Farrar; Paul A.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Farrar; Paul A..The latest application filed is for "methods of forming strained semiconductor channels".

Company Profile

0.180.181

Farrar; Paul A. - Bluffton SC
Farrar; Paul A. - Okatie SC US
Farrar; Paul A. - So. Burlington VT
Farrar; Paul A - Okatie SC
Farrar; Paul A. - South Burlington VT
Farrar; Paul A. - S. Burlington VT
Farrar; Paul A. - South Bulington VT
Farrar; Paul A. - Burlington VT
Farrar; Paul A. - Corvallis OR
Farrar, Paul A - So Burlington VT

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor device with strained channels Grant 9,379,241 - Bhattacharyya , et al. June 28, 2	2016-06-28
Methods Of Forming Strained Semiconductor Channels App 20160020322 - Bhattacharyya; Arup ; et al.	2016-01-21
Apparatus and method for high density multi-chip structures Grant 9,209,127 - Farrar December 8, 2	2015-12-08
Apparatus and method for controlling diffusion Grant 9,147,735 - Farrar , et al. September 29, 2	2015-09-29
Semiconductor device structures including strained transistor channels Grant 9,076,867 - Bhattacharyya , et al. July 7, 2	2015-07-07
Distributed semiconductor device methods, apparatus, and systems Grant 8,872,324 - Farrar , et al. October 28, 2	2014-10-28
High density chip packages, methods of forming, and systems including same Grant 8,841,169 - Farrar September 23, 2	2014-09-23
Distributed Semiconductor Device Methods, Apparatus, And Systems App 20140247638 - Farrar; Paul A. ; et al.	2014-09-04
Structures and methods to enhance copper metallization Grant 8,779,596 - Farrar July 15, 2	2014-07-15
Semiconductor Device Structures Including Strained Transistor Channels App 20140167186 - Bhattacharyya; Arup ; et al.	2014-06-19
Structures and Methods to Enhance Copper Metallization App 20140159241 - Farrar; Paul A.	2014-06-12
Methods for stressing transistor channels of a semiconductor device structure Grant 8,679,928 - Bhattacharyya , et al. March 25, 2	2014-03-25
Apparatus And Method For High Density Multi-chip Structures App 20140077393 - Farrar; Paul A.	2014-03-20
Apparatus and method for high density multi-chip structures Grant 8,592,964 - Farrar November 26, 2	2013-11-26
Distributed Semiconductor Device Methods, Apparatus, And Systems App 20130299999 - Farrar; Paul A. ; et al.	2013-11-14
High Density Chip Packages, Methods Of Forming, And Systems Including Same App 20130288433 - Farrar; Paul A.	2013-10-31
Distributed semiconductor device methods, apparatus, and systems Grant 8,498,171 - Farrar , et al. July 30, 2	2013-07-30
High density chip packages, methods of forming, and systems including same Grant 8,470,642 - Farrar June 25, 2	2013-06-25
Methods For Stressing Transistor Channels Of A Semiconductor Device Structure, And A Related Semiconductor Device Structure App 20130001575 - Bhattacharyya; Arup ; et al.	2013-01-03
Distributed Semiconductor Device Methods, Apparatus, And Systems App 20120302006 - Farrar; Paul A. ; et al.	2012-11-29
Implantation processes for straining transistor channels of semiconductor device structures and semiconductor devices with strained transistor channels Grant 8,293,611 - Bhattacharyya , et al. October 23, 2	2012-10-23
Distributed semiconductor device methods, apparatus, and systems Grant 8,237,254 - Farrar , et al. August 7, 2	2012-08-07
Methods Of Forming Strained Semiconductor Channels App 20110248353 - Bhattacharyya; Arup ; et al.	2011-10-13
Distributed Semiconductor Device Methods, Apparatus, And Systems App 20110222328 - Farrar; Paul A. ; et al.	2011-09-15
Methods of forming strained semiconductor channels Grant 7,968,960 - Bhattacharyya , et al. June 28, 2	2011-06-28
Distributed semiconductor device methods, apparatus, and systems Grant 7,952,184 - Farrar , et al. May 31, 2	2011-05-31
Epitaxial semiconductor layer and method Grant 7,898,062 - Farrar March 1, 2	2011-03-01
Strained semiconductor, devices and systems and methods of formation Grant 7,888,744 - Forbes , et al. February 15, 2	2011-02-15
Semiconductor devices Grant 7,875,529 - Forbes , et al. January 25, 2	2011-01-25
High Density Chip Packages, Methods Of Forming, And Systems Including Same App 20100271777 - Farrar; Paul A.	2010-10-28
Apparatus And Method For Controlling Diffusion App 20100237422 - Farrar; Paul A. ; et al.	2010-09-23
Integrated circuit insulators and related methods Grant 7,790,603 - Farrar September 7, 2	2010-09-07
Epitaxial Semiconductor Layer And Method App 20100193838 - Farrar; Paul A.	2010-08-05
High density chip packages, methods of forming, and systems including same Grant 7,754,532 - Farrar July 13, 2	2010-07-13
Metal-substituted transistor gates Grant 7,750,379 - Forbes , et al. July 6, 2	2010-07-06
Integrated circuit and seed layers Grant 7,745,934 - Farrar June 29, 2	2010-06-29
Apparatus and method for controlling diffusion Grant 7,727,868 - Farrar , et al. June 1, 2	2010-06-01
Epitaxial semiconductor layer and method Grant 7,705,429 - Farrar April 27, 2	2010-04-27
High density nanodot nonvolatile memory App 20100090265 - Bhattacharyya; Arup ; et al.	2010-04-15
Metal-substituted transistor gates Grant 7,674,698 - Forbes , et al. March 9, 2	2010-03-09
Method of cleaning semiconductor surfaces Grant 7,655,095 - Farrar February 2, 2	2010-02-02
Method of cleaning semiconductor surfaces Grant 7,645,344 - Farrar January 12, 2	2010-01-12
Multi-chip electronic package and cooling system Grant 7,626,252 - Farrar , et al. December 1, 2	2009-12-01
Methods for forming a MRAM with non-orthogonal wiring Grant 7,614,027 - Farrar November 3, 2	2009-11-03
Low K Interconnect Dielectric Using Surface Transformation App 20090256243 - Geusic; Joseph E. ; et al.	2009-10-15
Structures And Methods To Enhance Copper Metallization App 20090243106 - Farrar; Paul A.	2009-10-01
Apparatus and method for controlling diffusion Grant 7,592,242 - Farrar , et al. September 22, 2	2009-09-22
Controlling diffusion in doped semiconductor regions Grant 7,585,753 - Farrar , et al. September 8, 2	2009-09-08
Integrated Circuit Insulators And Related Methods App 20090179331 - Farrar; Paul A.	2009-07-16
Apparatus and method for high density multi-chip structures Grant 7,560,305 - Farrar July 14, 2	2009-07-14
Epitaxial Semiconductor Layer And Method App 20090166806 - Farrar; Paul A.	2009-07-02
Low k interconnect dielectric using surface transformation Grant 7,550,824 - Geusic , et al. June 23, 2	2009-06-23
Phase change memory for archival data storage Grant 7,541,081 - Farrar , et al. June 2, 2	2009-06-02
Structures and methods to enhance copper metallization Grant 7,535,103 - Farrar May 19, 2	2009-05-19
Strained Semiconductor, Devices And Systems And Methods Of Formation App 20090108363 - Forbes; Leonard ; et al.	2009-04-30
Integrated circuit insulators and related methods Grant 7,521,355 - Farrar April 21, 2	2009-04-21
Semiconductor Devices App 20090090950 - Forbes; Leonard ; et al.	2009-04-09
Electronic apparatus having a core conductive structure within an insulating layer Grant 7,504,674 - Farrar March 17, 2	2009-03-17
Integrated circuit cooling and insulating device and method Grant 7,492,042 - Farrar , et al. February 17, 2	2009-02-17
Techniques to create low K ILD forming voids between metal lines Grant 7,492,030 - Bhattacharyya , et al. February 17, 2	2009-02-17
Epitaxial semiconductor layer and method Grant 7,489,019 - Farrar February 10, 2	2009-02-10
Integrated circuit cooling system and method Grant 7,489,034 - Farrar February 10, 2	2009-02-10
Intermetallic conductors App 20090032958 - Farrar; Paul A.	2009-02-05
Integrated circuit cooling and insulating device and method Grant 7,485,497 - Farrar , et al. February 3, 2	2009-02-03
Strained semiconductor, devices and systems and methods of formation Grant 7,485,544 - Forbes , et al. February 3, 2	2009-02-03
Etch stop in a damascene interconnect structure Grant 7,482,687 - Farrar January 27, 2	2009-01-27
Integrated Circuit And Seed Layers App 20090001586 - Farrar; Paul A.	2009-01-01
Three-dimensional multichip module Grant 7,465,608 - Farrar December 16, 2	2008-12-16
Digital data apparatuses and digital data operational methods Grant 7,453,718 - Farrar November 18, 2	2008-11-18
Implantation Processes For Straining Transistor Channels Of Semiconductor Device Structures And Semiconductor Devices With Strained Transistor Channels App 20080277734 - Bhattacharyya; Arup ; et al.	2008-11-13
Epitaxial semiconductor layer and method Grant 7,416,958 - Farrar August 26, 2	2008-08-26
In-service reconfigurable DRAM and flash memory device Grant 7,411,823 - Forbes , et al. August 12, 2	2008-08-12
Integrated circuit and seed layers Grant 7,394,157 - Farrar July 1, 2	2008-07-01
Packaging of electronic chips with air-bridge structures Grant 7,387,912 - Farrar June 17, 2	2008-06-17
Structures and methods to enhance copper metallization Grant 7,378,737 - Farrar May 27, 2	2008-05-27
High density chip packages, methods of forming, and systems including same App 20080096320 - Farrar; Paul A.	2008-04-24
In-service reconfigurable DRAM and flash memory device Grant 7,359,241 - Forbes , et al. April 15, 2	2008-04-15
Low capacitance wiring layout Grant 7,348,674 - Farrar March 25, 2	2008-03-25
Apparatus and method for printing micro metal structures Grant 7,347,349 - Farrar , et al. March 25, 2	2008-03-25
Controlling diffusion in doped semiconductor regions App 20080070392 - Farrar; Paul A. ; et al.	2008-03-20
Distributed semiconductor device methods, apparatus, and systems App 20080054489 - Farrar; Paul A. ; et al.	2008-03-06
Integrated circuit cooling and insulating device and method App 20080057629 - Farrar; Paul A. ; et al.	2008-03-06
Integrated circuit cooling and insulating device and method App 20080048314 - Farrar; Paul A. ; et al.	2008-02-28
Packaging of electronic chips with air-bridge structures Grant 7,335,965 - Farrar February 26, 2	2008-02-26
Strained semiconductor channels and methods of formation App 20080042211 - Bhattacharyya; Arup ; et al.	2008-02-21
Strained semiconductor, devices and systems and methods of formation App 20080029840 - Forbes; Leonard ; et al.	2008-02-07
Apparatus and method for printing micro metal structures Grant 7,322,511 - Farrar , et al. January 29, 2	2008-01-29
Low dielectric constant integrated circuit insulators and methods App 20070296083 - Farrar; Paul A.	2007-12-27
Integrated circuit cooling and insulating device and method Grant 7,304,380 - Farrar , et al. December 4, 2	2007-12-04
Method of cleaning semiconductor surfaces Grant 7,303,637 - Farrar December 4, 2	2007-12-04
Structures and methods to enhance copper metallization Grant 7,301,190 - Farrar November 27, 2	2007-11-27
Controlling diffusion in doped semiconductor regions Grant 7,301,221 - Farrar , et al. November 27, 2	2007-11-27
Integrated circuit cooling and insulating device and method Grant 7,300,821 - Farrar , et al. November 27, 2	2007-11-27
Method for controlling diffusion in semiconductor regions Grant 7,297,617 - Farrar , et al. November 20, 2	2007-11-20
Coating of copper and silver air bridge structures to improve electromigration resistance and other applications Grant 7,285,839 - Farrar October 23, 2	2007-10-23
Hydrophobic foamed insulators for high density circuits Grant 7,276,788 - Farrar October 2, 2	2007-10-02
Chemical mechanical polishing system and process App 20070167115 - Farrar; Paul A.	2007-07-19
CMOS gates with intermetallic compound tunable work functions App 20070164323 - Forbes; Leonard ; et al.	2007-07-19
CMOS gates with solid-solution alloy tunable work functions App 20070164367 - Forbes; Leonard ; et al.	2007-07-19
Selective deposition of solder ball contacts Grant 7,239,025 - Farrar July 3, 2	2007-07-03
Operation and design of integrated circuits at constrained temperature ranges in accordance with bit error rates App 20070150115 - Forbes; Leonard ; et al.	2007-06-28
Chemical mechanical polishing system and process App 20070145011 - Farrar; Paul A.	2007-06-28
Integrated Circuit Insulators And Related Methods App 20070141832 - Farrar; Paul A.	2007-06-21
Surface barriers for copper and silver interconnects produced by a damascene process Grant 7,229,924 - Farrar June 12, 2	2007-06-12
Epitaxial semiconductor layer and method App 20070122996 - Farrar; Paul A.	2007-05-31
H.sub.2 plasma treatment Grant 7,220,665 - Farrar May 22, 2	2007-05-22
Interconnect alloys and methods and apparatus using same Grant 7,205,229 - Farrar April 17, 2	2007-04-17
Integrated circuit cooling system and method Grant 7,202,562 - Farrar April 10, 2	2007-04-10
Method of cleaning semiconductor surfaces App 20070072368 - Farrar; Paul A.	2007-03-29
Metal-substituted transistor gates Grant 7,195,999 - Forbes , et al. March 27, 2	2007-03-27
Techniques to create low K ILD for beol Grant 7,190,043 - Bhattacharyya , et al. March 13, 2	2007-03-13
In-service reconfigurable DRAM and flash memory device Grant 7,190,616 - Forbes , et al. March 13, 2	2007-03-13
Methods and structures for metal interconnections in integrated circuits Grant 7,186,664 - Ahn , et al. March 6, 2	2007-03-06
Packaging of electronic chips with air-bridge structures App 20070042595 - Farrar; Paul A.	2007-02-22
Epitaxial semiconductor layer and method Grant 7,172,949 - Farrar February 6, 2	2007-02-06
Electromigration resistant metallurgy device and method App 20070023914 - Farrar; Paul A.	2007-02-01
Integrated circuit cooling system and method App 20070023894 - Farrar; Paul A.	2007-02-01
Buried conductor patterns formed by surface transformation of empty spaces in solid state materials Grant 7,164,188 - Farrar , et al. January 16, 2	2007-01-16
Metal-substituted transistor gates App 20070007560 - Forbes; Leonard ; et al.	2007-01-11
Metal-substituted transistor gates App 20070010061 - Forbes; Leonard ; et al.	2007-01-11
Metal-substituted transistor gates App 20070010060 - Forbes; Leonard ; et al.	2007-01-11
Interconnect alloys and methods and apparatus using same Grant 7,161,246 - Farrar January 9, 2	2007-01-09
Gold-semiconductor phase change memory for archival data storage App 20070003731 - Forbes; Leonard ; et al.	2007-01-04
Phase change memory for archival data storage App 20070003732 - Forbes; Leonard ; et al.	2007-01-04
Digital data apparatuses and digital data operational methods Grant 7,158,399 - Farrar January 2, 2	2007-01-02
Techniques to create low K ILD for BEOL Grant 7,157,387 - Bhattacharyya , et al. January 2, 2	2007-01-02
Method Of Cleaning Semiconductor Surfaces App 20060289033 - Farrar; Paul A.	2006-12-28
Apparatus And Method For High Density Multi-chip Structures App 20060289990 - Farrar; Paul A.	2006-12-28
Techniques to create low K ILD for beol App 20060292858 - Bhattacharyya; Arup ; et al.	2006-12-28
Epitaxial Semiconductor Layer And Method App 20060284284 - Farrar; Paul A.	2006-12-21
Etch stop in a damascene interconnect structure App 20060278990 - Farrar; Paul A.	2006-12-14
Digital data apparatuses and digital data operational methods App 20060262592 - Farrar; Paul A.	2006-11-23
Electronic apparatus having polynorbornene foam insulation App 20060261484 - Farrar; Paul A.	2006-11-23
Polar fluid removal from surfaces using supercritical fluids App 20060254612 - Farrar; Paul A.	2006-11-16
Structures And Methods To Enhance Copper Metallization App 20060255462 - Farrar; Paul A.	2006-11-16
Integrated circuit cooling and insulating device and method App 20060249837 - Farrar; Paul A. ; et al.	2006-11-09
Chemical mechanical polishing system and process App 20060252350 - Farrar; Paul A.	2006-11-09
Low k interconnect dielectric using surface transformation Grant 7,132,348 - Geusic , et al. November 7, 2	2006-11-07
Packaging Of Electronic Chips With Air-bridge Structures App 20060244112 - Farrar; Paul A.	2006-11-02
Packaging Of Electronic Chips With Air-bridge Structures App 20060238187 - Farrar; Paul A.	2006-10-26
Chemical mechanical polishing system and process Grant 7,121,919 - Farrar October 17, 2	2006-10-17
In-service reconfigurable DRAM and flash memory device App 20060221670 - Forbes; Leonard ; et al.	2006-10-05
Coating of copper and silver air bridge structures to improve electromigration resistance and other applications App 20060220172 - Farrar; Paul A.	2006-10-05
In-service reconfigurable DRAM and flash memory device App 20060208305 - Forbes; Leonard ; et al.	2006-09-21
Photolithographic Techniques For Producing Angled Lines App 20060211153 - Farrar; Paul A.	2006-09-21
Photolithographic techniques for producing angled lines Grant 7,105,841 - Farrar September 12, 2	2006-09-12
Integrated circuit and seed layers Grant 7,105,914 - Farrar September 12, 2	2006-09-12
Coating of copper and silver air bridge structures to improve electromigration resistance and other applications Grant 7,094,682 - Farrar August 22, 2	2006-08-22
Photolithographic techniques for producing angled lines Grant 7,084,413 - Farrar August 1, 2	2006-08-01
Coating of copper and silver air bridge structures to improve electromigration resistance and other applications Grant 7,075,166 - Farrar July 11, 2	2006-07-11
Method of using foamed insulators in three dimensional multichip structures Grant 7,064,007 - Farrar June 20, 2	2006-06-20
Micro-C-4 semiconductor die and method for depositing connection sites thereon App 20060124699 - Farrar; Paul A. ; et al.	2006-06-15
Integrated circuit cooling system and method App 20060118949 - Farrar; Paul A.	2006-06-08
Etch stop in damascene interconnect structure and method of making Grant 7,057,289 - Farrar June 6, 2	2006-06-06
Die-to-die connection method and assemblies and packages including dice so connected App 20060115929 - Cloud; Eugene H. ; et al.	2006-06-01
Method for fabricating a low capacitance wiring layout Grant 7,052,987 - Farrar May 30, 2	2006-05-30
Coating of copper and silver air bridge structures to improve electromigration resistance and other applications Grant 7,049,219 - Farrar May 23, 2	2006-05-23
Multi-chip electronic package and cooling system App 20060103015 - Farrar; Paul A. ; et al.	2006-05-18
System for depositing connection sites on micro C-4 semiconductor die Grant 7,028,879 - Farrar , et al. April 18, 2	2006-04-18
Apparatus and method for high density multi-chip structures App 20060063302 - Farrar; Paul A.	2006-03-23
Integrated circuit cooling and insulating device and method App 20060046322 - Farrar; Paul A. ; et al.	2006-03-02
Buried conductors App 20060033181 - Farrar; Paul A. ; et al.	2006-02-16
Apparatus And Method For Printing Micro Metal Structures App 20060032890 - Farrar; Paul A. ; et al.	2006-02-16
Method of forming a micro solder ball for use in C4 bonding process Grant 6,998,711 - Farrar February 14, 2	2006-02-14
Epitaxial semiconductor layer and method App 20060030121 - Farrar; Paul A.	2006-02-09
Apparatus and method for printing micro metal structures App 20060022017 - Farrar; Paul A. ; et al.	2006-02-02
In-service reconfigurable dram and flash memory device App 20060013042 - Forbes; Leonard ; et al.	2006-01-19
Controlling diffusion in doped semiconductor regions App 20060006499 - Farrar; Paul A. ; et al.	2006-01-12
Method of forming a micro solder ball for use in C4 bonding process App 20060006544 - Farrar; Paul A.	2006-01-12
H2 plasma treatment App 20060006548 - Farrar; Paul A.	2006-01-12
Die to die connection method and assemblies and packages including dice so connected Grant 6,984,544 - Cloud , et al. January 10, 2	2006-01-10
apparatus and method for controlling diffusion App 20060003559 - Farrar; Paul A. ; et al.	2006-01-05
Apparatus and method for controlling diffusion App 20060003535 - Farrar; Paul A. ; et al.	2006-01-05
Conductive structures in integrated circuits App 20050285272 - Farrar, Paul A.	2005-12-29
Packaging of electronic chips with air-bridge structures App 20050285220 - Farrar, Paul A.	2005-12-29
Interconnect alloys and methods and apparatus using same App 20050285267 - Farrar, Paul A.	2005-12-29
Memory system with conductive structures embedded in foamed insulator Grant 6,979,848 - Farrar December 27, 2	2005-12-27
Photolithographic techniques for producing angled lines App 20050280150 - Farrar, Paul A.	2005-12-22
Multi-chip electronic package and cooling system Grant 6,975,027 - Farrar , et al. December 13, 2	2005-12-13
Micro C-4 semiconductor die Grant 6,958,287 - Farrar , et al. October 25, 2	2005-10-25
Interconnect Alloys And Methods And Apparatus Using Same App 20050230815 - Farrar, Paul A.	2005-10-20
Method of providing a semiconductor package having an internal heat-activated hydrogen source Grant 6,953,706 - Eldridge , et al. October 11, 2	2005-10-11
Low dielectric constant STI with SOI devices Grant 6,953,983 - Farrar October 11, 2	2005-10-11
Microelectronic device package filled with liquid or pressurized gas and associated method of manufacture App 20050213373 - Eldridge, Jerome M. ; et al.	2005-09-29
Aligned buried structures formed by surface transformation of empty spaces in solid state materials Grant 6,949,839 - Farrar , et al. September 27, 2	2005-09-27
Method of forming buried conductors Grant 6,946,389 - Farrar , et al. September 20, 2	2005-09-20
Aluminum-beryllium alloys for air bridges Grant 6,943,090 - Farrar September 13, 2	2005-09-13
Low capacitance wiring layout and method for making same App 20050191844 - Farrar, Paul A.	2005-09-01
Methods and structures for metal interconnections in integrated circuits App 20050186773 - Ahn, Kie Y. ; et al.	2005-08-25
Microelectronic device package filled with liquid or pressurized gas and associated method of manufacture Grant 6,909,171 - Eldridge , et al. June 21, 2	2005-06-21
Assemblies and packages including die-to-die connections Grant 6,906,408 - Cloud , et al. June 14, 2	2005-06-14
Techniques to create low K ILD for BEOL Grant 6,903,001 - Bhattacharyya , et al. June 7, 2	2005-06-07
Selective deposition of solder ball contacts App 20050116341 - Farrar, Paul A.	2005-06-02
Polynorbornene foam insulation for integrated circuits Grant 6,890,847 - Farrar May 10, 2	2005-05-10
Semiconductor package having a heat-activated source of releasable hydrogen Grant 6,888,232 - Eldridge , et al. May 3, 2	2005-05-03
Digital data apparatuses and digital data operational methods App 20050082585 - Farrar, Paul A.	2005-04-21
Method of using foamed insulators in three dimensional multichip structures App 20050085015 - Farrar, Paul A.	2005-04-21
Method of cleaning semiconductor surfaces App 20050076935 - Farrar, Paul A.	2005-04-14
Micro C-4 semiconductor die and method for depositing connection sites thereon Grant 6,878,396 - Farrar , et al. April 12, 2	2005-04-12
Methods and structures for metal interconnections in integrated circuits Grant 6,879,017 - Ahn , et al. April 12, 2	2005-04-12
Insulators for high density circuits Grant 6,872,671 - Farrar March 29, 2	2005-03-29
Apparatus and method for high density multi-chip structures App 20050046034 - Farrar, Paul A.	2005-03-03
Multiple chip stack structure and cooling system Grant 6,861,287 - Farrar , et al. March 1, 2	2005-03-01
Low k interconnect dielectric using surface transformation App 20050029501 - Geusic, Joseph E. ; et al.	2005-02-10
Techniques to create low K ILD for beol App 20050029609 - Bhattacharyya, Arup ; et al.	2005-02-10
Photolithographic techniques for producing angled lines App 20050030513 - Farrar, Paul A.	2005-02-10
H2 plasma treatment App 20050032352 - Farrar, Paul A.	2005-02-10
Photolithographic techniques for producing angled lines App 20050030516 - Farrar, Paul A.	2005-02-10
Polynorbornene foam insulation for integrated circuits App 20050029663 - Farrar, Paul A.	2005-02-10
Photolithographic techniques for producing angled lines App 20050026086 - Farrar, Paul A.	2005-02-03
Packaging of electronic chips with air-bridge structures App 20050026351 - Farrar, Paul A.	2005-02-03
Techniques to create low K ILD for BEOL App 20050026388 - Bhattacharyya, Arup ; et al.	2005-02-03
Forming submicron integrated-circuit wiring from gold, silver, copper, and other metals Grant 6,849,927 - Farrar February 1, 2	2005-02-01
Selective deposition of solder ball contacts Grant 6,844,253 - Farrar January 18, 2	2005-01-18
Method of alignment for buried structures formed by surface transformation of empty spaces in solid state materials Grant 6,841,408 - Farrar , et al. January 11, 2	2005-01-11
Insulators for high density circuits Grant 6,838,764 - Farrar January 4, 2	2005-01-04
Method of using foamed insulators in three dimensional multichip structures Grant 6,831,370 - Farrar December 14, 2	2004-12-14
Alignment for buried structures formed by surface transformation of empty spaces in solid state materials Grant 6,815,826 - Farrar , et al. November 9, 2	2004-11-09
Structures and methods to enhance copper metallization App 20040217481 - Farrar, Paul A.	2004-11-04
Low capacitance wiring layout and method for making same Grant 6,812,571 - Farrar November 2, 2	2004-11-02
Controlling diffusion in doped semiconductor regions App 20040212046 - Farrar, Paul A. ; et al.	2004-10-28
Multi-chip electronic package and cooling system App 20040207061 - Farrar, Paul A. ; et al.	2004-10-21
Surface barriers for copper and silver interconnects produced by a damascene process App 20040209456 - Farrar, Paul A.	2004-10-21
Low capacitance wiring layout and method for making same App 20040207090 - Farrar, Paul A.	2004-10-21
Aluminum-beryllium alloys for air bridges App 20040192020 - Farrar, Paul A.	2004-09-30
Three-dimensional multichip module Grant 6,790,702 - Farrar September 14, 2	2004-09-14
Microelectronic device package filled with liquid or pressurized gas and associated method of manufacture App 20040175861 - Eldridge, Jerome M. ; et al.	2004-09-09
Integrated circuit and seed layers App 20040169213 - Farrar, Paul A.	2004-09-02
Thermal processing of metal alloys for an improved CMP process in integrated circuit fabrication Grant 6,784,550 - Farrar , et al. August 31, 2	2004-08-31
Low dielectric constant shallow trench isolation Grant 6,781,192 - Farrar August 24, 2	2004-08-24
Low dielectric constant shallow trench isolation Grant 6,780,721 - Farrar August 24, 2	2004-08-24
Buried conductors App 20040159950 - Farrar, Paul A. ; et al.	2004-08-19
Thermal processing of metal alloys for an improved CMP process in integrated circuit fabrication Grant 6,774,035 - Farrar , et al. August 10, 2	2004-08-10
Low dielectric constant STI with SOI devices App 20040152278 - Farrar, Paul A.	2004-08-05
Low dielectric constant shallow trench isolation Grant 6,770,537 - Farrar August 3, 2	2004-08-03
Integrated circuit device structure including foamed polymeric material App 20040145014 - Farrar, Paul A.	2004-07-29
Selective deposition of solder ball contacts App 20040140562 - Farrar, Paul A.	2004-07-22
Low dielectric constant shallow trench isolation Grant 6,756,653 - Farrar June 29, 2	2004-06-29
Apparatus and method for controlling diffusion App 20040121524 - Farrar, Paul A. ; et al.	2004-06-24
Multi-chip electronic package and cooling system Grant 6,747,347 - Farrar , et al. June 8, 2	2004-06-08
Structures and methods to enhance copper metallization Grant 6,743,716 - Farrar June 1, 2	2004-06-01
Surface barriers for copper and silver interconnects produced by a damascene process Grant 6,740,392 - Farrar May 25, 2	2004-05-25
Low dielectric constant shallow trench isolation Grant 6,737,723 - Farrar May 18, 2	2004-05-18
Integrated circuit device structure including foamed polymeric material Grant 6,734,562 - Farrar May 11, 2	2004-05-11
Etch stop in damascene interconnect structure and method of making App 20040066679 - Farrar, Paul A.	2004-04-08
Aluminum-beryllium alloys for air bridges Grant 6,717,191 - Farrar April 6, 2	2004-04-06
Multiple chip stack structure and cooling system App 20040063248 - Farrar, Paul A. ; et al.	2004-04-01
Three terminal magnetic random access memory Grant 6,714,445 - Farrar March 30, 2	2004-03-30
Barrier layer associated with a conductor layer in damascene structures Grant 6,713,875 - Farrar March 30, 2	2004-03-30
Microelectronic device with package with conductive elements and associated method of manufacture Grant 6,709,968 - Eldridge , et al. March 23, 2	2004-03-23
Buried conductors Grant 6,696,746 - Farrar , et al. February 24, 2	2004-02-24
Photolithographic techniques for producing angled lines App 20040029022 - Farrar, Paul A.	2004-02-12
Multiple chip stack structure and cooling system Grant 6,686,654 - Farrar , et al. February 3, 2	2004-02-03
Techniques to create low K ILD for BEOL App 20040014273 - Bhattacharyya, Arup ; et al.	2004-01-22
Low dielectric constant STI with SOI devices Grant 6,677,209 - Farrar January 13, 2	2004-01-13
Microelectronic device package filled with liquid or pressurized gas and associated method of manufacture Grant 6,670,719 - Eldridge , et al. December 30, 2	2003-12-30
Etch stop in damascene interconnect structure and method of making Grant 6,649,522 - Farrar November 18, 2	2003-11-18
Method of alignment for buried structures formed by surface transformation of empty spaces in solid state materials App 20030209814 - Farrar, Paul A. ; et al.	2003-11-13
Internal hydrogen sources for heat conductive packaging of low dielectric constant semiconductor chips, and method of providing hydrogen therefor App 20030209702 - Eldridge, Jerome M. ; et al.	2003-11-13
Methods and structures for metal interconnections in integrated circuits App 20030209775 - Ahn, Kie Y. ; et al.	2003-11-13
Low dielectric constant shallow trench isolation App 20030197234 - Farrar, Paul A.	2003-10-23
Angled edge connections for multichip structures Grant 6,635,960 - Farrar October 21, 2	2003-10-21
Micro C-4 semiconductor die and method for depositing connection site thereon App 20030183677 - Farrar, Paul A. ; et al.	2003-10-02
Micro C-4 semiconductor die and method for depositing connection sites thereon App 20030186485 - Farrar, Paul A. ; et al.	2003-10-02
Method of removing free halogen from a halogenated polymer insulating layer of a semiconductor device and resulting semiconductor device App 20030183952 - Farrar, Paul A.	2003-10-02
Low k interconnect dielectric using surface transformation App 20030181018 - Geusic, Joseph E. ; et al.	2003-09-25
Aluminum based alloy bridge structure and method of forming same Grant 6,624,519 - Farrar September 23, 2	2003-09-23
Testing of multi-chip electronic modules Grant 6,620,638 - Farrar September 16, 2	2003-09-16
Subtractive metallization structure and method of making Grant 6,617,239 - Farrar September 9, 2	2003-09-09
Microelectronic device package with conductive elements and associated method of manufacture Grant 6,614,092 - Eldridge , et al. September 2, 2	2003-09-02
Copper metallurgy in integrated circuits Grant 6,614,099 - Farrar September 2, 2	2003-09-02
Die to die connection method and assemblies and packages including dice so connected App 20030160321 - Cloud, Eugene H. ; et al.	2003-08-28
Method of alignment for buried structures formed by surface transformation of empty spaces in solid state materials App 20030157780 - Farrar, Paul A. ; et al.	2003-08-21
Three terminal magnetic random access memory App 20030137871 - Farrar, Paul A.	2003-07-24
Aluminum-beryllium alloys for air bridges App 20030127741 - Farrar, Paul A.	2003-07-10
Low capacitance wiring layout and method for making same App 20030127745 - Farrar, Paul A.	2003-07-10
Method of alignment for buried structures formed by surface transformation of empty spaces in solid state materials Grant 6,579,738 - Farrar , et al. June 17, 2	2003-06-17
Damascene structure and method of making Grant 6,573,572 - Farrar June 3, 2	2003-06-03
Mask on a polymer having an opening width less than that of the opening in the polymer Grant 6,552,432 - Farrar April 22, 2	2003-04-22
Methods and structures for silver interconnections in integrated circuits Grant 6,541,859 - Forbes , et al. April 1, 2	2003-04-01
Angled edge connections for multichip structures App 20030054618 - Farrar, Paul A.	2003-03-20
Multiple chip stack structure and cooling system App 20030042153 - Farrar, Paul A. ; et al.	2003-03-06
Multi-chip electronic package and cooling system App 20030043543 - Farrar, Paul A. ; et al.	2003-03-06
Chemical mechanical polishing system and process App 20030045206 - Farrar, Paul A.	2003-03-06
Angeled Edge Connections For Multichip Structures App 20030042599 - Farrar, Paul A.	2003-03-06
Angled Edge Connections For Multichip Structures App 20030042616 - Farrar, Paul A.	2003-03-06
Method of alignment for buried structures formed by surface transformation of empty spaces in solid state materials App 20030042627 - Farrar, Paul A. ; et al.	2003-03-06
Internal hydrogen sources for heat conductive packaging of low dielectric constant semiconductor chips, and method of providing hydrogen therefor App 20030038364 - Eldridge, Jerome M. ; et al.	2003-02-27
Die to die connection method and assemblies and packages including dice so connected Grant 6,525,413 - Cloud , et al. February 25, 2	2003-02-25
Three-dimensional multichip module App 20030036218 - Farrar, Paul A.	2003-02-20
Low capacitance wiring layout and method for making same Grant 6,522,011 - Farrar February 18, 2	2003-02-18
Method of using foamed insulators in three dimensional multichip structures App 20030015781 - Farrar, Paul A.	2003-01-23
Etch stop in damascene interconnect structure and method of making Grant 6,509,258 - Farrar January 21, 2	2003-01-21
Three terminal magnetic random access memory Grant 6,510,080 - Farrar January 21, 2	2003-01-21
Etch stop in damascene interconnect structure and method of making App 20030013292 - Farrar, Paul A.	2003-01-16
Conductive implant structure in a dielectric Grant 6,495,919 - Farrar December 17, 2	2002-12-17
Structures and methods to enhance copper metallization App 20020182858 - Farrar, Paul A.	2002-12-05
Structures and methods to enhance copper metallization App 20020182859 - Farrar, Paul A.	2002-12-05
Structures and methods to enhance copper metallization App 20020177302 - Farrar, Paul A.	2002-11-28
Insulators for high density circuits App 20020175405 - Farrar, Paul A.	2002-11-28
Insulators for high density circuits App 20020171124 - Farrar, Paul A.	2002-11-21
Insulators for high density circuits App 20020168872 - Farrar, Paul A.	2002-11-14
Low Dielectric Constant Shallow Trench Isolation App 20020163045 - Farrar, Paul A.	2002-11-07
Low dielectric constant shallow trench isolation App 20020163044 - Farrar, Paul A.	2002-11-07
Low dielectric constant shallow trench isolation App 20020164859 - Farrar, Paul A.	2002-11-07
Low dielectric constant shallow trench isolation App 20020158322 - Farrar, Paul A.	2002-10-31
Barrier layer associated with a conductor layer in damascene structures App 20020132476 - Farrar, Paul A.	2002-09-19
Damascene structure and method of making App 20020130375 - Farrar, Paul A.	2002-09-19
Conductive Structures In Integrated Circuits App 20020127845 - FARRAR, PAUL A.	2002-09-12
Process for providing seed layers for integrated circuit metallurgy App 20020109233 - Farrar, Paul A.	2002-08-15
Implanted conductor and methods of making Grant 6,432,844 - Farrar August 13, 2	2002-08-13
Three-dimensional multichip module Grant 6,433,413 - Farrar August 13, 2	2002-08-13
Low dielectric constant STI with SOI devices App 20020094651 - Farrar, Paul A.	2002-07-18
Low dielectric constant shallow trench isolation Grant 6,413,827 - Farrar July 2, 2	2002-07-02
Method of alignment for buried structures formed by surface transformation of empty spaces in solid state materials App 20020076896 - Farrar, Paul A. ; et al.	2002-06-20
Method of forming buried conductor patterns by surface transformation of empty spaces in solid state materials App 20020070419 - Farrar, Paul A. ; et al.	2002-06-13
Low capacitance wiring layout and method for making same App 20020063333 - Farrar, Paul A.	2002-05-30
Etch stop in damascene interconnect structure and method of making Grant 6,395,632 - Farrar May 28, 2	2002-05-28
Method of forming buried conductor patterns by surface transformation of empty spaces in solid state materials Grant 6,383,924 - Farrar , et al. May 7, 2	2002-05-07
Damascene structure and method of making App 20020048931 - Farrar, Paul A.	2002-04-25
High-Q inductive elements Grant 6,377,156 - Farrar , et al. April 23, 2	2002-04-23
Process for providing seed layers for using aluminum, copper, gold and silver metallurgy process for providing seed layers for using aluminum, copper, gold and silver metallurgy Grant 6,376,370 - Farrar April 23, 2	2002-04-23
Microelectronic device package with conductive elements and associated method of manufacture App 20020037603 - Eldridge, Jerome M. ; et al.	2002-03-28
Subtractive metallization structure and method of making App 20020033538 - Farrar, Paul A.	2002-03-21
Thermal processing of metal alloys for an improved CMP process in integrated circuit fabrication App 20020033498 - Farrar, Paul A. ; et al.	2002-03-21
Micro C-4 semiconductor die and method for depositing connection sites thereon App 20020034581 - Farrar, Paul A. ; et al.	2002-03-21
Reduced power DRAM device and method Grant 6,356,500 - Cloud , et al. March 12, 2	2002-03-12
Etch stop in damascene interconnect structure and method of making App 20020024150 - Farrar, Paul A.	2002-02-28
Forming submicron integrated-circuit wiring from gold, silver, copper, and other metals App 20020020920 - Farrar, Paul A.	2002-02-21
Low dielectric constant shallow trench isolation App 20020019112 - Farrar, Paul A	2002-02-14
Buried conductors App 20020009874 - Farrar, Paul A. ; et al.	2002-01-24
Die to die connection method and assemblies and packages including dice so connected App 20020006686 - Cloud, Eugene H. ; et al.	2002-01-17
Thermal processing of metal alloys for an improved CMP process in integrated circuit fabricatin App 20020006719 - Farrar, Paul A. ; et al.	2002-01-17
Copper metallurgy in integrated circuits App 20020006725 - Farrar, Paul A.	2002-01-17
Dynamic flash memory cells with ultra thin tunnel oxides App 20010053096 - Forbes, Leonard ; et al.	2001-12-20
Conductive implant structure in a dielectric App 20010045659 - Farrar, Paul A.	2001-11-29
Microelectronic device package filled with liquid or pressurized gas and associated method of manufacture App 20010034117 - Eldridge, Jerome M. ; et al.	2001-10-25
High-Q inductive elements App 20010024153 - Farrar, Paul A. ; et al.	2001-09-27
Integrated circuit with oxidation-resistant polymeric layer Grant 6,288,442 - Farrar September 11, 2	2001-09-11
High-q Inductive Elements App 20010016409 - FARRAR, PAUL A. ; et al.	2001-08-23
Selective Deposition Of Solder Ball Contacts App 20010014524 - FARRAR, PAUL A.	2001-08-16
Forming submicron integrated-circuit wiring from gold, silver, copper, and other metals App 20010010403 - Farrar, Paul A.	2001-08-02
Forming submicron integrated-circuit wiring from gold, silver, copper, and other metals Grant 6,211,049 - Farrar April 3, 2	2001-04-03
Methods and structures for silver interconnections in integrated circuits Grant 6,143,655 - Forbes , et al. November 7, 2	2000-11-07
Methods and structures for metal interconnections in integrated circuits Grant 6,121,126 - Ahn , et al. September 19, 2	2000-09-19
Methods and structures for gold interconnections in integrated circuits Grant 6,100,176 - Forbes , et al. August 8, 2	2000-08-08
Method of forming foamed polymeric material for an integrated circuit Grant 6,077,792 - Farrar June 20, 2	2000-06-20
Method for making high-Q inductive elements Grant 6,025,261 - Farrar , et al. February 15, 2	2000-02-15
Method and support structure for air bridge wiring of an integrated circuit Grant 5,994,777 - Farrar November 30, 1	1999-11-30
Methods and structures for gold interconnections in integrated circuits Grant 5,920,121 - Forbes , et al. July 6, 1	1999-07-06
Method of forming a support structure for air bridge wiring of an integrated circuit Grant 5,891,797 - Farrar April 6, 1	1999-04-06
Method and apparatus for a stress relieved electronic module Grant 5,506,753 - Bertin , et al. April 9, 1	1996-04-09
High density memory module Grant 5,313,097 - Haj-Ali-Ahmadi , et al. May 17, 1	1994-05-17
Method for forming dense multilevel interconnection metallurgy for semiconductor devices Grant 4,423,547 - Farrar , et al. January 3, 1	1984-01-03
Method For Making Integrated Circuit Contact Structure Grant 3,830,657 - Farrar August 20, 1	1974-08-20