CHUNG W. ; et al. | 2007-06-07 |
| Printed wiring board and method of fabricating the same Grant 7,223,687 - Ho , et al. May 29, 2 | 2007-05-29 |
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