Light emitting diode package
Choi , et al.
U.S. patent number D889,421 [Application Number 35/506,561] was granted by the patent office on 2020-07-07 for light emitting diode package. This patent grant is currently assigned to Seoul Semiconductor Co., Ltd.. The grantee listed for this patent is SEOUL SEMICONDUCTOR CO., LTD.. Invention is credited to SeMin Bang, SeungRi Choi, MyungHee Lee.
| United States Patent | D889,421 |
| Choi , et al. | July 7, 2020 |
Light emitting diode package
Claims
CLAIM The ornamental design for light emitting diode package, as shown and described.
| Inventors: | Choi; SeungRi (Ansan-si, KR), Bang; SeMin (Ansan-si, KR), Lee; MyungHee (Ansan-si, KR) | ||||||||||
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| Applicant: |
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| Assignee: | Seoul Semiconductor Co., Ltd.
(Ansan-si, KR) |
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| Appl. No.: | 35/506,561 | ||||||||||
| Filed: | October 12, 2018 |
International Registration
| Int'l Reg. No. | Int'l Reg. Date | Int'l Reg. Publication Date |
Hague Int'l Filing Date |
|---|---|---|---|
| DM/103805 | Oct 12, 2018 | Apr 12, 2019 | Oct 12, 2018 |
Foreign Application Priority Data
| Apr 13, 2018 [KR] | 30-2018-0017547 | |||
| Current U.S. Class: | D13/180 |
| Current International Class: | 1303 |
| Field of Search: | ;D10/106.1,114.4 ;D13/180,182 ;D26/2,25,35,74,80,81 |
References Cited [Referenced By]
U.S. Patent Documents
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| 2007/0114555 | May 2007 | Takemoto |
| 2016/0300987 | October 2016 | Sanga |
Attorney, Agent or Firm: H.C. Park & Associates, PLC
Description
1. Light emitting diode package
1.1 : Perspective
1.2 : Front
1.3 : Back
1.4 : Left
1.5 : Right
1.6 : Top
1.7 : Bottom
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