U.S. patent number D770,992 [Application Number D/544,070] was granted by the patent office on 2016-11-08 for electrode cover for a plasma processing apparatus.
This patent grant is currently assigned to Hitachi High-Technologies Corporation. The grantee listed for this patent is Hitachi High-Technologies Corporation. Invention is credited to Kohei Sato, Susumu Tauchi, Takashi Uemura.
United States Patent |
D770,992 |
Tauchi , et al. |
November 8, 2016 |
Electrode cover for a plasma processing apparatus
Claims
CLAIM The ornamental design for an electrode cover for a plasma
processing apparatus, as shown and described.
Inventors: |
Tauchi; Susumu (Tokyo,
JP), Uemura; Takashi (Tokyo, JP), Sato;
Kohei (Tokyo, JP) |
Applicant: |
Name |
City |
State |
Country |
Type |
Hitachi High-Technologies Corporation |
Minato-ku, Tokyo |
N/A |
JP |
|
|
Assignee: |
Hitachi High-Technologies
Corporation (Tokyo, JP)
|
Appl.
No.: |
D/544,070 |
Filed: |
October 30, 2015 |
Foreign Application Priority Data
|
|
|
|
|
Jun 12, 2015 [JP] |
|
|
2015-013037 |
|
Current U.S.
Class: |
D13/182 |
Current International
Class: |
1303 |
Field of
Search: |
;D13/158-177,182,184
;204/286.1,297.1 ;205/118,123
;200/1R,5R,52R,315,310,6A,302.1,308,314,317,11R,16B |
References Cited
[Referenced By]
U.S. Patent Documents
Foreign Patent Documents
|
|
|
|
|
|
|
D1184862 |
|
Sep 2003 |
|
JP |
|
D1208795 |
|
Jun 2004 |
|
JP |
|
D1210214 |
|
Jun 2004 |
|
JP |
|
D1267920 |
|
Apr 2006 |
|
JP |
|
D1438663 |
|
Apr 2012 |
|
JP |
|
D1444749 |
|
Jun 2012 |
|
JP |
|
D1444992 |
|
Jun 2012 |
|
JP |
|
Primary Examiner: Oswecki; Elizabeth J
Attorney, Agent or Firm: Crowell & Moring LLP
Description
FIG. 1 is a front, top and right side enlarged perspective view of
an electrode cover for a plasma processing apparatus showing our
new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a left side elevational view thereof;
FIG. 5 is a right side elevational view thereof;
FIG. 6 is a top plan view thereof;
FIG. 7 is a bottom plan view thereof;
FIG. 8 is a cross-sectional view taken along line 8-8 of FIG. 6;
and,
FIG. 9 is an enlarged portion view taken along line 9-9 of FIG.
8.
* * * * *