Electrical contact for use in a plating apparatus

Fujikata , et al. December 27, 2

Patent Grant D651178

U.S. patent number D651,178 [Application Number D/356,550] was granted by the patent office on 2011-12-27 for electrical contact for use in a plating apparatus. This patent grant is currently assigned to Ebara Corporation. Invention is credited to Yuji Araki, Jumpei Fujikata.


United States Patent D651,178
Fujikata ,   et al. December 27, 2011

Electrical contact for use in a plating apparatus

Claims

CLAIM The ornamental design for an electrical contact for use in a plating apparatus, as shown and described.
Inventors: Fujikata; Jumpei (Tokyo, JP), Araki; Yuji (Tokyo, JP)
Assignee: Ebara Corporation (Tokyo, JP)
Appl. No.: D/356,550
Filed: February 26, 2010

Current U.S. Class: D13/148
Current International Class: 1303
Field of Search: ;D13/133,148,154,184,199 ;439/865,868,877-891,894

References Cited [Referenced By]

U.S. Patent Documents
296547 April 1884 Flad
354268 December 1886 Stiff et al.
519031 May 1894 Streuber
3670298 June 1972 Klumpp, Jr.
5043528 August 1991 Mohr
6534706 March 2003 Rapp et al.
6830667 December 2004 Yamamoto
7170013 January 2007 Lewis
D555595 November 2007 Yahagi et al.
D556692 December 2007 Yahagi et al.
D569802 May 2008 Long et al.
D578075 October 2008 Yang
D624027 September 2010 Huang et al.
2010/0105256 April 2010 Lyford et al.
Foreign Patent Documents
2005-029863 Feb 2005 JP
Primary Examiner: Johannes; Thomas
Attorney, Agent or Firm: Sughrue Mion, PLLC

Description



FIG. 1 is a front view of an electrical contact for use in a plating apparatus showing our new design;

FIG. 2 is a right side elevation view thereof; the left side being a mirror image thereto,

FIG. 3 is a rear elevation view thereof;

FIG. 4 is a top plan view thereof;

FIG. 5 is a bottom plan view thereof;

FIG. 6 is a rear perspective view thereof; and,

FIG. 7 is a perspective view thereof, observed from below.

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