U.S. patent number D918,177 [Application Number D/684,239] was granted by the patent office on 2021-05-04 for earphone.
This patent grant is currently assigned to SONY CORPORATION. The grantee listed for this patent is SONY CORPORATION. Invention is credited to Mayu Kosaka.
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United States Patent |
D918,177 |
Kosaka |
May 4, 2021 |
Earphone
Claims
CLAIM The ornamental design for an earphone, as shown and
described.
Inventors: |
Kosaka; Mayu (Tokyo,
JP) |
Applicant: |
Name |
City |
State |
Country |
Type |
SONY CORPORATION |
Tokyo |
N/A |
JP |
|
|
Assignee: |
SONY CORPORATION (Tokyo,
JP)
|
Appl.
No.: |
D/684,239 |
Filed: |
March 19, 2019 |
Foreign Application Priority Data
|
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|
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Dec 17, 2018 [CN] |
|
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201830731908.9 |
Dec 17, 2018 [JP] |
|
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D2018-027440 |
Dec 17, 2018 [JP] |
|
|
D2018-027441 |
Dec 17, 2018 [JP] |
|
|
D2018-027442 |
Dec 26, 2018 [CN] |
|
|
201830757874.0 |
Dec 26, 2018 [CN] |
|
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201830758005.X |
Dec 27, 2018 [CN] |
|
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201830761067.6 |
Dec 27, 2018 [CN] |
|
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201830761321.2 |
Dec 27, 2018 [CN] |
|
|
201830761547.2 |
|
Current U.S.
Class: |
D14/223 |
Current International
Class: |
1401 |
Field of
Search: |
;D14/223,205
;381/380,381,374 ;455/90.3,575.1,569.1 |
References Cited
[Referenced By]
U.S. Patent Documents
Foreign Patent Documents
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301558888 |
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302341056 |
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302423379 |
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302916949 |
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303225604 |
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304829575 |
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D1083872 |
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D1379169 |
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D1397866 |
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JP |
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D1516351 |
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Feb 2015 |
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JP |
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D1533201 |
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Sep 2015 |
|
JP |
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D1580979 |
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Jul 2017 |
|
JP |
|
D1598683 |
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Mar 2018 |
|
JP |
|
30-0919082 |
|
Aug 2017 |
|
KR |
|
Other References
"Michael young for EOps-EOps noisezerio i+ eco edition in-ear
headphones", Website
https://www.designboom.com/design/michael-young-for-eops/, Dec. 24,
2010, all design news. cited by applicant.
|
Primary Examiner: Greene; Paula Allen
Attorney, Agent or Firm: Michael Best and Friedrich LLP
Description
FIG. 1 is a perspective view of a first embodiment of an earphone
showing my new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a right side elevational view thereof;
FIG. 4 is a top plan view thereof; and
FIG. 5 is a bottom plan view thereof.
FIG. 6 is a perspective view of a second embodiment of an earphone
showing my new design;
FIG. 7 is a front elevational view thereof;
FIG. 8 is a right side elevational view thereof;
FIG. 9 is a top plan view thereof; and
FIG. 10 is a bottom plan view thereof.
FIG. 11 is a perspective view of a third embodiment of an earphone
showing my new design;
FIG. 12 is a front elevational view thereof;
FIG. 13 is a right side elevational view thereof;
FIG. 14 is a top plan view thereof; and,
FIG. 15 is a bottom plan view thereof.
The broken lines illustrating portions of the earphone form no part
of the claimed design. The dot-dash broken lines define the
boundaries of the claimed design and form no part of the claimed
design.
* * * * *
References