Heat dissipation device

Lin , et al. July 13, 2

Patent Grant D619551

U.S. patent number D619,551 [Application Number D/350,259] was granted by the patent office on 2010-07-13 for heat dissipation device. This patent grant is currently assigned to Foxsemicon Integrated Technology, Inc.. Invention is credited to Shan-Ju Lin, Hong-Bin Yang.


United States Patent D619,551
Lin ,   et al. July 13, 2010

Heat dissipation device

Claims

CLAIM The ornamental design for a heat dissipation device, as shown.
Inventors: Lin; Shan-Ju (Miao-Li Hsien, TW), Yang; Hong-Bin (Miao-Li Hsien, TW)
Assignee: Foxsemicon Integrated Technology, Inc. (Chu-Nan, Miao-Li Hsien, TW)
Appl. No.: D/350,259
Filed: November 13, 2009

Foreign Application Priority Data

Jul 21, 2009 [CN] 2009 3 0309739
Current U.S. Class: D13/179
Current International Class: 1303
Field of Search: ;D13/179 ;165/80.3,104.33,151,122,185 ;257/706,707,718-722 ;361/687,695,697,700,702,704,709,710,711,719

References Cited [Referenced By]

U.S. Patent Documents
6633484 October 2003 Lee et al.
D570504 June 2008 Maxik et al.
D576964 September 2008 Shaner
7487824 February 2009 Lin et al.
D592613 May 2009 Plonski et al.
D593963 June 2009 Plonski et al.
2002/0046826 April 2002 Kao
2004/0118552 June 2004 Huang et al.
2005/0174780 August 2005 Park
2007/0236935 October 2007 Wang
2008/0121377 May 2008 Lin et al.
2009/0147520 June 2009 Liu et al.
2009/0279314 November 2009 Wu et al.
2010/0014287 January 2010 Chiang et al.
2010/0026158 February 2010 Wu
Primary Examiner: Sikder; Selina
Attorney, Agent or Firm: Chew; Raymond J.

Description



FIG. 1 is a perspective view of a heat dissipation device of our new design.

FIG. 2 is a front elevational view thereof

FIG. 3 is a rear elevational view thereof.

FIG. 4 is a left-side, elevational view thereof.

FIG. 5 is a right-side, elevational view thereof.

FIG. 6 is a top plan view thereof; and,

FIG. 7 is a bottom plan view thereof.

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