U.S. patent application number 14/153094 was filed with the patent office on 2015-05-28 for heat dissipation substrate.
This patent application is currently assigned to SUBTRON TECHNOLOGY CO., LTD.. The applicant listed for this patent is Ching-Sheng Chen. Invention is credited to Ching-Sheng Chen.
Application Number | 20150144315 14/153094 |
Document ID | / |
Family ID | 52388413 |
Filed Date | 2015-05-28 |
United States Patent
Application |
20150144315 |
Kind Code |
A1 |
Chen; Ching-Sheng |
May 28, 2015 |
HEAT DISSIPATION SUBSTRATE
Abstract
A heat dissipation substrate includes a heat sink, a metal base
and an elastic structure. The heat sink includes a carrying portion
and supporting portions. The supporting portions are parallel to
one another and disposed on a lower surface of the carrying
portion. The supporting portions are perpendicular to the carrying
portion and surround an accommodating space with the carrying
portion. The carrying portion has first rough surface structure
disposed on a portion of the lower surface and located in the
accommodating space. The metal base is disposed below the heat sink
and has an assemble surface and a second rough surface structure
disposed on a portion of the assemble surface and corresponding to
the first rough surface structure. The first and second rough
surface structures and the supporting portions define a fluid
chamber in which the elastic structure is disposed, and a working
fluid flows in the fluid chamber.
Inventors: |
Chen; Ching-Sheng; (Hsinchu
County, TW) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
Chen; Ching-Sheng |
Hsinchu County |
|
TW |
|
|
Assignee: |
SUBTRON TECHNOLOGY CO.,
LTD.
Hsinchu County
TW
|
Family ID: |
52388413 |
Appl. No.: |
14/153094 |
Filed: |
January 13, 2014 |
Current U.S.
Class: |
165/168 |
Current CPC
Class: |
F28F 13/00 20130101;
F28D 15/04 20130101; F28D 15/0233 20130101; F28F 3/02 20130101;
F28F 3/12 20130101; F28F 2255/02 20130101 |
Class at
Publication: |
165/168 |
International
Class: |
F28F 3/12 20060101
F28F003/12 |
Foreign Application Data
Date |
Code |
Application Number |
Nov 27, 2013 |
TW |
102143239 |
Claims
1. A heat dissipation substrate, comprising: a heat sink comprising
a carrying portion and a plurality of supporting portions, the
carrying portion having a carrying surface and a lower surface
opposite to each other, the supporting portions being parallel to
one another and disposed on the lower surface of the carrying
portion, wherein the supporting portions are perpendicular to the
carrying portion and surround an accommodating space with the
carrying portion, the carrying portion has a first rough surface
structure disposed on a portion of the lower surface, and the first
rough surface structure is located in the accommodating space; a
metal base disposed below the heat sink and having an assemble
surface, wherein the metal base has a second rough surface
structure disposed on a portion of the assemble surface and
corresponding to the first rough surface structure, the first rough
surface structure, the second rough surface structure and the
supporting portions define a fluid chamber, and a working fluid
flows in the fluid chamber; and at least one elastic structure
disposed within the fluid chamber.
2. The heat dissipation substrate as recited in claim 1, further
comprising: a plurality of fixing elements disposed between the
metal base and the supporting portions of the heat sink so as to
fix the metal base on the heat sink.
3. The heat dissipation substrate as recited in claim 1, wherein
each of the supporting portions has a first supporting portion and
a second supporting portion, the first supporting portion connects
the lower surface of the heat sink and the second supporting
portion, a thickness of the first supporting portion is greater
than a thickness of the second supporting portion, the metal base
is located in the accommodating space, and edges of the metal base
contact the second supporting portions.
4. The heat dissipation substrate as recited in claim 3, wherein
each of the second supporting portions has a first threaded
portion, a surrounding surface of the metal base has a second
threaded portion, and the first threaded portions and the second
threaded portion cooperatively fix the metal base on the supporting
portions.
5. The heat dissipation substrate as recited in claim 1, wherein
the assemble surface of the metal base contacts an end of each of
the supporting portions that is relatively far away from the
carrying portion.
6. The heat dissipation substrate as recited in claim 1, wherein
the heat sink further comprises a plurality of heat dissipation
fins arranged in parallel with each other, and the heat dissipation
fins are disposed on the supporting portions and located outside of
the accommodating space.
7. The heat dissipation substrate as recited in claim 6, wherein an
extending direction of the heat dissipation fins is the same as an
extending direction of the carrying portion.
8. The heat dissipation substrate as recited in claim 6, wherein an
extending direction of the heat dissipation fins is the same as an
extending direction of the supporting portions.
9. The heat dissipation substrate as recited in claim 6, wherein
each of the heat dissipation fins has at least one heat dissipation
hole, and an extending direction of each of the heat dissipation
holes is perpendicular to an extending direction of each of the
heat dissipation fins.
10. The heat dissipation substrate as recited in claim 1, wherein
the metal base further comprises at least one opening, and the
opening penetrates the metal base and connects with the fluid
chamber.
11. The heat dissipation substrate as recited in claim 1, wherein
the first rough surface structure is a lumpy surface structure, and
a Rymax of the first rough surface structure ranges from several
micrometers to several centimeters.
12. The heat dissipation substrate as recited in claim 1, wherein
the second rough surface structure is a lumpy surface structure,
and a Rymax of the second rough surface structure ranges from
several micrometers to several centimeters.
13. The heat dissipation substrate as recited in claim 1, wherein
the working fluid comprises air or liquid.
14. The heat dissipation substrate as recited in claim 1, wherein
the elastic structure is a spring.
Description
CROSS-REFERENCE TO RELATED APPLICATION
[0001] This application claims the priority benefit of Taiwan
application serial no. 102143239, filed on Nov. 27, 2013. The
entirety of the above-mentioned patent application is hereby
incorporated by reference herein and made a part of this
specification.
BACKGROUND OF THE INVENTION
[0002] 1. Field of the Invention
[0003] The invention relates to a heat dissipation substrate, and
more particularly, to a heat dissipation substrate adapted to carry
at lest one heating element.
[0004] 2. Description of Related Art
[0005] Generally, in order to enhance a heat dissipation effect of
a vapor chamber, additional heat dissipation fins would usually
disposed on the vapor chamber already fixed with a fluid chamber so
as to form a so-called heat dissipation substrate. Since the
overall thickness of the heat dissipation substrate is the sum of
the thickness of the vapor chamber and the thicknesses of the heat
dissipation fins, as compared to the thickness of a single vapor
chamber, the thickness of the heat dissipation substrate is
significantly increased by much, and thus is incompatible with the
trend of slim and light.
SUMMARY OF THE INVENTION
[0006] The invention provides a heat dissipation substrate capable
of solving the problem of causing a thicker overall thickness in
the conventional heat dissipation substrate due to the addition of
heat dissipation fins.
[0007] The heat dissipation substrate of the invention includes a
heat sink, a metal base and at least one elastic structure. The
heat sink includes a carrying portion and a plurality of supporting
portions. The carrying portion has a carrying surface and a lower
surface opposite to each other. The supporting portions are
parallel to one another and disposed on the lower surface of the
carrying portion. The supporting portions are perpendicular to the
carrying portion and surround an accommodating space with the
carrying portion. The carrying portion has a first rough surface
structure disposed on a portion of the lower surface, and the first
rough surface structure is located in the accommodating space. The
metal base is disposed below the heat sink and has an assemble
surface. The metal base has a second rough surface structure
disposed on a portion of the assemble surface and corresponding to
the first rough surface structure. The first rough surface
structure, the second rough surface structure and the supporting
portions define a fluid chamber, and a working fluid flows in the
fluid chamber. The elastic structure is disposed within the fluid
chamber.
[0008] In one embodiment of the invention, the heat dissipation
substrate further includes a plurality of fixing elements disposed
between the metal base and the supporting portions of the heat sink
so as to fix the metal base on the heat sink.
[0009] In one embodiment of the invention, each of the supporting
portions has a first supporting portion and a second supporting
portion. The first supporting portion connects the lower surface of
the heat sink and the second supporting portion. A thickness of the
first supporting portion is greater than a thickness of the second
supporting portion, the metal base is located in the accommodating
space, and edges of the metal base contact the second supporting
portion.
[0010] In one embodiment of the invention, each of the second
supporting portions has a first threaded portion, a surrounding
surface of the metal base has a second threaded portion, and the
first threaded portion and the second threaded portion
cooperatively fix the metal base on the supporting portions.
[0011] In one embodiment of the invention, the assemble surface of
the metal base contacts an end of each of the supporting portions
that is relatively far away from the carrying portion.
[0012] In one embodiment of the invention, the heat sink includes a
plurality of heat dissipation fins arranged in parallel with each
other. The heat dissipation fins are disposed on the supporting
portions and located outside of the accommodating space.
[0013] In one embodiment of the invention, an extending direction
of the heat dissipation fins is the same as an extending direction
of the carrying portion.
[0014] In one embodiment of the invention, an extending direction
of the heat dissipation fins is the same as an extending direction
of the supporting portions.
[0015] In one embodiment of the invention, each of the heat
dissipation fins has at least one heat dissipation hole, and an
extending direction of each of the heat dissipation holes is
perpendicular to an extending direction of each of the heat
dissipation fins.
[0016] In one embodiment of the invention, the metal base further
includes at lease one opening. The opening penetrates the metal
base and connects with the fluid chamber.
[0017] In one embodiment of the invention, the first rough surface
structure is a lumpy surface structure, and a Rymax of the first
rough surface structure ranges from several micrometers to several
centimeters.
[0018] In one embodiment of the invention, the second rough surface
structure is a lumpy surface structure, and a Rymax of the second
rough surface structure ranges from several micrometers to several
centimeters.
[0019] In one embodiment of the invention, the working fluid
includes air or liquid.
[0020] In one embodiment of the invention, the elastic structure is
a spring.
[0021] In view of the foregoing, since the heat dissipation
substrate of the invention is assembled with the heat sink, the
metal base and the elastic structure, as compared to the overall
thickness of a conventional heat dissipation substrate that has
been disposed with additional heat dissipation fins on a vapor
chamber already fixed with a fluid chamber, the heat dissipation
substrate of the invention may have a thinner thickness and may
flexibly adjust the space dimensions of the fluid chamber according
to a location whereby the metal base is assembled to the heat sink,
and thus a heat dissipation effect of the heat dissipation
substrate may be enhanced. In addition, the elastic structure may
also increase a total surface area and a structural strength within
the fluid chamber.
[0022] Several exemplary embodiments accompanied with figures are
described in detail below to further describe the disclosure in
details.
BRIEF DESCRIPTION OF THE DRAWINGS
[0023] The accompanying drawings are included to provide further
understanding, and are incorporated in and constitute a part of
this specification. The drawings illustrate exemplary embodiments
and, together with the description, serve to explain the principles
of the disclosure.
[0024] FIG. 1 is a cross-sectional view schematically illustrating
a heat dissipation substrate according to an embodiment of the
invention.
[0025] FIG. 2 is a cross-sectional view schematically illustrating
a heat dissipation substrate according to another embodiment of the
invention.
[0026] FIG. 3 is a cross-sectional view schematically illustrating
a heat dissipation substrate according to another embodiment of the
invention.
[0027] FIG. 4 is a cross-sectional view schematically illustrating
a heat dissipation substrate according to another embodiment of the
invention.
[0028] FIG. 5 is a cross-sectional view schematically illustrating
a heat dissipation substrate according to another embodiment of the
invention.
[0029] FIG. 6 is a cross-sectional view schematically illustrating
a heat dissipation substrate according to another embodiment of the
invention.
DESCRIPTION OF EMBODIMENTS
[0030] FIG. 1 is a cross-sectional view schematically illustrating
a heat dissipation substrate according to an embodiment of the
invention. Referring to FIG. 1, in the present embodiment, a heat
dissipation substrate 100a includes a heat sink 110a, a metal base
120a and at least one elastic structure 140 (two are schematically
illustrated in FIG. 1). The heat sink 110a includes a carrying
portion 112a and a plurality of supporting portions 114a. The
carrying portion 112a has a carrying surface S1 and a lower surface
S2 opposite to each other. The supporting portions 114a are
parallel to one another and disposed on the lower surface S2 of the
carrying portion 112a. The supporting portions 114a are
perpendicular to the carrying portion 112a and surround an
accommodating space S with the carrying portion 112a. The carrying
portion 112a has a first rough surface structure 116a disposed on a
portion of the lower surface S2, and the first rough surface
structure 116a is located in the accommodating space S. The metal
base 120a is disposed below the heat sink 110a and has an assemble
surface S3. The metal base 120a has a second rough surface
structure 126a disposed on a portion of the assemble surface S3 and
corresponding to the first rough surface structure 116a. The first
rough surface structure 116a, the second rough surface structure
126a and the supporting portions 114a define a fluid chamber C1,
and a working fluid F flows in the fluid chamber C1, and the
elastic structures 140 are disposed within the fluid chamber C.
[0031] More specifically, each of the supporting portions 114a of
the heat sink 110a of the present embodiment has a first supporting
portion 114a1 and a second supporting portion 114a2. The first
supporting portion 114a1 connects the lower surface S2 of the heat
sink 110a and the second supporting portion 114a2. A thickness of
the first supporting portion 114a1 is greater than a thickness of
the second supporting portion 114a2. The lower surface S2 of the
carrying portion 112a surrounds the accommodating space S with the
supporting portions 114a. On the other hand, the first rough
surface structure 116a, the second rough surface structure 126a and
the second supporting portions 114a2 of the supporting portions
114a define the fluid chamber C1. Moreover, the heat sink 110a of
the present embodiment further includes a plurality of heat
dissipation fins 118a, wherein the heat dissipation fins 118a are
arranged in parallel with each other, and the heat dissipation fins
118a are disposed on the supporting portions 114a and outside of
the accommodating space S. As shown in FIG. 1, the heat dissipation
fins 118a are located on the supporting portions 114a, and an
extending direction of the heat dissipation fins 118a is
substantially the same as an extending direction of the carrying
portion 112a; namely, the extending direction of the heat
dissipation fins 118a is perpendicular to an extending direction of
the supporting portions 114a. Cross-sectional areas of the heat
dissipation fins 118a gradually decrease from near the supporting
portions 114a towards a direction far away from the supporting
portions 118a, but not limited thereto. Herein, the carrying
portion 112a, the supporting portions 114a and the heat dissipation
fins 118a of the heat sink 110a of the present embodiment are
seamlessly connected with each other, namely, integrally formed,
but not limited thereto.
[0032] In the present embodiment, a material of the metal base 120a
is selected from copper, aluminum or an alloy of the above, wherein
the metal base 120a is located in the accommodating space S, and
edges of the metal base 120a contact the second supporting portion
114a2 of the supporting portions 114a. Since the metal base 120a is
located in the accommodating space S, the space dimensions of the
accommodating space S of the present embodiment is substantially
greater than the space dimensions of the fluid chamber C1.
Furthermore, the elastic structure 140 of the present embodiment is
substantially a spring, which can effectively increases a total
surface area and a structural strength of the fluid chamber C1. In
addition, in order to enhance an assembly reliability, the heat
dissipation substrate 100a of the present embodiment may further
include a plurality of fixing elements 130, wherein the fixing
elements 130 are disposed between the metal base 120a and the
supporting portions 114a of the heat sink 110a, so as to fix the
metal base 120a on the heat sink 110a. Herein, the fixing elements
130, for example, are screws, nuts, rivets or leak stopping
elements having both a fixing function and an airtight and
watertight function, but not limited thereto; structure designs
achieving the same level of fixing effect are all within the
protection scope of the invention. In brief, the heat dissipation
substrate 100a of the present embodiment is assembled from the heat
sink 110a and the metal base 120a with the fixing elements 130.
[0033] Furthermore, the metal base 120a of the present embodiment
may further have at least one opening H, wherein the opening H
penetrates the metal base 120a and connects with the fluid chamber
C1, so as to extract air from or to inject fluid to the fluid
chamber C1 via the opening H, thereby enhancing an heat dissipation
efficiency of the overall heat dissipation substrate 100a. Herein,
the opening H is able to be inserted with a metal tubule (not
shown) for exhausting air or injecting fluid, so that the fluid
chamber C1 enters a low vacuum state, and afterwards, the inserted
metal tubule is sealed. Herein, the fluid chamber C1 is
substantially as a low vacuum chamber, and the working fluid F, for
example, is air or liquid.
[0034] Particularly, the first rough surface structure 116a of the
carrying portion 112a of the heat sink 110a of the present
embodiment, for example, is a continuous lumpy surface structure or
a discontinuous lumpy surface structure, and a Rymax of the first
rough surface structure 116a ranges from several micrometers to
several centimeters. The first rough surface structure 116a may be
considered as a type of capillary structure. On the other hand, the
second rough surface structure 126a of the metal base 120 of the
present embodiment, for example, is a continuous discontinuous
lumpy surface structure or a discontinuous lumpy surface structure,
and a Rymax of the second rough surface structure 132 ranges from
several micrometers to several centimeters. The second rough
surface structure 126a may be considered as a type of capillary
structure. Herein, the first rough surface structure 116a and the
second rough surface structure 126a, for example, are processed via
machining, such as computer numerical control (CNC) milling
technique, stamping or sandblasting; or chemical processing, such
as electroplating or etching; or physical grinding, but not limited
thereto.
[0035] Since the heat dissipation substrate 100a of the present
embodiment is substantially assembled from the heat sink 110a and
the metal base 120a with the fixing elements 130, as compared to
the overall thickness of a conventional heat dissipation substrate
that has been disposed with additional heat dissipation fins on a
vapor chamber already fixed with a fluid chamber, the heat
dissipation substrate 100a of the present embodiment may have a
thinner thickness and may flexibly adjust the space dimensions of
the fluid chamber C1 according to the location whereby the metal
base 120a is assembled to the heat sink 110a, and thus a heat
dissipation effect of the heat dissipation substrate 100a may be
enhanced. In addition, the heat dissipation substrate 100a of the
present embodiment may increase a total surface area and a
structural strength within the fluid chamber C1 through the design
of the elastic structures 140.
[0036] When a heating element (not shown) is disposed on the
carrying surface S1 of the carrying portion 112a, the working fluid
F with in the fluid chamber C1 absorbs energy E generated by the
heating element and is vaporized in a low vacuum environment. Now,
the working fluid F absorbs the energy E and rapidly expends in
volume, and the vaporized working fluid F soon fills up the entire
fluid chamber C1. A phenomenon of condensation is generated when
the vaporized working fluid F encounters regions with lower
temperature, so that the energy E being absorbed during the
vaporization is released through the phenomenon of condensation.
The condensed liquid working fluid F is returned to the evaporation
location (viz. below the heating element) through capillary actions
of the first rough surface structure 116a and the second rough
surface structure 126a. As such, i.e., through repeating cycling
steps of conduction, evaporation, convection and condensation, the
energy E generated by the heating element may quickly be
transferred to each part of the heat dissipation substrate 100a. In
brief, the heat dissipation substrate 100a of the present
embodiment may be considered as a vapor chamber having a favorable
flat-plate structure with two-phase flow characteristics and may
provide an excellent two-dimensional transverse heat conduction
effect for quickly diffusing the energy E generated by the heating
element, thereby avoiding formations of hot spots at partial
regions and prolonging the serve-life of the heating element.
[0037] Several embodiments are provide in the following below for
describing the structure designs of heat dissipation substrate
100b, 100c and 100d in details. It is to be explained that, the
following embodiments have adopted component notations and part of
the contents from the previous embodiment, wherein the same
notations are used for representing the same or similar components,
and descriptions of the same technical contents are omitted. The
descriptions regarding to the omitted part may be referred to the
previous embodiments, and thus is not repeated herein.
[0038] FIG. 2 is a cross-sectional view schematically illustrating
a heat dissipation substrate according to another embodiment of the
invention. Referring to FIG. 2, the heat dissipation substrate 100b
of the present embodiment is similar to the heat dissipation
substrate 100a of FIG. 1, except that a main difference between the
two lies in: an extending direction of heat dissipation fins 118b
of a heat sink 110b of the present embodiment is the same as the
extending direction of the supporting portions 114a, namely, the
extending direction of the heat dissipation fins 118b is
perpendicular to the extending direction of the carrying portion
112a. As shown in FIG. 2, the heat dissipation fins 118b of the
present embodiment substantially are located on the lower surface
S2 of the carrying portion 112a not being disposed with the first
rough surface structure 116a, and cross-sectional areas of the heat
dissipation fins 118b gradually decrease from near the lower
surface S2 of the carrying portion 112a towards a direction far
away from the lower surface S2 of the carrying portion 112a, but
not limited thereto.
[0039] FIG. 3 is a cross-sectional view schematically illustrating
a heat dissipation substrate according to another embodiment of the
invention. Referring to FIG. 3, the heat dissipation substrate 100c
of the present embodiment is similar to the heat dissipation
substrate 100a of FIG. 1, except that a main difference between the
two lies in: the space dimensions of a fluid chamber C2 are greater
than the space dimensions of the fluid chamber C1 of FIG. 1. In
detail, an assemble surface S3' of a metal base 120c of the present
embodiment contacts an end of each of the supporting portions 114c
of the heat sink 110a that is far away from the carrying portion
112a. Now, the space dimensions of the fluid chamber C2 are roughly
equal to the accommodating space S. Herein, as shown in FIG. 3, the
supporting portions 114c of the present embodiment have a same
thickness.
[0040] FIG. 4 is a cross-sectional view schematically illustrating
a heat dissipation substrate according to another embodiment of the
invention. Referring to FIG. 4, the heat dissipation substrate 100d
of the present embodiment is similar to the heat dissipation
substrate 100c of FIG. 3, except that a main difference between the
two lies in: an extending direction of heat dissipation fins 118d
of a heat sink 110d of the present embodiment is the same as the
extending direction of the supporting portions 114c, namely, the
extending direction of the heat dissipation fins 118d is
perpendicular to extending direction of the carrying portion 112a.
As shown in FIG. 4, the heat dissipation fins 118d of the present
embodiment substantially are located on the lower surface S2 of the
carrying portion 112a not being disposed with the first rough
surface structure 116a, and cross-sectional areas of the heat
dissipation fins 118d gradually decrease from near the lower
surface S2 of the carrying portion 112a towards the direction far
away from the lower surface S2 of the carrying portion 112a, but
not limited thereto.
[0041] FIG. 5 is a cross-sectional view schematically illustrating
a heat dissipation substrate according to another embodiment of the
invention. Referring to FIG. 5, the heat dissipation substrate 100e
of the present embodiment is similar to the heat dissipation
substrate 100a of FIG. 1, except that a main difference between the
two lies in: each of a plurality of second supporting portions
114d2 of supporting portions 114d of the present embodiment has a
first threaded portion 115, a surrounding surface 121 of a metal
base 120e has a second threaded portion 123, and the first threaded
portion 115 and the second threaded portion 123 cooperatively fix
the metal base 120e on the supporting portions 114d. Namely, the
metal base 120e may be fixed on any position on the second
supporting, portion 114d2 via the cooperation between the second
threaded portion 123 and the first threaded portion 115, but it is
not limited to that the metal base 120e must be in contact with a
first supporting portion 114d1. Furthermore, each of a plurality of
heat dissipation fins 118e of a heat sink 110e of the present
embodiment may further include at least one heat dissipation hole
119e, and an extending direction of each of the heat dissipation
holes 119e is perpendicular to an extending direction of each of
the heat dissipation fins 118e, so that a heat dissipation effect
of the heat dissipation substrate 100e may be enhanced. In
addition, a fixing element 130f of the present embodiment
substantially is a leak stopping element having both a fixing
function and an airtight and watertight function, so that the a
reliability of the fluid chamber C1 may be enhanced.
[0042] FIG. 6 is a cross-sectional view schematically illustrating
a heat dissipation substrate according to another embodiment of the
invention. Referring to FIG. 6, the heat dissipation substrate 100f
of the present embodiment is similar to the heat dissipation
substrate 100d of FIG. 4, except that a main difference between the
two lies in: each of a plurality of heat dissipation fins 118f of a
heat sink 110f of the present embodiment may further include at
least one heat dissipation hole 119f, and an extending direction of
each of the heat dissipation holes 119f is perpendicular to an
extending direction of each of the heat dissipation fins 118f, so
that a heat dissipation effect of the heat dissipation substrate
100f may be enhanced.
[0043] In summary, since the heat dissipation substrate of the
invention is assembled with the heat sink and the metal base, as
compared to the overall thickness of the conventional heat
dissipation substrate that has been disposed with additional heat
dissipation fins on the vapor chamber already fixed with the fluid
chamber, the heat dissipation substrate of the invention may have
the thinner thickness and may flexibly adjust the space dimensions
of the fluid chamber according to the location whereby the metal
base is assembled to the heat sink, and thus the heat dissipation
effect of the heat dissipation substrate may be enhanced. In
addition, the elastic structure may also increase the total surface
area and the structural strength within the fluid chamber.
[0044] It will be apparent to those skilled in the art that various
modifications and variations can be made to the structure of the
disclosed embodiments without departing from the scope or spirit of
the disclosure. In view of the foregoing, it is intended that the
disclosure cover modifications and variations of this disclosure
provided they fall within the scope of the following claims and
their equivalents.
* * * * *