U.S. patent application number 09/982016 was filed with the patent office on 2002-04-25 for cpu cooling structure.
Invention is credited to Kao, Chao-Chih.
Application Number | 20020046826 09/982016 |
Document ID | / |
Family ID | 26666918 |
Filed Date | 2002-04-25 |
United States Patent
Application |
20020046826 |
Kind Code |
A1 |
Kao, Chao-Chih |
April 25, 2002 |
CPU cooling structure
Abstract
A CPU cooling structure includes a heat sink and an axial flow
fan adapted to dissipate heat from the CPU of the motherboard in a
computer, the heat sink having a hollow center shaft filled up with
a heat transfer fluid and a plurality of radiation fins
equiangularly radially arranged around the periphery of the center
shaft and curved in direction corresponding or reversed to the
direction of rotation of the fan blade and hub assembly of the
axial flow fan.
Inventors: |
Kao, Chao-Chih; (Taipei,
TW) |
Correspondence
Address: |
RABIN & BERDO, P.C.
Suite 500
1101 14th STREET, N.W.
Washington
DC
20005
US
|
Family ID: |
26666918 |
Appl. No.: |
09/982016 |
Filed: |
October 19, 2001 |
Current U.S.
Class: |
165/104.33 ;
165/185; 257/E23.099; 257/E23.103 |
Current CPC
Class: |
F28D 15/00 20130101;
H01L 23/467 20130101; H01L 2924/00 20130101; H01L 2924/0002
20130101; H01L 2924/0002 20130101; H01L 23/3672 20130101 |
Class at
Publication: |
165/104.33 ;
165/185 |
International
Class: |
F28D 015/00; F28F
007/00 |
Foreign Application Data
Date |
Code |
Application Number |
Oct 25, 2000 |
TW |
089122409 |
Mar 13, 2001 |
TW |
090203720 |
Jul 26, 2001 |
TW |
089122409A01 |
Claims
What the invention claimed is:
1. A CPU cooling structure comprising a heat sink disposed in
contact with the surface of the CPU (central processing unit) of
the motherboard in a computer, and an axial flow fan fastened to a
top side of said heat sink and having a fan blade and hub assembly
rotated to cause an axial flow of air toward said heat sink and
said CPU and to dissipate heat from said heat sink and said CPU,
wherein said heat sink comprises a center shaft and a plurality of
radiation fins equiangularly radially arranged around the periphery
of said center shaft and curved in direction reversed to the
direction of rotation of the fan blade and hub assembly of said
axial flow fan.
2. The CPU cooling structure as claimed in claim 1 wherein said
center shaft comprises an enclosed fluid chamber and a heat
transfer fluid filled in said enclosed fluid chamber.
3. A CPU cooling structure comprising a heat sink disposed in
contact with the surface of the CPU (central processing unit) of
the motherboard in a computer, and an axial flow fan fastened to a
top side of said heat sink and having a fan blade and hub assembly
rotated to cause an axial flow of air toward said heat sink and
said CPU and to dissipate heat from said heat sink and said CPU,
wherein said heat sink comprises a center shaft and a plurality of
radiation fins equiangularly radially arranged around the periphery
of said center shaft and curved in direction corresponding to the
direction of rotation of the fan blade and hub assembly of said
axial flow fan, said center shaft comprising an enclosed fluid
chamber and a heat transfer fluid filled in said enclosed fluid
chamber.
Description
BACKGROUND OF THE INVENTION
[0001] The present invention relates to a CPU cooling structure
adapted to lower the temperature of the CPU of a computer during
its operation and, more particularly, to such a CPU cooling
structure, which enables induced currents of air to pass toward the
CPU and the surrounding electronic component parts to quickly
dissipate heat from the CPU and the surrounding electronic
component parts.
[0002] Advanced CPUs (central processing units) provide a high
operational speed, and simultaneously produce a high temperature
during its operation. In order to keep the CPU of the motherboard
to function normally, a CPU cooling structure is needed. High
performance and low manufacturing cost are important factors in
designing a CPU cooling structure. FIG. 13 shows a heat sink for
use with a fan in a computer to dissipate heat from the CPU. This
structure of heat sink A comprises a flat base A1 and a plurality
of upright radiation fins A11 arranged in parallel on the top side
of the flat base A1. When used with an axial flow fan, the axial
flow of air induced by the axial flow fan is stopped by the flat
base A1 of the heat sink A and forced sideways, i.e., the axial
flow of air does not pass to the CPU and the surrounding electronic
component parts. Due to this problem, the heat dissipation
efficiency of the heat sink A is low.
SUMMARY OF THE INVENTION
[0003] The present invention has been accomplished to provide a CPU
cooling structure, which eliminates the aforesaid drawbacks.
According to one aspect of the present invention, the CPU cooling
structure comprises a heat sink and an axial flow fan. The heat
sink has a center shaft disposed in contact with the CPU to be
cooled down and a plurality of radiation fins equiangularly
radially arranged around the periphery of the center shaft. The
radiation fins may be curved in direction corresponding or reversed
to the direction of rotation of the fan blade and hub assembly of
the axial flow fan. During operation, the induced axial flow of air
passes through the gaps in between the radiation fins of the heat
sink toward the CPU and the surrounding electronic component parts
to dissipate heat from the CPU and the surrounding electronic
component parts. According to another aspect of the present
invention, the center shaft of the heat sink can be made having a
hollow structure filled with a heat transfer fluid for quick
transfer of heat from the CPU to the radiation fins.
BRIEF DESCRIPTION OF THE DRAWINGS
[0004] FIG. 1 is an elevational view of a heat sink for a CPU
cooling structure according to a first embodiment of the present
invention.
[0005] FIG. 2 is a side view in section of the heat sink shown in
FIG. 1.
[0006] FIG. 3 is an exploded view of the CPU cooling structure
according to the first embodiment of the present invention.
[0007] FIG. 4 is an installed view of FIG. 3.
[0008] FIG. 5 is a side view in section of FIG. 4.
[0009] FIG. 6 is a schematic drawing showing radiation fins of the
heat sink curved in direction reversed to the direction of rotation
of the axial flow fan according to the first embodiment of the
present invention.
[0010] FIG. 7 is an exploded view of the CPU cooling structure
according to the second embodiment of the present invention.
[0011] FIG. 8 is an installed view of the second embodiment of the
present invention.
[0012] FIG. 9 is a schematic drawing showing radiation fins of the
heat sink curved in direction corresponding to the direction of
rotation of the axial flow fan according to the second embodiment
of the present invention.
[0013] FIG. 10 is an installed view of the CPU cooling structure
according to the third embodiment of the present invention.
[0014] FIG. 11 is a side view in section of FIG. 10.
[0015] FIG. 12 is a schematic drawing showing radiation fins of the
heat sink curved in direction reversed to the direction of rotation
of the axial flow fan according to the third embodiment of the
present invention.
[0016] FIG. 13 is an elevational view of a heat sink according to
the prior art.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT
[0017] Referring to FIGS. 1 and 2, a heat sink 1 is shown
comprising a hollow center shaft 11, an enclosed fluid chamber 111
defined in the center shaft 11, a heat transfer fluid 113 filled in
the enclosed fluid chamber 111, and a plurality of radiation fins
12 radially arranged around the periphery of the center shaft 11.
The center shaft 11 has a flat bottom contact surface 112.
[0018] Referring to FIGS. 3 and 4 and FIG. 2 again, the heat sink 1
is used with an axial flow fan 2 to cool the temperature of the CPU
31 in a motherboard 3. Tie screws 4 are mounted in respective
mounting holes 21 of axial flow fan 2 and threaded into gaps 121 in
between the radiation fins 12 to secure the axial flow fan 2 to the
top side of the heat sink 1. The flat bottom contact surface 112 of
the hollow center shaft 11 of the heat sink 1 is disposed in
contact with the top surface of the CPU 31. Further, the radiation
fin 12 of the heat sink 1 are smoothly arched and radially curved
in direction reverse to the direction of rotation of the fan blade
and hub assembly 22 of the axial flow fan 2.
[0019] Referring to FIGS. 5 and 6 and FIG. 4 again, during
operation of the CPU 31, heat is transferred from the CPU 31 to the
heat transfer fluid 113 through the flat bottom contact surface 112
of the hollow center shaft 11 of the heat sink 1, and then quickly
transferred from the heat transfer fluid 113 to the radiation fins
12, the axial flow of air induced by the axial flow fan 2
continuously passes through the gaps 121 in between the radiation
fins 12 toward the top surface of the CPU 31 and the surrounding
electronic component parts 32 to quickly dissipate heat from the
heat sink 1, the CPU 31, and the surrounding electronic component
parts 32.
[0020] FIGS. from 7 through 9 show an alternate form of the present
invention. According to this alternate form, the radiation fins 12
are smoothly arched and radially curved in direction corresponding
to the direction of rotation of the fan blade and hub assembly 22
of the axial flow fan 2. During operation, heat is transferred in
proper order from the CPU 31 to the flat bottom contact surface 112
of the hollow center shaft 11, the heat transfer fluid 113, and the
radiation fins 12, and at the same time the axial flow of air
induced by the axial flow fan 2 continuously passes through the
gaps 121 in between the radiation fins 12 toward the top surface of
the CPU 31 and the surrounding electronic component parts 32 to
quickly dissipate heat from the heat sink 1, the CPU 31, and the
surrounding electronic component parts 32.
[0021] FIGS. from 10 through 12 show another alternate form of the
present invention. According to this embodiment, the center shaft
11 of the heat sink 1 is a solid shaft, and the radiation fins 12
are smoothly arched and radially curved in direction reversed to
the direction of rotation of the fan blade and hub assembly 22 of
the axial flow fan 2. During operation, heat is transferred from
the CPU 31 to the solid center shaft 11 and then the radiation fins
12, and at the same time the axial flow of air induced by the axial
flow fan 2 continuously passes through the gaps 121 in between the
radiation fins 12 toward the top surface of the CPU 31 and the
surrounding electronic component parts 32 to quickly dissipate heat
from the heat sink 1, the CPU 31, and the surrounding electronic
component parts 32.
[0022] A prototype of heat sink has been constructed with the
features of the annexed drawings of FIGS. 1.about.12. The heat sink
functions smoothly to provide all of the features discussed
earlier.
[0023] Although particular embodiments of the invention have been
described in detail for purposes of illustration, various
modifications and enhancements may be made without departing from
the spirit and scope of the invention. Accordingly, the invention
is not to be limited except as by the appended claims.
* * * * *