Electrical contact for use in a plating apparatus Patent Grant Yahagi , et al. December 4, 2 [Ebara Corporation]

Electrical contact for use in a plating apparatus

Yahagi , et al. December 4, 2

Patent Grant D556692

U.S. patent number D556,692 [Application Number D/270,693] was granted by the patent office on 2007-12-04 for electrical contact for use in a plating apparatus. This patent grant is currently assigned to Ebara Corporation. Invention is credited to Kenichi Abe, Yuji Araki, Mitsutoshi Yahagi.

United States Patent	D556,692
Yahagi , et al.	December 4, 2007

Electrical contact for use in a plating apparatus

Claims

CLAIM The ornamental design for an electrical contact for use in a plating apparatus, as shown and described.

Inventors:	Yahagi; Mitsutoshi (Tokyo, JP), Abe; Kenichi (Tokyo, JP), Araki; Yuji (Tokyo, JP)
Assignee:	Ebara Corporation (Tokyo, JP)
Appl. No.:	D/270,693
Filed:	January 3, 2007

Current U.S. Class:	D13/148
Current International Class:	1303
Field of Search:	;D13/133,148,154,184,199 ;439/865,868,877-891,894

References Cited [Referenced By]

U.S. Patent Documents


D296547	July 1988	Sachs
5043528	August 1991	Mohr
D354268	January 1995	Siemon et al.
6534706	March 2003	Rapp et al.
6830667	December 2004	Yamamoto
D519931	May 2006	Van Haaster
7170013	January 2007	Lewis

Foreign Patent Documents


2005-029863	Feb 2005	JP

Primary Examiner: Bui; Daniel
Attorney, Agent or Firm: Wenderoth, Lind & Ponack, L.L.P.

Description

FIG. 1 is a perspective view of an electrical contact for use in a plating apparatus in accordance with the present design;

FIG. 2 is a front view thereof;

FIG. 3 is a back view thereof;

FIG. 4 is a plan view thereof;

FIG. 5 is a bottom plan view thereof;

FIG. 6 is a left side view thereof; and,

FIG. 7 is a right side view thereof.

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