U.S. patent number D635,957 [Application Number D/347,588] was granted by the patent office on 2011-04-12 for headphone.
This patent grant is currently assigned to Sony Corporation. Invention is credited to Shinpei Hirano, Rui Morisawa.
United States Patent |
D635,957 |
Hirano , et al. |
April 12, 2011 |
Headphone
Claims
CLAIM The ornamental design for a headphone, as shown and
described.
Inventors: |
Hirano; Shinpei (Tokyo,
JP), Morisawa; Rui (Tokyo, JP) |
Assignee: |
Sony Corporation (Tokyo,
JP)
|
Appl.
No.: |
D/347,588 |
Filed: |
March 10, 2010 |
Foreign Application Priority Data
|
|
|
|
|
Oct 28, 2009 [JP] |
|
|
D2009-025259 |
|
Current U.S.
Class: |
D14/205 |
Current International
Class: |
1401 |
Field of
Search: |
;D14/205,206,223,192
;381/380,381,379,370,374 ;181/129,130,135 ;D29/112 ;2/209,423,425
;128/866 ;24/163R,171 ;379/430,431 |
References Cited
[Referenced By]
U.S. Patent Documents
Primary Examiner: Greene; Paula
Attorney, Agent or Firm: Rader, Fishman & Grauer
PLLC
Description
FIG. 1 is a top, front, right perspective view of a headphone
showing our new design;
FIG. 2 is a front, bottom perspective view thereof;
FIG. 3 is a front elevational view thereof;
FIG. 4 is a rear elevational view thereof;
FIG. 5 is a left side elevational view thereof;
FIG. 6 is a right side elevational view thereof; and,
FIG. 7 is a bottom plan view thereof.
Portions in broken lines are for illustrative purposes only and
form no part of claimed design.
* * * * *