LIN; Tzu-Hung
Patent Applications and Registrations
Patent applications and USPTO patent grants for LIN; Tzu-Hung.The latest application filed is for "semiconductor package structure".
Company Profile
45.87.127
- LIN; Tzu-Hung - Hsinchu City TW
- Lin; Tzu-Hung - Hsin-Chu TW
- Lin; Tzu-Hung - Zhubei TW
- Lin; Tzu-Hung - Hsinchu TW
- LIN; Tzu-Hung - Zhubei City TW
- Lin; Tzu-Hung - Hsinchu County TW
- - Zhubei TW
- LIN; Tzu Hung - Taipei City TW
- Lin; Tzu Hung - Taipei TW
Patent Activity
| Patent | Date |
|---|---|
| Semiconductor Package Structure App 20220310498 - LIN; Tzu-Hung ; et al. | 2022-09-29 |
| Chip scale package structure and method of forming the same Grant 11,450,606 - Chi , et al. September 20, 2 | 2022-09-20 |
| Semiconductor Package Structure App 20220278055 - Lin; Tzu-Hung ; et al. | 2022-09-01 |
| Semiconductor package structure Grant 11,410,936 - Lin , et al. August 9, 2 | 2022-08-09 |
| Semiconductor package structure Grant 11,387,176 - Lin , et al. July 12, 2 | 2022-07-12 |
| Semiconductor package structure Grant 11,362,044 - Lin , et al. June 14, 2 | 2022-06-14 |
| Innovative Air Gap For Antenna Fan Out Package App 20220173497 - Liu; Nai-Wei ; et al. | 2022-06-02 |
| Package structure Grant 11,348,900 - Lin , et al. May 31, 2 | 2022-05-31 |
| Semiconductor Package Structure App 20220139848 - CHANG; Chia-Cheng ; et al. | 2022-05-05 |
| Semiconductor package structure Grant 11,264,337 - Chang , et al. March 1, 2 | 2022-03-01 |
| Semiconductor Package Structure Having An Annular Frame With Truncated Corners App 20220020726 - CHANG; Chia-Cheng ; et al. | 2022-01-20 |
| Semiconductor package structure having an annular frame with truncated corners Grant 11,171,113 - Chang , et al. November 9, 2 | 2021-11-09 |
| Semiconductor Package Structure With Antenna App 20210327835 - Liu; Nai-Wei ; et al. | 2021-10-21 |
| Flip chip package utilizing trace bump trace interconnection Grant 11,121,108 - Lin , et al. September 14, 2 | 2021-09-14 |
| Fan-out Package Structure With Integrated Antenna App 20210273317 - Liu; Nai-Wei ; et al. | 2021-09-02 |
| Semiconductor package structure with antenna Grant 11,081,453 - Liu , et al. August 3, 2 | 2021-08-03 |
| Fan-out package structure with integrated antenna Grant 11,043,730 - Liu , et al. June 22, 2 | 2021-06-22 |
| Semiconductor Package Including Lid Structure With Opening And Recess App 20210175137 - CHANG; Chia-Cheng ; et al. | 2021-06-10 |
| Semiconductor package with antenna and fabrication method thereof Grant 11,024,954 - Liu , et al. June 1, 2 | 2021-06-01 |
| Semiconductor package including lid structure with opening and recess Grant 10,957,611 - Chang , et al. March 23, 2 | 2021-03-23 |
| Semiconductor Package Structure Including Antenna App 20210035930 - CHI; Yen-Yao ; et al. | 2021-02-04 |
| Semiconductor package assembly and method for forming the same Grant 10,903,198 - Chang , et al. January 26, 2 | 2021-01-26 |
| Semiconductor Package Structure App 20200365526 - LIN; Tzu-Hung ; et al. | 2020-11-19 |
| Chip Scale Package Structure And Method Of Forming The Same App 20200312732 - CHI; Yen-Yao ; et al. | 2020-10-01 |
| Package Structure App 20200303352 - Lin; Tzu-Hung ; et al. | 2020-09-24 |
| Semiconductor package structure Grant 10,784,211 - Lin , et al. Sept | 2020-09-22 |
| Flip Chip Package Utilizing Trace Bump Trace Interconnection App 20200294948 - Lin; Tzu-Hung ; et al. | 2020-09-17 |
| Semiconductor Package Structure App 20200273812 - LIN; Tzu-Hung ; et al. | 2020-08-27 |
| Package structure Grant 10,727,202 - Lin , et al. | 2020-07-28 |
| Flip chip package utilizing trace bump trace interconnection Grant 10,707,183 - Lin , et al. | 2020-07-07 |
| Semiconductor Package Structure App 20200211944 - LIN; Tzu-Hung ; et al. | 2020-07-02 |
| Stacked fan-out package structure Grant 10,692,789 - Liu , et al. | 2020-06-23 |
| Semiconductor Package And Method For Fabricating Base For Semiconductor Package App 20200176408 - Lin; Tzu-Hung ; et al. | 2020-06-04 |
| Method for NAT traversal in VPN Grant 10,673,813 - Hang , et al. | 2020-06-02 |
| Semiconductor Package Assembly Having A Conductive Electromagnetic Shield Layer App 20200168572 - Lin; Tzu-Hung ; et al. | 2020-05-28 |
| Semiconductor Package Structure App 20200105684 - CHANG; Chia-Cheng ; et al. | 2020-04-02 |
| Chip Scale Package Structure And Method Of Forming The Same App 20200091070 - Chi; Yen-Yao ; et al. | 2020-03-19 |
| Semiconductor Package Assembly And Method For Forming The Same App 20200075572 - CHANG; Chia-Cheng ; et al. | 2020-03-05 |
| Semiconductor package and method for fabricating base for semiconductor package Grant 10,580,747 - Lin , et al. | 2020-03-03 |
| Semiconductor package and method for fabricating base for semiconductor package Grant 10,573,615 - Lin , et al. Feb | 2020-02-25 |
| Semiconductor package and method for fabricating base for semiconductor package Grant 10,573,616 - Lin , et al. Feb | 2020-02-25 |
| Semiconductor package Grant 10,553,526 - Hsu , et al. Fe | 2020-02-04 |
| Semiconductor Package Structure With Antenna App 20200013735 - Liu; Nai-Wei ; et al. | 2020-01-09 |
| Semiconductor Package Structure Having An Annular Frame With Truncated Corners App 20200006289 - Chang; Chia-Cheng ; et al. | 2020-01-02 |
| Semiconductor package assembly and method for forming the same Grant 10,497,689 - Chang , et al. De | 2019-12-03 |
| Fan-out package structure and method for forming the same Grant 10483211 - | 2019-11-19 |
| Semiconductor Package With Antenna And Fabrication Method Thereof App 20190348756 - Liu; Nai-Wei ; et al. | 2019-11-14 |
| Fan-out Package Structure With Integrated Antenna App 20190348748 - Liu; Nai-Wei ; et al. | 2019-11-14 |
| Innovative Air Gap For Antenna Fan Out Package App 20190348747 - Liu; Nai-Wei ; et al. | 2019-11-14 |
| Semiconductor package assembly Grant 10,468,341 - Liu , et al. No | 2019-11-05 |
| Structure and formation method of chip package structure Grant 10,431,564 - Lin O | 2019-10-01 |
| Flip Chip Package Utilizing Trace Bump Trace Interconnection App 20190295980 - Lin; Tzu-Hung ; et al. | 2019-09-26 |
| Semiconductor package assembly and method for forming the same Grant 10,424,563 - Lin , et al. Sept | 2019-09-24 |
| Semiconductor package assembly Grant 10,410,969 - Lin , et al. Sept | 2019-09-10 |
| Semiconductor Package Structure Having An Antenna Pattern Electrically Coupled To A First Redistribution Layer (rdl) App 20190252351 - Lin; Tzu-Hung ; et al. | 2019-08-15 |
| Method For Nat Traversal In Vpn App 20190238503 - HANG; Hsueh Ming ; et al. | 2019-08-01 |
| Semiconductor package assemblies with system-on-chip (SOC) packages Grant 10,361,173 - Lin , et al. | 2019-07-23 |
| Flip chip package utilizing trace bump trace interconnection Grant 10,354,970 - Lin , et al. July 16, 2 | 2019-07-16 |
| Semiconductor package assembly Grant 10,332,830 - Yang , et al. | 2019-06-25 |
| Semiconductor Package Assembly App 20190131233 - LIU; Nai-Wei ; et al. | 2019-05-02 |
| Semiconductor package structure and method for forming the same Grant 10256210 - | 2019-04-09 |
| Semiconductor package assembly with embedded IPD Grant 10,217,724 - Lin , et al. Feb | 2019-02-26 |
| Semiconductor package with improved bandwidth Grant 10,217,723 - Lin , et al. Feb | 2019-02-26 |
| Semiconductor Package Assembly And Method For Forming The Same App 20190043848 - CHANG; Chia-Cheng ; et al. | 2019-02-07 |
| Semiconductor Package Including Lid Structure With Opening And Recess App 20190043771 - CHANG; Chia-Cheng ; et al. | 2019-02-07 |
| Semiconductor package assembly Grant 10,199,318 - Liu , et al. Fe | 2019-02-05 |
| Semiconductor package assembly Grant 10,177,125 - Lin , et al. J | 2019-01-08 |
| Stacked Fan-out Package Structure App 20180323127 - Liu; Nai-Wei ; et al. | 2018-11-08 |
| Semiconductor package Grant 10,109,566 - Fang , et al. October 23, 2 | 2018-10-23 |
| Semiconductor package Grant 10,109,608 - Lin , et al. October 23, 2 | 2018-10-23 |
| Method For Householder Of Mansion To Manage Entrance By Smart Phone App 20180286159 - HWANG; Shaw Hwa ; et al. | 2018-10-04 |
| Treatment Method For Doorbell Communication App 20180288373 - HWANG; Shaw Hwa ; et al. | 2018-10-04 |
| Semiconductor structure Grant 10,090,375 - Lin , et al. October 2, 2 | 2018-10-02 |
| Method for householder of mansion to manage entrance by smart phone Grant 10,089,805 - Hwang , et al. October 2, 2 | 2018-10-02 |
| Semiconductor Package Structure App 20180269164 - LIN; Tzu-Hung ; et al. | 2018-09-20 |
| Semiconductor chip package assembly with improved heat dissipation performance Grant 10,079,192 - Hsiao , et al. September 18, 2 | 2018-09-18 |
| Semiconductor Package Assembly App 20180233452 - LIN; Tzu-Hung ; et al. | 2018-08-16 |
| Semiconductor package assembly with facing active surfaces of first and second semiconductor die and method for forming the same Grant 10,032,756 - Lin , et al. July 24, 2 | 2018-07-24 |
| Semiconductor package assembly Grant 9,997,498 - Lin , et al. June 12, 2 | 2018-06-12 |
| Semiconductor package assembly Grant 9,978,729 - Lin , et al. May 22, 2 | 2018-05-22 |
| Semiconductor package assembly with through silicon via interconnect Grant 9,947,624 - Yang , et al. April 17, 2 | 2018-04-17 |
| Semiconductor Package With Improved Bandwidth App 20180102343 - Lin; Tzu-Hung ; et al. | 2018-04-12 |
| Fan-out package structure having embedded package substrate Grant 9,941,260 - Lin , et al. April 10, 2 | 2018-04-10 |
| Semiconductor package structure and method for forming the same Grant 9,899,261 - Hung , et al. February 20, 2 | 2018-02-20 |
| Semiconductor Package Structure And Method For Forming The Same App 20170373038 - LIN; Tzu-Hung ; et al. | 2017-12-28 |
| Semiconductor Package Assembly App 20170338175 - LIU; Nai-Wei ; et al. | 2017-11-23 |
| Method Of Preventing Pry For Random Access Memory App 20170316218 - HWANG; Shaw Hwa ; et al. | 2017-11-02 |
| Monitor For Dynamic Displaying App 20170316663 - HWANG; Shaw Hwa ; et al. | 2017-11-02 |
| Semiconductor package structure and method for forming the same Grant 9,786,632 - Lin , et al. October 10, 2 | 2017-10-10 |
| Semiconductor package structure having first and second guard ring regions of different conductivity types and method for forming the same Grant 9,786,560 - Hung , et al. October 10, 2 | 2017-10-10 |
| Semiconductor Package Assembly App 20170287877 - LIN; Tzu-Hung ; et al. | 2017-10-05 |
| Registration method for managing NAT shutdown Grant 9,781,171 - Hwang , et al. October 3, 2 | 2017-10-03 |
| Semiconductor Package Assembly App 20170278832 - LIN; Tzu-Hung ; et al. | 2017-09-28 |
| Semiconductor Package Assembly App 20170250165 - YANG; Ming-Tzong ; et al. | 2017-08-31 |
| Fan-out Package Structure And Method For Forming The Same App 20170243826 - LIN; Tzu-Hung ; et al. | 2017-08-24 |
| Semiconductor Package App 20170243814 - Fang; Jia-Wei ; et al. | 2017-08-24 |
| Method Of Searching For Multimedia Image App 20170228399 - HWANG; Shaw Hwa ; et al. | 2017-08-10 |
| Semiconductor package assembly Grant 9,711,488 - Lin , et al. July 18, 2 | 2017-07-18 |
| Semiconductor package assembly Grant 9,704,836 - Lin , et al. July 11, 2 | 2017-07-11 |
| Semiconductor Package App 20170186676 - HSU; Wen-Sung ; et al. | 2017-06-29 |
| Semiconductor Structure App 20170179055 - LIN; Tzu-Hung ; et al. | 2017-06-22 |
| Semiconductor package assembly Grant 9,679,842 - Yang , et al. June 13, 2 | 2017-06-13 |
| Semiconductor package Grant 9,679,830 - Fang , et al. June 13, 2 | 2017-06-13 |
| Microelectronic package with surface mounted passive element Grant 9,660,017 - Yeh , et al. May 23, 2 | 2017-05-23 |
| Semiconductor package Grant 9,659,893 - Lin , et al. May 23, 2 | 2017-05-23 |
| Semiconductor Package Assembly App 20170141041 - LIN; Tzu-Hung ; et al. | 2017-05-18 |
| Semiconductor package with trace covered by solder resist Grant 9,640,505 - Lin , et al. May 2, 2 | 2017-05-02 |
| Semiconductor package Grant 9,633,936 - Hsu , et al. April 25, 2 | 2017-04-25 |
| Semiconductor Package Assembly With Through Silicon Via Interconnect App 20170110406 - YANG; Ming-Tzong ; et al. | 2017-04-20 |
| Semiconductor structure Grant 9,620,580 - Lin , et al. April 11, 2 | 2017-04-11 |
| Semiconductor Package Structure And Method For Forming The Same App 20170098628 - LIU; Nai-Wei ; et al. | 2017-04-06 |
| Fan-out Wafer Level Package Structure App 20170098589 - LIU; Nai-Wei ; et al. | 2017-04-06 |
| Stacked Fan-out Package Structure App 20170098629 - LIU; Nai-Wei ; et al. | 2017-04-06 |
| Method of image conversion operation for panorama dynamic IP camera Grant 9,609,211 - Hwang , et al. March 28, 2 | 2017-03-28 |
| Chip package Grant 9,607,951 - Ko , et al. March 28, 2 | 2017-03-28 |
| Semiconductor Package Structure And Method For Forming The Same App 20170084525 - HUNG; Cheng-Chou ; et al. | 2017-03-23 |
| Semiconductor Package Structure And Method For Forming The Same App 20170084488 - HUNG; Cheng-Chou ; et al. | 2017-03-23 |
| Semiconductor Package Assemblies With System-on-chip (soc) Packages App 20170084583 - LIN; Tzu-Hung ; et al. | 2017-03-23 |
| Fan-out Package Structure Having Embedded Package Substrate App 20170077073 - LIN; Tzu-Hung ; et al. | 2017-03-16 |
| Package Structure App 20170062388 - Lin; Tzu-Hung ; et al. | 2017-03-02 |
| Structure And Layout Of Ball Grid Array Packages App 20170053884 - Lin; Tzu-Hung ; et al. | 2017-02-23 |
| Semiconductor package assembly with through silicon via interconnect Grant 9,570,399 - Yang , et al. February 14, 2 | 2017-02-14 |
| Fan-out Package Structure Including Antenna App 20170040266 - LIN; Tzu-Hung ; et al. | 2017-02-09 |
| Semiconductor Package Structure And Method For Forming The Same App 20170033079 - LIN; Tzu-Hung ; et al. | 2017-02-02 |
| Semiconductor package Grant 9,553,040 - Hsu , et al. January 24, 2 | 2017-01-24 |
| Semiconductor package Grant 9,548,271 - Chan , et al. January 17, 2 | 2017-01-17 |
| Semiconductor package assemblies with system-on-chip (SOC) packages Grant 9,548,289 - Lin , et al. January 17, 2 | 2017-01-17 |
| Semiconductor package structure and method for forming the same Grant 9,543,232 - Hung , et al. January 10, 2 | 2017-01-10 |
| Interactive And Multimedia Medical Report System And Method Thereof App 20170004288 - LIN; Tzu-Hung ; et al. | 2017-01-05 |
| Package structure Grant 9,524,948 - Lin , et al. December 20, 2 | 2016-12-20 |
| Semiconductor package Grant 9,520,349 - Hsu , et al. December 13, 2 | 2016-12-13 |
| Semiconductor Package Assembly And Method For Forming The Same App 20160343694 - LIN; Tzu-Hung ; et al. | 2016-11-24 |
| Semiconductor Package Assembly And Method For Forming The Same App 20160343695 - LIN; Tzu-Hung ; et al. | 2016-11-24 |
| Semiconductor Package Assembly And Method For Forming The Same App 20160343685 - LIN; Tzu-Hung ; et al. | 2016-11-24 |
| Semiconductor Chip Package Assembly With Improved Heat Dissipation Performance App 20160329262 - Hsiao; Ching-Wen ; et al. | 2016-11-10 |
| Fan-out Package Structure Including Antenna App 20160329299 - LIN; Tzu-Hung ; et al. | 2016-11-10 |
| Algorithm For Dtmf Detection App 20160323455 - HWANG; Shaw Hwa ; et al. | 2016-11-03 |
| Semiconductor Package And Method For Fabricating Base For Semiconductor Package App 20160307861 - Lin; Tzu-Hung ; et al. | 2016-10-20 |
| Semiconductor Package App 20160307863 - Lin; Tzu-Hung ; et al. | 2016-10-20 |
| Semiconductor Package Assembly With Embedded Ipd App 20160293581 - LIN; Tzu-Hung ; et al. | 2016-10-06 |
| Method Of Image Conversion Operation For Panorama Dynamic Ip Camera App 20160286123 - HWANG; Shaw Hwa ; et al. | 2016-09-29 |
| Semiconductor Package Assembly App 20160276324 - LIN; Tzu-Hung ; et al. | 2016-09-22 |
| Semiconductor Package Assembly App 20160268234 - LIN; Tzu-Hung ; et al. | 2016-09-15 |
| Semiconductor Package Assembly App 20160260693 - Lin; Tzu-Hung ; et al. | 2016-09-08 |
| Enhanced flip chip structure using copper column interconnect Grant 9,437,534 - Gregorich , et al. September 6, 2 | 2016-09-06 |
| Integrated circuit package structure Grant 9,437,512 - Gregorich , et al. September 6, 2 | 2016-09-06 |
| Microelectronic Package With Surface Mounted Passive Element App 20160211318 - Yeh; Chao-Yang ; et al. | 2016-07-21 |
| Semiconductor Package Structure And Method For Forming The Same App 20160211194 - HUNG; Cheng-Chou ; et al. | 2016-07-21 |
| Cloud-based Medical Information Retrieval Method And System Thereof App 20160180048 - LIN; Tzu-Hung ; et al. | 2016-06-23 |
| Semiconductor Package Assembly With Through Silicon Via Interconnect App 20160181201 - YANG; Ming-Tzong ; et al. | 2016-06-23 |
| Semiconductor Package App 20160126161 - Fang; Jia-Wei ; et al. | 2016-05-05 |
| Registration Method For Managing Nat Shutdown App 20160127425 - HWANG; Shaw Hwa ; et al. | 2016-05-05 |
| Semiconductor Package App 20160111358 - HSU; Wen-Sung ; et al. | 2016-04-21 |
| Semiconductor Package Assembly App 20160099231 - YANG; Ming-Tzong ; et al. | 2016-04-07 |
| Semiconductor Package Assembly App 20160079205 - LIN; Tzu-Hung ; et al. | 2016-03-17 |
| Semiconductor Package Assembly App 20160079220 - LIN; Tzu-Hung ; et al. | 2016-03-17 |
| Semiconductor Package App 20160056105 - CHAN; Kuei-Ti ; et al. | 2016-02-25 |
| Toning Control Method Of Wifi Device Setting By Smart Device App 20160043895 - HWANG; Shaw Hwa ; et al. | 2016-02-11 |
| Semiconductor Package App 20150357291 - LIN; Tzu-Hung ; et al. | 2015-12-10 |
| Semiconductor package Grant 9,209,148 - Chan , et al. December 8, 2 | 2015-12-08 |
| AUTHENTICATION METHOD OF VoLTE App 20150350899 - HWANG; Shaw Hwa ; et al. | 2015-12-03 |
| Semiconductor Package App 20150348932 - LIN; Tzu-Hung ; et al. | 2015-12-03 |
| Semiconductor package and method for fabricating base for semiconductor package Grant 9,177,899 - Lin , et al. November 3, 2 | 2015-11-03 |
| Method Of Transmitting By Relay Server For Advanced Domain Name System App 20150281174 - HWANG; Shaw Hwa ; et al. | 2015-10-01 |
| Semiconductor package with solder resist capped trace to prevent underfill delamination Grant 9,142,526 - Lin , et al. September 22, 2 | 2015-09-22 |
| Enhanced Flip Chip Structure Using Copper Column Interconnect App 20150249060 - Gregorich; Thomas Matthew ; et al. | 2015-09-03 |
| Bilateral Firewall Traversal Method For Advanced Domain Name System App 20150229607 - HWANG; Shaw Hwa ; et al. | 2015-08-13 |
| Structure And Formation Method Of Chip Package Structure App 20150214192 - LIN; Tzu-Hung | 2015-07-30 |
| Semiconductor Package App 20150206855 - LIN; Tzu-Hung | 2015-07-23 |
| Semiconductor Package App 20150194403 - CHAN; Kuei-Ti ; et al. | 2015-07-09 |
| Enhanced flip chip structure using copper column interconnect Grant 9,064,757 - Gregorich , et al. June 23, 2 | 2015-06-23 |
| Semiconductor Package App 20150145127 - HSU; Wen-Sung ; et al. | 2015-05-28 |
| Molded interposer package and method for fabricating the same Grant 9,040,359 - Gregorich , et al. May 26, 2 | 2015-05-26 |
| Traversal method for ICMP-sensitive NAT Grant 9,042,376 - Hwang , et al. May 26, 2 | 2015-05-26 |
| Semiconductor Structure App 20150115406 - LIN; Tzu-Hung ; et al. | 2015-04-30 |
| Package Structure App 20150091158 - Lin; Tzu-Hung ; et al. | 2015-04-02 |
| Semiconductor package Grant 8,987,897 - Chan , et al. March 24, 2 | 2015-03-24 |
| Molded interposer package and method for fabricating the same Grant 8,957,518 - Gregorich , et al. February 17, 2 | 2015-02-17 |
| Chip Package App 20150035131 - KO; Uming ; et al. | 2015-02-05 |
| Molded Interposer Package And Method For Fabricating The Same App 20140377913 - GREGORICH; Thomas Matthew ; et al. | 2014-12-25 |
| Molded interposer package and method for fabricating the same Grant 8,859,340 - Gregorich , et al. October 14, 2 | 2014-10-14 |
| Multi-traversal Method For Nat In Break-in App 20140286331 - Hwang; Shaw Hwa ; et al. | 2014-09-25 |
| Traversal Method For Icmp-sensitive Nat App 20140241339 - Hwang; Shaw Hwa ; et al. | 2014-08-28 |
| Semiconductor Package And Method For Fabricating Base For Semiconductor Package App 20140191396 - LIN; Tzu-Hung ; et al. | 2014-07-10 |
| Semiconductor Package And Method For Fabricating Base For Semiconductor Package App 20140151867 - LIN; Tzu-Hung ; et al. | 2014-06-05 |
| Molded Interposer Package And Method For Fabricating The Same App 20140127865 - GREGORICH; Thomas Matthew ; et al. | 2014-05-08 |
| Semiconductor Package App 20140091481 - LIN; Tzu-Hung ; et al. | 2014-04-03 |
| Semiconductor Package And Method For Fabricating Base For Semiconductor Package App 20140035095 - LIN; Tzu-Hung ; et al. | 2014-02-06 |
| Semiconductor package Grant 8,633,588 - Lin , et al. January 21, 2 | 2014-01-21 |
| Power Saving System For Smart Mobile Communication Device In Internet Communication App 20130286910 - Hwang; Shaw Hwa ; et al. | 2013-10-31 |
| Nat Traversal Under Tcp For Real Time Streaming Protocol App 20130290517 - Hwang; Shaw Hwa ; et al. | 2013-10-31 |
| Semiconductor Package App 20130256878 - HSU; Wen-Sung ; et al. | 2013-10-03 |
| Enhanced Flip Chip Structure Using Copper Column Interconnect App 20130221536 - Gregorich; Thomas Matthew ; et al. | 2013-08-29 |
| Package substrate for bump on trace interconnection Grant 8,502,377 - Lin , et al. August 6, 2 | 2013-08-06 |
| Molded Interposer Package And Method For Fabricating The Same App 20130168857 - GREGORICH; Thomas Matthew ; et al. | 2013-07-04 |
| Semiconductor Package App 20130161810 - Lin; Tzu-Hung ; et al. | 2013-06-27 |
| Flip Chip Package Utilizing Trace Bump Trace Interconnection App 20130140694 - Lin; Tzu-Hung ; et al. | 2013-06-06 |
| Integrated Circuit Package Structure App 20130087911 - GREGORICH; Thomas Matthew ; et al. | 2013-04-11 |
| Flip chip package utilizing trace bump trace interconnection Grant 8,390,119 - Lin , et al. March 5, 2 | 2013-03-05 |
| Semiconductor Package App 20120267779 - LIN; Tzu-Hung ; et al. | 2012-10-25 |
| Semiconductor Package App 20120126368 - Chan; Kuei-Ti ; et al. | 2012-05-24 |
| Flip Chip Package Utilizing Trace Bump Trace Interconnection App 20120032322 - Lin; Tzu-Hung ; et al. | 2012-02-09 |
| Package Substrate For Bump On Trace Interconnection App 20120032343 - Lin; Tzu-Hung ; et al. | 2012-02-09 |
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