Headphone

Hirano , et al. April 12, 2

Patent Grant D635957

U.S. patent number D635,957 [Application Number D/347,588] was granted by the patent office on 2011-04-12 for headphone. This patent grant is currently assigned to Sony Corporation. Invention is credited to Shinpei Hirano, Rui Morisawa.


United States Patent D635,957
Hirano ,   et al. April 12, 2011

Headphone

Claims

CLAIM The ornamental design for a headphone, as shown and described.
Inventors: Hirano; Shinpei (Tokyo, JP), Morisawa; Rui (Tokyo, JP)
Assignee: Sony Corporation (Tokyo, JP)
Appl. No.: D/347,588
Filed: March 10, 2010

Foreign Application Priority Data

Oct 28, 2009 [JP] D2009-025259
Current U.S. Class: D14/205
Current International Class: 1401
Field of Search: ;D14/205,206,223,192 ;381/380,381,379,370,374 ;181/129,130,135 ;D29/112 ;2/209,423,425 ;128/866 ;24/163R,171 ;379/430,431

References Cited [Referenced By]

U.S. Patent Documents
529176 November 1894 Kleinert
1149806 August 1915 Basch
2946860 July 1960 Jansen et al.
3050739 August 1962 Fogarty
3856007 December 1974 Leight
3943574 March 1976 Yamaguchi et al.
5117464 May 1992 Jones et al.
D388436 December 1997 Segan et al.
D435249 December 2000 Yasutomi
D452492 December 2001 Mori
6724906 April 2004 Naksen et al.
D508483 August 2005 Suzuki
D518474 April 2006 Suzuki
D539267 March 2007 Komiyama
D549688 August 2007 Suzuki
D597070 July 2009 Zheng
Primary Examiner: Greene; Paula
Attorney, Agent or Firm: Rader, Fishman & Grauer PLLC

Description



FIG. 1 is a top, front, right perspective view of a headphone showing our new design;

FIG. 2 is a front, bottom perspective view thereof;

FIG. 3 is a front elevational view thereof;

FIG. 4 is a rear elevational view thereof;

FIG. 5 is a left side elevational view thereof;

FIG. 6 is a right side elevational view thereof; and,

FIG. 7 is a bottom plan view thereof.

Portions in broken lines are for illustrative purposes only and form no part of claimed design.

* * * * *


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