U.S. patent number D729,776 [Application Number D/483,330] was granted by the patent office on 2015-05-19 for earphone.
This patent grant is currently assigned to Sony Corporation. The grantee listed for this patent is Sony Corporation. Invention is credited to Ryo Miyake, Kiyoshi Oota.
United States Patent |
D729,776 |
Miyake , et al. |
May 19, 2015 |
Earphone
Claims
CLAIM The ornamental design for an earphone, as shown and
described.
Inventors: |
Miyake; Ryo (Tokyo,
JP), Oota; Kiyoshi (Tokyo, JP) |
Applicant: |
Name |
City |
State |
Country |
Type |
Sony Corporation |
Tokyo |
N/A |
JP |
|
|
Assignee: |
Sony Corporation (Tokyo,
JP)
|
Appl.
No.: |
D/483,330 |
Filed: |
February 27, 2014 |
Foreign Application Priority Data
|
|
|
|
|
Aug 29, 2013 [JP] |
|
|
D2013-019941 |
Aug 29, 2013 [JP] |
|
|
D2013-019942 |
Aug 29, 2013 [JP] |
|
|
D2013-019943 |
Aug 30, 2013 [CN] |
|
|
2013 3 0418953 |
|
Current U.S.
Class: |
D14/223;
D14/205 |
Current International
Class: |
1401 |
Field of
Search: |
;D14/223,205 ;D24/174
;181/129,130,135 ;379/430,431 ;381/380,381 ;455/90.3,575.1 |
References Cited
[Referenced By]
U.S. Patent Documents
Foreign Patent Documents
Primary Examiner: Greene; Paula
Attorney, Agent or Firm: Fishman Stewart Yamaguchi PLLC
Description
FIG. 1 is a perspective view of a first embodiment of an earphone
showing our new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a left side elevational view thereof;
FIG. 5 is a right side elevational view thereof;
FIG. 6 is a top plan view thereof; and
FIG. 7 is a bottom plan view thereof.
FIG. 8 is a cross sectional view thereof along the lines 8-8 and
8'-8' of FIG. 5.
FIG. 9 is a cross sectional view thereof along the lines 9-9 and
9'-9'of FIG. 5.
FIG. 10 is a perspective view of a second embodiment of an earphone
showing our new design;
FIG. 11 is a front elevational view thereof;
FIG. 12 is a rear elevational view thereof;
FIG. 13 is a left side elevational view thereof;
FIG. 14 is a right side elevational view thereof;
FIG. 15 is a top plan view thereof; and
FIG. 16 is a bottom plan view thereof.
FIG. 17 is a cross sectional view thereof along the lines 17-17 and
17'-17' of FIG. 14.
FIG. 18 is a cross sectional view thereof along the lines 18-18 and
18'-18'of FIG. 14.
FIG. 19 is a perspective view of a third embodiment of an earphone
showing our new design;
FIG. 20 is a front elevational view thereof;
FIG. 21 is a rear elevational view thereof;
FIG. 22 is a left side elevational view thereof;
FIG. 23 is a right side elevational view thereof;
FIG. 24 is a top plan view thereof; and
FIG. 25 is a bottom plan view thereof.
FIG. 26 is a cross sectional view thereof along the lines 26-26 and
26'-26' of FIG. 23; and,
FIG. 27 is a cross sectional view thereof along the lines 27-27 and
27'-27'of FIG. 23.
The broken lines forms no part of the claimed design.
* * * * *