Packing structure of light-emitting diode

Description

FIG. 1 is a perspective view of a "packing structure of light-emitting diode" showing our new design;

FIG. 2 is a front view thereof;

FIG. 3 is a rear view thereof;

FIG. 4 is a left side view thereof;

FIG. 5 is a right side view thereof;

FIG. 6 is a top view thereof; and,

FIG. 7 is a bottom view thereof.

The broken lines showing portion of the packing structure of light emitting diode is for illustrative purposes only and form no part of the claimed design.

Claims

CLAIM The ornamental design for a "packing structure of light-emitting diode," as shown and described.

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Inventors:	Lin; Chen-Hsiu (Tucheng, TW), Lee; Yi-Fei (Taipei, TW), Chen; Wen-Nan (Yilan, TW)
Assignee:	Lite-On Technology Corporation (Taipei, TW)
Appl. No.:	D/375,739
Filed:	September 27, 2010

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Current U.S. Class:	D13/180
Current International Class:	1303
Field of Search:	;D13/180 ;257/79,80,81,88,89,95,98,99,100,E33.058 ;313/483,498,500 ;362/555,800

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References Cited [Referenced By]

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U.S. Patent Documents

D475028	May 2003	Hori et al.
D475355	June 2003	Hori et al.
D475982	June 2003	Hori et al.
D562272	February 2008	Su et al.
D578084	October 2008	Kobayakawa
D578969	October 2008	Kobayakawa
D595674	July 2009	Wang et al.
D595675	July 2009	Wang et al.
D608309	January 2010	Kim
D622680	August 2010	Lin et al.
D627310	November 2010	Lin et al.
D628541	December 2010	Lin
D634284	March 2011	Ko et al.

Primary Examiner: Sikder; Selina
Attorney, Agent or Firm: Rabin & Berdo, P.C.