Earphone

Kosaka May 4, 2

Patent Grant D918177

U.S. patent number D918,177 [Application Number D/684,239] was granted by the patent office on 2021-05-04 for earphone. This patent grant is currently assigned to SONY CORPORATION. The grantee listed for this patent is SONY CORPORATION. Invention is credited to Mayu Kosaka.


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United States Patent D918,177
Kosaka May 4, 2021

Earphone

Claims

CLAIM The ornamental design for an earphone, as shown and described.
Inventors: Kosaka; Mayu (Tokyo, JP)
Applicant:
Name City State Country Type

SONY CORPORATION

Tokyo

N/A

JP
Assignee: SONY CORPORATION (Tokyo, JP)
Appl. No.: D/684,239
Filed: March 19, 2019

Foreign Application Priority Data

Dec 17, 2018 [CN] 201830731908.9
Dec 17, 2018 [JP] D2018-027440
Dec 17, 2018 [JP] D2018-027441
Dec 17, 2018 [JP] D2018-027442
Dec 26, 2018 [CN] 201830757874.0
Dec 26, 2018 [CN] 201830758005.X
Dec 27, 2018 [CN] 201830761067.6
Dec 27, 2018 [CN] 201830761321.2
Dec 27, 2018 [CN] 201830761547.2
Current U.S. Class: D14/223
Current International Class: 1401
Field of Search: ;D14/223,205 ;381/380,381,374 ;455/90.3,575.1,569.1

References Cited [Referenced By]

U.S. Patent Documents
5809159 September 1998 Lee
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Other References

"Michael young for EOps-EOps noisezerio i+ eco edition in-ear headphones", Website https://www.designboom.com/design/michael-young-for-eops/, Dec. 24, 2010, all design news. cited by applicant.

Primary Examiner: Greene; Paula Allen
Attorney, Agent or Firm: Michael Best and Friedrich LLP

Description



FIG. 1 is a perspective view of a first embodiment of an earphone showing my new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a right side elevational view thereof;

FIG. 4 is a top plan view thereof; and

FIG. 5 is a bottom plan view thereof.

FIG. 6 is a perspective view of a second embodiment of an earphone showing my new design;

FIG. 7 is a front elevational view thereof;

FIG. 8 is a right side elevational view thereof;

FIG. 9 is a top plan view thereof; and

FIG. 10 is a bottom plan view thereof.

FIG. 11 is a perspective view of a third embodiment of an earphone showing my new design;

FIG. 12 is a front elevational view thereof;

FIG. 13 is a right side elevational view thereof;

FIG. 14 is a top plan view thereof; and,

FIG. 15 is a bottom plan view thereof.

The broken lines illustrating portions of the earphone form no part of the claimed design. The dot-dash broken lines define the boundaries of the claimed design and form no part of the claimed design.

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References

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