U.S. patent number D909,989 [Application Number D/704,654] was granted by the patent office on 2021-02-09 for headphones.
This patent grant is currently assigned to DONG GUAN GORSUN ELECTRONICS CO., LTD.. The grantee listed for this patent is DONG GUAN GORSUN ELECTRONICS CO., LTD.. Invention is credited to Qihao Lu.
![](/patent/grant/D0909989/USD0909989-20210209-D00000.png)
![](/patent/grant/D0909989/USD0909989-20210209-D00001.png)
![](/patent/grant/D0909989/USD0909989-20210209-D00002.png)
![](/patent/grant/D0909989/USD0909989-20210209-D00003.png)
![](/patent/grant/D0909989/USD0909989-20210209-D00004.png)
![](/patent/grant/D0909989/USD0909989-20210209-D00005.png)
![](/patent/grant/D0909989/USD0909989-20210209-D00006.png)
![](/patent/grant/D0909989/USD0909989-20210209-D00007.png)
![](/patent/grant/D0909989/USD0909989-20210209-D00008.png)
United States Patent |
D909,989 |
Lu |
February 9, 2021 |
Headphones
Claims
CLAIM The ornamental design for headphones, as shown and described.
Inventors: |
Lu; Qihao (Shantou,
CN) |
Applicant: |
Name |
City |
State |
Country |
Type |
DONG GUAN GORSUN ELECTRONICS CO., LTD. |
Dongguan |
N/A |
CN |
|
|
Assignee: |
DONG GUAN GORSUN ELECTRONICS CO.,
LTD. (Dongguan, CN)
|
Appl.
No.: |
D/704,654 |
Filed: |
September 6, 2019 |
Current U.S.
Class: |
D14/205;
D14/207 |
Current International
Class: |
1401 |
Field of
Search: |
;D14/205,207,223,188,192
;D29/112 ;2/209 ;D21/617 ;446/189 ;381/380,381,374
;455/90.3,575.1,569.1 |
References Cited
[Referenced By]
U.S. Patent Documents
Foreign Patent Documents
|
|
|
|
|
|
|
004669943-0001 |
|
Jan 2018 |
|
EM |
|
006740338-0001 |
|
Aug 2019 |
|
EM |
|
007685730-0001 |
|
Feb 2020 |
|
EM |
|
008160840-0001 |
|
Sep 2020 |
|
EM |
|
Primary Examiner: Greene; Paula Allen
Description
FIG. 1 is a perspective view of headphones showing my new
design;
FIG. 2 is another perspective view thereof;
FIG. 3 is a front elevational view thereof;
FIG. 4 is a rear elevational view thereof;
FIG. 5 is a left side elevational view thereof;
FIG. 6 is a right side elevational view thereof;
FIG. 7 is a. top plan view thereof; and,
FIG. 8 is a bottom plan view thereof.
The broken lines in the drawings depict portions of the headphones
that form no part of the claimed design.
* * * * *