Fujikata; Jumpei

Patent Applications and Registrations

Patent applications and USPTO patent grants for Fujikata; Jumpei.The latest application filed is for "leak check method, leak check apparatus, plating method, and plating apparatus".

Company Profile

26.52.54

Fujikata; Jumpei - Tokyo JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Leak Check Method, Leak Check Apparatus, Plating Method, And Plating Apparatus App 20220307938 - Suzuki; Kiyoshi ; et al.	2022-09-29
Plating method and plating apparatus Grant 11,447,885 - Fujikata , et al. September 20, 2	2022-09-20
Powder Supply Apparatus And Plating System App 20220243356 - CHANG; Shao Hua ; et al.	2022-08-04
Leak check method, leak check apparatus, plating method, and plating apparatus Grant 11,385,125 - Suzuki , et al. July 12, 2	2022-07-12
Method and apparatus for processing a substrate Grant 11,371,155 - Okuzono , et al. June 28, 2	2022-06-28
Powder supply apparatus and plating system Grant 11,359,304 - Chang , et al. June 14, 2	2022-06-14
Semiconductor Manufacturing Apparatus, Failure Prediction Method For Semiconductor Manufacturing Apparatus, And Failure Prediction Program For Semiconductor Manufacturing Apparatus App 20220181180 - Fujikata; Jumpei ; et al.	2022-06-09
Semiconductor manufacturing apparatus, failure prediction method for semiconductor manufacturing apparatus, and failure prediction program for semiconductor manufacturing apparatus Grant 11,315,812 - Fujikata , et al. April 26, 2	2022-04-26
Method of removing liquid from seal of a substrate holder Grant 11,230,789 - Seki , et al. January 25, 2	2022-01-25
Device For Measuring Bump Height, Apparatus For Processing Substrate, Method Of Measuring Bump Height, And Storage Medium App 20210285893 - Okuzono; Takahisa ; et al.	2021-09-16
Paddle, Processing Apparatus Having The Paddle, And Method Of Producing The Paddle App 20210262111 - Masuda; Yasuyuki ; et al.	2021-08-26
Plating apparatus and plating method Grant 11,047,063 - Fujikata , et al. June 29, 2	2021-06-29
Paddle, Plating Apparatus Equipped With The Paddle, And Plating Method App 20210154629 - Masuda; Yasuyuki ; et al.	2021-05-27
Substrate holder, plating apparatus, plating method, and electric contact Grant 10,954,603 - Fujikata March 23, 2	2021-03-23
Paddle, plating apparatus equipped with the paddle, and plating method Grant 10,946,351 - Masuda , et al. March 16, 2	2021-03-16
Plating Method And Plating Apparatus App 20210062354 - Fujikata; Jumpei ; et al.	2021-03-04
Wave absorbing member attachable to paddle and plating apparatus including wave absorbing member Grant 10,914,020 - Chang , et al. February 9, 2	2021-02-09
Plating apparatus and plating method Grant 10,914,019 - Chang , et al. February 9, 2	2021-02-09
Device for inspecting a bump height surrounded by resist, device for processing a substrate, method for inspecting a bump height, and storage medium Grant 10,910,334 - Okuzono , et al. February 2, 2	2021-02-02
Plating method and plating apparatus Grant 10,865,492 - Fujikata , et al. December 15, 2	2020-12-15
Regulation Plate, Plating Apparatus Equipped With The Same, And Plating Method App 20200270760 - NAKAGAWA; Yoichi ; et al.	2020-08-27
Substrate-holder Inspection Apparatus, Plating Apparatus Including The Same, And Appearance Inspection Apparatus App 20200255968 - MUKAIYAMA; Yoshitaka ; et al.	2020-08-13
Electrical contact Grant D892,747 - Suzuki , et al. A	2020-08-11
Leak Check Method, Leak Check Apparatus, Plating Method, And Plating Apparatus App 20200209099 - Suzuki; Kiyoshi ; et al.	2020-07-02
Method Of Removing Liquid From Seal Of A Substrate Holder App 20200199769 - Seki; Masaya ; et al.	2020-06-25
Plating device, plating method, substrate holder, resistance measuring module, and substrate holder testing method Grant 10,676,838 - Nagai , et al.	2020-06-09
Copper Oxide Powder For Use In Plating Of A Substrate App 20200165737 - SHIMOYAMA; MASASHI ; et al.	2020-05-28
Electrical contact Grant D884,650 - Suzuki , et al.	2020-05-19
Plating method and plating apparatus Grant 10,641,677 - Minami , et al.	2020-05-05
Plating apparatus, plating method, and recording medium Grant 10,633,757 - Shimoyama , et al.	2020-04-28
Electrolytic plating apparatus Grant 10,607,842 - Higaki , et al.	2020-03-31
Method And Apparatus For Processing A Substrate App 20200080218 - Okuzono; Takahisa ; et al.	2020-03-12
Substrate holder, plating apparatus, and method for manufacturing substrate holder Grant 10,577,713 - Miyamoto , et al.	2020-03-03
Plating apparatus and plating method Grant 10,577,714 - Mukaiyama , et al.	2020-03-03
Plating apparatus, substrate holder, plating apparatus controlling method, and storage medium configured to store program for instructing computer to implement plating apparatus controlling method Grant 10,533,262 - Fujikata Ja	2020-01-14
Substrate Holder And Plating Apparatus App 20190390359 - Seki; Masaya ; et al.	2019-12-26
Feeder capable of feeding anode and plating apparatus Grant 10,508,354 - Fujikata Dec	2019-12-17
Method and apparatus for processing a substrate Grant 10,508,352 - Okuzono , et al. Dec	2019-12-17
Method of adjusting plating apparatus, and measuring apparatus Grant 10,487,415 - Fujikata , et al. Nov	2019-11-26
Device For Inspecting A Bump Height, Device For Processing A Substrate, Method For Inspecting A Bump Height, And Storage Medium App 20190348384 - OKUZONO; Takahisa ; et al.	2019-11-14
Plating Apparatus, Plating Method, And Recording Medium App 20190309436 - SHIMOYAMA; Masashi ; et al.	2019-10-10
Plating Method And Plating Apparatus App 20190249325 - MINAMI; Yoshio ; et al.	2019-08-15
Plating Apparatus And Plating Method App 20190226114 - FUJIKATA; Jumpei ; et al.	2019-07-25
Substrate Holder, Transport System Capable Of Transporting Substrate In Electronic Device Manufacturing Apparatus, And Electroni App 20190203373 - FUJIKATA; Jumpei	2019-07-04
Powder Supply Apparatus And Plating System App 20190203374 - CHANG; Shao Hua ; et al.	2019-07-04
Wave Absorbing Member Attachable To Paddle And Plating Apparatus Including Wave Absorbing Member App 20190186038 - CHANG; SHAO HUA ; et al.	2019-06-20
Plating Apparatus, Substrate Holder, Plating Apparatus Controlling Method, And Storage Medium Configured To Store Program For In App 20190186039 - FUJIKATA; Jumpei	2019-06-20
Plating method and plating apparatus Grant 10,309,030 - Minami , et al.	2019-06-04
Plating apparatus and plating method Grant 10,294,578 - Fujikata , et al.	2019-05-21
Plating Apparatus And Plating Method App 20190127875 - CHANG; Shao Hua ; et al.	2019-05-02
Plating apparatus, substrate holder, plating apparatus controlling method, and storage medium configured to store program for instructing computer to implement plating apparatus controlling method Grant 10,273,594 - Fujikata	2019-04-30
Method Of Adjusting Plating Apparatus, And Measuring Apparatus App 20180371636 - FUJIKATA; Jumpei ; et al.	2018-12-27
Method of cleaning substrate holder Grant 10,119,198 - Fujikata , et al. November 6, 2	2018-11-06
Substrate holder, plating apparatus, and plating method Grant 10,113,246 - Fujikata , et al. October 30, 2	2018-10-30
Method of adjusting plating apparatus, and measuring apparatus Grant 10,100,424 - Fujikata , et al. October 16, 2	2018-10-16
Semiconductor Manufacturing Apparatus, Failure Prediction Method For Semiconductor Manufacturing Apparatus, And Failure Prediction Program For Semiconductor Manufacturing Apparatus App 20180294174 - FUJIKATA; Jumpei ; et al.	2018-10-11
Plating Method And Plating Apparatus App 20180282892 - FUJIKATA; Jumpei ; et al.	2018-10-04
Substrate Holder, Plating Apparatus, Plating Method, And Electric Contact App 20180230620 - FUJIKATA; Jumpei	2018-08-16
Plating apparatus and plating method Grant 10,047,454 - Araki , et al. August 14, 2	2018-08-14
Paddle, Plating Apparatus Equipped With The Paddle, And Plating Method App 20180221835 - MASUDA; Yasuyuki ; et al.	2018-08-09
Plating Device, Plating Method, Substrate Holder, Resistance Measuring Module, And Substrate Holder Testing Method App 20180209062 - NAGAI; Mizuki ; et al.	2018-07-26
Method And Apparatus For Processing A Substrate App 20180179656 - Okuzono; Takahisa ; et al.	2018-06-28
Electrolytic Plating Apparatus App 20180166286 - HIGAKI; Takehiko ; et al.	2018-06-14
Substrate Holder, Plating Apparatus, And Method For Manufacturing Substrate Holder App 20180155847 - MIYAMOTO; Matsutaro ; et al.	2018-06-07
Substrate cleaning apparatus and substrate cleaning method Grant 9,972,510 - Fujikata May 15, 2	2018-05-15
Copper Oxide Powder For Use In Plating Of A Substrate, Method Of Plating A Substrate Using The Copper Oxide Powder, And Method Of Managing Plating Solution Using The Copper Oxide Powder App 20180105946 - SHIMOYAMA; Masashi ; et al.	2018-04-19
Feeder Capable Of Feeding Anode And Plating Apparatus App 20170356098 - FUJIKATA; Jumpei	2017-12-14
Plating Apparatus, Substrate Holder, Plating Apparatus Controlling Method, And Storage Medium Configured To Store Program For Instructing Computer To Implement Plating Apparatus Controlling Method App 20170350033 - FUJIKATA; Jumpei	2017-12-07
Plating Apparatus And Plating Method App 20170298531 - MUKAIYAMA; Yoshitaka ; et al.	2017-10-19
Apparatus And Method For Supplying Plating Solution To Plating Tank, Plating System, Powder Container, And Plating Method App 20170226656 - DOU; Chunhui ; et al.	2017-08-10
Plating Method And Plating Apparatus App 20170159203 - MINAMI; Yoshio ; et al.	2017-06-08
Plating method and plating apparatus Grant 9,611,563 - Minami , et al. April 4, 2	2017-04-04
Method Of Adjusting Plating Apparatus, And Measuring Apparatus App 20160369422 - FUJIKATA; Jumpei ; et al.	2016-12-22
Substrate Holder, Plating Apparatus, And Plating Method App 20160348264 - FUJIKATA; Jumpei ; et al.	2016-12-01
Method Of Cleaning Substrate Holder App 20160265135 - FUJIKATA; Jumpei ; et al.	2016-09-15
Plating Method And Plating Apparatus App 20160222540 - MINAMI; Yoshio ; et al.	2016-08-04
Plating apparatus and method of cleaning substrate holder Grant 9,376,760 - Fujikata , et al. June 28, 2	2016-06-28
Electrical contact for use in a plating apparatus Grant D758,973 - Fujikata , et al. June 14, 2	2016-06-14
Plating Apparatus And Plating Method App 20160145760 - FUJIKATA; Jumpei ; et al.	2016-05-26
Plating method and plating apparatus Grant 9,340,891 - Minami , et al. May 17, 2	2016-05-17
Electroplating method and electroplating apparatus for through-hole Grant 9,297,088 - Shimoyama , et al. March 29, 2	2016-03-29
Plating Apparatus And Plating Method App 20150354084 - ARAKI; Yuji ; et al.	2015-12-10
Substrate holder and plating apparatus Grant 9,175,416 - Fujikata November 3, 2	2015-11-03
Electrical contact for use in a plating apparatus Grant D742,329 - Fujikata , et al. November 3, 2	2015-11-03
Plating apparatus and plating method Grant RE45,687 - Saito , et al. September 29, 2	2015-09-29
Electrical contact for use in a plating apparatus Grant D725,600 - Fujikata , et al. March 31, 2	2015-03-31
Substrate holder and plating apparatus Grant 8,864,965 - Fujikata , et al. October 21, 2	2014-10-21
Sn ALLOY PLATING APPARATUS AND METHOD App 20140166492 - SHIMOYAMA; Masashi ; et al.	2014-06-19
Sealing ring Grant D705,280 - Kimura , et al. May 20, 2	2014-05-20
Electroplating Method And Electroplating Apparatus For Through-hole App 20140042032 - SHIMOYAMA; Masashi ; et al.	2014-02-13
Plating Apparatus And Method Of Cleaning Substrate Holder App 20140020720 - FUJIKATA; Jumpei ; et al.	2014-01-23
Plating Method And Plating Apparatus App 20130255360 - MINAMI; Yoshio ; et al.	2013-10-03
Substrate Cleaning Apparatus And Substrate Cleaning Method App 20130220383 - FUJIKATA; Jumpei	2013-08-29
Substrate Holder And Plating Apparatus App 20130192983 - FUJIKATA; Jumpei	2013-08-01
Plating apparatus and plating method Grant 8,486,234 - Saito , et al. July 16, 2	2013-07-16
Electrical contact Grant D669,439 - Fujikata , et al. October 23, 2	2012-10-23
Plating Apparatus And Plating Method App 20120193220 - SAITO; Nobutoshi ; et al.	2012-08-02
Electroplating Method App 20120160696 - ARAKI; Yuji ; et al.	2012-06-28
Plating apparatus and plating method Grant 8,177,944 - Saito , et al. May 15, 2	2012-05-15
Sealing ring Grant D659,175 - Fujikata , et al. May 8, 2	2012-05-08
Substrate Holder And Plating Apparatus App 20120043200 - FUJIKATA; Jumpei ; et al.	2012-02-23
Electrical contact for use in a plating apparatus Grant D651,178 - Fujikata , et al. December 27, 2	2011-12-27
Sealing ring Grant D649,986 - Fujikata , et al. December 6, 2	2011-12-06
Plating apparatus and plating method App 20090139871 - Saito; Nobutoshi ; et al.	2009-06-04

uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.

While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.

All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.