U.S. patent number D770,425 [Application Number D/531,365] was granted by the patent office on 2016-11-01 for cap for earphone.
This patent grant is currently assigned to Samsung Electronics Co., Ltd.. The grantee listed for this patent is Samsung Electronics Co., Ltd.. Invention is credited to Hyun-Keun Son.
United States Patent |
D770,425 |
Son |
November 1, 2016 |
Cap for earphone
Claims
CLAIM I claim the ornamental design for a cap for earphone, as
shown and described.
Inventors: |
Son; Hyun-Keun (Seoul,
KR) |
Applicant: |
Name |
City |
State |
Country |
Type |
Samsung Electronics Co., Ltd. |
Suwon-si |
N/A |
KR |
|
|
Assignee: |
Samsung Electronics Co., Ltd.
(Suwon-si, KR)
|
Appl.
No.: |
D/531,365 |
Filed: |
June 25, 2015 |
Foreign Application Priority Data
|
|
|
|
|
Dec 29, 2014 [KR] |
|
|
30-2014-0063752 |
|
Current U.S.
Class: |
D14/223;
D14/205 |
Current International
Class: |
1401 |
Field of
Search: |
;D14/223,205
;D24/106,174 ;128/864,865,868 ;600/25 ;181/130,129,135,106
;379/430,431,420.02,420.03
;381/380,381,373,328,323,321,326,322,361,371,355
;455/90.3,575.1,569.1 |
References Cited
[Referenced By]
U.S. Patent Documents
Primary Examiner: Greene; Paula
Attorney, Agent or Firm: NSIP Law
Description
FIG. 1 is a front perspective view of a cap for earphone showing my
new design;
FIG. 2 is a front view thereof;
FIG. 3 is a rear view thereof;
FIG. 4 is a left-side view thereof;
FIG. 5 is a right-side view thereof;
FIG. 6 is a top view thereof;
FIG. 7 is a bottom view thereof; and,
FIG. 8 is a front perspective view in which the cord is provided in
broken lines to illustrate an example environment.
The broken lines in the figures show portions of the cap for
earphone which form no part of the claimed design.
The jagged uneven broken lines indicate an omission boundary and
form no part of the claimed design.
* * * * *