Headphone

Description

FIG. 1 is a perspective view of a first embodiment of a headphone showing our new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a left side elevational view thereof;

FIG. 5 is a top plan view thereof; and

FIG. 6 is a bottom plan view thereof.

FIG. 7 is a perspective view thereof wherein the headphone housing is in a first alternate position;

FIG. 8 is a perspective view thereof wherein the headphone housing is in a second alternate position;

FIG. 9 is a perspective view thereof wherein the headphone housing is in a third alternate position;

FIG. 10 is a perspective view thereof wherein the headphone housing is in a fourth alternate position;

FIG. 11 is a rear elevational view thereof wherein the headphone housing is in the first alternate position;

FIG. 12 is a rear elevational view thereof wherein the headphone housing is in the second alternate position; and

FIG. 13 is a rear elevational view thereof wherein the headphone housing is in the third alternate position.

FIG. 14 is a rear elevational view thereof wherein the headphone housing is in the fourth alternate position.

FIG. 15 is a perspective view of a second embodiment of a headphone showing our new design;

FIG. 16 is a front elevational view thereof;

FIG. 17 is a rear elevational view thereof;

FIG. 18 is a left side elevational view thereof;

FIG. 19 is a top plan view thereof; and

FIG. 20 is a bottom plan view thereof.

FIG. 21 is a perspective view thereof wherein the headphone housing is in a first alternate position;

FIG. 22 is a perspective view thereof wherein the headphone housing is in a second alternate position;

FIG. 23 is a perspective view thereof wherein the headphone housing is in a third alternate position;

FIG. 24 is a perspective view thereof wherein the headphone housing is in a fourth alternate position;

FIG. 25 is a rear elevational view thereof wherein the headphone housing is in the first alternate position;

FIG. 26 is a rear elevational view thereof wherein the headphone housing is in the second alternate position;

FIG. 27 is a rear elevational view thereof wherein the headphone housing is in the third alternate position; and

FIG. 28 is a rear elevational view thereof wherein the headphone housing is in the fourth alternate position.

FIG. 29 is a perspective view of a third embodiment of a headphone showing our new design;

FIG. 30 is a front elevational view thereof;

FIG. 31 is a rear elevational view thereof;

FIG. 32 is a left side elevational view thereof;

FIG. 33 is a top plan view thereof; and

FIG. 34 is a bottom plan view thereof.

FIG. 35 is a perspective view thereof wherein the headphone housing is in a first alternate position;

FIG. 36 is a perspective view thereof wherein the headphone housing is in a second alternate position;

FIG. 37 is a perspective view thereof wherein the headphone housing is in a third alternate position;

FIG. 38 is a perspective view thereof wherein the headphone housing is in a fourth alternate position;

FIG. 39 is a rear elevational view thereof wherein the headphone housing is in the first alternate position;

FIG. 40 is a rear elevational view thereof wherein the headphone housing is in the second alternate position;

FIG. 41 is a rear elevational view thereof wherein the headphone housing is in the third alternate position; and

FIG. 42 is a rear elevational view thereof wherein the headphone housing is in the fourth alternate position.

FIG. 43 is a right side elevational view of the embodiment of FIG. 1;

FIG. 44 is a right side elevational view of the embodiment of FIG. 15; and,

FIG. 45 is a right side elevational view of the embodiment of FIG. 29.

The broken lines illustrating unclaimed portions of the headphone form no part of the claimed design. Dot-dash broken lines illustrating boundaries of the claimed design form no part of the claimed design.

Claims

CLAIM The ornamental design for a headphone, as shown.

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Inventors:	Ito; Tomohiro (Tokyo, JP), Nakamura; Yosuke (Tokyo, JP), Shiomi; Shunsuke (Tokyo, JP), Yamamoto; Hideto (Kanagawa, JP), Otani; Yusuke (Kanagawa, JP), Katsumata; Kenji (Chiba, JP)
Applicant:	Name City State Country Type Sony Corporation Tokyo N/A JP
Assignee:	SONY CORPORATION (Tokyo, JP)
Appl. No.:	D/465,753
Filed:	August 30, 2013

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Current U.S. Class:	D14/205
Current International Class:	1401
Field of Search:	;D14/205,206,223 ;181/129,130,135 ;379/430,431 ;381/380,381,374,375,74 ;455/90.3,575.1 ;D29/112 ;2/209

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References Cited [Referenced By]

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Primary Examiner: Greene; Paula Allen
Attorney, Agent or Firm: Michael Best and Friedrich LLP