| Patent | Date |
|---|
Semiconductor package and method of fabricating the same
Grant 11,456,226 - Lin , et al. September 27, 2 | 2022-09-27 |
Molding apparatus, manufacturing method of molded semiconductor device and molded semiconductor device
Grant 11,446,851 - Weng , et al. September 20, 2 | 2022-09-20 |
Package Structure And Manufacturing Method Thereof
App 20220293505 - Wu; Sung-Yueh ; et al. | 2022-09-15 |
Bonding with Pre-Deoxide Process and Apparatus for Performing the Same
App 20220285310 - Yu; Chen-Hua ; et al. | 2022-09-08 |
Semiconductor Package And Manufacturing Method Thereof
App 20220278023 - Liao; Jen-Chun ; et al. | 2022-09-01 |
Semiconductor package and method of forming the same
Grant 11,417,698 - Chang , et al. August 16, 2 | 2022-08-16 |
Manufacturing Method Of Package On Package Structure
App 20220254767 - Kuo; Hsuan-Ting ; et al. | 2022-08-11 |
Integrated Fan-Out Packages and Methods of Forming the Same
App 20220246590 - Yu; Chen-Hua ; et al. | 2022-08-04 |
Chip package with fan-out structure
Grant 11,404,381 - Chen , et al. August 2, 2 | 2022-08-02 |
Three-dimensional Integrated Circuit Structures And Methods Of Forming The Same
App 20220238407 - Lin; Chia-Min ; et al. | 2022-07-28 |
Semiconductor Device And Manufacturing Method Thereof
App 20220223542 - Lin; Yu-Wei ; et al. | 2022-07-14 |
Semiconductor Device And Method Of Manufacture
App 20220216071 - Chen; Wei-Yu ; et al. | 2022-07-07 |
Package Structure
App 20220165689 - TAI; Chih-Hsuan ; et al. | 2022-05-26 |
Manufacturing method of package on package structure
Grant 11,342,321 - Kuo , et al. May 24, 2 | 2022-05-24 |
Bonding with pre-deoxide process and apparatus for performing the same
Grant 11,342,302 - Yu , et al. May 24, 2 | 2022-05-24 |
Semiconductor Packages
App 20220139894 - Yang; Sheng-Chieh ; et al. | 2022-05-05 |
Aligning Bumps in Fan-Out Packaging Process
App 20220130794 - Huang; Ying-Jui ; et al. | 2022-04-28 |
Reflow Method And System
App 20220130795 - Wong; Cheng-Shiuan ; et al. | 2022-04-28 |
Package Structure And Method Of Fabricating The Same
App 20220122926 - Pei; Hao-Jan ; et al. | 2022-04-21 |
Integrated fan-out packages and methods of forming the same
Grant 11,309,294 - Yu , et al. April 19, 2 | 2022-04-19 |
Three-dimensional integrated circuit structures and methods of forming the same
Grant 11,309,226 - Lin , et al. April 19, 2 | 2022-04-19 |
Integrated fan-out package and manufacturing method thereof
Grant 11,282,810 - Wan , et al. March 22, 2 | 2022-03-22 |
Semiconductor Package And Manufacturing Method Thereof
App 20220076982 - Yang; Sheng-Chieh ; et al. | 2022-03-10 |
Method And System For Optimizing Metal Stamping Process Parameters
App 20220050940 - HSIEH; Ching-Hua ; et al. | 2022-02-17 |
Copper contact plugs with barrier layers
Grant 11,251,131 - Su , et al. February 15, 2 | 2022-02-15 |
Package structure
Grant 11,251,141 - Tai , et al. February 15, 2 | 2022-02-15 |
Semiconductor Structure and Method
App 20220028823 - Cheng; Chia-Shen ; et al. | 2022-01-27 |
Semiconductor packages
Grant 11,233,039 - Yang , et al. January 25, 2 | 2022-01-25 |
Aligning bumps in fan-out packaging process
Grant 11,217,555 - Huang , et al. January 4, 2 | 2022-01-04 |
Package structure and method of fabrcating the same
Grant 11,211,341 - Pei , et al. December 28, 2 | 2021-12-28 |
Package And Manufacturing Method Thereof
App 20210366885 - Chen; Shing-Chao ; et al. | 2021-11-25 |
Manufacturing method of semiconductor package
Grant 11,177,237 - Chen , et al. November 16, 2 | 2021-11-16 |
Semiconductor package, manufacturing method of semiconductor device and semiconductor package
Grant 11,177,156 - Yang , et al. November 16, 2 | 2021-11-16 |
Semiconductor Package and Method
App 20210351172 - Pei; Hao-Jan ; et al. | 2021-11-11 |
Electronic Device And Manufacturing Method Thereof
App 20210351491 - Lee; Pei-Hsuan ; et al. | 2021-11-11 |
Semiconductor device and method of manufacture
Grant 11,171,090 - Wu , et al. November 9, 2 | 2021-11-09 |
Package Structure With Warpage-control Element
App 20210327840 - PEI; Hao-Jan ; et al. | 2021-10-21 |
Integrated circuit package and method
Grant 11,121,089 - Yu , et al. September 14, 2 | 2021-09-14 |
Formation Method Of Chip Package With Fan-out Structure
App 20210280520 - CHEN; Shing-Chao ; et al. | 2021-09-09 |
Package Structure
App 20210263243 - Chang; Chia-Lun ; et al. | 2021-08-26 |
Package and manufacturing method thereof
Grant 11,088,124 - Chen , et al. August 10, 2 | 2021-08-10 |
Iintegrated Fan-out Packages With Embedded Heat Dissipation Structure
App 20210233829 - Pei; Hao-Jan ; et al. | 2021-07-29 |
Semiconductor package and method of forming the same
Grant 11,075,131 - Tsai , et al. July 27, 2 | 2021-07-27 |
Electronic device and manufacturing method thereof
Grant 11,075,439 - Lee , et al. July 27, 2 | 2021-07-27 |
Workpiece Holder, Wafer Chuck, Wafer Holding Method
App 20210225684 - Wong; Cheng-Shiuan ; et al. | 2021-07-22 |
Semiconductor package and method
Grant 11,069,671 - Pei , et al. July 20, 2 | 2021-07-20 |
Method of manufacturing semiconductor structure
Grant 11,069,652 - Kalnitsky , et al. July 20, 2 | 2021-07-20 |
Semiconductor Package Structure
App 20210217728 - HUNG; JENG-NAN ; et al. | 2021-07-15 |
Fan-Out Packages and Methods of Forming the Same
App 20210202358 - Tsao; Chih-Chiang ; et al. | 2021-07-01 |
Semiconductor Package And Method Of Forming The Same
App 20210202562 - Chang; Chia-Lun ; et al. | 2021-07-01 |
Formation method of package structure with warpage-control element
Grant 11,049,832 - Pei , et al. June 29, 2 | 2021-06-29 |
Three-dimensional Integrated Circuit Structures And Methods Of Forming The Same
App 20210193544 - Lin; Chia-Min ; et al. | 2021-06-24 |
Package Structure And Method Of Fabrcating The Same
App 20210193589 - Pei; Hao-Jan ; et al. | 2021-06-24 |
Chip package and method of forming the same
Grant 11,031,376 - Kuan , et al. June 8, 2 | 2021-06-08 |
Package structure
Grant 11,002,927 - Chang , et al. May 11, 2 | 2021-05-11 |
Integrated fan-out packages with embedded heat dissipation structure
Grant 10,978,370 - Pei , et al. April 13, 2 | 2021-04-13 |
Semiconductor package structure
Grant 10,971,475 - Hung , et al. April 6, 2 | 2021-04-06 |
Package Structure And Method For Manufacturing The Same
App 20210098384 - TSAI; Yi-Da ; et al. | 2021-04-01 |
Package Structure And Method Of Fabricating The Same
App 20210098395 - Kuo; Cheng-Yu ; et al. | 2021-04-01 |
Semicondcutor Packages
App 20210066269 - Yang; Sheng-Chieh ; et al. | 2021-03-04 |
Semiconductor Package, Manufacturing Method Of Semiconductor Device And Semiconductor Package
App 20210057259 - Yang; Sheng-Chieh ; et al. | 2021-02-25 |
Semiconductor Package And Method Of Forming The Same
App 20210057298 - Tsai; Yi-Da ; et al. | 2021-02-25 |
Method of singulate a package structure using a light transmitting film on a polymer layer
Grant 10,903,090 - Chen , et al. January 26, 2 | 2021-01-26 |
Semiconductor Structure And Manufacturing Method Thereof
App 20210020581 - Kuan; Hsaing-Pin ; et al. | 2021-01-21 |
Advanced INFO POP and Method of Forming Thereof
App 20210020611 - Tsai; Yi-Da ; et al. | 2021-01-21 |
Chip Package And Method Of Forming The Same
App 20210020607 - Kuan; Hsaing-Pin ; et al. | 2021-01-21 |
Bonding Through Multi-Shot Laser Reflow
App 20210013173 - Chen; Wei-Yu ; et al. | 2021-01-14 |
Semiconductor structure and manufacturing method thereof
Grant 10,879,192 - Kuan , et al. December 29, 2 | 2020-12-29 |
Manufacturing method of integrated fan-out package
Grant 10,867,953 - Ang , et al. December 15, 2 | 2020-12-15 |
Method for manufacturing package structure
Grant 10,867,932 - Tsai , et al. December 15, 2 | 2020-12-15 |
Mutli-chip package with encapsulated conductor via
Grant 10,867,890 - Hwang , et al. December 15, 2 | 2020-12-15 |
Package structure and method of fabricating the same
Grant 10,867,939 - Kuo , et al. December 15, 2 | 2020-12-15 |
Electronic device and manufacturing method thereof
Grant 10,868,353 - Lu , et al. December 15, 2 | 2020-12-15 |
Method Of Singulate A Package Structure Using A Light Transmitting Film On A Polymer Layer
App 20200365420 - Chen; Cheng-Ting ; et al. | 2020-11-19 |
Molding Apparatus, Manufacturing Method Of Molded Semiconductor Device And Molded Semiconductor Device
App 20200338796 - Weng; Sheng-Feng ; et al. | 2020-10-29 |
Package structure
Grant 10,818,614 - Chen , et al. October 27, 2 | 2020-10-27 |
Integrated Fan-out Package And Manufacturing Method Thereof
App 20200335477 - Wan; Albert ; et al. | 2020-10-22 |
Semiconductor Device Having Antenna And Manufacturing Method Thereof
App 20200335459 - Wan; Albert ; et al. | 2020-10-22 |
Copper Contact Plugs with Barrier Layers
App 20200321279 - Su; Li-Lin ; et al. | 2020-10-08 |
Advanced INFO POP and method of forming thereof
Grant 10,797,025 - Tsai , et al. October 6, 2 | 2020-10-06 |
Semiconductor package and rework process for the same
Grant 10,797,038 - Yu , et al. October 6, 2 | 2020-10-06 |
Bonding through multi-shot laser reflow
Grant 10,790,261 - Chen , et al. September 29, 2 | 2020-09-29 |
Package Structure
App 20200294944 - TAI; Chih-Hsuan ; et al. | 2020-09-17 |
Clamping mechanism
Grant 10,773,294 - Chu , et al. Sept | 2020-09-15 |
Formation Method Of Package Structure With Warpage-control Element
App 20200279823 - PEI; Hao-Jan ; et al. | 2020-09-03 |
Package Structure
App 20200271873 - Chang; Chia-Lun ; et al. | 2020-08-27 |
Method of manufacturing integrated fan-out package
Grant 10,756,052 - Wan , et al. A | 2020-08-25 |
Semiconductor Package And Method Of Fabricating The Same
App 20200258801 - A1 | 2020-08-13 |
Semiconductor device having antenna and manufacturing method thereof
Grant 10,741,508 - Wan , et al. A | 2020-08-11 |
Method And Apparatus For Bonding Semiconductor Substrate
App 20200227379 - Huang; Ying-Jui ; et al. | 2020-07-16 |
Copper contact plugs with barrier layers
Grant 10,700,010 - Su , et al. | 2020-06-30 |
Semicondcutor Package And Method Of Dicing Semiconductor Device
App 20200203270 - Liu; Chung-Shi ; et al. | 2020-06-25 |
Clamping Mechanism
App 20200188984 - Chu; Hsin-Wei ; et al. | 2020-06-18 |
Integrated Circuit Package and Method
App 20200176387 - Yu; Jen-Jui ; et al. | 2020-06-04 |
Package structure and method of forming package structure
Grant 10,672,729 - Tai , et al. | 2020-06-02 |
Package Structure And Method Of Fabricating The Same
App 20200168568 - Kuo; Cheng-Yu ; et al. | 2020-05-28 |
Package structure with warpage-control element
Grant 10,658,323 - Pei , et al. | 2020-05-19 |
Method Of Manufacturing Semiconductor Structure
App 20200152599 - KALNITSKY; ALEXANDER ; et al. | 2020-05-14 |
Manufacturing Method Of Package On Package Structure
App 20200152616 - Kuo; Hsuan-Ting ; et al. | 2020-05-14 |
Method For Manufacturing Package Structure
App 20200152576 - TSAI; Yi-Da ; et al. | 2020-05-14 |
Chip Package With Fan-out Structure
App 20200135652 - CHEN; Shing-Chao ; et al. | 2020-04-30 |
Semiconductor package and method of fabricating the same
Grant 10,636,715 - Lin , et al. | 2020-04-28 |
Manufacturing Method Of Semiconductor Package
App 20200118962 - Chen; Meng-Tse ; et al. | 2020-04-16 |
Electronic Device And Manufacturing Method Thereof
App 20200106156 - Lu; Chun-Lin ; et al. | 2020-04-02 |
Semiconductor Device And Manufacturing Method Thereof
App 20200105689 - Hwang; Chien-Ling ; et al. | 2020-04-02 |
Package Structure
App 20200091090 - Chen; Meng-Tse ; et al. | 2020-03-19 |
Semiconductor Device And Method Of Manufacture
App 20200075488 - Wu; Jiun Yi ; et al. | 2020-03-05 |
Integrated Fan-Out Packages and Methods of Forming the Same
App 20200075562 - Yu; Chen-Hua ; et al. | 2020-03-05 |
Package And Manufacturing Method Thereof
App 20200058627 - Chen; Shing-Chao ; et al. | 2020-02-20 |
Integrated fan-out packages with embedded heat dissipation structure
Grant 10,566,261 - Pei , et al. Feb | 2020-02-18 |
Electronic Device And Manufacturing Method Thereof
App 20200044306 - Lee; Pei-Hsuan ; et al. | 2020-02-06 |
Package And Method Of Manufacturing The Same
App 20200020634 - Tsai; Tsai-Tsung ; et al. | 2020-01-16 |
Package structure and method for forming the same
Grant 10,535,609 - Tsai , et al. Ja | 2020-01-14 |
Manufacturing method of package on package structure
Grant 10,535,644 - Kuo , et al. Ja | 2020-01-14 |
Method of manufacturing semiconductor structure
Grant 10,535,629 - Kalnitsky , et al. Ja | 2020-01-14 |
Integrated Fan-out Packages With Embedded Heat Dissipation Structure
App 20200006191 - Pei; Hao-Jan ; et al. | 2020-01-02 |
Manufacturing Method Of Package On Package Structure
App 20200006308 - Kuo; Hsuan-Ting ; et al. | 2020-01-02 |
Chip package with fan-out structure
Grant 10,515,900 - Chen , et al. Dec | 2019-12-24 |
Systems and methods for integrated resputtering in a physical vapor deposition chamber
Grant 10,515,788 - Pan , et al. Dec | 2019-12-24 |
Polishing Pad, Polishing Apparatus And Method Of Manufacturing Semiconductor Package Using The Same
App 20190381630 - Wang; Kuan-Cheng ; et al. | 2019-12-19 |
Semicondcutor package and manufacturing method thereof
Grant 10,510,709 - Chen , et al. Dec | 2019-12-17 |
Integrated fan-out packages with embedded heat dissipation structure
Grant 10504815 - | 2019-12-10 |
Package structure and method of fabricating the same
Grant 10,504,858 - Chen , et al. Dec | 2019-12-10 |
Semiconductor Package Structure
App 20190363066 - HUNG; JENG-NAN ; et al. | 2019-11-28 |
Method Of Manufacturing Integrated Fan-out Package
App 20190355694 - Wan; Albert ; et al. | 2019-11-21 |
Semiconductor Device And Manufacturing Method Thereof
App 20190333877 - Wan; Albert ; et al. | 2019-10-31 |
Package Structure And Method Of Fabricating The Same
App 20190333870 - Chen; Meng-Tse ; et al. | 2019-10-31 |
Bonding with Pre-Deoxide Process and Apparatus for Performing the Same
App 20190326251 - Yu; Chen-Hua ; et al. | 2019-10-24 |
Method and system for mounting components in semiconductor fabrication process
Grant 10,438,922 - Hwang , et al. O | 2019-10-08 |
Semiconductor Package and Method
App 20190296002 - Pei; Hao-Jan ; et al. | 2019-09-26 |
Bonding Through Multi-Shot Laser Reflow
App 20190279958 - Chen; Wei-Yu ; et al. | 2019-09-12 |
Manufacturing Method Of Integrated Fan-out Package
App 20190252339 - Ang; Ai-Tee ; et al. | 2019-08-15 |
Package Structure With Warpage-control Element
App 20190252340 - PEI; Hao-Jan ; et al. | 2019-08-15 |
Semiconductor package structure and method of manufacturing the same
Grant 10,373,931 - Hung , et al. | 2019-08-06 |
Method of manufacturing integrated fan-out package
Grant 10,366,966 - Wan , et al. July 30, 2 | 2019-07-30 |
Package-on-package structure and method
Grant 10,325,883 - Chiu , et al. | 2019-06-18 |
Package on-package structure with epoxy flux residue
Grant 10,297,579 - Yu , et al. | 2019-05-21 |
Integrated Fan-Out Packages and Methods of Forming the Same
App 20190148262 - Pei; Hao-Jan ; et al. | 2019-05-16 |
Semiconductor Package And Method Of Fabricating The Same
App 20190139845 - Lin; Chun-Cheng ; et al. | 2019-05-09 |
Integrated Fan-out Package And Manufacturing Method Thereof
App 20190139787 - Chen; Meng-Tse ; et al. | 2019-05-09 |
Package Structure And Manufacturing Method Thereof
App 20190139886 - Chen; Wei-Yu ; et al. | 2019-05-09 |
Integrated fan-out package and manufacturing method thereof
Grant 10,283,377 - Chen , et al. | 2019-05-07 |
Semiconductor package and manufacturing method thereof
Grant 10,283,470 - Lin , et al. | 2019-05-07 |
Structure and formation method of chip package with fan-out structure
Grant 10,276,536 - Pei , et al. | 2019-04-30 |
Integrated fan-out package and manufacturing method thereof
Grant 10,276,537 - Ang , et al. | 2019-04-30 |
Chip Package With Fan-out Structure
App 20190122989 - CHEN; Shing-Chao ; et al. | 2019-04-25 |
Method Of Manufacturing Semiconductor Structure
App 20190115313 - KALNITSKY; ALEXANDER ; et al. | 2019-04-18 |
Aligning Bumps In Fan-out Packaging Process
App 20190103375 - Huang; Ying-Jui ; et al. | 2019-04-04 |
Integrated Fan-out Package And Manufacturing Method Thereof
App 20190096840 - Ang; Ai-Tee ; et al. | 2019-03-28 |
Method of manufacturing semiconductor structure
Grant 10,163,849 - Kalnitsky , et al. Dec | 2018-12-25 |
Method for forming chip package involving cutting process
Grant 10,157,846 - Chen , et al. Dec | 2018-12-18 |
Integrated fan-out package and method of fabricating the same
Grant 10,157,862 - Chen , et al. Dec | 2018-12-18 |
Semicondcutor Package And Manufacturing Method Thereof
App 20180337149 - Lin; Chih-Wei ; et al. | 2018-11-22 |
Package structure and method for forming the same
Grant 10,128,193 - Chen , et al. November 13, 2 | 2018-11-13 |
Structure And Formation Method Of Chip Package With Fan-out Structure
App 20180315728 - PEI; Hao-Jan ; et al. | 2018-11-01 |
Package Structure And Method For Forming The Same
App 20180308800 - TSAI; Yi-Da ; et al. | 2018-10-25 |
Semicondcutor Package And Manufacturing Method Thereof
App 20180308787 - Chen; Meng-Tse ; et al. | 2018-10-25 |
Semiconductor devices and methods of forming same
Grant 10,103,099 - Chi , et al. October 16, 2 | 2018-10-16 |
Package Structure And Method Of Forming Package Structure
App 20180286823 - TAI; Chih-Hsuan ; et al. | 2018-10-04 |
Package structure and method for forming the same
Grant 10,014,260 - Tsai , et al. July 3, 2 | 2018-07-03 |
Package-on-Package Structure with Epoxy Flux Residue
App 20180166421 - Yu; Chen-Hua ; et al. | 2018-06-14 |
Systems and Methods for Integrated Resputtering in a Physical Vapor Deposition Chamber
App 20180158658 - Pan; Shing-Chyang ; et al. | 2018-06-07 |
Package Structure And Method For Forming The Same
App 20180151500 - CHEN; Shing-Chao ; et al. | 2018-05-31 |
Semiconductor Package Structure And Method Of Manufacturing The Same
App 20180151538 - HUNG; JENG-NAN ; et al. | 2018-05-31 |
Integrated fan-out package and method of fabricating the same
Grant 9,984,960 - Hwang , et al. May 29, 2 | 2018-05-29 |
Package structure and method for manufacturing the same
Grant 9,978,716 - Tsao , et al. May 22, 2 | 2018-05-22 |
Package Structure And Method For Forming The Same
App 20180130749 - TSAI; Yi-Da ; et al. | 2018-05-10 |
Structure And Formation Method Of Chip Package With Fan-out Structure
App 20180108613 - CHEN; Shing-Chao ; et al. | 2018-04-19 |
Package-on-Package Structure and Method
App 20180068985 - Chiu; Sheng-Hsiang ; et al. | 2018-03-08 |
Method Of Manufacturing Semiconductor Structure
App 20180047701 - KALNITSKY; ALEXANDER ; et al. | 2018-02-15 |
Systems and methods for integrated resputtering in a physical vapor deposition chamber
Grant 9,887,072 - Pan , et al. February 6, 2 | 2018-02-06 |
Package-on-package structure with epoxy flux residue
Grant 9,881,903 - Yu , et al. January 30, 2 | 2018-01-30 |
Integrated Fan-out Package And Method Of Fabricating The Same
App 20180025966 - Hwang; Chien-Ling ; et al. | 2018-01-25 |
Metal capping process and processing platform thereof
Grant 9,873,944 - Chi , et al. January 23, 2 | 2018-01-23 |
Package structure and method for forming the same
Grant 9,859,229 - Tsai , et al. January 2, 2 | 2018-01-02 |
Method And System For Mounting Components In Semiconductor Fabrication Process
App 20170352641 - HWANG; Chien-Ling ; et al. | 2017-12-07 |
Package-on-package Structure With Epoxy Flux Residue
App 20170345794 - Yu; Chen-Hua ; et al. | 2017-11-30 |
Advanced INFO POP and Method of Forming Thereof
App 20170338202 - Tsai; Yi-Da ; et al. | 2017-11-23 |
Package-on-package structure and method
Grant 9,818,729 - Chiu , et al. November 14, 2 | 2017-11-14 |
Package Structure And Method For Forming The Same
App 20170317038 - TSAI; Yu-Peng ; et al. | 2017-11-02 |
Package Structure And Method For Manufacturing The Same
App 20170317054 - TSAO; Chih-Chiang ; et al. | 2017-11-02 |
Semiconductor structure and manufacturing method thereof
Grant 9,799,625 - Kalnitsky , et al. October 24, 2 | 2017-10-24 |
Packaging method and structure
Grant 9,754,805 - Yu , et al. September 5, 2 | 2017-09-05 |
Packaging Method and Structure
App 20170250091 - Yu; Chen-Hua ; et al. | 2017-08-31 |
Semiconductor Package And Rework Process For The Same
App 20170250171 - Yu; Chen-Hua ; et al. | 2017-08-31 |
Copper Contact Plugs with Barrier Layers
App 20170207167 - Su; Li-Lin ; et al. | 2017-07-20 |
Semiconductor Devices and Methods of Forming Same
App 20170162502 - Chi; Chih-Chien ; et al. | 2017-06-08 |
Self-aligned repairing process for barrier layer
Grant 9,640,428 - Chi , et al. May 2, 2 | 2017-05-02 |
Copper contact plugs with barrier layers
Grant 9,614,052 - Su , et al. April 4, 2 | 2017-04-04 |
Method for integrated circuit patterning
Grant 9,589,800 - Tung , et al. March 7, 2 | 2017-03-07 |
Semiconductor devices and methods of forming same
Grant 9,576,892 - Chi , et al. February 21, 2 | 2017-02-21 |
Metal Capping Process And Processing Platform Thereof
App 20170044668 - Chi; Chih-Chien ; et al. | 2017-02-16 |
Plasma apparatus, magnetic-field controlling method, and semiconductor manufacturing method
Grant 9,567,668 - Chi , et al. February 14, 2 | 2017-02-14 |
Structure and method for forming interconnect structure
Grant 9,543,198 - Chi , et al. January 10, 2 | 2017-01-10 |
Semiconductor Structure And Manufacturing Method Thereof
App 20160365332 - KALNITSKY; ALEXANDER ; et al. | 2016-12-15 |
Selective repairing process for barrier layer
Grant 9,514,928 - Chi , et al. December 6, 2 | 2016-12-06 |
Metal capping process and processing platform thereof
Grant 9,487,864 - Chi , et al. November 8, 2 | 2016-11-08 |
Semiconductor structure with inlaid capping layer and method of manufacturing the same
Grant 9,472,449 - Chen , et al. October 18, 2 | 2016-10-18 |
Self-aligned Repairing Process For Barrier Layer
App 20160204060 - CHI; Chih-Chien ; et al. | 2016-07-14 |
Bi-layer hard mask for robust metallization profile
Grant 9,385,086 - Pan , et al. July 5, 2 | 2016-07-05 |
Surface pre-treatment for hard mask fabrication
Grant 9,330,915 - Pan , et al. May 3, 2 | 2016-05-03 |
Self-aligned repairing process for barrier layer
Grant 9,324,606 - Chi , et al. April 26, 2 | 2016-04-26 |
Method for Integrated Circuit Patterning
App 20160071730 - Tung; Szu-Ping ; et al. | 2016-03-10 |
Copper Contact Plugs with Barrier Layers
App 20160064517 - Su; Li-Lin ; et al. | 2016-03-03 |
Method for forming semiconductor device structure
Grant 9,275,894 - Lin , et al. March 1, 2 | 2016-03-01 |
Hard mask edge cover scheme
Grant 9,218,986 - Tung , et al. December 22, 2 | 2015-12-22 |
Method of manufacturing a semiconductor device structure
Grant 9,184,134 - Lin , et al. November 10, 2 | 2015-11-10 |
Copper contact plugs with barrier layers
Grant 9,136,206 - Su , et al. September 15, 2 | 2015-09-15 |
Method for integrated circuit patterning
Grant 9,129,814 - Tung , et al. September 8, 2 | 2015-09-08 |
Plasma Apparatus, Magnetic-field Controlling Method, And Semiconductor Manufacturing Method
App 20150235823 - CHI; Chih-Chien ; et al. | 2015-08-20 |
Interconnect Structure And Method of Forming
App 20150206798 - Chi; Chih-Chien ; et al. | 2015-07-23 |
Systems and Methods for Integrated Resputtering in a Physical Vapor Deposition Chamber
App 20150206724 - Pan; Shing-Chyang ; et al. | 2015-07-23 |
Method For Forming Semiconductor Device Structure
App 20150206791 - LIN; Chi-Feng ; et al. | 2015-07-23 |
Semiconductor Device Structure And Method Of Manufacturing The Same
App 20150206840 - LIN; Chi-Feng ; et al. | 2015-07-23 |
Selective Repairing Process For Barrier Layer
App 20150201501 - Chi; Chih-Chien ; et al. | 2015-07-16 |
Metal Capping Process And Processing Platform Thereof
App 20150200132 - Chi; Chih-Chien ; et al. | 2015-07-16 |
Semiconductor Structure With Inlaid Capping Layer And Method Of Manufacturing The Same
App 20150200126 - Chen; Kuan-Chia ; et al. | 2015-07-16 |
Self-aligned Repairing Process For Barrier Layer
App 20150194343 - CHI; Chih-Chien ; et al. | 2015-07-09 |
Bi-layer Hard Mask For Robust Metallization Profile
App 20150162282 - Pan; Shing-Chyang ; et al. | 2015-06-11 |
Surface Pre-Treatment for Hard Mask Fabrication
App 20150162280 - Pan; Shing-Chyang ; et al. | 2015-06-11 |
Method For Integrated Circuit Patterning
App 20150147886 - Tung; Szu-Ping ; et al. | 2015-05-28 |
Structure and Method for Forming Interconnect Structure
App 20150123279 - Chi; Chih-Chien ; et al. | 2015-05-07 |
Interconnect structures and methods of forming same
Grant 8,980,745 - Tung , et al. March 17, 2 | 2015-03-17 |
Hard Mask Edge Cover Scheme
App 20150072528 - Tung; Szu-Ping ; et al. | 2015-03-12 |
Semiconductor Devices and Methods of Forming Same
App 20150069620 - Chi; Chih-Chien ; et al. | 2015-03-12 |
Interconnect Structures And Methods Of Forming Same
App 20150061141 - Tung; Szu-Ping ; et al. | 2015-03-05 |
Structure and method for forming interconnect structure
Grant 8,940,635 - Chi , et al. January 27, 2 | 2015-01-27 |
Method For Manufacturing A Magnet-conductive Device And Apparatus Thereof
App 20140144581 - Tu; Kuo-Yin ; et al. | 2014-05-29 |
Copper Contact Plugs with Barrier Layers
App 20140027822 - Su; Li-Lin ; et al. | 2014-01-30 |
Methods for via structure with improved reliability
Grant 8,629,058 - Shue , et al. January 14, 2 | 2014-01-14 |
Methods for optimizing conductor patterns for ECP and CMP in semiconductor processing
Grant 8,627,243 - Lin , et al. January 7, 2 | 2014-01-07 |
Barrier layer for copper interconnect
Grant 8,361,900 - Pan , et al. January 29, 2 | 2013-01-29 |
Methods for Via Structure with Improved Reliability
App 20120322261 - Shue; Shau-Lin ; et al. | 2012-12-20 |
Methods and Systems for Lithography Alignment
App 20120293782 - Lu; Hsiao-Tzu ; et al. | 2012-11-22 |
Via structure with improved reliability
Grant 8,264,086 - Shue , et al. September 11, 2 | 2012-09-11 |
In situ Cu seed layer formation for improving sidewall coverage
Grant 8,252,690 - Su , et al. August 28, 2 | 2012-08-28 |
Methods and systems for lithography alignment
Grant 8,236,579 - Lu , et al. August 7, 2 | 2012-08-07 |
Barrier material and process for Cu interconnect
Grant 8,178,437 - Chang , et al. May 15, 2 | 2012-05-15 |
Barrier Layer For Copper Interconnect
App 20110256715 - PAN; Shing-Chyang ; et al. | 2011-10-20 |
Method for forming composite barrier layer
Grant 8,034,709 - Huang , et al. October 11, 2 | 2011-10-11 |
Multi-step Cu seed layer formation for improving sidewall coverage
Grant 7,704,886 - Su , et al. April 27, 2 | 2010-04-27 |
Cleaning processes in the formation of integrated circuit interconnect structures
Grant 7,700,479 - Huang , et al. April 20, 2 | 2010-04-20 |
Reducing resistivity in interconnect structures by forming an inter-layer
Grant 7,612,451 - Shih , et al. November 3, 2 | 2009-11-03 |
Method for Improving the Reliability of Low-k Dielectric Materials
App 20090258487 - Lin; Keng-Chu ; et al. | 2009-10-15 |
In Situ Cu Seed Layer Formation for Improving Sidewall Coverage
App 20090209106 - Su; Li-Lin ; et al. | 2009-08-20 |
Multi-Step Cu Seed Layer Formation for Improving Sidewall Coverage
App 20090209098 - Su; Li-Lin ; et al. | 2009-08-20 |
Method for forming composite barrier layer
App 20090047780 - Huang; Cheng-Lin ; et al. | 2009-02-19 |
Composite barrier layer
Grant 7,453,149 - Huang , et al. November 18, 2 | 2008-11-18 |
Barrier Material and Process for Cu Interconnect
App 20080280432 - Chang; Chung-Liang ; et al. | 2008-11-13 |
Adhesion of copper and etch stop layer for copper alloy
Grant 7,443,029 - Lin , et al. October 28, 2 | 2008-10-28 |
Methods and Systems For Lithography Alignment
App 20080233661 - Lu; Hsiao-Tzu ; et al. | 2008-09-25 |
Cleaning processes in the formation of integrated circuit interconnect structures
App 20080124919 - Huang; Cheng-Lin ; et al. | 2008-05-29 |
Sequential reducing plasma and inert plasma pre-treatment method for oxidizable conductor layer
Grant 7,338,903 - Peng , et al. March 4, 2 | 2008-03-04 |
Reducing resistivity in interconnect structures by forming an inter-layer
App 20080012133 - Shih; Chih-Chao ; et al. | 2008-01-17 |
High performance metallization cap layer
Grant 7,253,501 - Lee , et al. August 7, 2 | 2007-08-07 |
Method of manufacturing a contact interconnection layer containing a metal and nitrogen by atomic layer deposition for deep sub-micron semiconductor technology
Grant 7,235,482 - Wu , et al. June 26, 2 | 2007-06-26 |
Via structure with improved reliability
App 20070126121 - Shue; Shau-Lin ; et al. | 2007-06-07 |
Barrier-less integration with copper alloy
Grant 7,215,024 - Lin , et al. May 8, 2 | 2007-05-08 |
Barrier structure for semiconductor devices
Grant 7,193,327 - Yu , et al. March 20, 2 | 2007-03-20 |
Barrier layer and fabrication method thereof
Grant 7,179,759 - Huang , et al. February 20, 2 | 2007-02-20 |
Via in semiconductor device
App 20070035026 - Su; Yi-Nien ; et al. | 2007-02-15 |
Integrated dual damascene clean apparatus and process
App 20060246727 - Hsieh; Ching-Hua ; et al. | 2006-11-02 |
Oblique Recess For Interconnecting Conductors In A Semiconductor Device
App 20060244151 - YU; CHEN-HUA ; et al. | 2006-11-02 |
Barrier structure for semiconductor devices
App 20060163746 - Yu; Chen-Hua ; et al. | 2006-07-27 |
Barrier metal re-distribution process for resistivity reduction
Grant 7,071,095 - Huang , et al. July 4, 2 | 2006-07-04 |
Barrier material and process for Cu interconnect
App 20060113675 - Chang; Chung-Liang ; et al. | 2006-06-01 |
Method for simultaneous degas and baking in copper damascene process
Grant 7,030,023 - Pan , et al. April 18, 2 | 2006-04-18 |
Barrier layer and fabrication method thereof
App 20060068604 - Huang; Cheng-Lin ; et al. | 2006-03-30 |
Composite barrier layer
App 20060027925 - Huang; Cheng-Lin ; et al. | 2006-02-09 |
High performance metallization cap layer
App 20060027922 - Lee; Hsien-Ming ; et al. | 2006-02-09 |
Method for fabricating low resistivity barrier for copper interconnect
App 20050277292 - Peng, Chao-Hsien ; et al. | 2005-12-15 |
Adhesion of copper and etch stop layer for copper alloy
App 20050277298 - Lin, Jing Cheng ; et al. | 2005-12-15 |
Barrier metal re-distribution process for resistivity reduction
App 20050260851 - Huang, Cheng-Lin ; et al. | 2005-11-24 |
Adhesion of copper and etch stop layer for copper alloy
Grant 6,967,155 - Lin , et al. November 22, 2 | 2005-11-22 |
Sequential reducing plasma and inert plasma pre-treatment method for oxidizable conductor layer
App 20050239288 - Peng, Chao-Hsien ; et al. | 2005-10-27 |
Method for high kinetic energy plasma barrier deposition
Grant 6,949,472 - Huang , et al. September 27, 2 | 2005-09-27 |
Pre-clean chamber with wafer heating apparatus and method of use
App 20050189075 - Pan, Shing-Chyang ; et al. | 2005-09-01 |
Bond pad for flip chip package
Grant 6,927,498 - Huang , et al. August 9, 2 | 2005-08-09 |
Bond pad for flip chip package
App 20050104224 - Huang, Tai-Chun ; et al. | 2005-05-19 |
Method for simultaneous degas and baking in copper damascene process
App 20050054202 - Pan, Shing-Chyang ; et al. | 2005-03-10 |
Method of manufacturing a contact interconnection layer containing a metal and nitrogen by atomic layer deposition for deep sub-micron semiconductor technology
App 20050054196 - Wu, Chii-Ming ; et al. | 2005-03-10 |
Barrier-less integration with copper alloy
App 20050029665 - Lin, Jing-Cheng ; et al. | 2005-02-10 |
Adhesion of copper and etch stop layer for copper alloy
App 20050006776 - Lin, Jing Cheng ; et al. | 2005-01-13 |
Method of barrier-less integration with copper alloy
Grant 6,806,192 - Lin , et al. October 19, 2 | 2004-10-19 |
Photoresist scum for copper dual damascene process
Grant 6,800,558 - Chang , et al. October 5, 2 | 2004-10-05 |
Method for reducing surface defects in an electrodeposition process
Grant 6,797,144 - Su , et al. September 28, 2 | 2004-09-28 |
Method of barrier-less integration with copper alloy
App 20040147104 - Lin, Jing-Cheng ; et al. | 2004-07-29 |
Method of improving a barrier layer in a via or contact opening
App 20040127014 - Huang, Cheng-Lin ; et al. | 2004-07-01 |
Method for reducing surface defects in an electrodeposition process
App 20030209444 - Su, Hung-Wen ; et al. | 2003-11-13 |
Dual damascene structure employing nitrogenated silicon carbide and non-nitrogenated silicon carbide etch stop layers
Grant 6,562,725 - Tsai , et al. May 13, 2 | 2003-05-13 |
Dual damascene structure employing nitrogenated silicon carbide and non-nitrogenated silicon carbide ETCH stop layers
App 20030008511 - Tsai, Ming-Hsing ; et al. | 2003-01-09 |
Methods for edge alignment mark protection during damascene electrochemical plating of copper
Grant 6,492,269 - Liu , et al. December 10, 2 | 2002-12-10 |
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