Headset

Description

FIG. 1 is a perspective view of a headset showing my new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a left side elevational view thereof;

FIG. 5 is a right side elevational view thereof;

FIG. 6 is a top plan view thereof; and

FIG. 7 is a bottom plan view thereof.

FIG. 8 is a perspective view of another embodiment of a headset showing my new design;

FIG. 9 is a front elevational view thereof;

FIG. 10 is a rear elevational view thereof;

FIG. 11 is a left side elevational view thereof;

FIG. 12 is a right side elevational view thereof;

FIG. 13 is a top plan view thereof; and,

FIG. 14 is a bottom plan view thereof.

Portions in broken lines are for illustrative purposes only and form no part of claimed design.

Claims

CLAIM The ornamental design for a headset, as shown and described.

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Inventors:	Iseki; Daisuke (Tokyo, JP)
Assignee:	Sony Corporation (Tokyo, JP)
Appl. No.:	D/347,988
Filed:	September 3, 2010

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Foreign Application Priority Data

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Mar 5, 2010 [JP]			D2010-005397
Mar 5, 2010 [JP]			D2010-005420

Current U.S. Class:	D14/205
Current International Class:	1401
Field of Search:	;D14/205,206,223,142,192,188,249,250 ;181/129,130,135 ;379/430,431 ;381/380,381,382,370,375 ;455/90.3,569.1,575.2 ;2/209,423 ;D29/112,122

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References Cited [Referenced By]

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Foreign Patent Documents

	D1124110		Oct 2001		JP
	D1363194		Jun 2009		JP

Primary Examiner: Greene; Paula
Attorney, Agent or Firm: Rader, Fishman & Grauer PLLC