Package for light emitting diode

Description

FIG. 1 is a perspective view of a package for light emitting diode showing my new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a left side elevational view, the right elevational view being a mirror image thereof;

FIG. 5 is a top plan view thereof; and,

FIG. 6 is a bottom plan view thereof.

The broken lines represent unclaimed subject matter.

Claims

CLAIM The ornamental design for package for light emitting diode, as shown and described.

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Inventors:	Cho; Jae Ho (Seoul, KR)
Assignee:	Seoul Semiconductor Co. Ltd. (Seoul, KR)
Appl. No.:	D/262,576
Filed:	July 5, 2006

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Current U.S. Class:	D13/180
Current International Class:	1303
Field of Search:	;D13/179 ;257/80,81,88,89,95,100,98,99 ;313/483,498,500 ;362/555,800 ;D26/2

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References Cited [Referenced By]

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U.S. Patent Documents

D476960	July 2003	Fukasawa et al.
D491538	June 2004	Ishida
D495668	September 2004	Kim et al.
D528999	September 2006	Cho et al.
D529452	October 2006	Kim et al.
D530684	October 2006	Tzeng
D531141	October 2006	Tzeng
D533146	December 2006	Wu et al.
D534132	December 2006	Yoon
D541759	May 2007	Shin et al.
7242035	July 2007	Kim et al.
D548704	August 2007	Wu et al.
2002/0149314	October 2002	Takahashi et al.
2003/0160256	August 2003	Durocher et al.
2007/0029564	February 2007	Han et al.

Foreign Patent Documents

	D1171213		Feb 2003		JP
	30-0147175		Jun 2006		KR
	00555458		Sep 2003		TW

Primary Examiner: Sikder; Selina
Attorney, Agent or Firm: Townsend and Townsend and Crew LLP