U.S. patent application number 16/063979 was filed with the patent office on 2020-08-27 for regulation plate, plating apparatus equipped with the same, and plating method.
The applicant listed for this patent is EBARA CORPORATION. Invention is credited to Jumpei FUJIKATA, Yoichi NAKAGAWA.
Application Number | 20200270760 16/063979 |
Document ID | / |
Family ID | 1000004872397 |
Filed Date | 2020-08-27 |
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United States Patent
Application |
20200270760 |
Kind Code |
A1 |
NAKAGAWA; Yoichi ; et
al. |
August 27, 2020 |
REGULATION PLATE, PLATING APPARATUS EQUIPPED WITH THE SAME, AND
PLATING METHOD
Abstract
The present invention provides a regulation plate and a plating
apparatus equipped with the regulation plate which can curb
reduction in in-plane uniformity due to influence of a terminal
effect with respect to plural substrates differing in
characteristics and processing conditions. One form of the present
invention provides a regulation plate used to adjust an electric
current between an anode and a substrate to be plated. The
regulation plate includes a plate main body provided with an
opening adapted to allow passage of an electric current; plural
first blades used to narrow a diameter of the opening; and a first
moving mechanism adapted to translate the plural first blades in a
radial direction of the opening.
Inventors: |
NAKAGAWA; Yoichi; (Tokyo,
JP) ; FUJIKATA; Jumpei; (Tokyo, JP) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
EBARA CORPORATION |
Tokyo |
|
JP |
|
|
Family ID: |
1000004872397 |
Appl. No.: |
16/063979 |
Filed: |
December 5, 2016 |
PCT Filed: |
December 5, 2016 |
PCT NO: |
PCT/JP2016/086021 |
371 Date: |
June 19, 2018 |
Current U.S.
Class: |
1/1 |
Current CPC
Class: |
C25D 21/12 20130101;
C25D 5/04 20130101; C25D 5/022 20130101; C25D 17/001 20130101 |
International
Class: |
C25D 21/12 20060101
C25D021/12; C25D 5/04 20060101 C25D005/04; C25D 5/02 20060101
C25D005/02 |
Foreign Application Data
Date |
Code |
Application Number |
Dec 21, 2015 |
JP |
2015-248380 |
Claims
1. A regulation plate used to adjust an electric current between an
anode and a substrate to be plated, comprising: a plate main body
provided with a rim forming a first opening adapted to allow
passage of an electric current; plural first blades used to narrow
a diameter of the first opening; and a first moving mechanism
adapted to translate the plural first blades in a radial direction
of the first opening.
2. The regulation plate according to claim 1, wherein: the first
moving mechanism includes a ring member placed along the rim;
either of the ring member and the plural first blades includes a
slide slot inclined in the radial direction of the first opening;
and another of the ring member and the plural first blades includes
a slide pin adapted to slide along the slide slot.
3. The regulation plate according to claim 2, wherein: the first
moving mechanism includes a blade presser member fixed on a side
opposite the ring member of the plural first blades; either of the
blade presser member and the plural first blades includes a guide
slot formed in parallel to a translation direction of the first
blades; and another of the blade presser member and the plural
first blades includes a guide pin adapted to slide along the guide
slot.
4. The regulation plate according to claim 2, wherein: the first
moving mechanism includes a rotating member used to rotate the ring
member in a circumferential direction; and the rotating member
includes a ring portion fixed to the ring member, and a lever
portion adapted to rotate the ring portion in the circumferential
direction.
5. The regulation plate according to claim 4, wherein: either of
the plate main body and the ring member includes a support slot
formed along a rotation direction of the ring member; and another
of the plate main body and the ring member includes a support pin
slidably engaged with the support slot.
6. The regulation plate according to claim 1, wherein an inner
peripheral edge of each of the plural first blades is formed into
an arc shape and is overlapped with other first blades, forming a
substantially circular inner peripheral edge.
7. The regulation plate according to claim 1, further comprising:
plural second blades placed at a position shifted from the plural
first blades in a direction orthogonal to the radial direction of
the first opening and used to narrow the diameter of the first
opening; and a second moving mechanism adapted to translate the
plural second blades in the radial direction of the first
opening.
8. The regulation plate according to claim 7, wherein the plural
first blades and the plural second blades are arranged such that a
straight line joining a center of an opening formed by the first
blades and a center of an opening formed by the second blades is
orthogonal to the radial direction of the openings.
9. A regulation plate used to adjust an electric current between an
anode and a substrate to be plated, comprising: a first plate main
body provided with a first rim forming a first opening adapted to
allow passage of an electric current and plural first blades used
to narrow a diameter of the first opening; and a second plate main
body provided with a second rim forming a second opening adapted to
allow passage of an electric current and plural second blades used
to narrow a diameter of the second opening, wherein the first plate
main body and the second plate main body are coupled together such
that a straight line joining a center of an opening formed by the
plural first blades and a center of an opening formed by the plural
second blades is orthogonal to the radial direction of the
openings.
10. The regulation plate according to claim 7, wherein the diameter
of the opening formed by the plural first blades and the diameter
of the opening formed by the plural second blades are configured to
be adjustable independently of each other.
11. A plating apparatus comprises: an anode holder configured to
hold an anode; a substrate holder placed opposite the anode holder
and configured to hold a substrate; an anode mask mounted
integrally on the anode holder and provided with a second opening
adapted to allow passage of an electric current flowing between the
anode and the substrate; and the regulation plates according to
claim 1, wherein the anode mask includes an adjustment mechanism
adapted to adjust a diameter of the second opening.
12. A plating method comprising: placing an anode holder in a
plating bath, where the anode holder is integrally provided with an
anode mask having a first opening adapted to allow passage of an
electric current flowing between an anode and a substrate; placing
a substrate holder adapted to hold a first substrate in the plating
bath; placing a regulation plate between the anode mask and the
substrate, where the regulation plate includes a second opening and
third opening adapted to allow passage of the electric current
flowing between the anode and the substrate; plating the first
substrate by adjusting a diameter of the first opening to a first
diameter; placing a substrate holder adapted to hold a second
substrate in the plating bath; and plating the second substrate by
adjusting a diameter of the first opening to a second diameter
smaller than the first diameter and by changing the diameters of
the second opening and third opening in the regulation plate.
Description
TECHNICAL FIELD
[0001] The present invention relates to a regulation plate, a
plating apparatus equipped with the regulation plate, and a plating
method.
BACKGROUND ART
[0002] Conventionally, wiring is formed in minute wiring grooves,
holes, or resist openings provided on surfaces of substrates such
as semiconductor wafers or bumps (bumpy electrodes) used to
electrically connect to electrodes of a package which are formed on
the surfaces of the substrates. As a method for forming the wiring
and bumps, an electrolytic plating process, vacuum deposition
process, printing process, ball bumping process, and the like are
known, for example. With increases in I/O counts and pitch
refinement on semiconductor chips, the electrolytic plating process
which allows refinement and shows comparatively stable performance
has come to be used frequently.
[0003] When wiring or bumps are formed by the electrolytic plating
process, a seed layer (feeder layer) with low electrical resistance
is formed on surfaces of barrier metal provided in the wiring
grooves, holes, or resist openings in the substrates. A plating
film grows on a surface of the seed layer. In recent years, seed
layers with thinner film thickness have come to be used along with
refinement of wiring and bumps. With decreases in the film
thickness of the seed layer, the electrical resistance (sheet
resistance) of the seed layer increases.
[0004] Generally, a substrate to be plated has an electrical
contact on its periphery. Consequently, an electric current
corresponding to combined resistance of an electrical resistance
value of the plating solution and electrical resistance value of
the seed layer between a central portion of the substrate and the
electrical contact flows through the central portion of the
substrate. On the other hand, an electric current almost
corresponding to the electrical resistance value of the plating
solution flows through the periphery (near the electrical contact)
of the substrate. That is, the flow of the electric current to the
central portion of the substrate is resisted to an extent
corresponding to the electrical resistance value of the seed layer
between the central portion of the substrate and the electrical
contact. The phenomenon in which electric current concentrates on
the periphery of a substrate is referred to as a terminal
effect.
[0005] In the case of a substrate which has a seed layer
comparatively thin in film thickness, the electrical resistance
value of the seed layer between the central portion of the
substrate and the electrical contact is comparatively high.
Therefore, in plating a substrate whose seed layer is comparatively
thin in film thickness, the terminal effect is prominent.
Consequently, the plating rate in the central portion of the
substrate falls, making the plating film in the central portion of
the substrate thinner in film thickness than the plating film in
the periphery of the substrate and resulting in reduced in-plane
uniformity of film thickness.
[0006] In order to curb the reduction in the in-plane uniformity of
film thickness due to the terminal effect, it is necessary to
adjust an electric field applied to the substrate. For example, a
plating apparatus is known, in which a regulation plate is
installed between an anode and substrate to regulate a potential
distribution between the anode and substrate (see PTL 1).
CITATION LIST
Patent Literature
[0007] PTL 1: Japanese Patent Laid-Open No. 2005-029863
SUMMARY OF INVENTION
Technical Problem
[0008] Now, the influence of the terminal effect varies with the
degree of film thickness of the seed layer on the substrate.
Specifically, as described above, when the seed layer is
comparatively thin in film thickness, since the sheet resistance is
comparatively high, the influence of the terminal effect appears
prominently. On the other hand, when the seed layer is
comparatively thick in film thickness, since the sheet resistance
is comparatively low, the influence of the terminal effect is
comparatively small.
[0009] Also, the influence of the terminal effect can vary not only
with the degree of film thickness of the seed layer, but also with
the other factors. For example, when a resist aperture ratio of the
substrate is comparatively high, the plating film formed on the
substrate has a comparatively large area, where the resist aperture
ratio is the area ratio of a portion not covered with resist (open
portion of the resist) to a region bordered by an outer edge of the
resist. Therefore, as the plating film is formed on the substrate,
the formed plating film causes electric current to flow readily in
the central portion of the substrate as well. In other words, as
the plating film is formed on the substrate, the electrical
resistance value between the central portion of the substrate and
the electrical contact decreases, gradually reducing the influence
of the terminal effect. On the other hand, when the resist aperture
ratio of the substrate is comparatively low, the area of the
plating film formed on the substrate is relatively small.
Consequently, when the resist aperture ratio of the substrate is
comparatively low, even if a plating film is formed on the
substrate, variation in the electrical resistance value between the
central portion of the substrate and the electrical contact is
smaller than when the resist aperture ratio of the substrate is
comparatively high, and thus the influence of the terminal effect
remains large.
[0010] Also, when the electrical resistance value of a plating
solution used to process the substrate is comparatively high, the
influence of the terminal effect is smaller than when the
electrical resistance value of the plating solution used to process
the substrate is comparatively low. Specifically, if the electrical
resistance value of the plating solution is R1 and the electrical
resistance value of the seed layer between the central portion of
the substrate and the electrical contact is R2, an electric current
corresponding to combined resistance value (R1 +R2) flows through
the central portion of the substrate. On the other hand, an
electric current almost corresponding to the electrical resistance
value R1 of the plating solution flows through the periphery (near
the electrical contact) of the substrate. Thus, as the electrical
resistance value R1 increases, the influence of the electrical
resistance value R2 to the electric current flowing through the
central portion of the substrate decreases, reducing the influence
of the terminal effect.
[0011] In this way, the influence of the terminal effect varies
with characteristics of the substrate, conditions for processing
the substrate, and the like. Therefore, when plural substrates
differing in the influence of the terminal effect are plated one
after another using a single plating apparatus, in order to curb
the reduction in the in-plane uniformity of film thickness due to
the terminal effect, it is necessary to adjust the electric fields
applied to the substrates, according to the characteristics of the
respective substrates, conditions for processing the substrates,
and the like. However, in order to adjust the electric fields
according to the characteristics of the substrates, conditions for
processing the substrates, and the like using a regulation plate
such as described in PTL 1, it is necessary to prepare plural
regulation plates which suit the characteristics of the substrates,
conditions for processing the substrates, and the like.
[0012] Besides, even if plural regulation plates are prepared, each
time substrates differing in characteristics and processing
conditions are processed, it is necessary to take the regulation
plate out of the plating bath and install another regulation plate,
involving time and effort.
[0013] The present invention has been made in view of the above
problems and has an object to provide a regulation plate, a plating
apparatus equipped with the regulation plate, and a plating method
which can curb reduction in in-plane uniformity due to influence of
a terminal effect in plating plural substrates differing in
characteristics and processing conditions.
Solution to Problem
[0014] A first form provides a regulation plate used to adjust an
electric current between an anode and a substrate to be plated. The
regulation plate comprises: a plate main body provided with a rim
forming a first opening adapted to allow passage of an electric
current; plural first blades used to narrow a diameter of the first
opening; and a first moving mechanism adapted to translate the
plural first blades in a radial direction of the first opening.
[0015] The first form allows the diameter of the opening to be
adjusted by narrowing a diameter of an opening in the regulation
plate using the first blades. This makes it possible to curb
reduction in in-plane uniformity due to influence of a terminal
effect when a first substrate and second substrate differ from each
other in characteristics or processing conditions. Specifically, in
plating the substrate under conditions in which the influence of
the terminal effect appears prominently, by reducing the diameter
of the opening in the regulation plate, the film deposition rate on
the periphery of the substrate can be slowed down, making it
possible to improve the in-plane uniformity on the substrate. Also,
since the first blades are configured to perform translational
movement, the plural first blades can move in the radial direction
while maintaining an angular relationship among the first blades.
Therefore, a perfectly circular shape of the opening formed by the
first blades can be maintained better than when plural aperture
blades rotate around a predetermined axis, reducing the diameter of
the opening as with an aperture mechanism of a camera.
[0016] According to a second form, in the first form, the first
moving mechanism includes a ring member placed along the rim;
either of the ring member and the plural first blades includes a
slide slot inclined in the radial direction of the first opening;
and another of the ring member and the plural first blades includes
a slide pin adapted to slide along the slide slot.
[0017] According to the second form, the slide pin provided on the
other of the ring member and the plural first blades slide along
the slide slot provided in either of the ring member and the plural
first blades. Therefore, as the ring member is rotated in a
circumferential direction, the slide pin slide along the slide
slot, allowing the first blades to move in the radial direction of
the first opening.
[0018] According to a third form, in the second form, the first
moving mechanism includes a blade presser member fixed on a side
opposite the ring member of the plural first blades; either of the
blade presser member and the plural first blades includes a guide
slot formed in parallel to a translation direction of the first
blades; and another of the blade presser member and the plural
first blades includes a guide pin adapted to slide along the guide
slot.
[0019] According to the second form, the guide pins provided in the
other of the blade presser member and the plural first blades slide
along the guide slots provided in either of the blade presser
member and the plural first blades. Therefore, when the plural
first blades is moved by the moving mechanism, the first blades can
be translated in a desired direction while preventing the plural
first blades from performing rotary motion.
[0020] According to a fourth form, in the second or third form, the
first moving mechanism includes a rotating member used to rotate
the ring member in a circumferential direction; and the rotating
member includes a ring portion fixed to the ring member, and a
lever portion adapted to rotate the ring portion in the
circumferential direction.
[0021] According to the fourth form, as the lever portion is
operated by an actuator or by hand, the ring portion can be rotated
in the circumferential direction. Since the ring portion is fixed
to the ring member, the ring member rotates along with rotation of
the ring portion. Consequently, the slide slots or slide pins
provided in/on the ring member slide with respect to the slide pins
or slide slots provided on/in the plural first blades, making it
possible to translate the plural first blades.
[0022] According to a fifth form, in the fourth form, either of the
plate main body and the ring member includes a support slot formed
along a rotation direction of the ring member; and another of the
plate main body and the ring member includes a support pin slidably
engaged with the support slot.
[0023] According to the fifth form, the support pin provided on the
other of the plate main body and the ring member is slidably
engaged with the support slot provided in either of the plate main
body and the ring member. As the support pin gets engaged with the
support slot, the ring member is supported by the plate main body.
Since the support slot is formed along the rotation direction of
the ring member, the ring member can be rotated when the support
pin slides along the support slot.
[0024] According to a sixth form, in any one of the first to fifth
forms, an inner peripheral edge of each of the plural first blades
is formed into an arc shape and is overlapped with other first
blades, forming a substantially circular inner peripheral edge.
[0025] According to the sixth form, when the plural first blades
perform translational movement in the radial direction of the first
opening, reducing the diameter of the opening, the inner peripheral
edges of the plural first blades can maintain a substantially
circular shape.
[0026] According to a seventh form, in any one of the first to
sixth forms, the regulation plate further comprises: plural second
blades placed at a position shifted from the plural first blades in
a direction orthogonal to the radial direction of the first opening
and used to narrow the diameter of the first opening; and a second
moving mechanism adapted to translate the plural second blades in
the radial direction of the first opening.
[0027] According to the seventh form, the regulation plate includes
formed by the plural first blades and an opening having a second
diameter formed by the plural second blades. By appropriately
adjusting sizes of the first diameter and second diameter, it is
possible to more appropriately adjust the electric current passing
through the opening in the regulation plate.
[0028] According to an eighth form, in the seventh form, the plural
first blades and the plural second blades are arranged such that a
straight line joining a center of an opening formed by the first
blades and a center of an opening formed by the second blades is
orthogonal to the radial direction of the openings.
[0029] According to the eighth form, the first blades and the
second blades are arranged such that the center of the opening
formed by the first blades and the center of the opening formed by
the second blades will coincide each other. Therefore, when
positioning the regulation plate in a plating bath, there is no
need to position the center of the opening formed by the plural
first blades and the center of the opening formed by the plural
second blades separately. Consequently, even when high accuracy is
required of the center position of the opening in the regulation
plate, the regulation plate can be positioned easily.
[0030] A ninth form provides a regulation plate used to adjust an
electric current between an anode and a substrate to be plated. The
regulation plate comprises: a first plate main body provided with a
first rim forming a first opening adapted to allow passage of an
electric current and plural first blades used to narrow a diameter
of the first opening; and a second plate main body provided with a
second rim forming a second opening adapted to allow passage of an
electric current and plural second blades used to narrow a diameter
of the second opening. The first plate main body and the second
plate main body are coupled together such that a straight line
joining a center of an opening formed by the plural first blades
and a center of an opening formed by the plural second blades is
orthogonal to the radial direction of the openings.
[0031] According to the ninth form, the regulation plate includes
the opening having a first diameter formed by the plural first
blades and the opening having a second diameter formed by the
plural second blades. By appropriately adjusting sizes of the first
diameter and second diameter, it is possible to more appropriately
adjust the electric current passing through the opening in the
regulation plate. Also, the first blades and the second blades are
arranged such that the center of the opening formed by the first
blades and the center of the opening formed by the second blades
will coincide each other. Therefore, when positioning the
regulation plate in a plating bath, there is no need to position
the center of the opening formed by the plural first blades and the
center of the opening formed by the plural second blades
separately. Consequently, even when high accuracy is required of
the center position of the opening in the regulation plate, the
regulation plate can be positioned easily.
[0032] According to a tenth form, in any one of the seventh to
ninth forms, the diameter of the opening formed by the plural first
blades and the diameter of the opening formed by the plural second
blades are configured to be adjustable independently of each
other.
[0033] According to the tenth form, the diameter of the opening
defined by the plural first blades and the diameter of the opening
defined by the plural second blades can be made different from each
other. This makes it possible to decrease the diameters of the
openings in stages according to the characteristics or processing
conditions of the substrate, such as reducing the diameter of the
opening defined by the blades closer to the substrate and
increasing the diameter of the opening defined by the blades
farther from the substrate.
[0034] An eleventh form provides a plating apparatus. The plating
apparatus comprises: an anode holder configured to hold an anode; a
substrate holder placed opposite the anode holder and configured to
hold a substrate; an anode mask mounted integrally on the anode
holder and provided with a second opening adapted to allow passage
of an electric current flowing between the anode and the substrate;
and any of the regulation plates described above, wherein the anode
mask includes an adjustment mechanism adapted to adjust a diameter
of the second opening.
[0035] According to the eleventh form, the diameter of the second
opening of the anode mask can be adjusted for each of a first
substrate and second substrate. This makes it possible to curb
reduction in in-plane uniformity due to influence of a terminal
effect when the first substrate and second substrate differ from
each other in characteristics or processing conditions.
Specifically, when the second substrate is plated under conditions
in which the influence of the terminal effect appears prominently,
by reducing the diameter of the second opening, it is possible to
concentrate an electric field on a central portion of the substrate
and thereby increase film thickness in the central portion of the
substrate. Also, if the diameter of the first opening in the
regulation plate is reduced, the film deposition rate on the
periphery of the substrate can be slowed down. Thus, if both the
diameter of the first opening in the regulation plate and the
diameter of the second opening of the anode mask are adjusted, the
in-plane uniformity on the substrate W can be further improved.
[0036] A twelfth form provides a plating method. The plating method
comprises: placing an anode holder in a plating bath, where the
anode holder is integrally provided with an anode mask having a
first opening adapted to allow passage of an electric current
flowing between an anode and a substrate; placing a substrate
holder adapted to hold a first substrate in the plating bath;
placing a regulation plate between the anode mask and the
substrate, where the regulation plate includes a second opening and
third opening adapted to allow passage of the electric current
flowing between the anode and the substrate; plating the first
substrate by adjusting a diameter of the first opening to a first
diameter; placing a substrate holder adapted to hold a second
substrate in the plating bath; and plating the second substrate by
adjusting a diameter of the first opening to a second diameter
smaller than the first diameter and by changing the diameters of
the second opening and third opening in the regulation plate.
[0037] According to the twelfth form, the diameter of the first
opening in the anode mask can be adjusted for each of the first
substrate and second substrate. This makes it possible to curb
reduction in in-plane uniformity due to influence of a terminal
effect when the first substrate and second substrate differ from
each other in characteristics or processing conditions.
Specifically, when the second substrate is plated under conditions
in which the influence of the terminal effect appears prominently,
by reducing the diameter of the first opening, it is possible to
concentrate an electric field on a central portion of the substrate
and thereby increase film thickness in the central portion of the
substrate. Also, by changing the diameters of the second opening
and third opening in the regulation plate, the film deposition rate
on the periphery of the substrate can be slowed down, making it
possible to improve the in-plane uniformity on the substrate W.
BRIEF DESCRIPTION OF DRAWINGS
[0038] FIG. 1 is a schematic sectional side view of a plating
apparatus according to an embodiment of the present invention.
[0039] FIG. 2 is a schematic front view of an anode mask.
[0040] FIG. 3 is a schematic front view of the anode mask.
[0041] FIG. 4 is a perspective front view of a regulation plate, of
which a diameter of an opening is comparatively large.
[0042] FIG. 5 is a perspective rear view of the regulation plate,
of which the diameter of the opening is comparatively large.
[0043] FIG. 6 is a front perspective view of the regulation plate,
of which the diameter of the opening is comparatively small.
[0044] FIG. 7 is an exploded perspective view of the regulation
plate.
[0045] FIG. 8 is a perspective front view of a plate main body.
[0046] FIG. 9 is a perspective rear view of the plate main
body.
[0047] FIG. 10 is a perspective front view of a ring member.
[0048] FIG. 11 shows a perspective front view of a rotating
member.
[0049] FIG. 12 shows a perspective front view of a first blade
making up a blade body.
[0050] FIG. 13 is a perspective front view of a blade presser
member.
[0051] FIG. 14 is a perspective front view of a protective
member.
[0052] FIG. 15 is a partial front view of the regulation plate as
viewed from a front side.
[0053] FIG. 16 is a rear view of the regulation plate when an
inside diameter of the opening is at the maximum.
[0054] FIG. 17 is a rear view of the regulation plate when the
inside diameter of the opening is at the minimum.
[0055] FIG. 18 is a perspective front view of a regulation plate
having plural first blades and plural second blades according to
another embodiment.
[0056] FIG. 19 is a perspective rear view of the regulation plate
having the plural first blades and plural second blades according
to the other embodiment.
[0057] FIG. 20 is an exploded perspective view of a first plate
main body and second plate main body of the regulation plate
according to the other embodiment.
[0058] FIG. 21 is an exploded perspective view of a first plate
main body of the regulation plate according to the other
embodiment.
[0059] FIG. 22 is an exploded perspective view of a second plate
main body of the regulation plate according to the other
embodiment.
[0060] FIG. 23 is a diagram showing profiles of plating films for
substrates with a high resist aperture ratio and substrates with a
low resist aperture ratio.
[0061] FIG. 24 is a diagram showing profiles of plating films for
substrates with a thick seed layer and substrates with a thin seed
layer.
[0062] FIG. 25 is a diagram showing profiles of plating films on
substrates plated in a plating solution having a comparatively high
electrical resistance and substrates plated in a plating solution
having a comparatively low electrical resistance.
DESCRIPTION OF EMBODIMENTS
[0063] An embodiment of the present invention will be described
below with reference to the drawings. In the drawings described
below, same or equivalent components are denoted by the same
reference numerals, and redundant description thereof will be
omitted.
[0064] FIG. 1 is a schematic sectional side view of a plating
apparatus according to an embodiment of the present invention. As
illustrated in FIG. 1, the plating apparatus 10 according to the
present embodiment includes an anode holder 20 configured to hold
an anode 21, a substrate holder 40 configured to hold a substrate
W, and a plating bath 50 adapted to hold the anode holder 20 and
substrate holder 40 therein.
[0065] As shown in FIG. 1, the plating bath 50 includes a plating
treatment bath 52 adapted to hold a plating solution Q containing
additives, a plating solution discharge bath 54 adapted to receive
and discharge the plating solution Q overflowing from the plating
treatment bath 52, and a partition wall 55 adapted to separate the
plating treatment bath 52 and plating solution discharge bath
54.
[0066] The anode holder 20 holding the anode 21 and substrate
holder 40 holding the substrate W are immersed in the plating
solution Q in the plating treatment bath 52 and installed there
facing each other such that the anode 21 and a surface-to-be-plated
W1 of the substrate W will be substantially parallel to each other.
A voltage is applied by a plating power supply 59 to the anode 21
and substrate W immersed in the plating solution Q in the plating
treatment bath 52. Consequently, the metal ions are reduced on the
surface-to-be-plated W1 of the substrate W, forming a film on the
surface-to-be-plated W1.
[0067] The plating treatment bath 52 has a plating solution supply
port 56 for use to supply the plating solution Q into the bath. The
plating solution discharge bath 54 has a plating solution discharge
port 57 for use to discharge the plating solution Q overflowing
from the plating treatment bath 52. The plating solution supply
port 56 is located at a bottom of the plating treatment bath 52
while the plating solution discharge port 57 is located at a bottom
of the plating solution discharge bath 54.
[0068] When supplied to the plating treatment bath 52 through the
plating solution supply port 56, the plating solution Q overflows
from the plating treatment bath 52, gets over the partition wall
55, and flows into the plating solution discharge bath 54. After
flowing into the plating solution discharge bath 54, the plating
solution Q is discharged through the plating solution discharge
port 57, and impurities are removed by a filter and the like of a
plating solution circulation unit 58. The plating solution Q with
the impurities removed therefrom is supplied to the plating
treatment bath 52 through the plating solution supply port 56 by
the plating solution circulation unit 58.
[0069] The anode holder 20 includes an anode mask 25 adapted to
adjust an electric field between the anode 21 and substrate W. The
anode mask 25 is a substantially plate-like member made, for
example, of a dielectric material and is installed on a front face
of the anode holder 20. The front face of the anode holder 20 here
is a face on the side facing the substrate holder 40. That is, the
anode mask 25 is placed between the anode 21 and substrate holder
40. The anode mask 25 has an opening 25a (which is an example of a
second opening) in an approximate central portion thereof, where an
electric current flowing between the anode 21 and substrate W
passes through the opening 25a. Preferably the opening 25a is
smaller in diameter than the anode 21. As described later, the
diameter of the opening 25a in the anode mask 25 is configured to
be adjustable.
[0070] The anode mask 25 has an anode mask mount 25b on its outer
circumference to mount the anode mask 25 integrally on the anode
holder 20. Note that the position of the anode mask 25 can be
between the anode holder 20 and substrate holder 40, but preferably
the anode mask 25 is closer to the anode holder 20 than the
intermediate position between the anode holder 20 and substrate
holder 40. Also, for example, the anode mask 25 may be placed on
the front face of the anode holder 20 without being mounted on the
anode holder 20. However, when the anode mask 25 is attached to the
anode holder 20 as with the present embodiment, the position of the
anode mask 25 relative to the anode holder 20 is fixed, making it
possible to prevent displacement between the position of the anode
21 and position of the opening 25a.
[0071] Preferably the anode 21 held by the anode holder 20 is an
insoluble anode. When the anode 21 is an insoluble anode, the anode
21 does not dissolve even when the plating process progresses, and
the shape of the anode 21 remains unchanged. Consequently, since
the positional relationship (distance) between the anode mask 25
and anode 21 does not change, it is possible to prevent changes in
the electric field between the anode 21 and substrate W, which
would be caused by changes in the positional relationship between
the anode mask 25 and a surface of anode 21.
[0072] The plating apparatus 10 further includes a regulation plate
60 adapted to adjust the electric field between the anode 21 and
substrate W. The regulation plate 60 is a substantially flat-plate
member made, for example, of a dielectric material and is installed
between the anode mask 25 and substrate holder 40 (substrate W).
The regulation plate 60 includes an opening 60a (which is an
example of a first opening) adapted to allow passage of the
electric current flowing between the anode 21 and substrate W.
Preferably the opening 60a is smaller in diameter than the
substrate W. As described later, the diameter of the opening 60a in
the regulation plate 60 is configured to be adjustable.
[0073] Preferably the regulation plate 60 is closer to the
substrate holder 40 than the intermediate position between the
anode holder 20 and substrate holder 40. The closer to the
substrate holder 40 the regulation plate 60 is placed, the more
accurately the film thickness on the periphery of the substrate W
can be controlled by adjusting the diameter of the opening 60a in
the regulation plate 60.
[0074] A paddle 18 is installed between the regulation plate 60 and
substrate holder 40 to stir the plating solution Q near the
surface-to-be-plated W1 of the substrate W. The paddle 18 is a
substantially rod-shaped member and is installed in the plating
treatment bath 52, extending in a vertical direction. One end of
the paddle 18 is fixed to a paddle drive unit 19. The paddle 18 is
moved by the paddle drive unit 19 horizontally along the
surface-to-be-plated W1 of the substrate W, thereby stirring the
plating solution Q.
[0075] Next, the anode mask 25 shown in FIG. 1 will be described in
detail. FIGS. 2 and 3 are schematic front views of the anode mask
25. FIG. 2 shows the anode mask 25 when the diameter of the opening
25a is comparatively large. FIG. 3 shows the anode mask 25 when the
diameter of the opening 25a is comparatively small. Here, the
smaller the opening 25a in the anode mask 25, the more heavily the
electric current flowing from the anode 21 to the substrate W is
concentrated on the central portion of the surface-to-be-plated W1
of the substrate W. Thus, as the opening 25a is reduced in size,
the film thickness in the central portion of the
surface-to-be-plated W1 of the substrate W tends to increase.
[0076] As shown in FIG. 2, the anode mask 25 has a rim 26
substantially annular in shape. In FIG. 2, the diameter size of the
opening 25a in the anode mask 25 is maximized. In this case, the
diameter of the opening 25a coincides with the inside diameter of
the rim 26.
[0077] As shown in FIG. 3, the anode mask 25 includes plural
aperture blades 27 (which is an example of an adjustment mechanism)
configured to be able to adjust the opening 25a. The aperture
blades 27 define the opening 25a in collaboration with one another.
Being structured similarly to an aperture mechanism of a camera,
the aperture blades 27 together increase and decrease the diameter
of the opening 25a (adjust the diameter of the opening 25a). The
opening 25a in the anode mask 25 shown in FIG. 3 is formed into a
non-circular shape (e.g., polygonal shape) by means of the aperture
blades 27. In this case, the diameter of the opening 25a
corresponds to the shortest distance between opposite sides of the
polygon or the diameter of an inscribed circle. Alternatively, the
diameter of the opening 25a can be defined by the diameter of a
circle having an area equivalent to the area of the opening. Note
that the distance between anode 21 and that face of the aperture
blade 27 which faces the anode 21 is, for example, between 0 mm and
8 mm (both inclusive).
[0078] The aperture blades 27 are used in conjunction, for example,
to manually increase and decrease the diameter of the opening 25a.
Also, the aperture blades 27 may be configured to be driven
together by means of pneumatic pressure or an electric driving
force. The adjustment mechanism which uses the aperture blades 27
features the capability to make the opening 25a variable in a
comparatively wide range. Also, when the substrate is circular,
desirably the opening 25a in the anode mask 25 is circular.
However, with the opening 25a whose diameter is variable in a
comparatively wide range, it is mechanically difficult to maintain
a completely circular shape in an entire range of the opening 25a
from minimum diameter to maximum diameter. Generally, when the
opening adapted to allow the passage of the electric current
flowing between the anode 21 and substrate W is not completely
circular, an azimuth distribution in an electric field becomes
nonuniform and consequently the shape of the opening may be
transferred to a thickness distribution of a plating film formed on
the periphery of the substrate W. However, since the anode mask 25
is mounted integrally on the anode holder 20, allowing a sufficient
distance from the substrate, the influence on the plating film
thickness distribution can be minimized even when the opening is
not completely circular.
[0079] Next, the regulation plate 60 shown in FIG. 1 will be
described in detail. FIG. 4 shows a perspective front view of the
regulation plate 60, of which a diameter of an opening 60a is
comparatively large, and FIG. 5 shows a perspective rear view of
the regulation plate 60, of which the diameter of the opening 60a
is comparatively large. Also, FIG. 6 shows a front perspective view
of the regulation plate 60, of which the diameter of the opening
60a is comparatively small.
[0080] As shown in FIGS. 4 to 6, the regulation plate 60 includes a
plate main body 61 which has a substantially flat-plate shape. The
plate main body 61 has a pair of suspension parts 62 in upper right
and left end portions to suspend the regulation plate 60 on edges
of a plating treatment bath 52 shown in FIG. 1. Also, the plate
main body 61 has an opening 60a in an approximate central portion
thereof. The opening 60a is formed by an opening adjustment portion
63 provided in the plate main body 61.
[0081] As shown in FIG. 5, a rotating member 100 making up part of
the opening adjustment portion 63 is mounted on a back side of the
regulation plate 60. Also, as shown in FIG. 6, the regulation plate
60 includes a blade body 70 configured to narrow the diameter of
the opening 60a. Details of the rotating member 100 and blade body
70 will be described later.
[0082] FIG. 7 is an exploded perspective view of the regulation
plate 60. As shown in FIG. 7, the regulation plate 60 includes the
plate main body 61, the blade body 70, a ring member 80, a blade
presser member 90, the rotating member 100, and a protective member
110. The blade body 70, ring member 80, blade presser member 90,
rotating member 100, and protective member 110 make up the opening
adjustment portion 63. Also, the regulation plate 60 includes a rim
64 configured to form the opening 60a in conjunction with the plate
main body 61.
[0083] The blade body 70 is located on a front side of the rim 64
of the regulation plate 60 and is provided with plural first blades
71 used to narrow the diameter of the opening 60a. Note that
according to the present embodiment, the front side of the
regulation plate 60 corresponds to the plane opposed to the
substrate holder 40 shown in FIG. 1. However, in another
embodiment, the regulation plate 60 may be placed in the plating
treatment bath 52 shown in FIG. 1 such that the front side of the
regulation plate 60 will be opposed to the anode holder 20 shown in
FIG. 1.
[0084] The ring member 80 is configured to translate the plural
first blades 71 in the radial direction of the opening 60a. The
ring member 80 is placed along the rim 64 of the regulation plate
60. According to the present embodiment, the ring member 80 is
placed along an inner circumferential surface of the rim 64 of the
regulation plate 60. However, this is not restrictive, and the ring
member 80 may be placed, for example, on a front side of the rim 64
of the regulation plate 60.
[0085] The blade presser member 90 is placed on a front side of the
blade body 70 (on a side opposite the ring member 80). The rotating
member 100 is placed on a rear side of the plate main body 61 and
integrated with the ring member 80 as described later. Members
making up regulation plate 60 will be described in detail
below.
[0086] FIG. 8 shows a perspective front view of the plate main body
61, and FIG. 9 shows a perspective rear view of the plate main body
61. As shown in FIG. 8, the plate main body 61 is a substantially
flat-plate member and has the opening 60a in an approximate central
portion thereof. The rim 64 having substantially a same opening as
the opening 60a is fixed on a front side of the plate main body 61.
The rim 64 forms the opening 60a in conjunction with the plate main
body 61. As shown in FIG. 9, the plate main body 61 has plural pin
holes 65 on a rear side, to insert support pins adapted to slidably
support the rotating member 100. Also, the rim 64 has plural screw
holes 66 on a front side to accept screws for use to fix the blade
presser member 90 and protective member 110.
[0087] FIG. 10 is a drawing showing a perspective front view of the
ring member 80. As described above, the ring member 80 is placed
along an inner circumferential surface of the opening 60a in the
plate main body 61 shown in FIGS. 8 and 9. Therefore, an outside
diameter of the ring member 80 is configured to approximately
coincide with an inside diameter of the rim 64 forming the opening
60a in the plate main body 61. Consequently, an inside diameter of
the ring member 80 equals a maximum inside diameter of the opening
60a. As illustrated, the ring member 80 (which is an example of a
first moving mechanism) has plural slide slots 81 on the front
side. According to the present embodiment, eight slide slots 81
corresponding to the number of first blades 71 making up the blade
body 70 is provided in the ring member 80. The slide slots 81 may
or may not penetrate toward a rear side of the ring member 80. The
slide slots 81 are configured to incline in the radial direction of
the opening 60a. In other words, the slide slots 81 are placed
being inclined such that a longitudinal direction of the slide
slots will not face a center of the opening 60a. The slide slots 81
are provided in the ring member 80 in such a way as to be
rotationally symmetric about a central axis of the opening 60a.
According to the present embodiment, since eight slide slots 81 are
provided, the slide slots 81 have eight-fold rotational
symmetry.
[0088] FIG. 11 shows a perspective front view of the rotating
member 100. The rotating member 100 includes a ring portion 101 and
a flat-plate lever portion 102 attached to the ring portion 101.
The ring portion 101 is fixed on the rear side of the ring member
80 shown in FIG. 10. An inside diameter of the ring portion 101 is
configured to substantially coincide in inside diameter with the
ring member 80. The lever portion 102 is coupled to an outer
circumferential portion of the ring portion 101, and when the lever
portion 102 is swung in a circumferential direction of the ring
portion 101, the ring portion 101 rotates in the circumferential
direction within a range of a swing angle.
[0089] Four projections 104 are provided on a circumference of the
ring portion 101, and a support slot 103 is formed in each of the
projections 104 along the circumferential direction of the ring
portion 101. As described later, the support slots 103 are slidably
supported by support pins fixed to the pin holes 65 in the plate
main body 61 shown in FIG. 9.
[0090] FIG. 12 shows a perspective front view of a first blade 71
making up the blade body 70. As illustrated, the first blade 71 is
a fan-shaped member whose inner peripheral edge is formed into an
arc shape. As shown in FIG. 7, the first blade 71 is overlapped
with other first blades 71, forming a substantially circular inner
peripheral edge of the blade body 70 as a whole. According to the
present embodiment, the blade body 70 is made up of eight first
blades 71, but this is not restrictive, and the blade body 70 can
be made up of any number of first blades 71.
[0091] A slide pin 72 configured to slide along a slide slot 81 in
the ring member 80 shown in FIG. 10 is provided on a rear side of
the first blade 71. Although in the present embodiment, a single
slide pin 72 is provided on the first blade 71, this is not
restrictive, and two or more slide pins 72 may be provided on the
first blade 71. In this case, the number of slide slots 81 in the
ring member 80 shown in FIG. 10 needs to be set equal to the number
of slide pins 72.
[0092] Also, guide pins 73 configured to slide along guide slots 91
in the blade presser member 90 shown in FIG. 13 described later are
provided on a front side of the first blade 71. Although in the
present embodiment, two guide pins 73 are provided on the first
blade 71, this is not restrictive, and one or three or more guide
pins 73 may be provided on the first blade 71.
[0093] FIG. 13 is a perspective front view of the blade presser
member 90. The blade presser member 90 is a substantially
flat-plate member and the opening 60a is formed in an approximate
central portion thereof. The diameter of the opening 60a in the
blade presser member 90 is substantially equal to the inside
diameter of the ring member 80 shown in FIG. 10. The blade presser
member 90 has plural guide slots 91. According to the present
embodiment, sixteen guide slots 91 are provided in the blade
presser member 90 and two guide slots 91 correspond, respectively,
to the two guide pins 73 on the first blade 71 shown in FIG. 12.
The number of guide slots 91 can be changed appropriately according
to the number of guide pins 73. The guide slots 91 are formed in
parallel to a translation direction of the first blades 71. Also,
the blade presser member 90 has plural screw holes 92. When the
screw holes 92 are aligned with the screw holes 66 formed in the
rim 64 of the plate main body 61 shown in FIG. 8 and screws are
screwed into the screw holes, the blade presser member 90 can be
fixed to the plate main body 61.
[0094] The blade presser member 90 is placed such that a rear side
of the blade presser member 90 will be put in contact with the
front side of the blade body 70. Therefore, when performing
translational movement in the radial direction of the opening 60a,
the first blades 71 of the blade body 70 perform translational
movement in contact with the blade presser member 90. To reduce
abrasion of the blade presser member 90 and first blades 71,
preferably the blade presser member 90 is made, for example, of a
low-friction resin such as PTFE.
[0095] FIG. 14 is a perspective front view of the protective member
110. The protective member 110 is a substantially flat-plate member
and the opening 60a is formed in an approximate central portion
thereof. The diameter of the opening 60a in the protective member
110 is substantially equal to the inside diameter of the ring
member 80 shown in FIG. 10. The protective member 110 is placed on
a front side of the blade presser member 90. The protective member
110 has plural screw holes 111. When the screw holes 111 are
aligned with the screw holes 66 shown in FIG. 8 and screw holes 92
shown in FIG. 13 and screws are screwed into the screw holes, the
protective member 110 can be fixed to the plate main body 61. The
protective member 110 is made, for example, of vinyl chloride or
the like, and protects the front side of the blade presser member
90.
[0096] Next, a mechanism for translating the first blade 71 shown
in FIG. 12 will be described in detail. FIG. 15 is a partial front
view of the regulation plate 60 as viewed from the front side. FIG.
15 shows the rotating member 100, plural first blades 71, blade
presser member 90, and slide slots 81 in the ring member 80 as seen
one through another, and other members are omitted for simplicity
of illustration.
[0097] As shown in FIG. 15, each of the plural first blades 71 is
placed so as to partially overlap other first blades 71, forming
overlapping portions 75. The inner peripheral edges of the plural
first blades 71 form a substantially circular shape. In the
illustrated state, the slide pins 72 on the plural first blades 71
are located in intermediate part of the respective slide slots 81
and the guide pins 73 are located in intermediate part of the
respective guide slots 91. In the illustrated state, the inside
diameter formed by the inner peripheral edges of the plural first
blades 71 is smaller than an inside diameter of the opening 60a in
the regulation plate 60. Therefore, the plural first blades 71
reduce the inside diameter of the opening 60a in the regulation
plate 60.
[0098] When the lever portion 102 of the rotating member 100 moves
in the direction of arrow A1 or A2, i.e., in the circumferential
direction of the ring portion 101, the non-illustrated ring member
80 coupled to the ring portion 101 also rotates in the
circumferential direction. For example, when the lever portion 102
moves in the direction of arrow A1 (clockwise in FIG. 15), the ring
member 80 rotates clockwise. Consequently, the slide pins 72 on the
first blades 71 slide in the slide slots 81 and minimum diameter
portions 81a of the slide slots 81 move toward the slide pins 72.
As the minimum diameter portions 81a of the slide slots 81 move
toward the slide pins 72, the first blades 71 move inward in the
radial direction of the opening 60a. Since the guide pins 73 on the
first blades 71 slide in the guide slots 91, circumferential
movement and rotary motion of the first blades 71 are prevented.
Therefore, the first blades 71 can reliably perform translational
movement in the radial direction.
[0099] Also, for example, when the lever portion 102 moves in the
direction of arrow A2 (counterclockwise in FIG. 15), the ring
member 80 rotates counterclockwise. Consequently, the slide pins 72
on the first blades 71 slide in the slide slots 81 and maximum
diameter portions 81b of the slide slots 81 move toward the slide
pins 72. As the maximum diameter portions 81b of the slide slots 81
move toward the slide pins 72, the first blades 71 perform
translational movement outward in the radial direction of the
opening 60a.
[0100] The plural first blades 71 perform translational movement in
the radial direction similarly to one another. Therefore, the
plural first blades can move in the radial direction while
maintaining an angular relationship among the first blades 71.
Consequently, a perfectly circular shape formed by the inner
peripheral edges of the plural first blades 71 can be maintained
better than when plural aperture blades rotate around a
predetermined axis, reducing the diameter of the opening as with an
aperture mechanism of a camera.
[0101] FIG. 16 is a rear view of the regulation plate 60 when the
inside diameter of the opening 60a is at the maximum and FIG. 17 is
a rear view of the regulation plate 60 when the inside diameter of
the opening 60a is at the minimum. As shown in FIG. 16, when the
inside diameter of the opening 60a in the regulation plate 60 is at
the maximum, the lever portion 102 of the rotating member 100 is
located relatively to the right and has its range of movement
restricted by a stopper 67 provided on the plate main body 61. In
the state illustrated in FIG. 16, the non-illustrated first blades
71 are located at an outermost position in the radial direction of
the opening 60a and the inner peripheral edges of the first blades
71 substantially coincide with an inner peripheral edge of the ring
portion 101 of the rotating member 100.
[0102] Four support pins 105 are provided on the plate main body
61. The support pins 105 slidably engage with the support slots 103
provided in the projections 104 on the ring portion 101.
Consequently, when the lever portion 102 is operated, the ring
portion 101 is guided to rotate in the circumferential direction
along the support slots 103.
[0103] As shown in FIG. 17, when the inside diameter of the opening
60a in the regulation plate 60 is at the minimum, the lever portion
102 of the rotating member 100 is located relatively to the left
and has its range of movement restricted by a stopper 67 provided
on the plate main body 61. In the state illustrated in FIG. 17, the
plural first blades 71 are located at an innermost position in the
radial direction of the opening 60a and the first blades 71 reduce
the opening 60a in the regulation plate 60.
[0104] The lever portion 102 may be operated, for example,
automatically by a mechanical actuator or manually by an operator.
Also, the lever portion 102 can be fixed at any position between
the pair of stoppers 67.
[0105] As described above, the regulation plate 60 according to the
present embodiment allows the diameter of the opening 60a to be
adjusted by narrowing the diameter of the opening 60a using the
plural first blades 71. This makes it possible to curb reduction in
in-plane uniformity due to influence of a terminal effect when the
first substrate and second substrate differ from each other in
characteristics or processing conditions. Specifically, in plating
the substrate under conditions in which the influence of the
terminal effect appears prominently, by reducing the diameter of
the opening a in the regulation plate 60, the film deposition rate
on the periphery of the substrate can be slowed down, making it
possible to improve the in-plane uniformity on the substrate. Also,
since the first blades 71 are configured to perform translational
movement, the plural first blades 71 can move in the radial
direction while maintaining an angular relationship among the first
blades 71. Therefore, a perfectly circular shape formed by the
inner peripheral edges of the plural first blades 71 can be
maintained better than when plural aperture blades rotate around a
predetermined axis, reducing the diameter of the opening as with an
aperture mechanism of a camera.
[0106] Note that according to the present embodiment, the first
blades 71 have the slide pins 72 while the ring member 80 has the
slide slots 81. However, this is not restrictive, and the ring
member 80 may have slide pins 72 and the first blades 71 may have
corresponding slide slots 81. Even when the first blades 71 and
ring member 80 are configured in this way, as the ring member 80
rotates in the circumferential direction, the slide pins 72 slide
in the slide slots 81, allowing the first blades 71 to move in the
radial direction.
[0107] According to the present embodiment, the first blades 71
have the guide pins 73 and the blade presser member 90 have the
guide slots 91. However, this is not restrictive, and the blade
presser member 90 may have the guide pins 73 and the first blades
71 may have corresponding guide slots 91. Even when the first
blades 71 and blade presser member 90 are configured in this way,
as the first blades 71 are moved by the ring member 80, the guide
pins 73 slide in the guide slots 91, making it possible to prevent
circumferential movement and rotary motion of the first blades
71.
[0108] According to the present embodiment, the projections 104
provided with the support slots 103 are formed on the ring portion
101 of the rotating member 100 and the support pins 105 are fixed
to the plate main body 61. However, this is not restrictive, and
the ring portion 101 of the rotating member 100 may have support
pins 105 and the plate main body 61 may have corresponding support
slots 103. Even when the rotating member 100 and plate main body 61
are configured in this way, as the ring portion 101 is swung by the
lever portion 102, the support pins 105 slide in the support slots
103, allowing the ring portion 101 to rotate in the circumferential
direction.
[0109] Furthermore, according to the present embodiment, the
regulation plate 60 includes only the blade body 70 (plural first
blades 71) as a means of reducing the diameter of the opening 60a.
However, the regulation plate 60 may include plural second blades
other than the plural first blades 71, and a mechanism for
translating the plural second blades. In this case, the plural
second blades are placed at a position shifted from the plural
first blades 71 in a direction orthogonal to the radial direction
of the opening 60a. The mechanism for translating the plural second
blades is identical with the above-mentioned mechanism for
translating the plural first blades 71, and consequently the plural
second blades perform translational movement in the radial
direction of the opening 60a. Concrete examples will be described
below with reference to drawings.
[0110] FIG. 18 is a perspective front view of a regulation plate
having plural first blades and plural second blades according to
another embodiment, and FIG. 19 is a perspective rear view of the
regulation plate. In the drawings described below, components
corresponding to those shown in FIGS. 4 to 17 are denoted by the
same reference numerals as those used in FIGS. 4 to 17 with either
"A" or "B" added to the end of the numerals, and redundant
description thereof will be omitted.
[0111] As shown in FIGS. 18 and 19, the regulation plate 60
according to the present embodiment includes a first plate main
body 61A and a second plate main body 61B. The first plate main
body 61A includes a first opening adjustment portion 63A and the
second plate main body 61B includes a second opening adjustment
portion 63B. The first plate main body 61A and second plate main
body 61B are coupled together by arbitrary fixing means 120 such as
screws or bolts. In the illustrated regulation plate 60, the first
plate main body 61A and second plate main body 62B are coupled
together by the fixing means 120, being placed in close contact
without a gap therebetween. However, this is not restrictive, and
the first plate main body 61A and second plate main body 62B may be
coupled together with a gap therebetween. Also, the fixing means
120 may include an adjustment mechanism adapted to adjust size of
the gap between the first plate main body 61A and second plate main
body 62B. This will make it possible to adjust a distance between
after-mentioned plural first blades 71A (see FIG. 21) and plural
second blades 71B (see FIG. 22) as desired.
[0112] The first plate main body 61A includes an opening portion
69A used to expose a handle 105A of a rotating member 100A to the
outside. Also, the second plate main body 61B includes an opening
portion 69B used to expose a handle 105B of a rotating member 100B
to the outside. The handle 105A exposed from the opening portion
69A and the handle 105B exposed from the opening portion 69B can be
operated independently of each other by any actuator or by hand.
This makes it possible to translate the plural first blades 71A
shown in FIG. 21 and the plural second blades 71B in the radial
direction independently of each other.
[0113] FIG. 20 is an exploded perspective view of the first plate
main body 61A and second plate main body 62B. As illustrated, the
first plate main body 61A and second plate main body 62B are
coupled together in such a way that a plane on which the rotating
member 100A is provided and a plane on which the rotating member
100B is provided will be opposed to each other. The first plate
main body 61A includes a cavity 68A capable of housing the rotating
member 100A and rotating member 100B. The cavity 68A is configured
to house the rotating member 100A and rotating member 100B when the
first plate main body 61A and second plate main body 62B are
coupled together.
[0114] The first plate main body 61A has a first opening 169A in an
approximate central portion thereof to allow passage of an electric
current. Also, the second plate main body 61B has a second opening
169B in an approximate central portion thereof to allow passage of
an electric current. The first plate main body 61A and second plate
main body 61B are coupled together in such a way that a center of
the first opening 169A and a center of the second opening 169B will
be concentric. In other words, the first plate main body 61A and
second plate main body 61B are coupled together in such a way that
a straight line joining the center of the first opening 169A and
the center of the second opening 169B will be orthogonal to radial
directions of the respective openings.
[0115] FIG. 21 is an exploded perspective view of the first plate
main body 61A. As illustrated, the first plate main body 61A
includes a blade body 70A, a ring member 80A, a blade presser
member 90A, the rotating member 100A, and a protective member 110A.
According to the present embodiment, each of the plural first
blades 71A making up the blade body 70 has two slide pins 72A. The
ring member 80A has slide slots 81A in pairs corresponding to the
two slide pins 72A.
[0116] FIG. 22 is an exploded perspective view of the second plate
main body 61B. As illustrated, the second plate main body 61B
includes a blade body 70B, a ring member 80B, a blade presser
member 90B, the rotating member 100B, and a protective member 110B.
According to the present embodiment, each of the plural second
blades 71B making up the blade body 70 has two slide pins 72B. The
ring member 80B has slide slots 81B in pairs corresponding to the
two slide pins 72B.
[0117] The first plate main body 61A and second plate main body 61B
are coupled together in such a way that a center of an opening
formed by the plural first blades 71A shown in FIG. 21 and a center
of an opening formed by the plural second blades 71B shown in FIG.
22 will be concentric. In other words, the first plate main body
61A and second plate main body 61B are coupled together in such a
way that a straight line joining the center of the opening formed
by the plural first blades 71A and the center of the opening formed
by the plural second blades 71B will be orthogonal to radial
directions of the respective openings.
[0118] In this way, the regulation plate 60 provided with the
plural first blades 71A and plural second blades 71B allows the
diameter of the opening 60a to be narrowed by both the plural first
blades 71A and plural second blades 71B. In this case, the plural
first blades 71A and plural second blades 71B allow the film
deposition rate on the periphery of the substrate to be further
slowed down. This makes it possible to improve the in-plane
uniformity on the substrate whose film thicknesses tends to
increase on the periphery.
[0119] When installing plural conventional regulation plates in a
plating bath, it is necessary to position the center of an opening
with respect to each of the plural regulation plates, taking a lot
of trouble. In contrast, when plural first blades 71A and plural
second blades 71B can be installed in a common regulation plate 60,
the center of the opening formed by the first blades 71A and the
center of the opening formed by the second blades 71B are fixed
relatively. Therefore, when positioning the regulation plate 60 in
a plating bath, there is no need to position the center of the
opening formed by the plural first blades 71A and the center of the
opening formed by the plural second blades 71B separately.
Consequently, even when high accuracy is required of the center
position of the opening in the regulation plate 60, the regulation
plate 60 can be positioned easily.
[0120] Also, since the blade body 70A of the regulation plate 60 is
made up of the plural first blades 71A, the shape of the opening of
the blade body 70A is not perfectly circular in a strict sense.
Consequently, it is difficult to completely remove variations in an
electric field applied to the substrate W, where the variations are
caused by the shape of the opening. However, since the plural
second blades 71B are provided, electric field variations caused by
the opening shape formed by the plural first blades 71A and
electric field variations caused by the opening shape formed by the
plural second blades 71B cancel out each other, reducing the
electric field variations and making it possible to bring the
plating film formed on the substrate W close to a perfect
circle.
[0121] Furthermore, in the regulation plate 60, as shown in FIG.
15, each of the plural first blades 71 has the overlapping portions
75 with the adjacent first blades 71 and a portion not overlapping
the adjacent first blades 71. The overlapping portions 75 are
thicker than the non-overlapping portion, and consequently differ
in electric field suppression effect from the non-overlapping
portion. This can result in electric field variations in the
circumferential direction of the opening. On the other hand, when
the regulation plate 60 has the plural second blades 71B in
addition to the plural first blades 71A, by shifting
circumferential positions of the overlapping portions of the plural
second blades 71B from circumferential positions of the overlapping
portions of the plural first blades 71A, it is possible to reduce
the electric field variations caused by the respective overlapping
portions of the first blades and second blades. Preferably if the
circumferential positions of the overlapping portions of the plural
second blades 71B and the circumferential positions of the
overlapping portions of the plural first blades 71A are arranged in
a staggered manner, the electric field variations can be reduced
further.
[0122] Also, in the regulation plate 60 provided with the plural
first blades 71A and plural second blades 71B, the diameter of the
opening 60A defined by the plural first blades 71A and the diameter
of the opening 60B defined by the plural second blades 71B can be
made different from each other. This makes it possible to decrease
the diameters of the openings in stages according to the
characteristics or processing conditions of the substrate, such as
reducing the diameter of the opening defined by the blades closer
to the substrate and increasing the diameter of the opening defined
by the blades farther from the substrate.
[0123] Next, description will be given of the process of plating
the substrate W using the plating apparatus 10 shown in FIG. 1. As
described above, the influence of the terminal effect varies with
characteristics of the substrate W, conditions for processing the
substrate W, and the like. Therefore, when plural substrates W
differing in the influence of the terminal effect are plated using
a single plating apparatus 10, in order to curb the reduction in
the in-plane uniformity of film thickness due to the terminal
effect, it is necessary to adjust the electric field applied to
each substrate W, according to the characteristics of the substrate
W, conditions for processing the substrate W, and the like.
[0124] By adjusting the diameter of at least the opening 25a in the
anode mask 25 according to the characteristics of the substrates W
or conditions for processing the substrates W, the plating
apparatus 10 of the present embodiment can curb the reduction in
the in-plane uniformity of the plating film on the substrates
W.
[0125] Specifically, when the resist aperture ratio of the second
substrate is lower than the resist aperture ratio of the first
substrate, as described above, even if a plating film is formed on
the second substrate, variation in the electrical resistance value
between the central portion of the second substrate and the
electrical contact is smaller than in the case of the first
substrate whose resist aperture ratio is comparatively high.
Consequently, even if a plating film is formed to some extent on
the second substrate, the influence of the terminal effect on the
second substrate remains large. Therefore, when the first substrate
and second substrate are plated by keeping the conditions other
than the resist aperture ratios of the substrates equal, the film
thickness of the second substrate becomes larger in a peripheral
portion of the substrate and relatively smaller in the central
portion the substrate than the film thickness of the first
substrate. Thus, the diameter of the opening 25a in the anode mask
25 is set smaller when the second substrate is plated using the
plating apparatus 10 than when the first substrate is plated. This
makes it possible to increase the film thickness in the central
portion of the second substrate. Consequently, the reduction in
in-plane uniformity due to the influence of the terminal effect can
be curbed on both the first substrate and second substrate.
[0126] Also, when a seed layer of the second substrate is thinner
than a seed layer of the first substrate, the terminal effect on
the second substrate becomes prominent as described above.
Therefore, when the first substrate and second substrate are plated
by keeping the conditions other than the thickness of the seed
layer equal, the film thickness of the second substrate becomes
larger in the peripheral portion of the substrate and relatively
smaller in the central portion the substrate than the film
thickness of the first substrate. Thus, the diameter of the opening
25a in the anode mask 25 is set smaller when the second substrate
is plated using the plating apparatus 10 than when the first
substrate is plated. This makes it possible to increase the film
thickness in the central portion of the second substrate.
Consequently, the reduction in in-plane uniformity due to the
influence of the terminal effect can be curbed on both the first
substrate and second substrate.
[0127] Furthermore, when the second substrate is plated using a
plating solution with a lower electrical resistance value than the
plating solution used for the first substrate, the terminal effect
on the second substrate becomes prominent as described above.
Therefore, when the first substrate and second substrate are plated
by keeping the conditions other than the electrical resistance
value equal, the film thickness of the second substrate becomes
larger in the peripheral portion of the substrate and relatively
smaller in the central portion the substrate than the film
thickness of the first substrate. Thus, the diameter of the opening
25a in the anode mask 25 is set smaller when the second substrate
is plated using the plating apparatus 10 than when the first
substrate is plated. This makes it possible to increase the film
thickness in the central portion of the second substrate.
Consequently, the reduction in in-plane uniformity due to the
influence of the terminal effect can be curbed on both the first
substrate and second substrate.
[0128] Furthermore, by adjusting the diameter of the opening 60a in
the regulation plate 60 in addition to adjusting the diameter of
the opening 25a in the anode mask 25, the plating apparatus 10 of
the present embodiment can improve the in-plane uniformity of the
plating film on the substrate W.
[0129] The regulation plate 60 is placed at a position closer to
the substrate W than to the anode mask 25. Consequently, a plating
current passing through the opening 60a in the regulation plate 60
becomes less prone to spread to the periphery of the substrate W.
Thus, if the diameter of the opening 60a in the regulation plate 60
is decreased, the film thickness on the periphery of the substrate
W can be decreased, and if the diameter of the opening 60a in the
regulation plate 60 is increased, the film thickness on the
periphery of the substrate W can be increased.
[0130] Preferably the diameter of the opening 60a in the regulation
plate 60 is adjusted as appropriate according to the film thickness
distribution on the substrate W, which is changed by adjusting the
diameter of the opening 25a in the anode mask 25. Therefore, in
plating a second substrate differing from a first substrate in
characteristics or processing conditions, the diameter of the
opening 25a in the anode mask 25 is adjusted to be smaller or
larger than when the first substrate is processed and the diameter
of the opening 60a in the regulation plate 60 is changed as
appropriate. When the regulation plate 60 has plural first blades
71A and plural second blades 71B such as shown in FIGS. 18 to 22,
the opening portions 69A and 69B formed by the first and second
blades, respectively, can be changed independently of each other as
appropriate. This provides an equipment configuration capable of
more accurately controlling reduction in in-plane uniformity due to
influence of a terminal effect when plating plural substrates
differing in characteristics and processing conditions.
[0131] Next, a concrete description will be given of changes in
profiles of plating films on substrates W, where the profiles are
changed by changing the diameter of the opening 25a in the anode
mask 25 and the diameter of the opening 60a in the regulation plate
60. Examples in which the regulation plate 60 shown in FIGS. 4 to
17 is used will be shown below.
[0132] FIG. 23 is a diagram showing profiles of plating films on
substrates W with a high resist aperture ratio (80%) and substrates
W with a low resist aperture ratio (10%). In FIG. 23, "AM" denotes
the diameter of the opening 25a in the anode mask 25, "RP" denotes
the diameter of the opening 60a in the regulation plate 60, HDP
denotes a substrate W with a high resist aperture ratio, and LDP
denotes a substrate W with a low resist aperture ratio. Note that
both the substrates W with a high resist aperture ratio and
substrates W with a low resist aperture ratio are 50 nm to 100 nm
in seed layer thickness and that the profiles in FIG. 23 are
obtained using a solution with a comparatively low resistance for
plating.
[0133] As illustrated in FIG. 23, when the substrate W with a high
resist aperture ratio is plated with the diameter of the opening
25a set to 230 mm and with the diameter of the opening 60a set to
276 mm (hereinafter this condition will be referred to as condition
A), the film thickness in the central portion of the substrate is
large and the film thicknesses on the periphery of the substrate is
small. In contrast, when the substrate W with a high resist
aperture ratio is plated with the diameter of the opening 25a set
to 270 mm and with the diameter of the opening 60a set to 276 mm
(hereinafter this condition will be referred to as condition C),
since the diameter of the opening 25a is larger under condition C
than under condition A, the film thickness in the central portion
of the substrate is smaller. Also, when the substrate W with a high
resist aperture ratio is plated with the diameter of the opening
25a set to 270 mm and with the diameter of the opening 60a set to
280 mm (hereinafter this condition will be referred to as condition
B), since the diameter of the opening 60a is larger under condition
B than under condition C, the film thicknesses on the periphery of
the substrate is larger.
[0134] When the substrate W with a low resist aperture ratio is
plated with the diameter of the opening 25a set to 270 mm and with
the diameter of the opening 60a set to 276 mm (hereinafter this
condition will be referred to as condition E), the film thickness
in the central portion of the substrate is small and the film
thicknesses on the periphery of the substrate is large. This means
that the film thickness on the periphery of the substrate has been
increased under the influence of the terminal effect. In contrast,
when the substrate W with a low resist aperture ratio is plated
with the diameter of the opening 25a set to 220 mm and with the
diameter of the opening 60a set to 276 mm (hereinafter this
condition will be referred to as condition F), since the diameter
of the opening 25a is smaller under condition F than under
condition E, the film thickness in the central portion of the
substrate is larger. Also, when the substrate W with a low resist
aperture ratio is plated with the diameter of the opening 25a set
to 220 mm and with the diameter of the opening 60a set to 274 mm
(hereinafter this condition will be referred to as condition D),
since the diameter of the opening 60a is smaller under condition D
than under condition F, the film thicknesses on the periphery of
the substrate is smaller.
[0135] As shown in FIG. 23, even in the case of the substrates W
with a low resist aperture ratio on which the influence of the
terminal effect appears comparatively prominently, if the diameter
of the opening 25a is set smaller than the diameter (270 mm:
conditions B and C) of the opening 25a suitable for plating of the
substrates W with a high resist aperture ratio, it is possible to
curb the reduction in the in-plane uniformity of film thickness on
the substrates W due to the terminal effect (see conditions D and
F). Furthermore, by adjusting the diameter of the opening 60a in
the regulation plate 60, the film thickness on the periphery of the
substrate W can be adjusted, making it possible to further curb the
reduction in the in-plane uniformity of film thickness on the
substrates W due to the terminal effect (see condition D).
[0136] FIG. 24 is a diagram showing profiles of plating films on
substrates W with a thick seed layer (500 nm or above) and
substrates W with a thin seed layer (50 to 100 nm). Note that both
the substrates W with a thick seed layer and substrates W with a
thin seed layer have a resist aperture ratio of 10% and that the
profiles in FIG. 24 are obtained using a solution with a
comparatively low resistance for plating.
[0137] As illustrated in FIG. 24, when the substrate W with a thick
seed layer is plated with the diameter of the opening 25a set to
230 mm and with the diameter of the opening 60a set to 276 mm
(hereinafter this condition will be referred to as condition A),
the film thickness in the central portion of the substrate is large
and the film thicknesses on the periphery of the substrate is
small. In contrast, when the substrate W with a thick seed layer is
plated with the diameter of the opening 25a set to 270 mm and with
the diameter of the opening 60a set to 276 mm (hereinafter this
condition will be referred to as condition C), since the diameter
of the opening 25a is larger under condition C than under condition
A, the film thickness in the central portion of the substrate is
smaller. Also, when the substrate W with a thick seed layer is
plated with the diameter of the opening 25a set to 270 mm and with
the diameter of the opening 60a set to 278 mm (hereinafter this
condition will be referred to as condition B), since the diameter
of the opening 60a is larger under condition B than under condition
C, the film thicknesses on the periphery of the substrate is
larger.
[0138] When the substrate W with a thin seed layer is plated with
the diameter of the opening 25a set to 270 mm and with the diameter
of the opening 60a set to 276 mm (hereinafter this condition will
be referred to as condition E), the film thickness in the central
portion of the substrate is small and the film thicknesses on the
periphery of the substrate is large. This means that the film
thickness on the periphery of the substrate has been increased
under the influence of the terminal effect. In contrast, when the
substrate W with a thin seed layer is plated with the diameter of
the opening 25a set to 220 mm and with the diameter of the opening
60a set to 276 mm (hereinafter this condition will be referred to
as condition F), since the diameter of the opening 25a is smaller
under condition F than under condition E, the film thickness in the
central portion of the substrate is larger. Also, when the
substrate W with a thin seed layer is plated with the diameter of
the opening 25a set to 220 mm and with the diameter of the opening
60a set to 274 mm (hereinafter this condition will be referred to
as condition D), since the diameter of the opening 60a is smaller
under condition D than under condition F, the film thicknesses on
the periphery of the substrate is smaller.
[0139] As shown in FIG. 24, even in the case of the substrates W
with a thin seed layer on which the influence of the terminal
effect appears comparatively prominently, if the diameter of the
opening 25a is set smaller than the diameter (270 mm: conditions B
and C) of the opening 25a suitable for plating of the substrates W
with a thick seed layer, it is possible to curb the reduction in
the in-plane uniformity of film thickness on the substrates W due
to the terminal effect (see conditions D and F). Furthermore, by
adjusting the diameter of the opening 60a in the regulation plate
60, the film thickness on the periphery of the substrate W can be
adjusted, making it possible to further curb the reduction in the
in-plane uniformity of film thickness on the substrates W due to
the terminal effect (see condition D).
[0140] FIG. 25 is a diagram showing profiles of plating films on
substrates W plated in a plating solution (type A) having a
comparatively high electrical resistance and substrates W plated in
a plating solution (type B) having a comparatively low electrical
resistance. Note that both the substrates W plated in a plating
solution having a comparatively high electrical resistance and
substrates W plated in a plating solution having a comparatively
low electrical resistance have a resist aperture ratio of 10% and
have a seed layer thickness of 50 nm to 100 nm.
[0141] As illustrated in FIG. 25, when the substrate W is plated in
a plating solution having a comparatively high electrical
resistance with the diameter of the opening 25a set to 230 mm and
with the diameter of the opening 60a set to 276 mm (hereinafter
this condition will be referred to as condition A), the film
thickness in the central portion of the substrate is large and the
film thicknesses on the periphery of the substrate is small. In
contrast, when the substrate W is plated in a plating solution
having a comparatively high electrical resistance with the diameter
of the opening 25a set to 260 mm and with the diameter of the
opening 60a set to 276 mm (hereinafter this condition will be
referred to as condition C), since the diameter of the opening 25a
is larger under condition C than under condition A, the film
thickness in the central portion of the substrate is smaller. Also,
when the substrate W is plated in a plating solution having a
comparatively high electrical resistance with the diameter of the
opening 25a set to 260 mm and with the diameter of the opening 60a
set to 272 mm (hereinafter this condition will be referred to as
condition B), since the diameter of the opening 60a is smaller
under condition B than under condition C, the film thicknesses on
the periphery of the substrate is smaller.
[0142] When the substrate W is plated in a plating solution having
a comparatively low electrical resistance with the diameter of the
opening 25a set to 270 mm and with the diameter of the opening 60a
set to 276 mm (hereinafter this condition will be referred to as
condition E), the film thickness in the central portion of the
substrate is small and the film thicknesses on the periphery of the
substrate is large. This means that the film thickness on the
periphery of the substrate has been increased under the influence
of the terminal effect. In contrast, when the substrate W is plated
in a plating solution having a comparatively low electrical
resistance with the diameter of the opening 25a set to 220 mm and
with the diameter of the opening 60a set to 276 mm (hereinafter
this condition will be referred to as condition F), since the
diameter of the opening 25a is smaller under condition F than under
condition E, the film thickness in the central portion of the
substrate is smaller. Also, when the substrate W is plated in a
plating solution having a comparatively low electrical resistance
with the diameter of the opening 25a set to 220 mm and with the
diameter of the opening 60a set to 274 mm (hereinafter this
condition will be referred to as condition D), since the diameter
of the opening 60a is smaller under condition D than under
condition F, the film thicknesses on the periphery of the substrate
is smaller.
[0143] As shown in FIG. 25, even if the substrates W are plated in
a plating solution having a comparatively low electrical
resistance, if the diameter of the opening 25a is set smaller than
the diameter (260 mm: conditions B and C) of the opening 25a
suitable for plating of the substrates W in a plating solution
having a comparatively high electrical resistance, it is possible
to curb the reduction in the in-plane uniformity of film thickness
on the substrates W due to the terminal effect (see conditions D
and F). Furthermore, by adjusting the diameter of the opening 60a
in the regulation plate 60, the film thickness on the periphery of
the substrate W can be adjusted, making it possible to further curb
the reduction in the in-plane uniformity of film thickness on the
substrates W due to the terminal effect (see condition D).
[0144] As shown in FIGS. 23 to 25, in order to perform plating with
good uniformity under conditions differing in the influence of the
terminal effect, desirably the diameter of the opening 25a in the
anode mask 25 has a wide variation range than the diameter of the
opening 60a in the regulation plate 60. In order to make the
diameter of the opening 25a in the anode mask 25 adjustable in a
wide variation range, a mechanism which uses the aperture blades 27
described above is suitable. Since the anode mask 25 and substrate
W are spaced away from each other, even if the opening 25a in the
anode mask 25 is decreased, an electric flux spreads between the
anode mask 25 and substrate W, allowing the film thickness
distribution of the plating film to be adjusted in a wide range of
the substrate W.
[0145] Even if the influence of the terminal effect is excluded,
the plating film tends to become thick on the periphery of the
substrate W because the electric flux spreading outward between the
anode mask 25 and substrate W concentrates on the periphery of the
substrate W. Adjustment of plating film thickness in a
comparatively narrow region on the periphery of the substrate W
such as described above is achieved by the opening adjustment
portion 63 of the regulation plate 60. The regulation plate 60,
which is located close to the substrate W, can directly shield
electric fields on the peripheral portion of the substrate W and
adjust the plating film thickness even by a comparatively small
change in an aperture diameter.
[0146] An embodiment of the present invention has been described
above, but the embodiment described above is intended to facilitate
understanding of the present invention and is not meant to limit
the present invention. The present invention can be modified and
improved without departing from the spirit and scope of the present
invention. Needless to say, the present invention includes
equivalents thereof. Also, the components described in the appended
claims and in the specification may be used in any combination or
any of the components may be omitted as long as at least some of
the problems described above can be solved or as long as at least
some of the advantageous effects described above can be achieved.
For example, in the embodiments described above, the plural
aperture blades 27 are used as a mechanism for adjusting the
diameter of the opening 25a in the anode mask 25, and the plural
first blades 71A and plural second blades 71B are used as a
mechanism for adjusting the diameter of the opening 60a in the
regulation plate 60. However, the diameter of the opening 25a in
the anode mask 25 may be adjusted using the plural first blades 71A
and plural second blades 71B and the opening 60a in the regulation
plate 60 may be adjusted using the plural aperture blades 27. Also,
not only the plural aperture blades 27 and the plural first blades
71A and plural second blades 71B, but also an adjustment mechanism
of another form may be adopted.
REFERENCE SIGNS LIST
[0147] 10 Plating apparatus [0148] 20 Anode holder [0149] 21 Anode
[0150] 25 Anode mask [0151] 25a Opening [0152] 40 Substrate holder
[0153] 60 Regulation plate [0154] 60a Opening [0155] 71, 71A First
blade [0156] 71B Second blade [0157] 72, 72A, 72B Slide pin [0158]
73 Guide pin [0159] 80, 80A, 80B Ring member [0160] 81, 81A, 81B
Slide slot [0161] 90, 90A, 90B Blade presser member [0162] 91 Guide
slot [0163] W Substrate
* * * * *