U.S. patent number D652,395 [Application Number D/371,213] was granted by the patent office on 2012-01-17 for semiconductor manufacturing equipment.
This patent grant is currently assigned to Hitachi Kokusai Electric Inc.. Invention is credited to Yukinori Aburatani, Satoshi Aizawa, Mitsuhiro Nagata, Seiyo Nakashima, Takashi Nogami, Masakazu Shimada, Shinobu Sugiura, Tomoyuki Yamada.
United States Patent |
D652,395 |
Shimada , et al. |
January 17, 2012 |
Semiconductor manufacturing equipment
Claims
CLAIM We claim the ornamental design for a semiconductor
manufacturing equipment, as shown and described.
Inventors: |
Shimada; Masakazu (Toyama,
JP), Nogami; Takashi (Toyama, JP), Aizawa;
Satoshi (Toyama, JP), Nakashima; Seiyo (Toyama,
JP), Yamada; Tomoyuki (Toyama, JP),
Sugiura; Shinobu (Toyama, JP), Aburatani;
Yukinori (Toyama, JP), Nagata; Mitsuhiro
(Kodaira, JP) |
Assignee: |
Hitachi Kokusai Electric Inc.
(Tokyo, JP)
|
Appl.
No.: |
D/371,213 |
Filed: |
November 29, 2010 |
Foreign Application Priority Data
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Jun 1, 2010 [JP] |
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2010-013454 |
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Current U.S.
Class: |
D13/182 |
Current International
Class: |
1303 |
Field of
Search: |
;D13/182,184
;118/500,719 ;250/307,310,311 ;414/217,935,936,937 |
References Cited
[Referenced By]
U.S. Patent Documents
Primary Examiner: Sikder; Selina
Attorney, Agent or Firm: Stites & Harbison PLLC Marquez,
Esq.; Juan Carlos A.
Description
FIG. 1 is a front, top and right side perspective view of an
semiconductor manufacturing equipment showing our new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a top plan view thereof;
FIG. 5 is a bottom plan view thereof;
FIG. 6 is a left side elevational view thereof; and,
FIG. 7 is a right side elevational view thereof.
The broken line showing of the "semiconductor manufacturing
equipment" is for the purpose of illustrating environmental
structure and forms no part of the claimed design.
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