Earphone component

Description

FIG. 1 is a perspective view of a first embodiment of an earphone component showing my new design;

FIG. 2 is another perspective view thereof;

FIG. 3 is a front elevational view thereof;

FIG. 4 is a rear elevational view thereof;

FIG. 5 is a left side elevational view thereof;

FIG. 6 is a right side elevational view thereof;

FIG. 7 is a top plan view thereof;

FIG. 8 is a bottom plan view thereof;

FIG. 9 is a perspective view of a second embodiment of the earphone component showing my new design;

FIG. 10 is another perspective view thereof;

FIG. 11 is a front elevational view thereof;

FIG. 12 is a rear elevational view thereof;

FIG. 13 is a left side elevational view thereof;

FIG. 14 is a right side elevational view thereof;

FIG. 15 is a top plan view thereof; and,

FIG. 16 is a bottom plan view thereof.

Claims

CLAIM The ornamental design for an earphone component, as shown and described.

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Inventors:	Wu; Junhua (Shenzhen, CN)
Applicant:	Name City State Country Type SHENZHEN XINZHENGYU TECHNOLOGY CO., LTD Shenzhen N/A CN
Assignee:	SHENZHEN XINZHENGYU TECHNOLOGY CO., LTD. (Shenzhen, CN)
Appl. No.:	D/736,113
Filed:	May 27, 2020

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Current U.S. Class:	D14/223
Current International Class:	1401
Field of Search:	;D14/223,205 ;D24/174,182 ;181/135 ;381/380,381,72,313,371,328 ;455/90.3,575.1,569.1

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References Cited [Referenced By]

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Foreign Patent Documents

	001476998-0001		May 2020		EM
	001476998-0002		May 2020		EM
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Primary Examiner: Greene; Paula Allen

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