Earphone
Morimoto Dec
U.S. patent number D871,365 [Application Number D/639,762] was granted by the patent office on 2019-12-31 for earphone. This patent grant is currently assigned to SONY CORPORATION. The grantee listed for this patent is SONY CORPORATION. Invention is credited to So Morimoto.
| United States Patent | D871,365 |
| Morimoto | December 31, 2019 |
Earphone
Claims
CLAIM The ornamental design for an earphone, as shown and described.
| Inventors: | Morimoto; So (Saitama, JP) | ||||||||||
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| Applicant: |
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| Assignee: | SONY CORPORATION (Tokyo,
JP) |
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| Appl. No.: | D/639,762 | ||||||||||
| Filed: | March 8, 2018 |
Foreign Application Priority Data
| Dec 28, 2017 [JP] | D2017-029452 | |||
| Dec 29, 2017 [CN] | 2017 3 0682841 | |||
| Current U.S. Class: | D14/205; D14/223 |
| Current International Class: | 1401 |
| Field of Search: | ;D14/205,223,218,168,496 ;428/179,180 ;D3/218,215,219 ;D13/107,108,154,184 ;181/129,130,135 ;379/430,431 ;381/380,381 ;455/90.3,575.1,569.1 ;D24/104 ;D9/508,549,564,428 |
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Other References
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Office Action issued in Japanese Application No. D2017-029606, dated May 7, 2019. cited by applicant. |
Primary Examiner: Greene; Paula Allen
Attorney, Agent or Firm: Michael Best and Friedrich LLP
Description
FIG. 1 is a perspective view of an earphone showing my new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a left side elevational view thereof;
FIG. 5 is a top plan view thereof; and,
FIG. 6 is a partially enlarged top plan view thereof along the lines 6-6 and 6'-6' of FIG. 5.
The broken lines illustrating the unclaimed portions of the earphone form no part of the claimed design.
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