U.S. patent application number 14/932974 was filed with the patent office on 2017-03-23 for package carrier and manufacturing method thereof.
The applicant listed for this patent is Subtron Technology Co., Ltd.. Invention is credited to Chih-Hsien Cheng.
Application Number | 20170086293 14/932974 |
Document ID | / |
Family ID | 58283918 |
Filed Date | 2017-03-23 |
United States Patent
Application |
20170086293 |
Kind Code |
A1 |
Cheng; Chih-Hsien |
March 23, 2017 |
PACKAGE CARRIER AND MANUFACTURING METHOD THEREOF
Abstract
A manufacturing method of a package carrier is provided. A
substrate having a through hole is provided, wherein a profile of
the through hole from top view is a first rounded rectangular. A
heat conducting slug is disposed inside the through hole, wherein
the heat conducting slug and an inner wall of the through hole are
separated with a gap, and a profile of the heat conducting slug
from top view is a second rounded rectangular. An insulating
material is filled in the through hole so as to fix the heat
conducting slug in the through hole. A conductive through hole
structure, a first and a second patterned circuit layers are
formed. The first and the second patterned circuit layers are
respectively formed on two opposite sides of the substrate. The
conductive through hole structure penetrates the substrate and
connects portions of the first and the second patterned circuit
layers.
Inventors: |
Cheng; Chih-Hsien; (Hsinchu
County, TW) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
Subtron Technology Co., Ltd. |
Hsinchu County |
|
TW |
|
|
Family ID: |
58283918 |
Appl. No.: |
14/932974 |
Filed: |
November 5, 2015 |
Current U.S.
Class: |
1/1 |
Current CPC
Class: |
H01L 2924/00014
20130101; H01L 2224/48091 20130101; H05K 1/0204 20130101; H05K
3/427 20130101; H01L 23/3677 20130101; H01L 2224/73265 20130101;
H05K 3/022 20130101; H01L 23/13 20130101; H05K 2203/0191 20130101;
H01L 2224/48227 20130101; H01L 23/49822 20130101; H05K 2201/10416
20130101; H01L 2224/48091 20130101 |
International
Class: |
H05K 1/11 20060101
H05K001/11; H05K 3/00 20060101 H05K003/00; H05K 1/02 20060101
H05K001/02 |
Foreign Application Data
Date |
Code |
Application Number |
Sep 18, 2015 |
TW |
104130925 |
Claims
1. A manufacturing method of a package carrier, comprising:
providing a substrate having a through hole, wherein a profile of
the through hole from top view is a first rounded rectangular;
disposing a heat conducting slug inside the through hole of the
substrate, wherein the heat conducting slug and an inner wall of
the through hole are separated with a gap, and a profile of the
heat conducting slug from top view is a second rounded rectangular;
filling the through hole of the substrate with an insulating
material so as to fix the heat conducting slug in the through hole
via the insulating material; and forming a conductive through hole
structure, a first patterned circuit layer and a second patterned
circuit layer, wherein the first patterned circuit layer and the
second patterned circuit layer are respectively formed on two
opposite sides of the substrate and expose a portion of the
substrate, the conductive through hole structure penetrates the
substrate and connects a portion of the first patterned circuit
layer and a portion of the second patterned circuit layer.
2. The manufacturing method of the package carrier as recited in
claim 1, wherein a radius of a curvature of the first rounded
rectangular is greater than or equal to 1 times of the gap.
3. The manufacturing method of the package carrier as recited in
claim 1, wherein the heat conducting slug is formed by a
punch-pressing process, and a radius of a curvature of the second
rounded rectangular is from 50 micrometers to 500 micrometers.
4. The manufacturing method of the package carrier as recited in
claim 1, wherein a radius of a curvature of the first rounded
rectangular is from 100 micrometers to 500 micrometers.
5. The manufacturing method of the package carrier as recited in
claim 1, further comprising: performing a grinding process to
remove a portion of the substrate, a portion of the insulating
material, and a portion of the heat conducting slug after filling
the through hole of the substrate with the insulating material and
before forming the conductive through hole structure, the first
patterned circuit layer, and the second patterned circuit layer, so
that a top surface and a bottom surface opposite to each other of
the heat conducting slug are substantially coplanar with a first
surface and a second surface opposite to each other of the
insulating material respectively, and substantially coplanar with
an upper surface and a lower surface opposite to each other of the
substrate respectively.
6. The manufacturing method of the package carrier as recited in
claim 5, wherein steps forming the conductive through hole
structure, the first patterned circuit layer and the second
patterned circuit layer comprise: forming a first metal layer and a
second metal layer, wherein the first metal layer covers the upper
surface of the substrate, the first surface of the insulating
material, and the top surface of the heat conducting slug, and the
second metal layer covers the lower surface of the substrate, the
second surface of the insulating material, and the bottom surface
of the heat conducting slug; forming a passing hole, penetrating
through the first metal layer, the substrate, and the second metal
layer; forming a seed layer on the first metal layer, an inner wall
of the passing hole, and the second metal layer; filling the
passing hole with a filling material to form the conductive through
hole structure, wherein the seed layer is located between the
filling material and the inner wall of the passing hole, and a
third surface and a fourth surface opposite to each other of the
filling material are substantially coplanar with a fifth surface
and a sixth surface opposite to each other of the seed layer
respectively; forming a third metal layer and a fourth metal layer,
wherein the third metal layer covers the fifth surface of the seed
layer and the third surface of the filling material, and the fourth
metal layer covers the sixth surface of the seed layer and the
fourth surface of the filling material; and performing a patterning
process to pattern the third metal layer, the seed layer, and the
first metal layer so as to form the first patterned circuit layer,
and to pattern the fourth metal layer, the seed layer, and the
second metal layer so as to form the second patterned circuit
layer.
7. The manufacturing method of the package carrier as recited in
claim 1, further comprising: forming a first solder mask layer and
a second solder mask layer after forming the conductive through
hole structure, the first patterned circuit layer, and the second
patterned circuit layer, wherein the first solder mask layer is
disposed on the first patterned circuit layer and exposes a portion
of the first patterned circuit layer, and the second solder mask
layer is disposed on the second patterned circuit layer and exposes
a portion of the second patterned circuit layer; and forming a
first surface treatment layer and a second surface treatment layer,
wherein the first surface treatment layer is disposed on the first
patterned circuit layer exposed by the first solder mask layer, and
the second surface treatment layer is disposed on the second
patterned circuit layer exposed by the second solder mask
layer.
8. A package carrier, comprising: a substrate, having a through
hole, wherein a profile of the through hole from top view is a
first rounded rectangular; a heat conducting slug, disposed inside
the through hole of the substrate, wherein the heat conducting slug
and an inner wall of the through hole are separated with a gap, and
a profile of the heat conducting slug from top view is a second
rounded rectangular; an insulating material, disposed inside the
through hole of the substrate so as to fix the heat conducting slug
in the through hole via the insulating material; a first patterned
circuit layer, disposed on one side of the substrate; a second
patterned circuit layer, disposed on another side of the substrate;
and a conductive through hole structure, penetrating the substrate
and connecting a portion of the first patterned circuit layer and a
portion of the second patterned circuit layer.
9. The package carrier as recited in claim 8, wherein a radius of a
curvature of the first rounded rectangular is greater than or equal
to 1 times of the gap.
10. The package carrier as recited in claim 8, wherein the heat
conducting slug is formed by a punch-pressing process, and a radius
of a curvature of the second rounded rectangular is from 50
micrometers to 500 micrometers.
11. The package carrier as recited in claim 8, wherein a radius of
a curvature of the first rounded rectangular is from 100
micrometers to 500 micrometers.
12. The package carrier as recited in claim 8, wherein a top
surface and a bottom surface opposite to each other of the heat
conducting slug are substantially coplanar with a first surface and
a second surface opposite to each other of the insulating material
respectively, and substantially coplanar with an upper surface and
a lower surface opposite to each other of the substrate
respectively.
13. The package carrier as recited in claim 8, further comprising:
a first solder mask layer, disposed on the first patterned circuit
layer and exposes a portion of the first patterned circuit layer;
and a second solder mask layer, disposed on the second patterned
circuit layer and exposes a portion of the second patterned circuit
layer.
14. The package carrier as recited in claim 13, further comprising:
a first surface treatment layer, disposed on the first patterned
circuit layer exposed by the first solder mask layer; and a second
surface treatment layer, disposed on the second patterned circuit
layer exposed by the second solder mask layer.
Description
CROSS-REFERENCE TO RELATED APPLICATION
[0001] This application claims the priority benefit of Taiwan
application serial no. 104130925, filed on Sep. 18, 2015. The
entirety of the above-mentioned patent application is hereby
incorporated by reference herein and made a part of this
specification.
BACKGROUND OF THE INVENTION
[0002] Field of the Invention
[0003] The present invention relates to a package structure and a
method for manufacturing the same, and particularly relates to a
package carrier and a method for manufacturing the same.
[0004] Description of Related Art
[0005] In general, the heat conducting slug is embedded inside the
package carrier in order to effectively enhance the heat conducting
effect of the package carrier. Herein, the hole used to embed the
heat conducting slug of the package carrier is manufactured by
mechanical routing process or laser routing process, and therefore
the profile of the hole from top view is easily formed as a rounded
rectangular. The heat conducting slug is manufactured by etching
process and laser cutting process, and therefore the profile of the
heat conducting slug from top view is a right angle rectangular.
Hence, stress is concentrated at the sharp corner of the heat
conducting slug or the sharp corner of the heat conducting slug
leans against the rounded corner of the hole so that the heat
conducting slug cannot be positioned inside the hole. Furthermore,
the production process of the heat conducting slug is also long
because of etching process, and simultaneously the disadvantage
that the cutting quality is inconsistent is generated because of
laser cutting process. In addition, when the heat conducting slug
is embedded inside the package carrier, in order to prevent the
hole used to embed the heat conducting slug of the package carrier
from interfering with the heat conducting slug, the gap between the
hole and the heat conducting slug needs being greater than 200
micrometers, so as to affect the circuit layout of the package
carrier. Therefore, how to narrow the gap between the hole and the
heat conducting slug and to increase the density of the circuit
layout is an urgent issue that needs being solved.
SUMMARY OF THE INVENTION
[0006] The invention provides a package carrier having a higher
density circuit layout and a better structural reliability.
[0007] The invention also provides a manufacturing method of the
package carrier, which is adapted to manufacture the
above-mentioned package carrier.
[0008] The invention provides the manufacturing method of the
package carrier, which includes following steps. A substrate having
a through hole is provided, wherein a profile of the through hole
from top view is a first rounded rectangular. A heat conducting
slug is disposed inside the through hole of the substrate, wherein
the heat conducting slug and an inner wall of the through hole are
separated with a gap, and a profile of the heat conducting slug
from top view is a second rounded rectangular. The through hole of
the substrate is filled with an insulating material so as to fix
the heat conducting slug in the through hole via the insulating
material. A conductive through hole structure, a first patterned
circuit layer and a second patterned circuit layer are for' red.
The first patterned circuit layer and the second patterned circuit
layer are respectively formed on two opposite sides of the
substrate and expose a portion of the substrate. The conductive
through hole structure penetrates the substrate and connects a
portion of the first patterned circuit layer and a portion of the
second patterned circuit layer.
[0009] In one embodiment of the invention, a radius of a curvature
of the first rounded rectangular is greater than or equal to 1
times of the gap.
[0010] In one embodiment of the invention, the heat conducting slug
is formed by a punch-pressing process, and a radius of a curvature
of a rounded corner of the second rounded rectangular is from 50
micrometers to 500 micrometers.
[0011] In one embodiment of the invention, the radius of the
curvature of the first rounded rectangular is from 100 micrometers
to 500 micrometers.
[0012] In one embodiment of the invention, the manufacturing method
of the package carrier further comprises: a grinding process is
performed to remove a portion of the substrate, a portion of the
insulating material, and a portion of the heat conducting slug
after filling the through hole of the substrate with the insulating
material and before forming the conductive through hole structure,
the first patterned circuit layer, and the second patterned circuit
layer, so that a top surface and a bottom surface opposite to each
other of the heat conducting slug are substantially coplanar with a
first surface and a second surface opposite to each other of the
insulating material respectively, and substantially coplanar with
an upper surface and a lower surface opposite to each other of the
substrate respectively.
[0013] In one embodiment of the invention, the steps forming the
conductive through hole structure, the first patterned circuit
layer, and the second patterned circuit layer comprise: a first
metal layer and a second metal layer are formed, wherein the first
metal layer covers the upper surface of the substrate, the first
surface of the insulating material, and the top surface of the heat
conducting slug, and the second metal layer covers the lower
surface of the substrate, the second surface of the insulating
material, and the bottom surface of the heat conducting slug. A
passing hole is formed, which penetrates through the first metal
layer, the substrate, and the second metal layer. Forming a seed
layer on the first metal layer, an inner wall of the passing hole,
and the second metal layer. The passing hole is filled with a
filling material to form the conductive through hole structure,
wherein the seed layer is located between the filling material and
the inner wall of the passing hole, and a third surface and a
fourth surface opposite to each other of the filling material are
substantially coplanar with a fifth surface and a sixth surface
opposite to each other of the seed layer respectively. A third
metal layer and a fourth metal layer are formed, wherein the third
metal layer covers the fifth surface of the seed layer and the
third surface of the filling material, and the fourth metal layer
covers the sixth surface of the seed layer and the fourth surface
of the filling material. A patterning process is performed to
pattern the third metal layer, the seed layer, and the first metal
layer so as to form the first patterned circuit layer, and to
pattern the fourth metal layer, the seed layer, and the second
metal layer so as to form the second patterned circuit layer.
[0014] In one embodiment of the invention, the manufacturing method
of the package carrier further comprises: a first solder mask layer
and a second solder mask layer are formed after forming the
conductive through hole structure, the first patterned circuit
layer, and the second patterned circuit layer. The first solder
mask layer is disposed on the first patterned circuit layer and
exposes a portion of the first patterned circuit layer, and the
second solder mask layer is disposed on the second patterned
circuit layer and exposes a portion of the second patterned circuit
layer. A first surface treatment layer and a second surface
treatment layer are formed. The first surface treatment layer is
disposed on the first patterned circuit layer exposed by the first
solder mask layer, and the second surface treatment layer is
disposed on the second patterned circuit layer exposed by the
second solder mask layer.
[0015] The package carrier of the invention includes a substrate, a
heat conducting slug, an insulating material, a first patterned
circuit layer, a second patterned circuit layer, and a conductive
through hole structure. The substrate has a through hole, wherein a
profile of the through hole from top view is a first rounded
rectangular. The heat conducting slug is disposed inside the
through hole of the substrate, wherein the heat conducting slug and
an inner wall of the through hole are separated with a gap, and a
profile of the heat conducting slug from top view is a second
rounded rectangular. The insulating material is disposed inside the
through hole of the substrate so as to fix the heat conducting slug
in the through hole via the insulating material. The first
patterned circuit layer is disposed on one side of the substrate.
The second patterned circuit layer is disposed on another side of
the substrate. The conductive through hole structure penetrates the
substrate and connects a portion of the first patterned circuit
layer and a portion of the second patterned circuit layer.
[0016] In one embodiment of the invention, a radius of a curvature
of the first rounded rectangular is greater than or equal to 1
times of the gap.
[0017] In one embodiment of the invention, the heat conducting slug
is formed by a punch-pressing process, and a radius of a curvature
of a rounded corner of the second rounded rectangular is from 50
micrometers to 500 micrometers.
[0018] In one embodiment of the invention, the radius of the
curvature of the first rounded rectangular is from 100 micrometers
to 500 micrometers.
[0019] In one embodiment of the invention, a top surface and a
bottom surface opposite to each other of the heat conducting slug
are substantially coplanar with a first surface and a second
surface opposite to each other of the insulating material
respectively, and substantially coplanar with an upper surface and
a lower surface opposite to each other of the substrate
respectively.
[0020] In an embodiment of the invention, the package carrier
further includes a first solder mask layer and a second solder mask
layer. The first solder mask layer is disposed on the first
patterned circuit layer and exposes a portion of the first
patterned circuit layer. The second solder mask layer is disposed
on the second patterned circuit layer and exposes a portion of the
second patterned circuit layer.
[0021] In an embodiment of the invention, the package carrier
further includes a first surface treatment layer and a second
surface treatment layer. The first surface treatment layer is
disposed on the first patterned circuit layer exposed by the first
solder mask layer. The second surface treatment layer is disposed
on the second patterned circuit layer exposed by the second solder
mask layer.
[0022] Based on the above, the profile of the heat conducting slug
of the invention from top view is the rounded rectangular, so as to
prevent the problem that stress concentration is generated at the
corners of the heat conducting slug, and to improve the structural
reliability of the package carrier. In addition, the profiles of
the heat conducting slug and the through hole of the substrate from
top view are the same (the rounded rectangular), and therefore the
heat conducting slug does not generate structural interference when
positioning inside the through hole of the substrate, so that the
heat conducting slug can be accurately positioned inside the
through hole to improve the structural reliability of the package
carrier.
[0023] In order to make the aforementioned and other features and
advantages of the invention more comprehensible, embodiments
accompanying figures are described in detail belows.
BRIEF DESCRIPTION OF THE DRAWINGS
[0024] The accompanying drawings are included to provide further
understanding, and are incorporated in and constitute a part of
this specification. The drawings illustrate exemplary embodiments
and, together with the description, serve to explain the principles
of the invention.
[0025] FIG. 1A to FIG. 1M are cross-sectional schematic views
depicting a manufacturing method of a package carrier of one
embodiment of the invention.
[0026] FIG. 2 is a partial schematic top view depicting a heat
conducting element disposed inside a through hole of a substrate
corresponding to FIG. 1D.
[0027] FIG. 3 is a partial schematic top view depicting an
insulating material disposed inside a through hole of a substrate
corresponding to FIG. 1E.
[0028] FIG. 4 is a cross-sectional schematic view depicting the
package carrier carrying a heat generating element corresponding to
FIG. 1M.
DESCRIPTION OF THE EMBODIMENTS
[0029] FIG. 1A to FIG. 1M are cross-sectional schematic views
depicting a manufacturing method of a package carrier of one
embodiment of the invention. FIG. 2 is a partial schematic top view
depicting a heat conducting element disposed inside a through hole
of a substrate corresponding to FIG. 1D. FIG. 3 is a partial
schematic top view depicting an insulating material disposed inside
a through hole of a substrate corresponding to FIG. 1E. According
to the manufacturing method of the package carrier, firstly,
referring to FIG. 1A, providing a substrate 110'. The substrate
110' of the present embodiment can be, for example, a single layer
circuit board, a double layer circuit board, or a multi-layer
circuit board. Herein, as shown in FIG. 1A, the substrate 110' is a
double layer circuit board which is constructed by a dielectric
layer 112 and circuit layers 114', 116' located at two opposite
sides of the dielectric layer 112, but the invention is not limited
thereto.
[0030] Subsequently, referring to the FIG. 1B and FIG. 2
simultaneously, forming a through hole 118 which penetrates through
the dielectric layer 112 and the circuit layers 114', 116' of the
substrate 110', wherein a profile of the through hole 118 from top
view is a first rounded rectangular 118a. Herein, the method for
forming the through hole 118 is, for example, punching, routing,
mechanical drilling, laser drilling, or other appropriate methods,
which are not limited by the invention. The radius of the curvature
of the first rounded rectangular 118a is, for example, greater than
or equal to 1 times of the gap L, or the radius of the curvature
can be, for example, from 1.5 times to 15 times of the gap L, but
the invention is not limited thereto. Preferably, the radius of the
curvature of the first rounded rectangular 118a is from 100
micrometers to 500 micrometers. The gap L is, for example, from 50
micrometers to 500 micrometers. The above-mentioned scope is used
for description and the invention is not limited thereto.
[0031] Subsequently, referring to FIG. 1C, an adhesive layer AD is
disposed on one side of the substrate 110', wherein the adhesive
layer AD and the through hole 118 of the substrate 110' define an
accommodating space S. It should be noted here, the adhesive layer
AD is only adhered to one side of the substrate 110' temporarily to
serve as a supporting element for a subsequent heat conducting
element 120'.
[0032] Subsequently, referring to FIG. 1D and FIG. 2, disposing a
heat conducting slug 120' inside the through hole 118 of the
substrate 110' and in the accommodating space S, wherein a gap L is
in between the heat conducting slug 120' and the inner wall of the
through hole 118, and a profile of the heat conducting slug 120'
from top view is a second rounded rectangular 120a. The heat
conducting slug 120' of the present embodiment is formed by a
punch-pressing process, and therefore the peripheral corners of the
heat conducting slug 120' are all rounded corners, so as to prevent
the conventional problem that stress concentration is generated at
the right angle corners of the heat conducting slug. After that,
the heat conducting slug 120' in the present embodiment is formed
by the punch-pressing process, therefore, the production is at a
fast rate and the process stability is high, so as to prevent the
product quality from being varied, and to improve the product
yield. Preferably, the radius of the curvature of the rounded
corner of the second rounded rectangular 120a is from 50
micrometers to 500 micrometers, herein, the material of the heat
conducting slug 120' is, for example, metal such as copper, copper
alloys, aluminum, aluminum alloys, titanium, titanium alloys, etc.,
but it is not limited thereto.
[0033] Subsequently, filling the through hole 118 of the substrate
110' with an insulating material (not shown) so as to fix the heat
conducting slug 120' in the through hole 118 of the substrate 110'
via the insulating material. At this time, the heights of the
thickness of the insulating material and the thickness of the heat
conducting slug 120' are all higher than the surface of the circuit
layer 114', and the accommodating space S is filled up with the
insulating material and the heat conducting slug 120'. Herein, the
method for filling the through hole 118 of the substrate 110' with
the insulating material is, for example, vacuum screen printing,
but not be limited thereto.
[0034] In addition, the material of the insulating material is, for
example, resin or glue, but not be limited thereto. Subsequently,
removing the adhesive layer AD (referring to FIG. 1D), so as to
expose the heat conducting slug 120' and the circuit layer 116'.
Herein, the method for removing the adhesive layer AD is a
mechanical stripping method.
[0035] Subsequently, Referring to the FIG. 1E, FIG. 1F, and FIG. 3
simultaneously, in order to have a better surface flatness, a
grinding process is performed to remove a portion of the substrate
110', a portion of the insulating material, and a portion of the
heat conducting slug 120', so as to form the insulating material
130, the heat conducting slug 120, and the substrate 110 having the
circuit layers 114, 116, and the dielectric layer 112. At this
time, a top surface 122 and a bottom surface 124 opposite to each
other of the heat conducting slug 120 are substantially coplanar
with a first surface 132 and a second surface 134 opposite to each
other of the insulating material 130 respectively, and
substantially coplanar with an upper surface 111 and a lower
surface 113 opposite to each other of the substrate 110
respectively.
[0036] Subsequently, referring to FIG. 1F, forming a first metal
layer 142 and a second metal layer 144, wherein the first metal
layer 142 covers the upper surface 111 of the substrate 110, the
first surface 132 of the insulating material 130, and the top
surface 122 of the heat conducting slug 120, and the second metal
layer 144 covers the lower surface 113 of the substrate 110, the
second surface 134 of the insulating material 130, and the bottom
surface 124 of the heat conducting slug 120. Herein, the material
of the first metal layer 142 and the second metal layer 144 is, for
example, copper, copper alloys, aluminum, aluminum alloys,
titanium, titanium alloys, etc., but it is not limited thereto.
[0037] Subsequently, referring to FIG. 1G, forming a passing hole
H, wherein the passing hole H penetrates through the first metal
layer 142, the substrate 110, and the second metal layer 144.
Herein, the method for forming the passing hole H is, for example,
punching, routing, mechanical drilling, laser drilling, or other
appropriate methods, which are not limited by the invention.
[0038] Subsequently, referring to FIG. 1H, forming a seed layer 150
on the first metal layer 142, an inner wall of the passing hole H,
and the second metal layer 144. Herein, the material of the seed
layer 150 is, for example, copper, or conductive materials such as
conducting polymer, which are not limited by the invention.
[0039] Subsequently, referring to FIG. 1I, filling the passing hole
H with a filling material 155 to form a conductive through hole
structure T. At this time, the seed layer 150 is located between
the filling material 155 and the inner wall of the through hole
118, and a third surface 157 and a fourth surface 159 opposite to
each other of the filling material 155 are substantially coplanar
with a fifth surface 152 and a sixth surface 154 opposite to each
other of the seed layer 150 respectively. In addition, the
conductive through hole structure T is constructed by the seed
layer 150 and the filling material 155. Herein, the material of the
filling material 155 is, for example, resin or glue.
[0040] Subsequently, referring to FIG. 1J, &liming a third
metal layer 162 and a fourth metal layer 164, wherein the third
metal layer 162 covers the fifth surface 152 of the seed layer 150
and the third surface 157 of the filling material 155, and the
fourth metal layer 164 covers the sixth surface 154 of the seed
layer 150 and the fourth surface 159 of the filling material 155.
Herein, the material of the third metal layer 162 and the fourth
metal layer 164 is, for example, copper, etc.
[0041] Subsequently, referring to FIG. 1K, performing a patterning
process to pattern the third metal layer 162, the seed layer 150,
the first metal layer 142 and a portion of the substrate 110 (the
circuit layer 114) so as to form the first patterned circuit layer
172, and to pattern the fourth metal layer 164, the seed layer 150,
the second metal layer 144, and a portion of the substrate 110 (the
circuit layer 116) so as to form the second patterned circuit layer
174. At this time, as shown in FIG. 1K, the first patterned circuit
layer 172 and the second patterned circuit layer 174 are
respectively formed on two opposite sides of the substrate 110 and
expose a portion of the substrate 110, and the conductive through
hole structure T penetrates the substrate 110 and connects a
portion of the first patterned circuit layer 172 and a portion of
the second patterned circuit layer 174.
[0042] After that, referring to FIG. 1L, optionally forming a first
solder mask layer 182 and a second solder mask layer 184, wherein
the first solder mask layer 182 is disposed on the first patterned
circuit layer 172 and exposes a portion of the first patterned
circuit layer 172, and the second solder mask layer 184 is disposed
on the second patterned circuit layer 174 and exposes a portion of
the second patterned circuit layer 174.
[0043] After that, referring to FIG. 1M, in order to maintain the
structural properties of the exposed first patterned circuit layer
172 and the exposed second patterned circuit layer 174, forming a
first surface treatment layer 192 and a second surface treatment
layer 194, wherein the first surface treatment layer 192 is
disposed on the first patterned circuit layer 172 exposed by the
first solder mask layer 182, and the second surface treatment layer
194 is disposed on the second patterned circuit layer 174 exposed
by the second solder mask layer 184. The material of the first
surface treatment layer 192 and the second surface treatment layer
194 in the present embodiment is, for example, nickel, palladium,
gold, or alloys of the said materials, so as to prevent the first
patterned circuit layer 172 and the second patterned circuit layer
174 from being oxidized or being subject to the external
contamination. So far, the package carrier 100 is completely
manufactured.
[0044] In above structure, referring to FIG. 1M, the package
carrier 100 of the present embodiment includes the substrate 110,
the heat conducting slug 120, the insulating material 130, the
first patterned circuit layer 172, the second patterned circuit
layer 174, and the conductive through hole structure T. The
substrate 110 has a through hole 118, wherein a profile of the
through hole 118 from top view is a first rounded rectangular 118a
(as shown in FIG. 2), preferably, the radius of the curvature of
the rounded corner of the first rounded rectangular 118a is from
100 micrometers to 500 micrometers. The heat conducting slug 120 is
disposed inside the through hole 118 of the substrate 110, wherein
the heat conducting slug 120 and the inner wall of the through hole
118 are separated with a gap L (referring to FIG. 2), and the
profile of the heat conducting slug 120 from top view is a second
rounded rectangular 120a. In one embodiment of the invention, the
radius of the curvature of the first rounded rectangular 118 is
greater than or equal to 1 times of the gap L. Preferably, the heat
conducting slug 120 is formed by a punch-pressing process, and the
radius of the curvature of the second rounded rectangular 120a is
from 50 micrometers to 500 micrometers. The insulating material 130
is disposed inside the through hole 118 of the substrate 110 so as
to fix the heat conducting slug 120 in the through hole 118 via the
insulating material 130. At this time, the top surface 122 and the
bottom surface 124 opposite to each other of the heat conducting
slug 120 are substantially coplanar with the first surface 132 and
the second surface 134 opposite to each other of the insulating
material 130 respectively, and substantially coplanar with the
upper surface 111 and the lower surface 113 opposite to each other
of the substrate 110 respectively. The first patterned circuit
layer 172 is disposed on one side of the substrate 110, and the
second patterned circuit layer 174 is disposed on another side of
the substrate 110. The conductive through hole structure T
penetrates the substrate 110 and connects a portion of the first
patterned circuit layer 172 and a portion of the second patterned
circuit layer 174.
[0045] In addition, the package carrier 100 in the present
embodiment can optionally include the first solder mask layer 182,
the second solder mask layer 184, the first surface treatment layer
192, and the second surface treatment layer 194. The first solder
mask layer 182 is disposed on the first patterned circuit layer 172
and exposes a portion of the first patterned circuit layer 172, and
the second solder mask layer 184 is disposed on the second
patterned circuit layer 174 and exposes a portion of the second
patterned circuit layer 174. The first surface treatment layer 192
is disposed on the first patterned circuit layer 172 exposed by the
first solder mask layer 182, and the second surface treatment layer
194 is disposed on the second patterned circuit layer 174 exposed
by the second solder mask layer 184.
[0046] The profile of the heat conducting slug 120 of the present
embodiment from top view is the rounded rectangular, so as to
prevent the problem that stress concentration is generated at the
corners of the heat conducting slug 120, and to improve the
structural reliability of the package carrier 100. Furthermore, the
profiles of the heat conducting slug 120 and the through hole 118
of the substrate 110 from top view are the same (the rounded
rectangular), and therefore the heat conducting slug 120 does not
generate structural interference when positioning inside the
through hole 118 of the substrate 110, so that the heat conducting
slug can be accurately positioned inside the through hole, so as to
improve the structural reliability of the package carrier 100.
Otherwise, in the subsequent application, referring to FIG. 4, a
heat generating element 200 can be disposed on the package carrier
100 and correspondingly configured above the heat conducting slug
120, and the heat generating element 200 is electrically connected
to the package carrier 100 by using a joining or a wire bonding
method, such as bonding a plurality of wires 210. As a result, the
heat generated by the heat generating element 200 transfers rapidly
and directly from the first surface treatment layer 192, the first
patterned circuit layer 172, the heat conducting slug 120, the
second patterned circuit layer 174, and the second surface
treatment layer 194 to the external environment, so that the
package carrier 100 in the present embodiment can have a better
heat conducting effect.
[0047] In summary, the profile of the heat conducting slug of the
invention from top view is the rounded rectangular, so as to
prevent the problem that stress concentration is generated at the
corners of the heat conducting slug, and to improve the structural
reliability of the package carrier. In addition, the profiles of
the heat conducting slug and the through hole of the substrate from
top view are the same (the rounded rectangular), and therefore the
structural interference that the heat conducting slug cannot be
positioned inside the through hole is not generated when the heat
conducting slug is positioned inside the through hole of the
substrate, so that the heat conducting slug can be accurately
positioned inside the through hole to improve the structural
reliability and the product yield of the package carrier.
[0048] Although the present invention has been described with
reference to the above embodiments, it will be apparent to one of
the ordinary skill in the art that modifications to the described
embodiments may be made without departing from the spirit of the
invention. Accordingly, the scope of the invention is defined by
the attached claims not by the above detailed descriptions.
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