| Patent | Date |
|---|
Selective Cobalt Deposition On Copper Surfaces
App 20220298625 - YU; Sang-Ho ; et al. | 2022-09-22 |
Silicon mandrel etch after native oxide punch-through
Grant 11,387,115 - Yan , et al. July 12, 2 | 2022-07-12 |
Selective cobalt deposition on copper surfaces
Grant 11,384,429 - Yu , et al. July 12, 2 | 2022-07-12 |
Processing of workpieces with reactive species generated using alkyl halide
Grant 11,387,111 - Yang , et al. July 12, 2 | 2022-07-12 |
Processing of workpieces using ozone gas and hydrogen radicals
Grant 11,315,801 - Zhang , et al. April 26, 2 | 2022-04-26 |
Selective Etch Process Using Hydrofluoric Acid and Ozone Gases
App 20220084839 - Zhang; Qi ; et al. | 2022-03-17 |
Generation of Hydrogen Reactive Species For Processing of Workpieces
App 20220059321 - Zhang; Qi ; et al. | 2022-02-24 |
Silicon oxide selective dry etch process
Grant 11,251,050 - Zhang , et al. February 15, 2 | 2022-02-15 |
Surface Smoothing of Workpieces
App 20210391185 - Zhang; Qi ; et al. | 2021-12-16 |
Spacer open process by dual plasma
Grant 11,195,718 - Sung , et al. December 7, 2 | 2021-12-07 |
Processing of Workpieces Using Ozone Gas and Hydrogen Radicals
App 20210366727 - Zhang; Qi ; et al. | 2021-11-25 |
Selective etch process using hydrofluoric acid and ozone gases
Grant 11,183,397 - Zhang , et al. November 23, 2 | 2021-11-23 |
Selective deposition using methylation treatment
Grant 11,164,742 - Yang , et al. November 2, 2 | 2021-11-02 |
Generation of hydrogen reactive species for processing of workpieces
Grant 11,164,725 - Zhang , et al. November 2, 2 | 2021-11-02 |
Processing of workpieces using hydrogen radicals and ozone gas
Grant 11,164,727 - Xie , et al. November 2, 2 | 2021-11-02 |
Integrated system for semiconductor process
Grant 11,164,767 - Bao , et al. November 2, 2 | 2021-11-02 |
Air Leak Detection In Plasma Processing Apparatus With Separation Grid
App 20210307151 - Meng; Shuang ; et al. | 2021-09-30 |
Methods for depositing metallic iridium and iridium silicide
Grant 11,124,874 - Chung , et al. September 21, 2 | 2021-09-21 |
Surface smoothing of workpieces
Grant 11,107,695 - Zhang , et al. August 31, 2 | 2021-08-31 |
Plasma Processing Apparatus and Methods
App 20210257196 - Ma; Shawming ; et al. | 2021-08-19 |
Surface treatment of silicon or silicon germanium surfaces using organic radicals
Grant 11,062,910 - Yang , et al. July 13, 2 | 2021-07-13 |
Systems and Methods for Removal of Hardmask
App 20210202231 - Sahay; Jeyta Anand ; et al. | 2021-07-01 |
Chamber Seasoning to Improve Etch Uniformity by Reducing Chemistry
App 20210202214 - Zhang; Qi ; et al. | 2021-07-01 |
Ozone treatment for selective silicon nitride etch over silicon
Grant 11,043,393 - Wang , et al. June 22, 2 | 2021-06-22 |
Air leak detection in plasma processing apparatus with separation grid
Grant 11,039,527 - Meng , et al. June 15, 2 | 2021-06-15 |
Method of selective silicon germanium epitaxy at low temperatures
Grant 11,018,003 - Huang , et al. May 25, 2 | 2021-05-25 |
Method of forming conformal epitaxial semiconductor cladding material over a fin field effect transistor (FINFET) device
Grant 11,011,635 - Kung , et al. May 18, 2 | 2021-05-18 |
Selective Etch Process Using Hydrofluoric Acid and Ozone Gases
App 20210118694 - Zhang; Qi ; et al. | 2021-04-22 |
Integration of materials removal and surface treatment in semiconductor device fabrication
Grant 10,964,528 - Yang , et al. March 30, 2 | 2021-03-30 |
Methods For The Treatment Of Workpieces
App 20210082724 - Xie; Ting ; et al. | 2021-03-18 |
Method for processing a workpiece
Grant 10,950,428 - Xie , et al. March 16, 2 | 2021-03-16 |
Chamber seasoning to improve etch uniformity by reducing chemistry
Grant 10,950,416 - Zhang , et al. March 16, 2 | 2021-03-16 |
Silicon Oxide Selective Dry Etch Process
App 20210066088 - Zhang; Qi ; et al. | 2021-03-04 |
Method for Processing a Workpiece
App 20210066074 - Xie; Ting ; et al. | 2021-03-04 |
Surface treatment of carbon containing films using organic radicals
Grant 10,910,228 - Yang , et al. February 2, 2 | 2021-02-02 |
Processing Of Workpieces Using Deposition Process And Etch Process
App 20210020445 - Wang; Shanyu ; et al. | 2021-01-21 |
Processing Of Workpieces Using Hydrogen Radicals And Ozone Gas
App 20210020413 - Xie; Ting ; et al. | 2021-01-21 |
Spacer Open Process By Dual Plasma
App 20210005456 - Sung; Tsai Wen ; et al. | 2021-01-07 |
Surface Pretreatment Process To Improve Quality Of Oxide Films Produced By Remote Plasma
App 20200373129 - Xie; Ting ; et al. | 2020-11-26 |
Selective Deposition Using Methylation Treatment
App 20200350161 - Yang; Michael X. ; et al. | 2020-11-05 |
Surface treatment of silicon and carbon containing films by remote plasma with organic precursors
Grant 10,804,109 - Yang , et al. October 13, 2 | 2020-10-13 |
Air Leak Detection In Plasma Processing Apparatus With Separation Grid
App 20200245444 - Kind Code | 2020-07-30 |
Post Plasma Gas Injection In A Separation Grid
App 20200243305 - Zeng; Weimin ; et al. | 2020-07-30 |
Ozone Treatment for Selective Silicon Nitride Etch Over Silicon
App 20200234969 - Wang; Shanyu ; et al. | 2020-07-23 |
Silicon Mandrel Etch After Native Oxide Punch-through
App 20200203182 - Yan; Chun ; et al. | 2020-06-25 |
Surface Smoothing of Workpieces
App 20200203173 - Zhang; Qi ; et al. | 2020-06-25 |
Silicon oxide selective dry etch process
Grant 10,692,730 - Zhang , et al. | 2020-06-23 |
Integration Of Materials Removal And Surface Treatment In Semiconductor Device Fabrication
App 20200185216 - Yang; Michael X. ; et al. | 2020-06-11 |
Chamber Seasoning to Improve Etch Uniformity by Reducing Chemistry
App 20200161094 - Zhang; Qi ; et al. | 2020-05-21 |
Methods For Depositing Metallic Iridium And Iridium Silicide
App 20200131633 - CHUNG; Hua ; et al. | 2020-04-30 |
Water Vapor Based Fluorine Containing Plasma For Removal Of Hardmask
App 20200135554 - Hou; Li ; et al. | 2020-04-30 |
Ozone for Selective Hydrophilic Surface Treatment
App 20200118813 - Xie; Ting ; et al. | 2020-04-16 |
Oxide Removal From Titanium Nitride Surfaces
App 20200075313 - Wang; Jin J. ; et al. | 2020-03-05 |
Method Of Selective Silicon Germanium Epitaxy At Low Temperatures
App 20200035489 - HUANG; Yi-Chiau ; et al. | 2020-01-30 |
Integrated System For Semiconductor Process
App 20200035525 - BAO; Xinyu ; et al. | 2020-01-30 |
Generation of Hydrogen Reactive Species For Processing of Workpieces
App 20190378692 - Zhang; Qi ; et al. | 2019-12-12 |
Integrated system and method for source/drain engineering
Grant 10,504,717 - Yan , et al. Dec | 2019-12-10 |
Method and apparatus for selective epitaxy
Grant 10,504,723 - Li , et al. Dec | 2019-12-10 |
Processing Of Workpieces With Reactive Species Generated Using Alkyl Halide
App 20190318937 - Yang; Michael X. ; et al. | 2019-10-17 |
Surface Treatment Of Silicon Or Silicon Germanium Surfaces Using Organic Radicals
App 20190304793 - Yang; Michael X. ; et al. | 2019-10-03 |
Low Temperature In-situ Cleaning Method For Epi-chambers
App 20190301011 - BAJAJ; Geetika ; et al. | 2019-10-03 |
Integration of materials removal and surface treatment in semiconductor device fabrication
Grant 10,403,492 - Yang , et al. Sep | 2019-09-03 |
Surface treatment of silicon or silicon germanium surfaces using organic radicals
Grant 10,354,883 - Yang , et al. July 16, 2 | 2019-07-16 |
Surface Treatment Of Carbon Containing Films Using Organic Radicals
App 20190214262 - Yang; Michael X. ; et al. | 2019-07-11 |
Plasma Processing Apparatus and Methods
App 20190198301 - Ma; Shawming ; et al. | 2019-06-27 |
UV radiation system and method for arsenic outgassing control in sub 7nm CMOS fabrication
Grant 10,332,739 - Yan , et al. | 2019-06-25 |
Degassing Chamber For Arsenic Related Processes
App 20190169767 - BAO; Xinyu ; et al. | 2019-06-06 |
Method And Apparatus For Wafer Outgassing Control
App 20190172728 - BAO; Xinyu ; et al. | 2019-06-06 |
Methods for titanium silicide formation using TiCl.sub.4 precursor and silicon-containing precursor
Grant 10,312,096 - Chung , et al. | 2019-06-04 |
Selective process for source and drain formation
Grant 10,276,688 - Bao , et al. | 2019-04-30 |
Self-aligned EPI contact flow
Grant 10,269,647 - Zhang , et al. | 2019-04-23 |
Surface treatment of carbon containing films using organic radicals
Grant 10,269,574 - Yang , et al. | 2019-04-23 |
Co-doping process for n-MOS source drain application
Grant 10,256,322 - Bao , et al. | 2019-04-09 |
Surface Treatment Of Carbon Containing Films Using Organic Radicals
App 20190103280 - Yang; Michael X. ; et al. | 2019-04-04 |
Surface Treatment Of Silicon And Carbon Containing Films By Remote Plasma With Organic Precursors
App 20190103270 - Yang; Michael X. ; et al. | 2019-04-04 |
Surface Treatment Of Silicon Or Silicon Germanium Surfaces Using Organic Radicals
App 20190103279 - Yang; Michael X. ; et al. | 2019-04-04 |
Low Temperature Deposition Of Iridium Containing Films
App 20190078203 - Liu; Feng Q. ; et al. | 2019-03-14 |
Self-aligned process for sub-10nm fin formation
Grant 10,224,421 - Ye , et al. | 2019-03-05 |
Method of epitaxial growth shape control for CMOS applications
Grant 10,205,002 - Bao , et al. Feb | 2019-02-12 |
Integrated System And Method For Source/drain Engineering
App 20190035623 - YAN; Chun ; et al. | 2019-01-31 |
Method to enhance growth rate for selective epitaxial growth
Grant 10,128,110 - Dube , et al. November 13, 2 | 2018-11-13 |
Method and apparatus for wafer outgassing control
Grant 10,115,607 - Bao , et al. October 30, 2 | 2018-10-30 |
Systems and methods for monitoring and characterizing information handling system use behavior
Grant 10,116,012 - Chang , et al. October 30, 2 | 2018-10-30 |
Co-doping Process For N-mos Source Drain Application
App 20180286962 - BAO; Xinyu ; et al. | 2018-10-04 |
Selective Process For Source And Drain Formation
App 20180286961 - BAO; Xinyu ; et al. | 2018-10-04 |
Integrated system and method for source/drain engineering
Grant 10,090,147 - Yan , et al. October 2, 2 | 2018-10-02 |
Self-aligned Process For Sub-10nm Fin Formation
App 20180277649 - YE; Zhiyuan ; et al. | 2018-09-27 |
Method And Apparatus For Low Temperature Selective Epitaxy In A Deep Trench
App 20180230624 - DUBE; Abhishek ; et al. | 2018-08-16 |
Integrated method for wafer outgassing reduction
Grant 10,043,667 - Yan , et al. August 7, 2 | 2018-08-07 |
Self-aligned Epi Contact Flow
App 20180211881 - ZHANG; Ying ; et al. | 2018-07-26 |
Template Formation For Fully Relaxed Sige Growth
App 20180211836 - YAN; Chun ; et al. | 2018-07-26 |
Method And Apparatus For Selective Epitaxy
App 20180190489 - LI; Xuebin ; et al. | 2018-07-05 |
Integrated System And Method For Source/drain Engineering
App 20180174825 - YAN; Chun ; et al. | 2018-06-21 |
Methods For Silicide Formation
App 20180166288 - CHUNG; Hua ; et al. | 2018-06-14 |
Method Of Forming Conformal Epitaxial Semiconductor Cladding Material Over A Fin Field Effect Transistor (finfet) Device
App 20180166570 - KUNG; Sheng-Chin ; et al. | 2018-06-14 |
Method To Enhance Growth Rate For Selective Epitaxial Growth
App 20180158682 - Dube; Abhishek ; et al. | 2018-06-07 |
Self-aligned multiple spacer patterning schemes for advanced nanometer technology
Grant 9,978,596 - Zhang , et al. May 22, 2 | 2018-05-22 |
Method of doped germanium formation
Grant 9,966,438 - Huang , et al. May 8, 2 | 2018-05-08 |
Method for modifying epitaxial growth shape
Grant 9,966,271 - Liu , et al. May 8, 2 | 2018-05-08 |
Method of decontamination of process chamber after in-situ chamber clean
Grant 9,932,670 - Su , et al. April 3, 2 | 2018-04-03 |
Method to grow thin epitaxial films at low temperature
Grant 9,929,055 - Dube , et al. March 27, 2 | 2018-03-27 |
Uv Radiation System And Method For Arsenic Outgassing Control In Sub 7nm Cmos Fabrication
App 20180082835 - YAN; Chun ; et al. | 2018-03-22 |
Method Of Doped Germanium Formation
App 20180083104 - HUANG; Yi-Chiau ; et al. | 2018-03-22 |
Method And Apparatus For Wafer Outgassing Control
App 20180082874 - BAO; Xinyu ; et al. | 2018-03-22 |
Integrated System And Method For Source/drain Engineering
App 20180082836 - YAN; Chun ; et al. | 2018-03-22 |
Selective process for source and drain formation
Grant 9,923,081 - Bao , et al. March 20, 2 | 2018-03-20 |
Degassing Chamber For Arsenic Related Processes
App 20180073162 - BAO; Xinyu ; et al. | 2018-03-15 |
Method Of Contact Formation Between Metal And Semiconductor
App 20180076324 - HUANG; Yi-Chiau ; et al. | 2018-03-15 |
Integrated Method For Wafer Outgassing Reduction
App 20180076031 - YAN; Chun ; et al. | 2018-03-15 |
Integrated System For Semiconductor Process
App 20180076065 - BAO; Xinyu ; et al. | 2018-03-15 |
Method Of Selective Epitaxy
App 20180047569 - HUANG; Yi-Chiau ; et al. | 2018-02-15 |
Method Of Epitaxial Growth Shape Control For Cmos Applications
App 20180033872 - BAO; Xinyu ; et al. | 2018-02-01 |
Method to enhance growth rate for selective epitaxial growth
Grant 9,881,790 - Dube , et al. January 30, 2 | 2018-01-30 |
Selective Cobalt Deposition On Copper Surfaces
App 20170321320 - YU; Sang-Ho ; et al. | 2017-11-09 |
Method Of Selective Etching On Epitaxial Film On Source/drain Area Of Transistor
App 20170323795 - LI; Xuebin ; et al. | 2017-11-09 |
Method For Fabricating Nanowires For Horizontal Gate All Around Devices For Semiconductor Applications
App 20170194430 - WOOD; Bingxi Sun ; et al. | 2017-07-06 |
Method To Grow Thin Epitaxial Films At Low Temperature
App 20170178962 - DUBE; Abhishek ; et al. | 2017-06-22 |
Method For Modifying Epitaxial Growth Shape
App 20170148636 - LIU; Wei ; et al. | 2017-05-25 |
Self-aligned Multiple Spacer Patterning Schemes For Advanced Nanometer Technology
App 20170092494 - ZHANG; Ying ; et al. | 2017-03-30 |
Trench formation with CD less than 10nm for replacement fin growth
Grant 9,553,147 - Zhang , et al. January 24, 2 | 2017-01-24 |
Method Of Selective Epitaxy
App 20170018427 - HUANG; Yi-Chiau ; et al. | 2017-01-19 |
Self-aligned multiple spacer patterning schemes for advanced nanometer technology
Grant 9,548,201 - Zhang , et al. January 17, 2 | 2017-01-17 |
Method to grow thin epitaxial films at low temperature
Grant 9,530,638 - Dube , et al. December 27, 2 | 2016-12-27 |
Fin structure formation by selective etching
Grant 9,530,637 - Zhang , et al. December 27, 2 | 2016-12-27 |
Method for fabricating vertically stacked nanowires for semiconductor applications
Grant 9,508,831 - Zhang , et al. November 29, 2 | 2016-11-29 |
Method To Enhance Growth Rate For Selective Epitaxial Growth
App 20160300715 - DUBE; Abhishek ; et al. | 2016-10-13 |
Method for fabricating vertically stacked nanowires for semiconductor applications
Grant 9,419,107 - Zhang , et al. August 16, 2 | 2016-08-16 |
Trimming silicon fin width through oxidation and etch
Grant 9,412,603 - Zhang , et al. August 9, 2 | 2016-08-09 |
Method to form trench structure for replacement channel growth
Grant 9,401,310 - Zhang , et al. July 26, 2 | 2016-07-26 |
Self aligned replacement Fin formation
Grant 9,373,546 - Zhang , et al. June 21, 2 | 2016-06-21 |
Systems And Methods For Monitoring And Characterizing Information Handling System Use Behavior
App 20160172719 - Chang; Chia-Fa ; et al. | 2016-06-16 |
Method To Grow Thin Epitaxial Films At Low Temperature
App 20160126093 - DUBE; Abhishek ; et al. | 2016-05-05 |
Fin Structure Formation By Selective Etching
App 20160099178 - ZHANG; Ying ; et al. | 2016-04-07 |
Systems and methods for monitoring and characterizing information handling system use behavior
Grant 9,300,015 - Chang , et al. March 29, 2 | 2016-03-29 |
Self Aligned Replacement Fin Formation
App 20160079126 - ZHANG; Ying ; et al. | 2016-03-17 |
Method for fabricating vertically stacked nanowires for semiconductor applications
Grant 9,287,386 - Zhang , et al. March 15, 2 | 2016-03-15 |
Trench Formation With Cd Less Than 10nm For Replacement Fin Growth
App 20160013273 - ZHANG; Ying ; et al. | 2016-01-14 |
Method For Fabricating Vertically Stacked Nanowires For Semiconductor Applications
App 20150372118 - ZHANG; Ying ; et al. | 2015-12-24 |
Method For Fabricating Vertically Stacked Nanowires For Semiconductor Applications
App 20150371868 - ZHANG; Ying ; et al. | 2015-12-24 |
Self-aligned Multiple Spacer Patterning Schemes For Advanced Nanometer Technology
App 20150371852 - ZHANG; Ying ; et al. | 2015-12-24 |
Method For Fabricating Vertically Stacked Nanowires For Semiconductor Applications
App 20150372119 - ZHANG; Ying ; et al. | 2015-12-24 |
Methods for silicon recess structures in a substrate by utilizing a doping layer
Grant 9,214,377 - Zhang , et al. December 15, 2 | 2015-12-15 |
Self aligned replacement fin formation
Grant 9,209,279 - Zhang , et al. December 8, 2 | 2015-12-08 |
Selective Cobalt Deposition On Copper Surfaces
App 20150325446 - YU; Sang-Ho ; et al. | 2015-11-12 |
Hardmask Trimming In Semiconductor Fin Patterning
App 20150228503 - Zhang; Ying ; et al. | 2015-08-13 |
Method To Form Trench Structure For Replacement Channel Growth
App 20150221556 - Zhang; Ying ; et al. | 2015-08-06 |
Trimming Silicon Fin Width Through Oxidation And Etch
App 20150140787 - ZHANG; Ying ; et al. | 2015-05-21 |
Atomic layer deposition apparatus
Grant 9,031,685 - Chin , et al. May 12, 2 | 2015-05-12 |
Methods For Silicon Recess Structures In A Substrate By Utilizing A Doping Layer
App 20150118822 - ZHANG; Ying ; et al. | 2015-04-30 |
Trench Formation With Cd Less Than 10 Nm For Replacement Fin Growth
App 20150099347 - ZHANG; Ying ; et al. | 2015-04-09 |
Trench formation with CD less than 10 NM for replacement Fin growth
Grant 8,993,419 - Zhang , et al. March 31, 2 | 2015-03-31 |
Gas distribution showerhead and method of cleaning
Grant 8,980,379 - Hanawa , et al. March 17, 2 | 2015-03-17 |
Method and apparatus for inducing turbulent flow of a processing chamber cleaning gas
Grant 8,910,644 - Chung , et al. December 16, 2 | 2014-12-16 |
Cu surface plasma treatment to improve gapfill window
Grant 8,764,961 - Luo , et al. July 1, 2 | 2014-07-01 |
Atomic Layer Deposition Apparatus
App 20140130739 - CHIN; Barry L. ; et al. | 2014-05-15 |
Method Of Decontamination Of Process Chamber After In-situ Chamber Clean
App 20140116470 - SU; Jie ; et al. | 2014-05-01 |
Gas delivery apparatus and method for atomic layer deposition
Grant 8,668,776 - Chen , et al. March 11, 2 | 2014-03-11 |
Atomic layer deposition apparatus
Grant 8,626,330 - Chin , et al. January 7, 2 | 2014-01-07 |
Sputtering chamber having auxiliary backside magnet to improve etch uniformity and magnetron producing sustained self sputtering of ruthenium and tantalum
Grant 8,557,094 - Tang , et al. October 15, 2 | 2013-10-15 |
Fabrication Of Light Emitting Diodes (leds) Using A Degas Process
App 20130023079 - Kang; Sang Won ; et al. | 2013-01-24 |
Formation Of Iii-v Materials Using Mocvd With Chlorine Cleans Operations
App 20130005118 - Jun; Sung Won ; et al. | 2013-01-03 |
Enhanced Magnesium Incorporation Into Gallium Nitride Films Through High Pressure Or Ald-type Processing
App 20120315741 - Su; Jie ; et al. | 2012-12-13 |
Integration of ALD tantalum nitride for copper metallization
Grant 8,324,095 - Chung , et al. December 4, 2 | 2012-12-04 |
Enhanced copper growth with ultrathin barrier layer for high performance interconnects
Grant 8,318,266 - Chen , et al. November 27, 2 | 2012-11-27 |
Enhanced copper growth with ultrathin barrier layer for high performance interconnects
Grant 8,293,328 - Chen , et al. October 23, 2 | 2012-10-23 |
Bottom up plating by organic surface passivation and differential plating retardation
Grant 8,293,647 - Wang , et al. October 23, 2 | 2012-10-23 |
Integrated Metrology For Wafer Screening
App 20120234238 - Hsu; Wei-Yung ; et al. | 2012-09-20 |
Cleaning plate for inducing turbulent flow of a processing chamber cleaning glass
Grant D664,170 - Chung , et al. July 24, 2 | 2012-07-24 |
Gap Fill Improvement Methods For Phase-change Materials
App 20120175245 - Ye; Mengqi ; et al. | 2012-07-12 |
Epitaxial Growth Temperature Control In Led Manufacture
App 20120118225 - HSU; Wei-Yung ; et al. | 2012-05-17 |
Gas Distribution Showerhead With High Emissivity Surface
App 20120052216 - Hanawa; Hiroji ; et al. | 2012-03-01 |
Process for selective growth of films during ECP plating
Grant 8,119,525 - Yu , et al. February 21, 2 | 2012-02-21 |
Atomic Layer Deposition Apparatus
App 20120006265 - CHIN; BARRY L. ; et al. | 2012-01-12 |
Methods For Enhanced Processing Chamber Cleaning
App 20120000490 - CHUNG; HUA ; et al. | 2012-01-05 |
Method And Apparatus For Inducing Turbulent Flow Of A Processing Chamber Cleaning Gas
App 20110308551 - Chung; Hua ; et al. | 2011-12-22 |
Apparatus and method for hybrid chemical processing
Grant 8,070,879 - Chen , et al. December 6, 2 | 2011-12-06 |
Method and apparatus for generating a precursor for a semiconductor processing system
Grant 8,062,422 - Chen , et al. November 22, 2 | 2011-11-22 |
Systems and methods for monitoring and characterizing information handling system use behavior
App 20110276810 - Chang; Chia-Fa ; et al. | 2011-11-10 |
Method Of Direct Plating Of Copper On A Ruthenium Alloy
App 20110259750 - Hafezi; Hooman ; et al. | 2011-10-27 |
Atomic layer deposition apparatus
Grant 8,027,746 - Chin , et al. September 27, 2 | 2011-09-27 |
Method Of Decontamination Of Process Chamber After In-situ Chamber Clean
App 20110117728 - Su; Jie ; et al. | 2011-05-19 |
Atomic Layer Deposition Apparatus
App 20110111603 - CHIN; BARRY L. ; et al. | 2011-05-12 |
Sequential Deposition Of Tantalum Nitride Using A Tantalum-containing Precursor And A Nitrogen-containing Precursor
App 20110070730 - Cao; Wei ; et al. | 2011-03-24 |
Gas Distribution Showerhead And Method Of Cleaning
App 20110052833 - HANAWA; HIROJI ; et al. | 2011-03-03 |
Cyclical deposition of refractory metal silicon nitride
Grant 7,892,602 - Chung , et al. February 22, 2 | 2011-02-22 |
Sequential deposition of tantalum nitride using a tantalum-containing precursor and a nitrogen-containing precursor
Grant 7,867,896 - Cao , et al. January 11, 2 | 2011-01-11 |
Atomic layer deposition apparatus
Grant 7,860,597 - Chin , et al. December 28, 2 | 2010-12-28 |
Method for forming tungsten materials during vapor deposition processes
Grant 7,846,840 - Kori , et al. December 7, 2 | 2010-12-07 |
Gas Delivery Apparatus And Method For Atomic Layer Deposition
App 20100247767 - CHEN; LING ; et al. | 2010-09-30 |
Gas delivery apparatus for atomic layer deposition
Grant 7,780,785 - Chen , et al. August 24, 2 | 2010-08-24 |
Gas delivery apparatus for atomic layer deposition
Grant 7,780,788 - Chen , et al. August 24, 2 | 2010-08-24 |
Methods for depositing tungsten layers employing atomic layer deposition techniques
Grant 7,745,333 - Lai , et al. June 29, 2 | 2010-06-29 |
Selective ruthenium deposition on copper materials
Grant 7,737,028 - Wang , et al. June 15, 2 | 2010-06-15 |
Bottom Up Plating By Organic Surface Passivation And Differential Plating Retardation
App 20100130007 - WANG; JENN-YUE ; et al. | 2010-05-27 |
Cu Surface Plasma Treatment To Improve Gapfill Window
App 20100096273 - Luo; Qian ; et al. | 2010-04-22 |
Atomic Layer Deposition Apparatus
App 20100099270 - Chin; Barry L. ; et al. | 2010-04-22 |
Gap Fill Improvement Methods For Phase-change Materials
App 20100096255 - YE; MENGQI ; et al. | 2010-04-22 |
Gas delivery apparatus for atomic layer deposition
Grant 7,699,023 - Chen , et al. April 20, 2 | 2010-04-20 |
Method For Forming Tungsten Materials During Vapor Deposition Processes
App 20100093170 - Kori; Moris ; et al. | 2010-04-15 |
Atomic layer deposition of tantalum-containing materials using the tantalum precursor TAIMATA
Grant 7,691,742 - Marcadal , et al. April 6, 2 | 2010-04-06 |
Integration Of Ald Tantalum Nitride For Copper Metallization
App 20100075494 - Chung; Hua ; et al. | 2010-03-25 |
Method for forming tungsten materials during vapor deposition processes
Grant 7,674,715 - Kori , et al. March 9, 2 | 2010-03-09 |
Atomic layer deposition apparatus
Grant 7,660,644 - Chin , et al. February 9, 2 | 2010-02-09 |
Oxidized barrier layer
Grant 7,659,204 - Tang , et al. February 9, 2 | 2010-02-09 |
Apparatus And Method For Hybrid Chemical Processing
App 20090308318 - Chen; Ling ; et al. | 2009-12-17 |
Selective Cobalt Deposition On Copper Surfaces
App 20090269507 - Yu; Sang-Ho ; et al. | 2009-10-29 |
Formation of composite tungsten films
Grant 7,605,083 - Lai , et al. October 20, 2 | 2009-10-20 |
Chemical precursor ampoule for vapor deposition processes
Grant 7,597,758 - Chen , et al. October 6, 2 | 2009-10-06 |
Atomic layer deposition of barrier materials
Grant 7,595,263 - Chung , et al. September 29, 2 | 2009-09-29 |
Apparatus for hybrid chemical processing
Grant 7,591,907 - Chen , et al. September 22, 2 | 2009-09-22 |
Apparatus and method for generating a chemical precursor
Grant 7,588,736 - Chen , et al. September 15, 2 | 2009-09-15 |
Process For Selective Growth Of Films During Ecp Plating
App 20090215264 - Yu; Jick M. ; et al. | 2009-08-27 |
Atomic Layer Deposition Of Tantalum-containing Materials Using The Tantalum Precursor Taimata
App 20090202710 - Marcadal; Christophe ; et al. | 2009-08-13 |
Sequential Deposition Of Tantalum Nitride Using A Tantalum-containing Precursor And A Nitrogen-containing Precursor
App 20090197406 - Cao; Wei ; et al. | 2009-08-06 |
Method And Apparatus For Generating A Precursor For A Semiconductor Processing System
App 20090151633 - Chen; Ling ; et al. | 2009-06-18 |
Method For Forming Tungsten Materials During Vapor Deposition Processes
App 20090156004 - KORI; MORIS ; et al. | 2009-06-18 |
Chalcogenide Target And Method
App 20090107834 - Ye; Mengqi ; et al. | 2009-04-30 |
Atomic layer deposition of tantalum-containing materials using the tantalum precursor TAIMATA
Grant 7,524,762 - Marcadal , et al. April 28, 2 | 2009-04-28 |
Method and apparatus for generating a precursor for a semiconductor processing system
Grant 7,524,374 - Chen , et al. April 28, 2 | 2009-04-28 |
Sequential deposition of tantalum nitride using a tantalum-containing precursor and a nitrogen-containing precursor
Grant 7,514,358 - Cao , et al. April 7, 2 | 2009-04-07 |
Selective Ruthenium Deposition On Copper Materials
App 20090087982 - WANG; RONGJUN ; et al. | 2009-04-02 |
Apparatus for integration of barrier layer and seed layer
Grant 7,494,908 - Chung , et al. February 24, 2 | 2009-02-24 |
Method for forming tungsten materials during vapor deposition processes
Grant 7,465,666 - Kori , et al. December 16, 2 | 2008-12-16 |
Methods For Depositing Tungsten Layers Employing Atomic Layer Deposition Techniques
App 20080280438 - Lai; Ken Kaung ; et al. | 2008-11-13 |
Apparatus And Method For Hybrid Chemical Processing
App 20080274299 - CHEN; LING ; et al. | 2008-11-06 |
Process For Forming Cobalt And Cobalt Silicide Materials In Copper Contact Applications
App 20080268635 - Yu; Sang-Ho ; et al. | 2008-10-30 |
Oxidized Barrier Layer
App 20080237029 - TANG; Xianmin ; et al. | 2008-10-02 |
Formation Of Composite Tungsten Films
App 20080227291 - LAI; KEN K. ; et al. | 2008-09-18 |
Chemical Precursor Ampoule For Vapor Deposition Processes
App 20080216743 - CHEN; LING ; et al. | 2008-09-11 |
Processing chamber configured for uniform gas flow
Grant 7,422,637 - Ku , et al. September 9, 2 | 2008-09-09 |
Resputtered Copper Seed Layer
App 20080190760 - TANG; XIANMIN ; et al. | 2008-08-14 |
Methods for depositing tungsten layers employing atomic layer deposition techniques
Grant 7,405,158 - Lai , et al. July 29, 2 | 2008-07-29 |
Apparatus and method for hybrid chemical processing
Grant 7,402,210 - Chen , et al. July 22, 2 | 2008-07-22 |
Formation of composite tungsten films
Grant 7,384,867 - Lai , et al. June 10, 2 | 2008-06-10 |
Sputtering Chamber Having Auxiliary Backside Magnet to Improve Etch Uniformity and Magnetron Producing Sustained Self Sputtering of Ruthenium and Tantalum
App 20080083610 - Tang; Xianmin ; et al. | 2008-04-10 |
Integration of barrier layer and seed layer
Grant 7,352,048 - Chung , et al. April 1, 2 | 2008-04-01 |
Gas Delivery Apparatus For Atomic Layer Deposition
App 20080041313 - CHEN; LING ; et al. | 2008-02-21 |
Atomic Layer Deposition Process
App 20080038463 - Chen; Ling ; et al. | 2008-02-14 |
Atomic Layer Deposition Of Tantalum-containing Materials Using The Tantalum Precursor Taimata
App 20080032041 - Marcadal; Christophe ; et al. | 2008-02-07 |
Apparatus For Integration Of Barrier Layer And Seed Layer
App 20070283886 - CHUNG; HUA ; et al. | 2007-12-13 |
Method For Forming Tungsten Materials During Vapor Deposition Processes
App 20070254481 - KORI; MORIS ; et al. | 2007-11-01 |
Method and apparatus of generating PDMAT precursor
Grant 7,270,709 - Chen , et al. September 18, 2 | 2007-09-18 |
Reduction of copper dewetting by transition metal deposition
Grant 7,265,048 - Chung , et al. September 4, 2 | 2007-09-04 |
Atomic Layer Deposition Of Barrier Materials
App 20070190780 - CHUNG; HUA ; et al. | 2007-08-16 |
Integration of ALD/CVD barriers with porous low k materials
Grant 7,244,683 - Chung , et al. July 17, 2 | 2007-07-17 |
Atomic layer deposition of tantalum-containing materials using the tantalum precursor TAIMATA
Grant 7,241,686 - Marcadal , et al. July 10, 2 | 2007-07-10 |
Apparatus And Method For Hybrid Chemical Processing
App 20070151514 - CHEN; LING ; et al. | 2007-07-05 |
Method for forming tungsten materials during vapor deposition processes
Grant 7,235,486 - Kori , et al. June 26, 2 | 2007-06-26 |
Integration Process Of Tungsten Atomic Layer Deposition For Metallization Application
App 20070099415 - Chen; Ling ; et al. | 2007-05-03 |
Atomic layer deposition of tantalum based barrier materials
Grant 7,211,508 - Chung , et al. May 1, 2 | 2007-05-01 |
Apparatus and method for hybrid chemical processing
Grant 7,204,886 - Chen , et al. April 17, 2 | 2007-04-17 |
Method and apparatus for generating a precursor for a semiconductor processing system
App 20070067609 - Chen; Ling ; et al. | 2007-03-22 |
Integrated process for sputter deposition of a conductive barrier layer, especially an alloy of ruthenium and tantalum, underlying copper or copper alloy seed layer
App 20070059502 - Wang; Rongjun ; et al. | 2007-03-15 |
Processing Chamber Configured For Uniform Gas Flow
App 20070044719 - Ku; Vincent ; et al. | 2007-03-01 |
Enhanced Copper Growth With Ultrathin Barrier Layer For High Performance Interconnects
App 20070026147 - CHEN; LING ; et al. | 2007-02-01 |
Enhanced Copper Growth With Ultrathin Barrier Layer For High Performance Interconnects
App 20070003698 - CHEN; LING ; et al. | 2007-01-04 |
Method For Forming Tungsten Materials During Vapor Deposition Processes
App 20060292874 - Kori; Moris ; et al. | 2006-12-28 |
Method of direct plating of copper on a ruthenium alloy
App 20060283716 - Hafezi; Hooman ; et al. | 2006-12-21 |
Apparatus And Method For Generating A Chemical Precursor
App 20060257295 - Chen; Ling ; et al. | 2006-11-16 |
Conductive barrier layer, especially an alloy of ruthenium and tantalum and sputter deposition thereof
App 20060251872 - Wang; Jenn Yue ; et al. | 2006-11-09 |
Atomic Layer Deposition Apparatus
App 20060223286 - Chin; Barry L. ; et al. | 2006-10-05 |
Method and system for controlling the presence of fluorine in refractory metal layers
Grant 7,115,494 - Sinha , et al. October 3, 2 | 2006-10-03 |
Cyclical Deposition Of Refractory Metal Silicon Nitride
App 20060216928 - CHUNG; HUA ; et al. | 2006-09-28 |
Reduction of copper dewetting by transition metal deposition
App 20060199372 - Chung; Hua ; et al. | 2006-09-07 |
Atomic layer deposition apparatus
Grant 7,085,616 - Chin , et al. August 1, 2 | 2006-08-01 |
Cyclical deposition of refractory metal silicon nitride
Grant 7,081,271 - Chung , et al. July 25, 2 | 2006-07-25 |
Integration of ALD tantalum nitride for copper metallization
App 20060148253 - Chung; Hua ; et al. | 2006-07-06 |
Method and system for controlling the presence of fluorine in refractory metal layers
App 20060128132 - Sinha; Ashok ; et al. | 2006-06-15 |
Integration of ALD tantalum nitride for copper metallization
Grant 7,049,226 - Chung , et al. May 23, 2 | 2006-05-23 |
Titanium tantalum nitride silicide layer
Grant 7,041,335 - Chung May 9, 2 | 2006-05-09 |
Method and system for controlling the presence of fluorine in refractory metal layers
Grant 7,033,922 - Kori , et al. April 25, 2 | 2006-04-25 |
Methods for depositing tungsten layers employing atomic layer deposition techniques
App 20060040052 - Fang; Hongbin ; et al. | 2006-02-23 |
Atomic layer deposition of tantalum-containing materials using the tantalum precursor taimata
App 20060019495 - Marcadal; Christophe ; et al. | 2006-01-26 |
Sequential deposition of tantalum nitride using a tantalum-containing precursor and a nitrogen-containing precursor
App 20060019494 - Cao; Wei ; et al. | 2006-01-26 |
Methods for depositing tungsten layers employing atomic layer deposition techniques
App 20060009034 - Lai; Ken Kaung ; et al. | 2006-01-12 |
Formation of composite tungsten films
App 20050287807 - Lai, Ken K. ; et al. | 2005-12-29 |
Sequential deposition of tantalum nitride using a tantalum-containing precursor and a nitrogen-containing precursor
Grant 6,972,267 - Cao , et al. December 6, 2 | 2005-12-06 |
Selective deposition of a barrier layer on a dielectric material
Grant 6,939,801 - Chung , et al. September 6, 2 | 2005-09-06 |
Formation of composite tungsten films
Grant 6,939,804 - Lai , et al. September 6, 2 | 2005-09-06 |
Method and apparatus of generating PDMAT precursor
App 20050189072 - Chen, Ling ; et al. | 2005-09-01 |
Integration of barrier layer and seed layer
Grant 6,936,906 - Chung , et al. August 30, 2 | 2005-08-30 |
Gas delivery apparatus and method for atomic layer deposition
App 20050173068 - Chen, Ling ; et al. | 2005-08-11 |
Gas delivery apparatus and method for atomic layer deposition
Grant 6,916,398 - Chen , et al. July 12, 2 | 2005-07-12 |
Integration of barrier layer and seed layer
App 20050139948 - Chung, Hua ; et al. | 2005-06-30 |
Method and apparatus of generating PDMAT precursor
Grant 6,905,541 - Chen , et al. June 14, 2 | 2005-06-14 |
Integration of ALD tantalum nitride for copper metallization
App 20050106865 - Chung, Hua ; et al. | 2005-05-19 |
Method and system for controlling the presence of fluorine in refractory metal layers
App 20050059241 - Kori, Moris ; et al. | 2005-03-17 |
Method and system for controlling the presence of fluorine in refractory metal layers
Grant 6,855,368 - Kori , et al. February 15, 2 | 2005-02-15 |
System and method to form a composite film stack utilizing sequential deposition techniques
Grant 6,849,545 - Mak , et al. February 1, 2 | 2005-02-01 |
Atomic layer deposition of barrier materials
App 20050009325 - Chung, Hua ; et al. | 2005-01-13 |
Method of film deposition using activated precursor gases
Grant 6,838,125 - Chung , et al. January 4, 2 | 2005-01-04 |
Integration of ALD/CVD barriers with porous low k materials
App 20040256351 - Chung, Hua ; et al. | 2004-12-23 |
Method for depositing refractory metal layers employing sequential deposition techniques
App 20040247788 - Fang, Hongbin ; et al. | 2004-12-09 |
Method for depositing refractory metal layers employing sequential deposition techniques
Grant 6,797,340 - Fang , et al. September 28, 2 | 2004-09-28 |
Method and apparatus for monitoring solid precursor delivery
Grant 6,772,072 - Ganguli , et al. August 3, 2 | 2004-08-03 |
Apparatus and method for hybrid chemical processing
App 20040144311 - Chen, Ling ; et al. | 2004-07-29 |
Titanium tantalum nitride silicide layer
App 20040077183 - Chung, Hua | 2004-04-22 |
Processing chamber configured for uniform gas flow
App 20040069227 - Ku, Vincent ; et al. | 2004-04-15 |
Method of film deposition using activated precursor gases
App 20040018304 - Chung, Hua ; et al. | 2004-01-29 |
Method and apparatus of generating PDMAT precursor
App 20040014320 - Chen, Ling ; et al. | 2004-01-22 |
Formation of composite tungsten films
App 20040014315 - Lai, Ken K. ; et al. | 2004-01-22 |
Formation of titanium nitride films using a cyclical deposition process
App 20040013803 - Chung, Hua ; et al. | 2004-01-22 |
Method and apparatus for monitoring solid precursor delivery
App 20040015300 - Ganguli, Seshadri ; et al. | 2004-01-22 |
Lid assembly for a processing system to facilitate sequential deposition techniques
Grant 6,660,126 - Nguyen , et al. December 9, 2 | 2003-12-09 |
Sequential deposition of tantalum nitride using a tantalum-containing precursor and a nitrogen-containing precursor
App 20030224600 - Cao, Wei ; et al. | 2003-12-04 |
Selective deposition of a barrier layer on a dielectric material
App 20030224578 - Chung, Hua ; et al. | 2003-12-04 |
Atomic layer deposition of tungsten barrier layers using tungsten carbonyls and boranes for copper metallization
App 20030203616 - Chung, Hua ; et al. | 2003-10-30 |
Gas delivery apparatus for atomic layer deposition
App 20030121608 - Chen, Ling ; et al. | 2003-07-03 |
Integration of ALD tantalum nitride and alpha-phase tantalum for copper metallization application
App 20030124262 - Chen, Ling ; et al. | 2003-07-03 |
Cyclical deposition of refractory metal silicon nitride
App 20030108674 - Chung, Hua ; et al. | 2003-06-12 |
Method for depositing refractory metal layers employing sequential deposition techniques
App 20030104126 - Fang, Hongbin ; et al. | 2003-06-05 |
Gas delivery apparatus and method for atomic layer deposition
App 20030079686 - Chen, Ling ; et al. | 2003-05-01 |
Integration of ALD tantalum nitride and alpha-phase tantalum for copper metallization application
App 20030082307 - Chung, Hua ; et al. | 2003-05-01 |
Enhanced copper growth with ultrathin barrier layer for high performance interconnects
App 20030082301 - Chen, Ling ; et al. | 2003-05-01 |
Bifurcated deposition process for depositing refractory metal layers employing atomic layer deposition and chemical vapor deposition techniques
Grant 6,551,929 - Kori , et al. April 22, 2 | 2003-04-22 |
Integration of barrier layer and seed layer
App 20030057526 - Chung, Hua ; et al. | 2003-03-27 |
Integration of barrier layer and seed layer
App 20030057527 - Chung, Hua ; et al. | 2003-03-27 |
Integration of barrier layer and seed layer
App 20030059538 - Chung, Hua ; et al. | 2003-03-27 |
Atomic layer deposition apparatus
App 20030023338 - Chin, Barry L. ; et al. | 2003-01-30 |
System and method to form a composite film stack utilizing sequential deposition techniques
App 20020197863 - Mak, Alfred W. ; et al. | 2002-12-26 |
Lid assembly for a processing system to facilitate sequential deposition techniques
App 20020121342 - Nguyen, Anh N. ; et al. | 2002-09-05 |
Processing chamber and method of distributing process fluids therein to facilitate sequential deposition of films
App 20020121241 - Nguyen, Anh N. ; et al. | 2002-09-05 |
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