U.S. patent number D651,178 [Application Number D/356,550] was granted by the patent office on 2011-12-27 for electrical contact for use in a plating apparatus.
This patent grant is currently assigned to Ebara Corporation. Invention is credited to Yuji Araki, Jumpei Fujikata.
United States Patent |
D651,178 |
Fujikata , et al. |
December 27, 2011 |
Electrical contact for use in a plating apparatus
Claims
CLAIM The ornamental design for an electrical contact for use in a
plating apparatus, as shown and described.
Inventors: |
Fujikata; Jumpei (Tokyo,
JP), Araki; Yuji (Tokyo, JP) |
Assignee: |
Ebara Corporation (Tokyo,
JP)
|
Appl.
No.: |
D/356,550 |
Filed: |
February 26, 2010 |
Current U.S.
Class: |
D13/148 |
Current International
Class: |
1303 |
Field of
Search: |
;D13/133,148,154,184,199
;439/865,868,877-891,894 |
References Cited
[Referenced By]
U.S. Patent Documents
Foreign Patent Documents
Primary Examiner: Johannes; Thomas
Attorney, Agent or Firm: Sughrue Mion, PLLC
Description
FIG. 1 is a front view of an electrical contact for use in a
plating apparatus showing our new design;
FIG. 2 is a right side elevation view thereof; the left side being
a mirror image thereto,
FIG. 3 is a rear elevation view thereof;
FIG. 4 is a top plan view thereof;
FIG. 5 is a bottom plan view thereof;
FIG. 6 is a rear perspective view thereof; and,
FIG. 7 is a perspective view thereof, observed from below.
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