Headphone

Yook

Patent Grant D888008

U.S. patent number D888,008 [Application Number D/661,389] was granted by the patent office on 2020-06-23 for headphone. This patent grant is currently assigned to Harman International Industries, Incorporated. The grantee listed for this patent is Harman International Industries, Incorporated. Invention is credited to Jinwon Yook.


United States Patent D888,008
Yook June 23, 2020

Headphone

Claims

CLAIM The ornamental design for a headphone, as shown and described.
Inventors: Yook; Jinwon (Shenzhen, CN)
Applicant:
Name City State Country Type

Harman International Industries, Incorporated

Northridge

CA

US
Assignee: Harman International Industries, Incorporated (Northridge, CA)
Appl. No.: D/661,389
Filed: August 27, 2018

Current U.S. Class: D14/205
Current International Class: 1401
Field of Search: ;D14/205,188,192,372 ;D29/112 ;2/209 ;181/129,130,135 ;379/430,431 ;381/380,381,370,374 ;455/90.3,575.1,569.1

References Cited [Referenced By]

U.S. Patent Documents
D328461 August 1992 Daido
7072483 July 2006 Lenhard-Backhaus
D573581 July 2008 Gondo
D642554 August 2011 Schaal
D673136 December 2012 Kelly
D675595 February 2013 Cho
D678860 March 2013 Hagelin
D683329 May 2013 Hagelin
D691579 October 2013 Lee
D693791 November 2013 Troy
D739842 September 2015 Birger
D768110 October 2016 Suzuki
D769842 October 2016 Rouffiat
D794602 August 2017 Riggs
D811364 February 2018 Park
D832232 October 2018 Czaniecki et al.
D857652 August 2019 Wang
D858483 September 2019 Hu
D860163 September 2019 Xia
2010/0310093 December 2010 Semcken
Foreign Patent Documents
003718634-0003 Jan 2017 EM
003773324-0002 Feb 2017 EM
005835428-0001 Nov 2018 EM

Other References

JBL E65BTNC Wireless Over-Ear Noise-Cancelling Headphones Specification Sheet, Harman International Industries, Incorporated, 2017. cited by applicant .
Design U.S. Appl. No. 29/615,688, filed Aug. 30, 2017. cited by applicant.

Primary Examiner: Greene; Paula Allen
Attorney, Agent or Firm: Plumsea Law Group, LLC

Description



FIG. 1 is a perspective view of a headphone showing the new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a side elevational view thereof;

FIG. 5 is an opposite side elevational view thereof;

FIG. 6 is a top view thereof; and,

FIG. 7 is a bottom view thereof.

The broken lines immediately adjacent the shaded areas represent the bounds of the claimed design while all other broken lines are directed to environment and are for illustrative purposes only; the broken lines form no part of the claimed design.

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Patent Diagrams and Documents

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