Attracting plate of an electrostatic chuck for semiconductor manufacturing

Description

FIG. 1 is a front elevational view of an attracting plate of an electrostatic chuck for semiconductor manufacturing, showing our new design;

FIG. 2 is a rear elevational view thereof;

FIG. 3 is a top plan view thereof;

FIG. 4 is an enlarged view thereof taken along sections A--A and B--B in FIG. 1;

FIG. 5 is a right side elevational view thereof;

FIG. 6 is a left side elevational view thereof;

FIG. 7 is a cross-sectional view taken along line 7--7 in FIG. 4 with portions of the internal mechanism omitted; and,

FIG. 8 is a front perspective view thereof.

The broken line showing in the figures is for illustrative purposes only and forms no part of the claimed design.

Claims

CLAIM The ornamental design for an attracting plate of an electrostatic chuck for semiconductor manufacturing, as shown and described.

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Inventors:	Sasaki; Yasuharu (Nirasaki, JP), Kosakai; Mamoru (Tokyo, JP)
Assignee:	Tokyo Electron Limited (Tokyo, JP) Sumitomo Osaka Cement Co., Ltd. (Tokyo, JP)
Appl. No.:	D/276,663
Filed:	February 1, 2007

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Foreign Application Priority Data

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Aug 1, 2006 [JP]			2006-020297

Current U.S. Class:	D13/182
Current International Class:	1303
Field of Search:	;D13/182 ;156/345.53 ;279/128 ;361/234

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References Cited [Referenced By]

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U.S. Patent Documents

3078565	February 1963	Sanders
4502094	February 1985	Lewin et al.
6278600	August 2001	Shamouilian et al.
6628503	September 2003	Sogard
6721162	April 2004	Weldon et al.
D546784	July 2007	Hayashi
D548200	August 2007	Hayashi
D548705	August 2007	Hayashi
D553104	October 2007	Oohashi et al.
2002/0027762	March 2002	Yamaguchi
2002/0159217	October 2002	Tsuruta et al.
2004/0179323	September 2004	Litman et al.
2004/0190215	September 2004	Weldon et al.
2004/0218339	November 2004	Nakamura
2006/0164785	July 2006	Pellegrin
2006/0221539	October 2006	Morita et al.

Primary Examiner: Sikder; Selina
Attorney, Agent or Firm: Oblon, Spivak, McClelland, Maier & Neustadt, P.C.