loadpatents
Patent applications and USPTO patent grants for Ozawa; Isao.The latest application filed is for "semiconductor device with sealed semiconductor chip".
Patent | Date |
---|---|
Semiconductor device with sealed semiconductor chip Grant 11,424,176 - Ozawa August 23, 2 | 2022-08-23 |
Semiconductor Device With Sealed Semiconductor Chip App 20220044987 - OZAWA; Isao | 2022-02-10 |
Semiconductor Device With Sealed Semiconductor Chip App 20210074609 - OZAWA; Isao | 2021-03-11 |
Semiconductor device with sealed semiconductor chip Grant 10,872,844 - Ozawa December 22, 2 | 2020-12-22 |
Semiconductor device and semiconductor package including plural solder ball sets each corresponding to a pair of differential input and differential output signals Grant 10,566,274 - Ozawa , et al. Feb | 2020-02-18 |
Semiconductor Device With Sealed Semiconductor Chip App 20190295928 - OZAWA; Isao | 2019-09-26 |
Semiconductor device package having an oscillator and an apparatus having the same Grant 10,409,338 - Matsumoto , et al. Sept | 2019-09-10 |
Semiconductor device with sealed semiconductor chip Grant 10,366,942 - Ozawa July 30, 2 | 2019-07-30 |
Semiconductor package Grant 10,297,571 - Ozawa | 2019-05-21 |
Semiconductor device Grant 10,204,661 - Matsumoto , et al. Feb | 2019-02-12 |
Semiconductor Device And Semiconductor Package App 20180315695 - OZAWA; Isao ;   et al. | 2018-11-01 |
Semiconductor device and semiconductor package Grant 10,090,235 - Ozawa , et al. October 2, 2 | 2018-10-02 |
Data storage device with nonvolatile memory Grant 9,911,502 - Nagai , et al. March 6, 2 | 2018-03-06 |
Water Treatment Method And Water Treatment Device App 20170203239 - OZAWA; Isao ;   et al. | 2017-07-20 |
Data storage device including nonvolatile memory in which on/off state of power source voltage is controlled Grant 9,704,593 - Nagai , et al. July 11, 2 | 2017-07-11 |
Ballast water treatment system for ship Grant 9,688,376 - Ueyama , et al. June 27, 2 | 2017-06-27 |
Substrate for an electronic circuit Grant D778,850 - Matsumoto , et al. February 14, 2 | 2017-02-14 |
Substrate for an electronic circuit Grant D778,852 - Matsumoto , et al. February 14, 2 | 2017-02-14 |
Substrate for an electronic circuit Grant D778,851 - Matsumoto , et al. February 14, 2 | 2017-02-14 |
Semiconductor Device Package Having An Oscillator And An Apparatus Having The Same App 20170010639 - MATSUMOTO; Manabu ;   et al. | 2017-01-12 |
Semiconductor device having a sealing layer covering a semiconductor memory unit and a memory controller Grant 9,543,271 - Matsumoto , et al. January 10, 2 | 2017-01-10 |
Semiconductor Device Having A Sealing Layer Covering A Semiconductor Memory Unit And A Memory Controller App 20160268229 - MATSUMOTO; Manabu ;   et al. | 2016-09-15 |
Substrate for an electronic circuit Grant D764,424 - Matsumoto , et al. August 23, 2 | 2016-08-23 |
Data Storage Device App 20160125950 - NAGAI; Koichi ;   et al. | 2016-05-05 |
Filtering Device, Ballast Water Treatment Method, And Ballast Water Treatment Apparatus Using The Same App 20160114269 - KANAZAWA; Shinichi ;   et al. | 2016-04-28 |
Semiconductor device and semiconductor package having a plurality of differential signal balls Grant 9,275,947 - Ozawa , et al. March 1, 2 | 2016-03-01 |
Memory Module And Video Camera App 20150380062 - Nagahara; Yasuyuki ;   et al. | 2015-12-31 |
Semiconductor Device App 20150380061 - MATSUMOTO; Manabu ;   et al. | 2015-12-31 |
Ballast Water Treatment Apparatus And Reverse Cleaning Method For Ballast Water Treatment Apparatus App 20150336651 - HARADA; Ryoji ;   et al. | 2015-11-26 |
Memory module and video camera Grant 9,173,293 - Nagahara , et al. October 27, 2 | 2015-10-27 |
Semiconductor module including first and second wiring portions separated from each other Grant 9,087,831 - Ozawa July 21, 2 | 2015-07-21 |
Semiconductor Package And Electronic Apparatus App 20150200008 - OZAWA; Isao ;   et al. | 2015-07-16 |
Semiconductor Device With Sealed Semiconductor Chip App 20150155225 - OZAWA; Isao | 2015-06-04 |
Substrate for an electronic circuit Grant D730,304 - Matsumoto , et al. May 26, 2 | 2015-05-26 |
Semiconductor Device And Semiconductor Package App 20150137363 - OZAWA; Isao ;   et al. | 2015-05-21 |
Semiconductor Device And Semiconductor Package App 20150130059 - OZAWA; Isao ;   et al. | 2015-05-14 |
Semiconductor Package App 20150069632 - OZAWA; Isao | 2015-03-12 |
Semiconductor device with sealed semiconductor chip Grant 8,970,019 - Ozawa March 3, 2 | 2015-03-03 |
Ballast Water Treatment System For Ship App 20140175021 - Ueyama; Munetsugu ;   et al. | 2014-06-26 |
Ballast Water Treatment Apparatus And Ballast Water Treatment Method App 20130319953 - Ozawa; Isao ;   et al. | 2013-12-05 |
Semiconductor Module App 20130187272 - OZAWA; Isao | 2013-07-25 |
Portion of a substrate for an electronic circuit Grant D673,922 - Moriai , et al. January 8, 2 | 2013-01-08 |
Portion of a substrate for an electronic circuit Grant D673,921 - Ozawa January 8, 2 | 2013-01-08 |
Semiconductor Device App 20120326338 - EGUCHI; Toyokazu ;   et al. | 2012-12-27 |
Memory Module And Video Camera App 20120210049 - NAGAHARA; Yasuyuki ;   et al. | 2012-08-16 |
Memory system Grant 8,131,912 - Ozawa , et al. March 6, 2 | 2012-03-06 |
Semiconductor Device With Sealed Semiconductor Chip App 20110133323 - OZAWA; Isao | 2011-06-09 |
Semiconductor device with sealed semiconductor chip Grant 7,919,837 - Ozawa April 5, 2 | 2011-04-05 |
Semiconductor Device App 20100007014 - Suzuki; Hidetoshi ;   et al. | 2010-01-14 |
Memory System App 20090089490 - OZAWA; Isao ;   et al. | 2009-04-02 |
Semiconductor memory card Grant 7,495,329 - Ohta , et al. February 24, 2 | 2009-02-24 |
Semiconductor Device And Method For Manufacturing Same App 20090026630 - OZAWA; Isao ;   et al. | 2009-01-29 |
Semiconductor device in which semiconductor chip is mounted on lead frame Grant 7,339,257 - Ozawa , et al. March 4, 2 | 2008-03-04 |
Semiconductor Memory Card App 20070170567 - Ohta; Yohichi ;   et al. | 2007-07-26 |
Semiconductor device with sealed semiconductor chip App 20060255436 - Ozawa; Isao | 2006-11-16 |
Lead frame for semiconductor device App 20060145329 - Ozawa; Isao | 2006-07-06 |
Wiring board and a packaging assembly using the same Grant 6,995,320 - Kusakabe , et al. February 7, 2 | 2006-02-07 |
Semiconductor device in which semiconductor chip is mounted on lead frame App 20050236698 - Ozawa, Isao ;   et al. | 2005-10-27 |
Chip mounting substrate, first level assembly, and second level assembly App 20050006747 - Watanabe, Shinya ;   et al. | 2005-01-13 |
Chip mounting substrate, first level assembly, and second level assembly Grant 6,791,193 - Watanabe , et al. September 14, 2 | 2004-09-14 |
Wiring board and a packaging assembly using the same App 20040104465 - Kusakabe, Takeshi ;   et al. | 2004-06-03 |
Chip mounting substrate, first level assembly, and second level assembly App 20040046262 - Watanabe, Shinya ;   et al. | 2004-03-11 |
Semiconductor device Grant D473,198 - Ozawa , et al. April 15, 2 | 2003-04-15 |
Semiconductor module in which plural semiconductor chips are enclosed in one package App 20020130404 - Ushijima, Toshihiro ;   et al. | 2002-09-19 |
Cup dispenser Grant 4,925,058 - Ozawa May 15, 1 | 1990-05-15 |
Elastically damping device for suspension of engine Grant 4,583,723 - Ozawa April 22, 1 | 1986-04-22 |
Elastically damping device for the suspension of an engine Grant 4,492,366 - Ozawa , et al. January 8, 1 | 1985-01-08 |
Halo-salicylanilide Grant 4,310,682 - Ozawa , et al. January 12, 1 | 1982-01-12 |
Packaging container Grant D257,555 - Ikushima , et al. November 25, 1 | 1980-11-25 |
Packaging container Grant D256,557 - Ikushima , et al. August 26, 1 | 1980-08-26 |
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