Yahagi; Mitsutoshi

Patent Applications and Registrations

Patent applications and USPTO patent grants for Yahagi; Mitsutoshi.The latest application filed is for "leak checking method, leak checking apparatus, electroplating method, and electroplating apparatus".

Company Profile

6.20.13

Yahagi; Mitsutoshi - Tokyo JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Leak Checking Method, Leak Checking Apparatus, Electroplating Method, And Electroplating Apparatus App 20210198800 - Ogata; Shoichiro ; et al.	2021-07-01
Leak checking method, leak checking apparatus, electroplating method, and electroplating apparatus Grant 10,982,347 - Ogata , et al. April 20, 2	2021-04-20
Current measuring module using inspection substrate and inspection substrate Grant 10,830,834 - Tomita , et al. November 10, 2	2020-11-10
Leak Checking Method, Leak Checking Apparatus, Electroplating Method, And Electroplating Apparatus App 20200010972 - Ogata; Shoichiro ; et al.	2020-01-09
Plating apparatus, plating method, and substrate holder Grant 10,513,795 - Mine , et al. Dec	2019-12-24
Leak checking method, leak checking apparatus, electroplating method, and electroplating apparatus Grant 10,458,036 - Ogata , et al. Oc	2019-10-29
Plating Apparatus, Plating Method, And Substrate Holder App 20190249326 - MINE; Junko ; et al.	2019-08-15
Current Measuring Module Using Inspection Substrate And Inspection Substrate App 20190219627 - TOMITA; Masaki ; et al.	2019-07-18
Plating apparatus, plating method, and substrate holder Grant 10,316,426 - Mine , et al.	2019-06-11
Substrate holder, plating apparatus, and plating method Grant 10,316,425 - Yajima , et al.	2019-06-11
Anode holder and plating apparatus Grant 10,240,247 - Yahagi , et al.	2019-03-26
Substrate holder and plating apparatus Grant 10,214,830 - Yahagi , et al. Feb	2019-02-26
Plating apparatus Grant 10,106,906 - Kimura , et al. October 23, 2	2018-10-23
Leak Checking Method, Leak Checking Apparatus, Electroplating Method, And Electroplating Apparatus App 20180135198 - OGATA; Shoichiro ; et al.	2018-05-17
Anode unit and plating apparatus having such anode unit Grant 9,708,724 - Tsujino , et al. July 18, 2	2017-07-18
Plating Apparatus, Plating Method, And Substrate Holder App 20170058423 - MINE; Junko ; et al.	2017-03-02
Anode Holder And Plating Apparatus App 20160369421 - YAHAGI; Mitsutoshi ; et al.	2016-12-22
Plating Apparatus App 20160258080 - KIMURA; Masaaki ; et al.	2016-09-08
Electrical contact for use in a plating apparatus Grant D758,973 - Fujikata , et al. June 14, 2	2016-06-14
Substrate Holder And Plating Apparatus App 20160108539 - YAHAGI; Mitsutoshi ; et al.	2016-04-21
Electrical contact for use in a plating apparatus Grant D742,329 - Fujikata , et al. November 3, 2	2015-11-03
Anode Unit And Plating Apparatus Having Such Anode Unit App 20150275390 - TSUJINO; Junichiro ; et al.	2015-10-01
Substrate Holder, Plating Apparatus, And Plating Method App 20150247253 - YAJIMA; Toshikazu ; et al.	2015-09-03
Electrical contact for use in a plating apparatus Grant D725,600 - Fujikata , et al. March 31, 2	2015-03-31
Copper Electroplating Apparatus App 20140360865 - KIMURA; Masaaki ; et al.	2014-12-11
Electrical contact for use in a plating apparatus Grant D719,101 - Kimura , et al. December 9, 2	2014-12-09
Electrical contact for use in a plating apparatus Grant D717,736 - Kimura , et al. November 18, 2	2014-11-18
Electrical contact for use in a plating apparatus Grant D706,224 - Kimura , et al. June 3, 2	2014-06-03
Sealing ring Grant D705,280 - Kimura , et al. May 20, 2	2014-05-20
Conducting belt for use with anode holder and anode holder Grant 7,897,024 - Yahagi , et al. March 1, 2	2011-03-01
Conducting belt for use with anode holder and anode holder App 20090050473 - Yahagi; Mitsutoshi ; et al.	2009-02-26
Electrical contact for use in a plating apparatus Grant D556,692 - Yahagi , et al. December 4, 2	2007-12-04
Electrical contact for use in a plating apparatus Grant D555,595 - Yahagi , et al. November 20, 2	2007-11-20

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