Semiconductor manufacturing equipment

Description

FIG. 1 is a front, top and right side perspective view of an semiconductor manufacturing equipment showing our new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a top plan view thereof;

FIG. 5 is a bottom plan view thereof;

FIG. 6 is a left side elevational view thereof; and,

FIG. 7 is a right side elevational view thereof.

The broken line showing of the "semiconductor manufacturing equipment" is for the purpose of illustrating environmental structure and forms no part of the claimed design.

Claims

CLAIM We claim the ornamental design for a semiconductor manufacturing equipment, as shown and described.

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Inventors:	Shimada; Masakazu (Toyama, JP), Nogami; Takashi (Toyama, JP), Aizawa; Satoshi (Toyama, JP), Nakashima; Seiyo (Toyama, JP), Yamada; Tomoyuki (Toyama, JP), Sugiura; Shinobu (Toyama, JP), Aburatani; Yukinori (Toyama, JP), Nagata; Mitsuhiro (Kodaira, JP)
Assignee:	Hitachi Kokusai Electric Inc. (Tokyo, JP)
Appl. No.:	D/371,213
Filed:	November 29, 2010

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Foreign Application Priority Data

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Jun 1, 2010 [JP]			2010-013454

Current U.S. Class:	D13/182
Current International Class:	1303
Field of Search:	;D13/182,184 ;118/500,719 ;250/307,310,311 ;414/217,935,936,937

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References Cited [Referenced By]

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U.S. Patent Documents

5810538	September 1998	Ozawa et al.
D469412	January 2003	Witte
6547660	April 2003	Suenaga et al.
6580087	June 2003	Suzuki et al.
6945746	September 2005	Yamagishi et al.
7039499	May 2006	Nasr et al.
7607879	October 2009	Hall et al.
D607424	January 2010	Hosaka et al.
2006/0120833	June 2006	Bonora et al.
2007/0098527	May 2007	Hall et al.
2008/0166208	July 2008	Lester et al.
2008/0317581	December 2008	Makino et al.
2011/0123300	May 2011	Hashimoto
2011/0236159	September 2011	Lenz

Primary Examiner: Sikder; Selina
Attorney, Agent or Firm: Stites & Harbison PLLC Marquez, Esq.; Juan Carlos A.