U.S. patent number D556,692 [Application Number D/270,693] was granted by the patent office on 2007-12-04 for electrical contact for use in a plating apparatus.
This patent grant is currently assigned to Ebara Corporation. Invention is credited to Kenichi Abe, Yuji Araki, Mitsutoshi Yahagi.
United States Patent |
D556,692 |
Yahagi , et al. |
December 4, 2007 |
Electrical contact for use in a plating apparatus
Claims
CLAIM The ornamental design for an electrical contact for use in a
plating apparatus, as shown and described.
Inventors: |
Yahagi; Mitsutoshi (Tokyo,
JP), Abe; Kenichi (Tokyo, JP), Araki;
Yuji (Tokyo, JP) |
Assignee: |
Ebara Corporation (Tokyo,
JP)
|
Appl.
No.: |
D/270,693 |
Filed: |
January 3, 2007 |
Current U.S.
Class: |
D13/148 |
Current International
Class: |
1303 |
Field of
Search: |
;D13/133,148,154,184,199
;439/865,868,877-891,894 |
References Cited
[Referenced By]
U.S. Patent Documents
Foreign Patent Documents
Primary Examiner: Bui; Daniel
Attorney, Agent or Firm: Wenderoth, Lind & Ponack,
L.L.P.
Description
FIG. 1 is a perspective view of an electrical contact for use in a
plating apparatus in accordance with the present design;
FIG. 2 is a front view thereof;
FIG. 3 is a back view thereof;
FIG. 4 is a plan view thereof;
FIG. 5 is a bottom plan view thereof;
FIG. 6 is a left side view thereof; and,
FIG. 7 is a right side view thereof.
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