Earphone
Morimoto March 9, 2
U.S. patent number D912,650 [Application Number D/715,158] was granted by the patent office on 2021-03-09 for earphone. This patent grant is currently assigned to SONY CORPORATION. The grantee listed for this patent is SONY CORPORATION. Invention is credited to So Morimoto.
| United States Patent | D912,650 |
| Morimoto | March 9, 2021 |
Earphone
Claims
CLAIM The ornamental design for an earphone, as shown and described.
| Inventors: | Morimoto; So (Saitama, JP) | ||||||||||
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| Applicant: |
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| Assignee: | SONY CORPORATION (Tokyo,
JP) |
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| Appl. No.: | D/715,158 | ||||||||||
| Filed: | November 27, 2019 |
Related U.S. Patent Documents
| Application Number | Filing Date | Patent Number | Issue Date | ||
|---|---|---|---|---|---|
| 29639762 | Mar 8, 2018 | D871365 | |||
Foreign Application Priority Data
| Dec 28, 2017 [JP] | 2017-029452 | |||
| Dec 29, 2017 [CN] | 201730682841.X | |||
| Current U.S. Class: | D14/223; D14/205 |
| Current International Class: | 1401 |
| Field of Search: | ;D14/205,223,218,168,496 ;D24/174,106 ;128/864-867 ;428/179,189 ;181/132 ;381/380,381 ;455/90.3,575.1,569.1 |
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Other References
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Office Action issued in Japanese Application No. D2017-029606, dated May 7, 2019. cited by applicant. |
Primary Examiner: Greene; Paula Allen
Attorney, Agent or Firm: Michael Best and Friedrich LLP
Description
FIG. 1 is a rear elevational view of an earphone showing my new design;
FIG. 2 is a left side elevational view thereof;
FIG. 3 is a top plan view thereof; and
FIG. 4 is a bottom plan view thereof; and,
FIG. 5 is a partially enlarged top plan view thereof along the lines 5-5 and 5'-5' of FIG. 3.
The broken lines illustrating the unclaimed portions of the earphone form no part of the claimed design. Dot-dash broken lines define the boundaries of the claimed design and form no part of the claimed design.
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