U.S. patent application number 10/391084 was filed with the patent office on 2004-06-24 for heat-dissipating device.
Invention is credited to Huang, Wen-Shi, Huang, Yu-Hung, Lin, Kuo-Cheng, Tan, Li-Kuang.
Application Number | 20040118552 10/391084 |
Document ID | / |
Family ID | 32591103 |
Filed Date | 2004-06-24 |
United States Patent
Application |
20040118552 |
Kind Code |
A1 |
Huang, Wen-Shi ; et
al. |
June 24, 2004 |
Heat-dissipating device
Abstract
The invention discloses an annular heat-dissipating device
formed by a plurality of fins combined together, all of which are
arranged around a base, wherein one side of each of the plurality
of fins is coupled to the base, respectively. The heat-dissipating
device of the invention can greatly increase the heat-dissipating
area so as to effectively dissipate heat generated from the
electronic elements to the outside.
Inventors: |
Huang, Wen-Shi; (Jungli
City, TW) ; Lin, Kuo-Cheng; (Taoyuan City, TW)
; Tan, Li-Kuang; (Taoyuan City, TW) ; Huang,
Yu-Hung; (Ilan, TW) |
Correspondence
Address: |
PRO-TECHTOR INTERNATIONAL
20775 Norada Court
Saratoga
CA
95070-3018
US
|
Family ID: |
32591103 |
Appl. No.: |
10/391084 |
Filed: |
March 17, 2003 |
Current U.S.
Class: |
165/80.3 ;
165/185; 165/78; 257/E23.099; 257/E23.103 |
Current CPC
Class: |
F21V 29/773 20150115;
F28F 3/02 20130101; H01L 23/3672 20130101; H01L 23/467 20130101;
H01L 2924/0002 20130101; F28D 2021/0029 20130101; H01L 2924/0002
20130101; H01L 2924/00 20130101 |
Class at
Publication: |
165/080.3 ;
165/078; 165/185 |
International
Class: |
F28F 007/00 |
Foreign Application Data
Date |
Code |
Application Number |
Dec 24, 2002 |
TW |
91221032 |
Claims
What is claimed is:
1. A heat-dissipating device comprising: a base; and a plurality of
fins mounted around a periphery of the base, wherein a first end of
each of the plurality of fins is coupled to the base after the base
is formed.
2. The heat-dissipating device of claim 1, wherein the fins are
formed as rectangular, triangular, trapezoid, polygonal or
irregular shapes.
3. The heat-dissipating device of claim 1, wherein the plurality of
fins are made from aluminum, copper, magnesium, an aluminum alloy,
a copper alloy or a mixture thereof or other material with high
thermal conductivity.
4. The heat-dissipating device of claim 1, wherein the plurality of
fins are coupled to the base by welding, adhesion, riveting,
engaging or fastening.
5. The heat-dissipating device of claim 1, wherein a second end of
each of the plurality of fins is connected to each other so as to
strengthen the heat-dissipating device.
6. The heat-dissipating device of claim 5, wherein the second end
of each of the plurality of fins is provided with a flange that is
formed with at least a concave portion and at least an engagement
portion, which are respectively fastened to an engagement portion
and a concave portion of another fin.
7. The heat-dissipating device of claim 5, wherein the second end
of each of the fin is provided with at least a concave portion and
at least an engagement portion, which are respectively fastened to
an engagement portion and a concave portion of another fin.
8. The heat-dissipating device of claim 1, further comprising a
plurality of bridge portions respectively connected between
corresponding ends of each two fins.
9. The heat-dissipating device of claim 8, wherein the bridge
portions and the fins are formed integrally as a unit.
10. The heat-dissipating device of claim 1, further comprising at
least a rim portion mounted on second ends of the plurality of fins
to strengthen the heat-dissipating device.
11. The heat-dissipating device of claim 1, wherein the base is a
pillar base with a circular, rectangular, triangular, trapezoid,
polygonal or irregular shape.
12. The heat-dissipating device of claim 1, wherein the base is
made from aluminum, copper, magnesium, an aluminum alloy, a copper
alloy or a mixture thereof or a thermal conductivity material with
high thermal conductivity.
Description
BACKGROUND OF THE INVENTION
[0001] (a) Field of the Invention
[0002] The invention relates generally to a heat-dissipating device
and, more particularly, to a heat sink, used in electronic
components such as CPUs of computers, capable of effectively
dissipating heat generated from the electronic components to the
outside.
[0003] (b) Description of the Related Art
[0004] Following continuous improvements in performance of
electronic devices, heat-dissipating devices or systems have become
indispensable components. If the heat generated by individual
components within the electronic device cannot be appropriately
dissipated, in a less serious situation, the performance thereof is
reduced, and in a more serious situation, the electronic device may
be burnt and damaged. As a result, the surfaces or side-walls of
the electronic component (for instance, the CPU of a computer)
which produced a great amount of heat is generally mounted on a
heat sink so as to dissipate the generated heat.
[0005] Referring to FIG. 1, there is shown a conventional heat sink
1 with a base 11 at the center and a plurality of heat-dissipation
fins 12 extended outward from the base 11. The base 11 and the heat
dissipation fins 12 are formed integrally as a unit. In the
manufacturing process of the conventional heat sink 1, there exists
the restrictions of the height and thickness of the fins 12, and
the distance between each of the fins 12 cannot be too small.
Therefore, when the heat dissipation area of the heat sink 1 is
increased, the entire volume of the heat sink is also
increased.
[0006] Therefore, it is an important subject of the invention to
provide a heat sink that has a larger heat dissipation area with
respect to a specific volume.
SUMMARY OF THE INVENTION
[0007] Accordingly, it is an object of the invention to provide a
heat-dissipating device formed with a plurality of fins, all of the
fins are coupled to a base after the base is formed. As compared
with a conventional heat sink, a larger heat-dissipating area can
be obtained, which effectively dissipates heat generated by the
electronic components to the outside.
[0008] Another object of the invention is to provide an annular
heat-dissipating device formed with a plurality of fins combined
together, and the device provides a larger heat-dissipating area
which effectively dissipates heat generated by the electronic
element to the outside.
[0009] In accordance with the invention, the heat-dissipating
device includes a base, and a plurality of fins mounted around the
periphery of the base, wherein a first end of each of the plurality
of fins is coupled to the base after the base is formed.
[0010] In accordance with the invention, each fin has a
rectangular, triangular, trapezoidal, polygonal or irregular shape.
In addition, the fins are made from aluminum, copper, magnesium, an
aluminum alloy, a copper alloy or a mixture thereof, or other
thermally conductive material with high thermal conductivity.
[0011] The base is a pillar base with a circular, rectangular,
triangular, trapezoidal or polygonal shape, or the base can be in a
conical shape or an irregular shape. The base is made from
aluminum, copper, magnesium, an aluminum alloy, a copper alloy, or
a mixture thereof, or other thermally conductive material with high
thermal conductivity.
[0012] The fins are coupled to the base at their first ends by way
of welding, adhesion, riveting, engaging or fastening. The first
ends of the fins are connected with each other by coupling,
riveting, engaging or fastening so as to strengthen the
heat-dissipating device. Alternatively, the fins are connected with
each other by means of at least a rim portion being disposed on
second ends of the fins to strengthen the heat-dissipating
device.
[0013] The second end of each of the fins is provided with a
flange. The flange is provided with at least a concave portion and
at least an engagement portion which can respectively fasten with
at least an engagement portion and at least a concave portion of
another fin. Alternatively, the second end of each of the fins is
provided with at least a concave portion and at least an engagement
portion, which can respectively fasten to at least an engagement
portion and at least a concave portion of another fin.
[0014] Preferably, the heat dissipation device further includes a
plurality of bridge portions each connecting corresponding ends of
each two fins. The plurality of bridge portions and the plurality
of fins are formed integrally as a unit.
BRIEF DESCRIPTION OF THE DRAWINGS
[0015] FIG. 1 is a schematic view of a conventional heat sink.
[0016] FIG. 2A is a heat sink in accordance with a first preferred
embodiment of the invention.
[0017] FIG. 2B is a perspective view of a fin in accordance with
the preferred embodiment of FIG. 2A of the invention.
[0018] FIG. 3A is a perspective view of the heat-dissipating device
in accordance with a second preferred embodiment of the
invention.
[0019] FIG. 3B is a schematic view showing coupling of the base and
fins in accordance with the preferred embodiment as shown in FIG.
3A.
[0020] FIG. 3C is a perspective view showing the fins in accordance
with the preferred embodiment as shown in FIG. 3A of the
invention.
[0021] FIG. 3D is a side view showing a combination of a fan with
the heat-dissipating device of FIG. 3A.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
[0022] Referring to FIGS. 2A and 2B, there is shown a first
preferred embodiment of a heat-dissipating device 2, which includes
a cylindrical base 22 and a plurality of fins 21 annularly mounted
around the base 22, and a first end of each fin 21 is coupled to
the base 22. The plurality of fins 21 are coupled to the base 22 by
means of welding, adhesion, riveting, engaging and fastening after
the base was formed.
[0023] Each of the fins 21 can be formed in a rectangular,
triangular, trapezoidal, polygonal, or irregular shape, which can
be made from aluminum, copper, magnesium, an aluminum alloy, a
copper alloy or a mixture thereof, or other thermally conductive
material having high thermal conductivity., Taking a rectangular
fin as an example, as shown in FIG. 2B, a first end of the fin 21
is provided with engagement portions 215 on its both sides,
respectively. Each of the engagement portions 215 can be fastened
with an engaging slot on the base 22. In addition, a second end of
the fin 21 is provided with a flange 211 with its two sides having
a concave portion 212 and an engagement portion 213. The concave
portion 212 and engagement portion 213 can be fastened to an
engagement portion and a concave portion formed on another fin,
respectively.
[0024] The plurality of fins 21 of the heat-dissipating device 2
can be connected by a plurality of bridge portions (not shown),
respectively connected between corresponding ends of each two fins
21. The plurality of bridge portions and the fins 21 can be formed
integrally as a unit. Alternatively, each of the fins 21 can be
connected with each other by means of at least one rim portion (not
shown), which is disposed on the second ends of the fins 21 so as
to strengthen the heat-dissipating device 2.
[0025] Next, referring to FIGS. 3A to 3C, there is shown a
heat-dissipating device 3 in accordance with a second preferred
embodiment of the invention. The heat-dissipating device 3 includes
a cylindrical base 32 and a plurality of fins 31 annularly mounted
around the base 32. An engaging portion 311 at a first end of each
fin 31 is coupled to the base 32. Alternatively, the fins 31 can be
coupled to the base 32 by welding, adhesion, riveting, or
fastening. In addition, a second end of each fin 31 is provided
with a pair of concave portions 312 and a pair of engagement
portions 313. In assembling, the engagement portion 313 of each fin
31 can be fastened with the concave portion 312 of a neighboring
fin 31.
[0026] In practical application, as shown in FIG. 3D, the bottom
surface of the heat-dissipating device 3 is mounted on an
electronic component (not shown) and an axial fan 4 is positioned
at the top surface of the heat-dissipating device 3. The electronic
component produces heat during operation and the heat is
transferred to the heat-dissipating device 3 and the air stream
produced by the axial fan 4 flows to the heat-dissipating device 3,
thereby the heat accumulated on the heat-dissipating device 3 is
dissipated.
[0027] Since the fins 31 of the heat-dissipating device 3 are
coupled to the base 32 one by one, the heat-dissipating area is
effectively increased so as to obtain an excellent heat-dissipating
effect. In addition, the second ends of the fins 31 can be
connected by coupling, riveting, engaging or fastening so as to
strengthen the heat-dissipating device 3 and secure the second ends
of the fins 31.
[0028] While the invention has been particularly described, in
conjunction with specific preferred embodiments, it is evident that
many alternatives, modifications and variations will be apparent to
those skilled in the art in light of the foregoing description. It
is therefore contemplated that the appended claims will embrace any
such alternatives, modifications and variations as falling within
the true scope and spirit of the invention.
* * * * *