Earphone

Miyake , et al. May 19, 2

Patent Grant D729776

U.S. patent number D729,776 [Application Number D/483,330] was granted by the patent office on 2015-05-19 for earphone. This patent grant is currently assigned to Sony Corporation. The grantee listed for this patent is Sony Corporation. Invention is credited to Ryo Miyake, Kiyoshi Oota.


United States Patent D729,776
Miyake ,   et al. May 19, 2015

Earphone

Claims

CLAIM The ornamental design for an earphone, as shown and described.
Inventors: Miyake; Ryo (Tokyo, JP), Oota; Kiyoshi (Tokyo, JP)
Applicant:
Name City State Country Type

Sony Corporation

Tokyo

N/A

JP
Assignee: Sony Corporation (Tokyo, JP)
Appl. No.: D/483,330
Filed: February 27, 2014

Foreign Application Priority Data

Aug 29, 2013 [JP] D2013-019941
Aug 29, 2013 [JP] D2013-019942
Aug 29, 2013 [JP] D2013-019943
Aug 30, 2013 [CN] 2013 3 0418953
Current U.S. Class: D14/223; D14/205
Current International Class: 1401
Field of Search: ;D14/223,205 ;D24/174 ;181/129,130,135 ;379/430,431 ;381/380,381 ;455/90.3,575.1

References Cited [Referenced By]

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Foreign Patent Documents
D1437170 Apr 2012 JP
Primary Examiner: Greene; Paula
Attorney, Agent or Firm: Fishman Stewart Yamaguchi PLLC

Description



FIG. 1 is a perspective view of a first embodiment of an earphone showing our new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a left side elevational view thereof;

FIG. 5 is a right side elevational view thereof;

FIG. 6 is a top plan view thereof; and

FIG. 7 is a bottom plan view thereof.

FIG. 8 is a cross sectional view thereof along the lines 8-8 and 8'-8' of FIG. 5.

FIG. 9 is a cross sectional view thereof along the lines 9-9 and 9'-9'of FIG. 5.

FIG. 10 is a perspective view of a second embodiment of an earphone showing our new design;

FIG. 11 is a front elevational view thereof;

FIG. 12 is a rear elevational view thereof;

FIG. 13 is a left side elevational view thereof;

FIG. 14 is a right side elevational view thereof;

FIG. 15 is a top plan view thereof; and

FIG. 16 is a bottom plan view thereof.

FIG. 17 is a cross sectional view thereof along the lines 17-17 and 17'-17' of FIG. 14.

FIG. 18 is a cross sectional view thereof along the lines 18-18 and 18'-18'of FIG. 14.

FIG. 19 is a perspective view of a third embodiment of an earphone showing our new design;

FIG. 20 is a front elevational view thereof;

FIG. 21 is a rear elevational view thereof;

FIG. 22 is a left side elevational view thereof;

FIG. 23 is a right side elevational view thereof;

FIG. 24 is a top plan view thereof; and

FIG. 25 is a bottom plan view thereof.

FIG. 26 is a cross sectional view thereof along the lines 26-26 and 26'-26' of FIG. 23; and,

FIG. 27 is a cross sectional view thereof along the lines 27-27 and 27'-27'of FIG. 23.

The broken lines forms no part of the claimed design.

* * * * *


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