Light emitting diode package
Hsu October 9, 2
U.S. patent number D668,623 [Application Number D/406,960] was granted by the patent office on 2012-10-09 for light emitting diode package. This patent grant is currently assigned to Lextar Electronics Corp.. Invention is credited to Hui-Kai Hsu.
| United States Patent | D668,623 |
| Hsu | October 9, 2012 |
Light emitting diode package
Claims
CLAIM I claim the ornamental design for light emitting diode package, as shown and described.
| Inventors: | Hsu; Hui-Kai (Taitung, TW) |
|---|---|
| Assignee: | Lextar Electronics Corp.
(Hsinchu, TW) |
| Appl. No.: | D/406,960 |
| Filed: | November 21, 2011 |
Foreign Application Priority Data
| Jun 29, 2011 [TW] | 100303270 | |||
| Current U.S. Class: | D13/180 |
| Current International Class: | 1303 |
| Field of Search: | ;D13/180 ;D26/2 ;257/79,80,81,88,89,95,98,99,100,E33.058 ;313/483,498,500 ;362/555,800 |
References Cited [Referenced By]
U.S. Patent Documents
| D622680 | August 2010 | Lin et al. |
| D627310 | November 2010 | Lin et al. |
| D634284 | March 2011 | Ko et al. |
| D640994 | July 2011 | Lin et al. |
| D640995 | July 2011 | Lin et al. |
| D640996 | July 2011 | Lee et al. |
| D644617 | September 2011 | Nishino et al. |
| D645425 | September 2011 | Lin et al. |
| D656106 | March 2012 | Hsu |
| D656107 | March 2012 | Hsu |
| 2007/0063213 | March 2007 | Hsieh et al. |
| 2007/0096114 | May 2007 | Aoki et al. |
| 2011/0127566 | June 2011 | Yoon |
| 2011/0186873 | August 2011 | Emerson |
| 2011/0241030 | October 2011 | Kim |
Attorney, Agent or Firm: Schmeiser Olsen & Watts LLP
Description
FIG. 1 is a front perspective view of light emitting diode package showing the new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a left side elevational view thereof;
FIG. 5 is a right side elevational view thereof;
FIG. 6 is a top plan view thereof; and,
FIG. 7 is a bottom plan view thereof.
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