Package of a light emitting diode

Description

FIG. 1 is a perspective view of package of a light emitting diode showing my new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a left side elevational view thereof;

FIG. 5 is a right side elevational view thereof;

FIG. 6 is a top plan view thereof; and,

FIG. 7 is a bottom plan view thereof.

Claims

CLAIM The ornamental design for package of a light emitting diode, as shown and described.

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Inventors:	Lin; Chen-Hsiu (Taipei, TW), Lee; Yi-Fei (Taipei, TW), Lin; Chang-Yen (Taipei, TW)
Assignee:	Silitek Electronic (Guangzhou) Go., Ltd. (Guangzhou, CN) Lite-On Technology Corp. (Taipei, TW)
Appl. No.:	D/347,322
Filed:	December 4, 2009

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Current U.S. Class:	D13/180
Current International Class:	1303
Field of Search:	;D13/180 ;D26/2 ;257/79,80,81,88,89,95,98,99,100,E33.058 ;313/483,498,500 ;362/555,800

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References Cited [Referenced By]

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U.S. Patent Documents

D559803	January 2008	Lee
D566055	April 2008	Kim
D578969	October 2008	Kobayakawa
D580891	November 2008	Sung et al.
D595674	July 2009	Wang et al.
D595675	July 2009	Wang et al.
D597971	August 2009	Kobayakawa et al.
D599750	September 2009	Kim et al.
2008/0185605	August 2008	Wada et al.
2009/0101897	April 2009	Murphy et al.

Primary Examiner: Sikder; Selina
Attorney, Agent or Firm: Rosenberg, Klein & Lee