Bone conduction earphone

Tamura , et al. November 17, 2

Patent Grant D604273

U.S. patent number D604,273 [Application Number D/330,548] was granted by the patent office on 2009-11-17 for bone conduction earphone. This patent grant is currently assigned to NEC Tokin Corporation. Invention is credited to Hajime Harada, Hiroshi Nashihara, Masako Takashima, Mitsuo Tamura, Hiroki Umeda.


United States Patent D604,273
Tamura ,   et al. November 17, 2009

Bone conduction earphone

Claims

CLAIM The ornamental design for a bone conduction earphone, as shown and described.
Inventors: Tamura; Mitsuo (Sendai, JP), Takashima; Masako (Sendai, JP), Nashihara; Hiroshi (Sendai, JP), Harada; Hajime (Sendai, JP), Umeda; Hiroki (Sendai, JP)
Assignee: NEC Tokin Corporation (Sendai-shi, JP)
Appl. No.: D/330,548
Filed: January 9, 2009

Foreign Application Priority Data

Jul 11, 2008 [JP] 2008-017878
Current U.S. Class: D14/223
Current International Class: 1401
Field of Search: ;D14/205,206,223 ;181/129,130 ;379/430 ;381/380,381,151,326,377 ;D24/174

References Cited [Referenced By]

U.S. Patent Documents
1406510 February 1922 Weber
2206807 July 1940 Christe
4972492 November 1990 Tanaka et al.
D340932 November 1993 Yan
D357921 May 1995 Ming-Chin
D444142 June 2001 Gerdom
6839443 January 2005 Fukuda
D512982 December 2005 Rodarte
D523846 June 2006 Lee
7076077 July 2006 Atsumi et al.
D529901 October 2006 Ohta
D531169 October 2006 Tokioka et al.
D542782 May 2007 Pena Angarita
D550656 September 2007 Gerdom et al.
D554627 November 2007 Gondo
D555152 November 2007 Wang
D556741 December 2007 Yeo
D557689 December 2007 Huang
D566687 April 2008 Duarte et al.
D572242 July 2008 Yang
D575269 August 2008 Ledbetter et al.
D578517 October 2008 Pausch
D579005 October 2008 Wilhelmsen
D579444 October 2008 Ewert et al.
D579923 November 2008 Andre et al.
Primary Examiner: Greene; Paula
Attorney, Agent or Firm: Frishauf, Holtz, Goodman & Chick, P.C.

Description



FIG. 1 is a front elevational view of a bone conduction earphone showing our new design;

FIG. 2 is a rear elevational view thereof;

FIG. 3 is a left side elevational view thereof;

FIG. 4 is a right side elevational view thereof;

FIG. 5 is a top plan view thereof;

FIG. 6 is a bottom plan view thereof; and,

FIG. 7 is a front perspective view showing the earphone in use.

The broken line showing in FIG. 7 is included for illustrative purposes only and forms no part of the claimed design.

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